JP2007001292A5 - - Google Patents

Download PDF

Info

Publication number
JP2007001292A5
JP2007001292A5 JP2006087369A JP2006087369A JP2007001292A5 JP 2007001292 A5 JP2007001292 A5 JP 2007001292A5 JP 2006087369 A JP2006087369 A JP 2006087369A JP 2006087369 A JP2006087369 A JP 2006087369A JP 2007001292 A5 JP2007001292 A5 JP 2007001292A5
Authority
JP
Japan
Prior art keywords
mol
polyester film
laminated
film according
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006087369A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007001292A (ja
JP4811078B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2006087369A priority Critical patent/JP4811078B2/ja
Priority claimed from JP2006087369A external-priority patent/JP4811078B2/ja
Publication of JP2007001292A publication Critical patent/JP2007001292A/ja
Publication of JP2007001292A5 publication Critical patent/JP2007001292A5/ja
Application granted granted Critical
Publication of JP4811078B2 publication Critical patent/JP4811078B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2006087369A 2005-05-26 2006-03-28 積層ポリエステルフィルム、それを用いた難燃性ポリエステルフィルム、銅張り積層板および回路基板 Expired - Fee Related JP4811078B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006087369A JP4811078B2 (ja) 2005-05-26 2006-03-28 積層ポリエステルフィルム、それを用いた難燃性ポリエステルフィルム、銅張り積層板および回路基板

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005154065 2005-05-26
JP2005154065 2005-05-26
JP2006087369A JP4811078B2 (ja) 2005-05-26 2006-03-28 積層ポリエステルフィルム、それを用いた難燃性ポリエステルフィルム、銅張り積層板および回路基板

Publications (3)

Publication Number Publication Date
JP2007001292A JP2007001292A (ja) 2007-01-11
JP2007001292A5 true JP2007001292A5 (enExample) 2009-04-16
JP4811078B2 JP4811078B2 (ja) 2011-11-09

Family

ID=37687297

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006087369A Expired - Fee Related JP4811078B2 (ja) 2005-05-26 2006-03-28 積層ポリエステルフィルム、それを用いた難燃性ポリエステルフィルム、銅張り積層板および回路基板

Country Status (1)

Country Link
JP (1) JP4811078B2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5371082B2 (ja) * 2008-06-24 2013-12-18 ユニチカ株式会社 包装材料
JP5339835B2 (ja) * 2008-09-29 2013-11-13 積水化学工業株式会社 積層発泡シート
JP2012011555A (ja) * 2010-06-29 2012-01-19 Toray Ind Inc 難燃性フィルム
JP2013252651A (ja) * 2012-06-07 2013-12-19 Toray Ind Inc 難燃性フィルム
CN106024089A (zh) * 2015-05-10 2016-10-12 王笑梅 一种导体为合金的漆包线及其制造方法
JP6763126B2 (ja) * 2015-09-30 2020-09-30 三菱ケミカル株式会社 金属積層フィルム
JP6763125B2 (ja) * 2015-09-30 2020-09-30 三菱ケミカル株式会社 金属積層フィルム
JP6519061B1 (ja) * 2018-01-17 2019-05-29 メック株式会社 一体成形物とその製造方法、およびプライマー組成物
JP7601001B2 (ja) * 2020-04-06 2024-12-17 東洋紡エムシー株式会社 ポリエステル樹脂、水分散体及びこれを用いた接着剤組成物

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002338717A (ja) * 2001-05-15 2002-11-27 Toray Ind Inc 積層ポリエステルフィルム
JP2003171487A (ja) * 2001-12-10 2003-06-20 Teijin Dupont Films Japan Ltd 光学用易接着性積層フィルム

Similar Documents

Publication Publication Date Title
WO2009019968A1 (ja) 多層ポリイミドフィルム、積層板および金属張積層板
TW200727744A (en) Multilayer wiring board
WO2007008329A3 (en) Fluoropolymer containing laminates
DE602007006361D1 (de) Mehrschichtiges Sportbrett mit aufgedruckter graphischer Schicht
ATE534970T1 (de) In einen flexiblen mehrschichtigen träger eingebetteter transponder
TW200740891A (en) Polyester film
TW200702161A (en) Copper-clad laminated board
JP2012515671A5 (enExample)
JP2007001292A5 (enExample)
JP2012124460A5 (enExample)
WO2009069741A1 (ja) 金属積層体、led搭載基板、および、白色フィルム
EP1881748A3 (en) Multi-layer laminate substrates useful in electronic type appliactions
TW200709739A (en) Hinge board and method for producing the same
EP1764214A3 (en) Laminated polyester film, flame-retardant polyester film thereof copper-clad laminated plate and circuit substrate
TW200709751A (en) Polyimide copper foil laminate and method of producing the same
TWI346127B (en) Halogen-free epoxy resin composition, coverlay film, bonding sheet, prepreg, and laminate for printed wiring board
CN204466044U (zh) 一种软硬结合板
ATE459938T1 (de) Flacher transponder und verfahren zu seiner herstellung
EP1684558A3 (en) Multilayer printed circuit board
CN102946688A (zh) 可弯曲线路板
CN201563288U (zh) 具有较好遮旋旋光性能的柔性印刷电路板的白色覆盖膜
JP2004170715A5 (enExample)
JP2015159214A (ja) 電磁波シールドフィルム及びフレキシブルプリント基板
WO2009017051A1 (ja) 多層回路基板用複合体
JP2009190387A5 (enExample)