JP2007009217A5 - - Google Patents
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- Publication number
- JP2007009217A5 JP2007009217A5 JP2006219129A JP2006219129A JP2007009217A5 JP 2007009217 A5 JP2007009217 A5 JP 2007009217A5 JP 2006219129 A JP2006219129 A JP 2006219129A JP 2006219129 A JP2006219129 A JP 2006219129A JP 2007009217 A5 JP2007009217 A5 JP 2007009217A5
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- resin
- composition according
- prepolymer
- cyanate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006219129A JP5303826B2 (ja) | 2006-08-11 | 2006-08-11 | 樹脂組成物、プリプレグ及びそれを用いたプリント配線板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006219129A JP5303826B2 (ja) | 2006-08-11 | 2006-08-11 | 樹脂組成物、プリプレグ及びそれを用いたプリント配線板 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2001265431A Division JP4132755B2 (ja) | 2001-09-03 | 2001-09-03 | 樹脂組成物、プリプレグ及びそれを用いたプリント配線板 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2007009217A JP2007009217A (ja) | 2007-01-18 |
JP2007009217A5 true JP2007009217A5 (fr) | 2008-10-16 |
JP5303826B2 JP5303826B2 (ja) | 2013-10-02 |
Family
ID=37748101
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006219129A Expired - Fee Related JP5303826B2 (ja) | 2006-08-11 | 2006-08-11 | 樹脂組成物、プリプレグ及びそれを用いたプリント配線板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5303826B2 (fr) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8871660B2 (en) | 2007-02-08 | 2014-10-28 | Sumitomo Bakelite Co., Ltd. | Laminated body, circuit board including laminated body, semiconductor package and process for manufacturing laminated body |
MY148660A (en) * | 2007-04-10 | 2013-05-15 | Sumitomo Bakelite Co | Resin composition, prepreg, laminated board, multilayer printed wiring board and semiconductor device |
JP4968460B2 (ja) * | 2007-04-12 | 2012-07-04 | 住友ベークライト株式会社 | 樹脂組成物、樹脂組成物付き金属箔及びプリント配線板 |
JP5428212B2 (ja) * | 2008-06-17 | 2014-02-26 | 住友ベークライト株式会社 | 樹脂組成物、プリプレグおよびそれを用いたプリント配線板 |
TWI565750B (zh) * | 2009-02-20 | 2017-01-11 | Ajinomoto Kk | Resin composition |
KR101763975B1 (ko) * | 2010-05-07 | 2017-08-01 | 스미토모 베이클리트 컴퍼니 리미티드 | 회로 기판용 에폭시 수지 조성물, 프리프레그, 적층판, 수지 시트, 프린트 배선판용 적층기재, 프린트 배선판, 및 반도체 장치 |
WO2013021869A1 (fr) | 2011-08-09 | 2013-02-14 | 三菱瓦斯化学株式会社 | Nouveau composé de type ester d'acide cyanique, procédé pour sa production, composition de résine durcissable contenant le nouveau composé de type ester d'acide cyanique et produit durci en composition de résine durcissable |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6354419A (ja) * | 1986-08-26 | 1988-03-08 | Mitsubishi Gas Chem Co Inc | 熱硬化性樹脂組成物 |
EP0290860B1 (fr) * | 1987-04-27 | 1995-01-25 | Mitsubishi Gas Chemical Company, Inc. | Composition de résine thermodurcissable |
JP2993065B2 (ja) * | 1990-07-27 | 1999-12-20 | 三菱瓦斯化学株式会社 | 表面平滑金属箔張積層板 |
JP2000001599A (ja) * | 1998-03-10 | 2000-01-07 | Kashima Oil Co Ltd | 高反応性変性フェノ―ル樹脂を用いた樹脂組成物、成形体、繊維強化樹脂板、摩擦材、発泡体、接着剤、防食塗料および難燃剤 |
JP2000191776A (ja) * | 1998-12-24 | 2000-07-11 | Mitsubishi Gas Chem Co Inc | シアン酸エステル・コ−プレポリマー |
JP2001172473A (ja) * | 1999-10-07 | 2001-06-26 | Nitto Denko Corp | 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置 |
JP2002194121A (ja) * | 2000-12-26 | 2002-07-10 | Mitsubishi Gas Chem Co Inc | プリプレグ及び金属箔張り積層板 |
-
2006
- 2006-08-11 JP JP2006219129A patent/JP5303826B2/ja not_active Expired - Fee Related
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