JP2006093286A - Process for manufacturing multilayer ceramic electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a process for manufacturing a multilayer ceramic electronic component in which short-circuiting is prevented without causing any increase in size. <P>SOLUTION: The process for manufacturing a multilayer ceramic electronic component comprises steps of: forming a predetermined conductor pattern on respective green sheets becoming a plurality of ceramic layers 2, 3, 4 and 5; laminating a plurality of green sheets thus obtained to obtain a laminate, and sintering the laminate thus obtained. In the patterning step, a first conductor pattern 21 and a second conductor pattern 22 becoming the first ceramic layer 2 are formed, lines 23 for interconnecting both conductor patterns 21 and 22 electrically are formed, and then the connection lines 23 are cut at subsequent insulation step thus insulating the first conductor pattern 21 and the second conductor pattern 22 from each other. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing a multilayer ceramic electronic component for constituting various electronic circuits equipped in a small electronic device such as a mobile phone.

  In recent years, in small electronic devices such as mobile phones, the demand for downsizing has become more and more severe. In such a situation, a plurality of circuit elements constituting the device are integrated into a single-chip multilayer ceramic electronic component. Thus, the multilayer ceramic electronic component is mounted on a main board.

4A to 4E show a series of manufacturing steps of the conventional multilayer ceramic electronic component (101). As shown in FIG. 4 (e), the multilayer ceramic electronic component (101) has a multilayer structure of four ceramic layers (6), (7), (8) and (9).
The multilayer ceramic electronic component (101) is composed of four green sheets (69) that form four ceramic layers (6), (7), (8), and (9) as shown in FIGS. (79) (89) (99) Conductive pattern forming step for forming a predetermined conductive pattern on each, and four green sheets (69) (79) (89) (99) obtained through the conductive pattern forming step 4 (d), and a laminate manufacturing step for manufacturing the laminate, and a firing step for firing the laminate obtained through the laminate manufacturing step as shown in FIG. 4 (e). It is produced through.
4A to 4C show the conductor pattern forming step for the first green sheet 69 which is the uppermost first ceramic layer 6.
As shown in FIG. 4 (a), first, a first green sheet (69) is prepared, and then, as shown in FIG. 4 (b), a through hole (64a) is formed at a predetermined position of the first green sheet (69). After opening (64b), as shown in FIG. 4 (c), the through holes (64a) and (64b) are filled with a conductor material to form a vertical line, and the conductor on the surface of the first green sheet (69). The material is printed to form predetermined conductor patterns (61) (62) (63).
Similarly, the second to fourth green sheets (79), (89), and (99) to be the second to fourth ceramic layers (7), (8), and (9) are respectively provided with predetermined conductor patterns and vertical lines. Form.

  In the next laminate manufacturing step, the first to fourth green sheets (69) (79) (89) (99) obtained through the conductor pattern forming step are sequentially stacked as shown in FIG. A laminate is produced. Thereafter, in the firing step shown in FIG. 4 (e), the laminate is integrated by thermocompression bonding and firing. In this way, the multilayer ceramic electronic component (101) is manufactured.

  However, in the firing step shown in FIG. 4 (e), the first conductor pattern (61) formed on the surface of the first ceramic layer (6) and the second conductor layer formed on the surface of the second ceramic layer (7). The conductor pattern (71) is connected by a fine short-circuit line (65) as shown in the figure, resulting in a short-circuit failure.

The inventor analyzed the conditions under which the above short-circuit failure occurred, and as a result, both the conductor patterns (61) and (71) were electrically insulated from each other, and both the conductor patterns (61) and (71) were vertically aligned. It has been found that short-circuit defects occur when overlapping and having overlapping regions.
The short-circuit failure described above is caused by, for example, the conductor pattern (63) on the first ceramic layer (6) and the conductor pattern (2) on the second ceramic layer (7) that are electrically connected to each other as shown in FIG. It does not occur with 72). That is, even if the two conductor patterns (63) and (72) overlap each other in the vertical direction and overlap each other, they are electrically connected to each other by the vertical line formed in the through hole (64b). In this case, no short circuit failure occurs.

Therefore, the inventor speculated that the cause of the short-circuit failure was due to the potential difference between the two conductor patterns (61) and (71) generated in the firing process.
That is, in the firing step, polarization occurs in the first ceramic layer (6), which is a dielectric, due to the pyroelectric effect accompanying the temperature rise and the piezoelectric effect due to the pressure bonding, and the first ceramic layer (6) is formed along with the polarization. The first and second conductor patterns (61) and (71) that are opposed to each other are charged, and a potential difference is generated between the conductor patterns (61) and (71). It is estimated that a fine short circuit line (65) is formed due to the potential difference and a short circuit failure occurs.

By the way, a migration phenomenon is known in which a conductor material moves between wirings formed at minute intervals under a high temperature and high humidity condition, and the wirings are short-circuited. Various conductor materials have been proposed (see Patent Document 1).
JP-A-6-20517 [H01B 1/16]

However, even when a conductive material that hardly causes the migration phenomenon is used, it is not sufficient to prevent the occurrence of the short-circuit failure described above.
Therefore, in the manufacture of conventional multilayer ceramic electronic components, two conductor patterns facing each other across the ceramic layer are arranged so as not to overlap in the stacking direction of the ceramic layer, or the thickness of the ceramic layer is a certain thickness or more. The occurrence of a short circuit failure was prevented by taking measures on the design such as forming on the surface.
However, due to such design measures, there is a problem that the degree of integration decreases and the multilayer ceramic electronic component becomes large.
Accordingly, an object of the present invention is to provide a method for manufacturing a multilayer ceramic electronic component capable of preventing the occurrence of a short circuit failure without increasing the size of the multilayer ceramic electronic component.

A multilayer ceramic electronic component which is an object of the present invention has a multilayer structure of a plurality of ceramic layers on which a predetermined conductor pattern is formed, and at least one of the uppermost ceramic layer and the lowermost ceramic layer The first conductor pattern and the second conductor pattern that are electrically insulated from each other are formed on the surface exposed to the outside, and a third layer is formed on the surface of the ceramic layer that directly overlaps the ceramic layer. The third conductor pattern is electrically connected to the second conductor pattern and electrically insulated from the first conductor pattern. The manufacturing method of the multilayer ceramic electronic component according to the present invention includes a conductor pattern forming step of forming a predetermined conductor pattern on each of the plurality of green sheets to be the plurality of ceramic layers, and a plurality of conductor patterns obtained through the conductor pattern forming step. It has the laminated body preparation process which laminates | stacks the green sheet of 1 sheet, and produces a laminated body, and the baking process which bakes the laminated body obtained through this laminated body preparation process.
In the conductor pattern forming step, the first conductor pattern and the second conductor pattern are formed on the surface of the green sheet serving as the one ceramic layer, and the first conductor pattern and the second conductor pattern are formed. Are connected to each other, and after the firing step, a part or all of the connection lines are removed to electrically insulate the first conductor pattern and the second conductor pattern from each other. An insulating treatment process is performed.

According to the method for manufacturing a multilayer ceramic electronic component of the present invention, in the conductor pattern forming step, the first conductor pattern and the second conductor pattern are electrically connected to each other via the connection line.
In the state of the laminate produced in the next laminate production process, the second conductor pattern and the third conductor pattern are electrically connected to each other, whereby the first conductor pattern and the third conductor pattern are electrically connected to each other. A conductive pattern is electrically connected to each other via the connection line and the second conductor pattern.
As a result, during the next firing step, the ceramic layer sandwiched between the first conductor pattern and the third conductor pattern is polarized, and the first conductor pattern and the third conductor pattern are temporarily separated. Even if charged to different potentials, the charge moves between the first conductor pattern and the third conductor pattern, and the first conductor pattern and the third conductor pattern are kept at the same potential. Be drunk. Therefore, there is no potential difference between the first conductor pattern and the third conductor pattern. Thereby, the occurrence of short circuit failure can be prevented.
Furthermore, the first conductor pattern and the second conductive pattern are electrically insulated by removing a part or all of the connection line in the next insulation processing step, so that a desired multilayer ceramic electronic component is obtained. Will be completed.

  According to the method for manufacturing a multilayer ceramic electronic component of the present invention, it is possible to prevent occurrence of a short circuit failure without taking a conventional design measure. In addition, since it is possible to form the third conductor pattern in a region where a short-circuit failure has conventionally occurred, that is, a region where at least part of the first conductor pattern overlaps, As a result, the degree of integration of the multilayer ceramic electronic component is improved, and the multilayer ceramic electronic component can be miniaturized.

In a specific method, in the insulation treatment step, part or all of the connection line is removed by shaving.
In the specific method, since the connection line is formed on the surface exposed to the outside of the multilayer ceramic electronic component, a part or all of the connection line is removed by removing while confirming the position of the connection line from the outside. I can do it.

Further, in a specific method, in the conductor pattern forming step, a vertical through hole is formed in the green sheet to be the one ceramic layer, and then the through hole is filled with a conductor material to form a vertical line, The second conductor pattern and the third conductor pattern are electrically connected to each other by a vertical line.
According to the specific method, in the state of the laminate produced through the laminate production step, a green sheet that becomes the one ceramic layer, and a green sheet on which the third conductor pattern is formed are formed. When the vertical line and the third conductor pattern come into contact with each other, the second conductor pattern and the third conductor pattern are electrically connected to each other through the vertical line. Become.

  According to the method for manufacturing a multilayer ceramic electronic component of the present invention, it is possible to prevent occurrence of a short circuit failure without increasing the size of the multilayer ceramic electronic component.

Hereinafter, embodiments of the present invention will be specifically described with reference to the drawings.
The multilayer ceramic electronic component (1) according to the present invention has a multilayer structure of four ceramic layers (2), (3), (4) and (5) as shown in FIG. 2 (b).
As shown in FIGS. 2B and 3B, a predetermined conductor including a first conductor pattern (21) and a second conductor pattern (22) is formed on the surface of the uppermost first ceramic layer (2). The third conductor pattern (31) formed on the surface of the second ceramic layer (3) in contact with the second conductor pattern (22) and the first ceramic layer (2) is formed of a conductive material. They are electrically connected to each other through the filled through holes (24a). On the other hand, the first conductor pattern (21) is not connected to any of the second conductor pattern (22) and the third conductor pattern (31), is electrically insulated, and the third conductor pattern (31). And are overlapped with each other in the vertical direction and overlap each other.
Each ceramic layer (2), (3), (4) and (5) has a flat plate shape of 5 mm square, for example, and the thickness of each ceramic layer (2), (3), (4) and (5) is, for example, 50 μm. Has been. Moreover, the thickness of each conductor pattern is formed to 10-20 micrometers, for example.

In the manufacturing process of the multilayer ceramic electronic component (1) of the present invention, first to first to fourth ceramic layers (2), (3), (4) and (5) are formed in the conductor pattern forming step. A predetermined conductor pattern is formed on each of the fourth green sheets (29), (39), (49), and (59).
FIGS. 1A to 1C show a conductor pattern forming process for the first green sheet (29) to be the first ceramic layer (2).
As shown in FIG. 1 (a), first, a first green sheet (29) is prepared. Next, as shown in FIG. 1 (b), a through hole (24a) is formed at a predetermined position of the first green sheet (29). (24b) is established. Thereafter, as shown in FIG. 1 (c), the through holes (24a) and (24b) are filled with a conductor material to form a vertical line, and the conductor material is printed on the surface of the first green sheet (29). As shown in FIGS. 1 (c) and 3 (a), a predetermined conductor pattern including the first conductor pattern (21) and the second conductor pattern (22) is formed, and the first conductor pattern (21) and the first conductor pattern (21) A connection line (23) for electrically connecting the two conductor patterns (22) to each other is formed.

Similarly, as shown in FIG. 1 (d), the second green sheet (39) to be the second ceramic layer (3) has through holes (33a) (33b) filled with a conductor material and conductor patterns ( 31) (32) and a predetermined conductor pattern are formed, and the third green sheet (49) to be the third ceramic layer (4) has a through hole (43) filled with a conductor material and a conductor pattern ( 41) (42) and a predetermined conductor pattern, and the fourth green sheet (59) to be the fourth ceramic layer (5) has through holes (57a) (57b) filled with a conductor material. A predetermined conductor pattern including conductor patterns (51) to (56) is formed.
In this way, the first to fourth green sheets (29) (39) (49) (59) in which the predetermined conductor pattern and the vertical line are formed are produced.

In the next laminate manufacturing process, the first to fourth green sheets (29), (39), (49) and (59) obtained through the conductor pattern forming process are sequentially stacked as shown in FIG. 1 (d). To produce a laminate. At this time, the lower end surface of the vertical line formed in the through hole 24a of the first green sheet 29 comes into contact with the third conductor pattern 31 on the second green sheet 39, and the first green sheet The first conductor pattern (21) and the third conductor pattern (31) facing each other across the sheet (29) are formed in the connection line (23), the second conductor pattern (22), and the through hole (24a). They are electrically connected to each other through the vertical lines. Similarly, the conductor pattern (25) on the first green sheet (29) and the conductor pattern (32) on the second green sheet (39) are formed in the through hole (24b) of the first green sheet (29). Are electrically connected to each other via the vertical lines.
The third conductor pattern (31) on the second green sheet (39) and the conductor pattern (41) on the third green sheet (49) are formed in the through hole (33a) of the second green sheet (39). They are electrically connected to each other through the formed vertical line. Similarly, the conductor pattern (32) on the second green sheet (39) and the conductor pattern (42) on the third green sheet (49) are formed in the through hole (33b) of the second green sheet (39). Are electrically connected to each other via the vertical lines.
Furthermore, the conductor pattern (41) on the third green sheet (49) and the conductor pattern (51) on the fourth green sheet (59) are formed in the through hole (43) of the third green sheet (49). They are electrically connected to each other via a vertical line.

  Next, in the firing step shown in FIG. 2 (a), the laminate produced through the laminate production step is subjected to thermocompression bonding and firing to be integrated. In the firing process, if the first ceramic layer (2) is polarized, the first conductor pattern (21) and the third conductor pattern (31) facing each other across the first ceramic layer (2) temporarily Even if charged to different potentials, the first conductor pattern (21) and the third conductor pattern (31) are electrically connected, so the first conductor pattern (21) and the third conductor pattern (31) The electric charge moves between the two conductor patterns (21) and (31), and the same potential is maintained. Therefore, there is no potential difference between the first conductor pattern (21) and the third conductor pattern (31). Thereby, the occurrence of short circuit failure can be prevented.

  Finally, in the insulation process shown in FIGS. 2 (b) and 3 (b), while confirming the position of the connection line (23), a part or all of the connection line (23) is used by using a tool such as a router. The connecting line (23) is cut off by cutting away the wire. Thus, the first conductor pattern (21) and the second conductor pattern (22) are electrically insulated from each other, and the target multilayer ceramic electronic component (1) is completed.

  According to the method for manufacturing the multilayer ceramic electronic component (1) of the present invention, it is possible to prevent the occurrence of a short circuit failure without taking conventional design measures. In addition, since it is possible to form the third conductor pattern (31) in a region where a short-circuit failure has conventionally occurred, that is, a region that greatly overlaps the first conductor pattern (21), The degree of integration of the multilayer ceramic electronic component is improved, and thus the size of the multilayer ceramic electronic component can be reduced.

In addition, each part structure of this invention is not restricted to the said embodiment, A various deformation | transformation is possible within the technical scope as described in a claim. For example, in this embodiment, the number of ceramic layers constituting the multilayer ceramic electronic component (1) is four, but any number of layers may be used as long as it is two or more.
In the present embodiment, the connection line (23) is formed on the surface of the uppermost ceramic layer (2). However, it can be formed on the back surface of the lowermost ceramic layer as necessary. That is, in the configuration in which the two conductive patterns (51) and (52) formed on the surface of the fourth ceramic layer (5) shown in FIG. 2B are electrically connected to each other, one conductor pattern (52 ) And the conductor pattern (55) formed on the back surface of the fourth ceramic layer (5), the conductor pattern forming step causes the back surface of the fourth green sheet (59) to A connection line that electrically connects the two conductor patterns (55) and (54) is formed, and in a subsequent insulation process, part or all of the connection line is removed, and both conductor patterns ( 55) (54) may be electrically insulated from each other.
The vertical line is formed by filling the through hole with a conductor material. However, the present invention is not limited to this, and for example, the vertical line may be constituted by a vertical electrode formed on the side surface of each ceramic layer.
Furthermore, although the method of printing a conductor material was used as a method of forming a predetermined conductor pattern on the surface of each green sheet, the present invention is not limited to this, and various methods such as a sputtering method, a vapor deposition method, and a plating method are employed. It is also possible.

It is a series of sectional views showing a conductor pattern formation step and a laminate manufacturing step in the method for manufacturing a multilayer ceramic electronic component according to the present invention. It is sectional drawing which shows the baking process and insulation process process in the manufacturing method of this multilayer ceramic electronic component. It is a top view which shows the surface of the 1st green sheet used as the 1st ceramic layer after a conductor pattern formation process, and the surface of the 1st ceramic layer after an insulation process process. It is a series of sectional views showing a manufacturing process of a conventional multilayer ceramic electronic component.

Explanation of symbols

(1) Multilayer ceramic electronic parts
(2) First ceramic layer
(21) First conductor pattern
(22) Second conductor pattern
(23) Connection line
(24) Through hole
(29) First green sheet
(3) Second ceramic layer
(31) Third conductor pattern
(39) Second green sheet
(4) Third ceramic layer
(49) Third green sheet
(5) Fourth ceramic layer
(59) 4th Green Sheet

Claims (4)

It has a laminated structure of a plurality of ceramic layers on which a predetermined conductor pattern is formed, and at least one of the uppermost ceramic layer and the lowermost ceramic layer is electrically connected to the surface exposed to the outside. The first conductor pattern and the second conductor pattern that are electrically insulated are formed, and the third conductor pattern is formed on the surface of the ceramic layer that directly overlaps the ceramic layer. In the method for manufacturing a multilayer ceramic electronic component, wherein the pattern is electrically connected to the second conductor pattern and electrically insulated from the first conductor pattern.
A conductor pattern forming step for forming a predetermined conductor pattern on each of the plurality of green sheets to be the plurality of ceramic layers, and a plurality of green sheets obtained through the conductor pattern forming step are stacked to produce a laminate. A laminate manufacturing step, and a firing step of firing the laminate obtained through the laminate fabrication step,
In the conductor pattern forming step, the first conductor pattern and the second conductor pattern are formed on the surface of the green sheet serving as the one ceramic layer, and the first conductor pattern and the second conductor pattern are formed. Are connected to each other, and after the firing step, a part or all of the connection lines are removed to electrically insulate the first conductor pattern and the second conductor pattern from each other. The manufacturing method of the multilayer ceramic electronic component characterized by implementing the insulation process process to perform.   In the conductor pattern forming step, in the surface of the green sheet to be directly superimposed on the green sheet to be the one ceramic layer, the region where at least a part of the first conductor pattern overlaps, The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein the third conductor pattern is formed.   3. The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein in the insulating treatment step, a part or all of the connection line is cut and removed.   In the conductor pattern forming step, a vertical through hole is formed in the green sheet serving as the one ceramic layer, and then a conductive material is filled in the through hole to form a vertical line, and the second line is formed by the vertical line. The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein the conductor pattern and the third conductor pattern are electrically connected to each other.

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