JP2006523040A - 螺旋状マイクロエレクトロニクス用コンタクトおよびその製造方法 - Google Patents

螺旋状マイクロエレクトロニクス用コンタクトおよびその製造方法 Download PDF

Info

Publication number
JP2006523040A
JP2006523040A JP2006509899A JP2006509899A JP2006523040A JP 2006523040 A JP2006523040 A JP 2006523040A JP 2006509899 A JP2006509899 A JP 2006509899A JP 2006509899 A JP2006509899 A JP 2006509899A JP 2006523040 A JP2006523040 A JP 2006523040A
Authority
JP
Japan
Prior art keywords
substrate
pad
contact
shape
trace
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006509899A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006523040A5 (enExample
Inventor
スコット イー． リンゼイ，
チャールズ エー． ミラー，
デイビッド エム． ロイスター，
スチュアート ダブリュー． ウェンツェル，
Original Assignee
フォームファクター，インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by フォームファクター，インコーポレイテッド filed Critical フォームファクター，インコーポレイテッド
Publication of JP2006523040A publication Critical patent/JP2006523040A/ja
Publication of JP2006523040A5 publication Critical patent/JP2006523040A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes)
    • H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes) consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H01R13/035—Plated dielectric material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/33—Contact members made of resilient wire
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/28—Clamped connections, spring connections
    • H01R4/48—Clamped connections, spring connections utilising a spring, clip, or other resilient member
    • H01R4/4854—Clamped connections, spring connections utilising a spring, clip, or other resilient member using a wire spring
    • H01R4/4863—Coil spring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06744—Microprobes, i.e. having dimensions as IC details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10265—Metallic coils or springs, e.g. as part of a connection element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/308—Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Ceramic Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
JP2006509899A 2003-04-10 2004-04-12 螺旋状マイクロエレクトロニクス用コンタクトおよびその製造方法 Pending JP2006523040A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/411,175 US6948940B2 (en) 2003-04-10 2003-04-10 Helical microelectronic contact and method for fabricating same
PCT/US2004/011115 WO2004093189A1 (en) 2003-04-10 2004-04-12 Helical microelectronic contact and method for fabricating same

Publications (2)

Publication Number Publication Date
JP2006523040A true JP2006523040A (ja) 2006-10-05
JP2006523040A5 JP2006523040A5 (enExample) 2007-06-14

Family

ID=33130922

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006509899A Pending JP2006523040A (ja) 2003-04-10 2004-04-12 螺旋状マイクロエレクトロニクス用コンタクトおよびその製造方法

Country Status (7)

Country Link
US (2) US6948940B2 (enExample)
EP (1) EP1616352A1 (enExample)
JP (1) JP2006523040A (enExample)
KR (1) KR20060002954A (enExample)
CN (1) CN1894792A (enExample)
TW (1) TWI338351B (enExample)
WO (1) WO2004093189A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008281519A (ja) * 2007-05-14 2008-11-20 Alps Electric Co Ltd プローブカードおよびその製造方法

Families Citing this family (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
SE522031C2 (sv) * 2001-07-12 2004-01-07 Perlos Ab Tvåkomponentsantenn samt förfarande för framställning av sådan
US20060051948A1 (en) * 2003-02-04 2006-03-09 Microfabrica Inc. Microprobe tips and methods for making
US7273812B2 (en) * 2002-05-07 2007-09-25 Microfabrica Inc. Microprobe tips and methods for making
US20060053625A1 (en) * 2002-05-07 2006-03-16 Microfabrica Inc. Microprobe tips and methods for making
US7412767B2 (en) * 2003-02-04 2008-08-19 Microfabrica, Inc. Microprobe tips and methods for making
US7363705B2 (en) * 2003-02-04 2008-04-29 Microfabrica, Inc. Method of making a contact
US7265565B2 (en) 2003-02-04 2007-09-04 Microfabrica Inc. Cantilever microprobes for contacting electronic components and methods for making such probes
US7241689B2 (en) * 2003-02-04 2007-07-10 Microfabrica Inc. Microprobe tips and methods for making
US20080211524A1 (en) * 2003-02-04 2008-09-04 Microfabrica Inc. Electrochemically Fabricated Microprobes
US10416192B2 (en) 2003-02-04 2019-09-17 Microfabrica Inc. Cantilever microprobes for contacting electronic components
US6948940B2 (en) * 2003-04-10 2005-09-27 Formfactor, Inc. Helical microelectronic contact and method for fabricating same
US7114961B2 (en) * 2003-04-11 2006-10-03 Neoconix, Inc. Electrical connector on a flexible carrier
US20080108221A1 (en) * 2003-12-31 2008-05-08 Microfabrica Inc. Microprobe Tips and Methods for Making
DE102004019588A1 (de) * 2004-04-22 2005-11-17 Osram Opto Semiconductors Gmbh Verfahren zur Strukturierung von zumindest einer Schicht sowie elektrisches Bauelement mit Strukturen aus der Schicht
DE102004030140B3 (de) * 2004-06-22 2006-01-19 Infineon Technologies Ag Flexible Kontaktierungsvorrichtung
US7688095B2 (en) * 2004-07-30 2010-03-30 International Business Machines Corporation Interposer structures and methods of manufacturing the same
KR100968184B1 (ko) * 2004-12-16 2010-07-05 인터내셔널 비지네스 머신즈 코포레이션 금속화 엘라스토머 전기 접점
US7771208B2 (en) 2004-12-16 2010-08-10 International Business Machines Corporation Metalized elastomeric electrical contacts
US7316572B2 (en) * 2005-02-03 2008-01-08 International Business Machines Corporation Compliant electrical contacts
JP2006261565A (ja) * 2005-03-18 2006-09-28 Alps Electric Co Ltd 電子機能部品実装体及びその製造方法
US7790987B2 (en) * 2005-04-27 2010-09-07 Sony Computer Entertainment Inc. Methods and apparatus for interconnecting a ball grid array to a printed circuit board
KR100852514B1 (ko) * 2006-07-31 2008-08-18 한국과학기술연구원 반도체 검사용 수직형 프로브 및 이 프로브를 구비한프로브 카드 및 그 제조방법
JP2008039502A (ja) * 2006-08-03 2008-02-21 Alps Electric Co Ltd 接触子およびその製造方法
JP2008060510A (ja) * 2006-09-04 2008-03-13 Alps Electric Co Ltd 半導体チップ搭載回路の製造方法および実装回路
KR100784753B1 (ko) * 2006-09-27 2007-12-13 (주)넴스프로브 3차원 포토리소그래피를 이용한 접속체 제조방법
US7674112B2 (en) * 2006-12-28 2010-03-09 Formfactor, Inc. Resilient contact element and methods of fabrication
US7585173B2 (en) * 2007-03-30 2009-09-08 Tyco Electronics Corporation Elastomeric electrical contact
US8832936B2 (en) * 2007-04-30 2014-09-16 International Business Machines Corporation Method of forming metallized elastomeric electrical contacts
TW200922009A (en) * 2007-12-07 2009-05-16 Jye Chuang Electronic Co Ltd Contact terminal
KR101004911B1 (ko) * 2008-08-12 2010-12-28 삼성전기주식회사 마이크로 전자기계적 부품 제조방법
US8278748B2 (en) 2010-02-17 2012-10-02 Maxim Integrated Products, Inc. Wafer-level packaged device having self-assembled resilient leads
JP5705882B2 (ja) * 2010-03-03 2015-04-22 コーニンクレッカ フィリップス エヌ ヴェ パーツのキット、接続装置、照明装置及び照明器具
US8686560B2 (en) 2010-04-07 2014-04-01 Maxim Integrated Products, Inc. Wafer-level chip-scale package device having bump assemblies configured to mitigate failures due to stress
CN105339173B (zh) * 2013-05-31 2018-10-09 惠普发展公司，有限责任合伙企业 修改对象的基层
CN104370272B (zh) * 2014-10-30 2016-07-06 无锡微奥科技有限公司 一种mems自对准高低梳齿及其制造方法
US9717148B2 (en) 2015-09-18 2017-07-25 Quartzdyne, Inc. Methods of forming a microelectronic device structure, and related microelectronic device structures and microelectronic devices
JP6805690B2 (ja) * 2016-09-30 2020-12-23 セイコーエプソン株式会社 Ｍｅｍｓデバイス、液体噴射ヘッド、液体噴射装置、及び、ｍｅｍｓデバイスの製造方法
US11262383B1 (en) 2018-09-26 2022-03-01 Microfabrica Inc. Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for making
US11973301B2 (en) 2018-09-26 2024-04-30 Microfabrica Inc. Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for making
US12078657B2 (en) 2019-12-31 2024-09-03 Microfabrica Inc. Compliant pin probes with extension springs, methods for making, and methods for using
US12181493B2 (en) 2018-10-26 2024-12-31 Microfabrica Inc. Compliant probes including dual independently operable probe contact elements including at least one flat extension spring, methods for making, and methods for using
US12000865B2 (en) 2019-02-14 2024-06-04 Microfabrica Inc. Multi-beam vertical probes with independent arms formed of a high conductivity metal for enhancing current carrying capacity and methods for making such probes
US11761982B1 (en) 2019-12-31 2023-09-19 Microfabrica Inc. Probes with planar unbiased spring elements for electronic component contact and methods for making such probes
US11867721B1 (en) 2019-12-31 2024-01-09 Microfabrica Inc. Probes with multiple springs, methods for making, and methods for using
US12196781B2 (en) 2019-12-31 2025-01-14 Microfabrica Inc. Probes with planar unbiased spring elements for electronic component contact, methods for making such probes, and methods for using such probes
US12196782B2 (en) 2019-12-31 2025-01-14 Microfabrica Inc. Probes with planar unbiased spring elements for electronic component contact, methods for making such probes, and methods for using such probes
US10937752B1 (en) * 2020-08-03 2021-03-02 Topline Corporation Lead free solder columns and methods for making same
US11774467B1 (en) 2020-09-01 2023-10-03 Microfabrica Inc. Method of in situ modulation of structural material properties and/or template shape
US12146898B2 (en) 2020-10-02 2024-11-19 Microfabrica Inc. Multi-beam probes with decoupled structural and current carrying beams and methods of making
FR3119048A1 (fr) * 2021-01-21 2022-07-22 Commissariat A L'energie Atomique Et Aux Energies Alternatives Interconnexion avec ame
CN116454647A (zh) * 2023-04-21 2023-07-18 苏试宜特(深圳)检测技术有限公司 先进封装芯片上样接地装置及方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001056345A (ja) * 1999-08-19 2001-02-27 Tokyo Electron Ltd プロービングカード及びその製造方法
WO2001075969A1 (de) * 2000-03-31 2001-10-11 Infineon Technologies Ag Elektronisches bauelement mit flexiblen kontaktierungsstellen und verfahren zu dessen herstellung
JP2003078078A (ja) * 2001-09-04 2003-03-14 Advanced Systems Japan Inc 電子部品用接続端子、これを用いたパッケージ、コネクタ、およびその製造方法
JP2003078075A (ja) * 2001-07-27 2003-03-14 Hewlett Packard Co <Hp> 電気接点を製造するための方法

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3881799A (en) * 1972-09-11 1975-05-06 George H Elliott Resilient multi-micro point metallic junction
US4466184A (en) * 1981-04-21 1984-08-21 General Dynamics, Pomona Division Method of making pressure point contact system
US5829128A (en) * 1993-11-16 1998-11-03 Formfactor, Inc. Method of mounting resilient contact structures to semiconductor devices
US5917707A (en) * 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
US5225771A (en) * 1988-05-16 1993-07-06 Dri Technology Corp. Making and testing an integrated circuit using high density probe points
DE3838413A1 (de) * 1988-11-12 1990-05-17 Mania Gmbh Adapter fuer elektronische pruefvorrichtungen fuer leiterplatten und dergl.
US5187020A (en) * 1990-07-31 1993-02-16 Texas Instruments Incorporated Compliant contact pad
US5090118A (en) * 1990-07-31 1992-02-25 Texas Instruments Incorporated High performance test head and method of making
US5092782A (en) * 1991-02-01 1992-03-03 Beaman Brian S Integral elastomeric card edge connector
US5172050A (en) * 1991-02-15 1992-12-15 Motorola, Inc. Micromachined semiconductor probe card
US5177438A (en) * 1991-08-02 1993-01-05 Motorola, Inc. Low resistance probe for semiconductor
JPH0618555A (ja) 1992-06-30 1994-01-25 Meisei Denshi Kogyo Kk マイクロスプリングコンタクト、マイクロスプリングコンタクトの集合体、該マイクロスプリングコンタクトの集合体からなる電気的接続用端子及びマイクロスプリングコンタクトの製造方法
JP3345948B2 (ja) 1993-03-16 2002-11-18 ジェイエスアール株式会社 プローブヘッドの製造方法
DE4310349C2 (de) * 1993-03-30 2000-11-16 Inst Mikrotechnik Mainz Gmbh Sensorkopf und Verfahren zu seiner Herstellung
JPH0782027B2 (ja) 1993-04-30 1995-09-06 フレッシュクエストコーポレーション テスト用コンタクトピンの製造方法
US5802699A (en) * 1994-06-07 1998-09-08 Tessera, Inc. Methods of assembling microelectronic assembly with socket for engaging bump leads
JPH07333232A (ja) 1994-06-13 1995-12-22 Canon Inc 探針を有するカンチレバーの形成方法
US6499216B1 (en) * 1994-07-07 2002-12-31 Tessera, Inc. Methods and structures for electronic probing arrays
US5476818A (en) * 1994-08-19 1995-12-19 Motorola, Inc. Semiconductor structure and method of manufacture
US5971253A (en) * 1995-07-31 1999-10-26 Tessera, Inc. Microelectronic component mounting with deformable shell terminals
JP2934202B2 (ja) * 1997-03-06 1999-08-16 山一電機株式会社 配線基板における導電バンプの形成方法
US6059982A (en) * 1997-09-30 2000-05-09 International Business Machines Corporation Micro probe assembly and method of fabrication
US6031282A (en) * 1998-08-27 2000-02-29 Advantest Corp. High performance integrated circuit chip package
JP3440243B2 (ja) * 2000-09-26 2003-08-25 株式会社アドバンストシステムズジャパン スパイラルコンタクタ
US6439894B1 (en) * 2001-01-31 2002-08-27 High Connection Density, Inc. Contact assembly for land grid array interposer or electrical connector
JP3814231B2 (ja) * 2002-06-10 2006-08-23 株式会社アドバンストシステムズジャパン スパイラルコンタクタ及びその製造方法、並びにそれを用いた半導体検査装置、及び電子部品
DE10239080A1 (de) * 2002-08-26 2004-03-11 Infineon Technologies Ag Integrierte Schaltung
US6948940B2 (en) * 2003-04-10 2005-09-27 Formfactor, Inc. Helical microelectronic contact and method for fabricating same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001056345A (ja) * 1999-08-19 2001-02-27 Tokyo Electron Ltd プロービングカード及びその製造方法
WO2001075969A1 (de) * 2000-03-31 2001-10-11 Infineon Technologies Ag Elektronisches bauelement mit flexiblen kontaktierungsstellen und verfahren zu dessen herstellung
JP2003078075A (ja) * 2001-07-27 2003-03-14 Hewlett Packard Co <Hp> 電気接点を製造するための方法
JP2003078078A (ja) * 2001-09-04 2003-03-14 Advanced Systems Japan Inc 電子部品用接続端子、これを用いたパッケージ、コネクタ、およびその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008281519A (ja) * 2007-05-14 2008-11-20 Alps Electric Co Ltd プローブカードおよびその製造方法

Also Published As

Publication number Publication date
US6948940B2 (en) 2005-09-27
US20040203262A1 (en) 2004-10-14
CN1894792A (zh) 2007-01-10
US20060024989A1 (en) 2006-02-02
EP1616352A1 (en) 2006-01-18
US7131848B2 (en) 2006-11-07
TW200503205A (en) 2005-01-16
KR20060002954A (ko) 2006-01-09
WO2004093189A1 (en) 2004-10-28
TWI338351B (en) 2011-03-01

Similar Documents

Publication Publication Date Title
JP2006523040A (ja) 螺旋状マイクロエレクトロニクス用コンタクトおよびその製造方法
KR100891066B1 (ko) 미세 전자 접속체, 미세 전자 접속체의 제조 방법, 반도체 장치 및 접속 구조물
CN101584033B (zh) 具有柔顺性的微电子组件及其方法
US7049837B2 (en) Probe sheet, probe card, semiconductor test equipment and semiconductor device fabrication method
US8213184B2 (en) Method of testing using a temporary chip attach carrier
US6708399B2 (en) Method for fabricating a test interconnect for bumped semiconductor components
US6016060A (en) Method, apparatus and system for testing bumped semiconductor components
JP2000502812A (ja) ウエハ・レベルのテストおよびバーンインのための集積化コンプライアント・プローブ
KR20120112879A (ko) 한번에 다수 방식으로 와이어 본드 프로브 카드를 구축하는 방법
US20010040464A1 (en) Electric contact device for testing semiconductor device
US20110043238A1 (en) Method of manufacturing needle for probe card using fine processing technology, needle manufactured by the method and probe card comprising the needle
JP2013138214A (ja) コンプライアンスを有する超小型電子アセンブリ

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070409

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20070409

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100427

RD03 Notification of appointment of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7423

Effective date: 20100513

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20100520

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20100726

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20100802

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100820

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20110926