JP2006517338A - 再結合領域を有するsoi電解効果トランジスタ素子及びその形成方法 - Google Patents
再結合領域を有するsoi電解効果トランジスタ素子及びその形成方法 Download PDFInfo
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- 238000005215 recombination Methods 0.000 title claims abstract description 19
- 230000005669 field effect Effects 0.000 title claims description 21
- 230000007547 defect Effects 0.000 claims abstract description 21
- 229910000577 Silicon-germanium Inorganic materials 0.000 claims abstract description 12
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000004065 semiconductor Substances 0.000 claims description 66
- 239000000758 substrate Substances 0.000 claims description 64
- 230000015572 biosynthetic process Effects 0.000 claims description 6
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 6
- 229910052732 germanium Inorganic materials 0.000 claims description 5
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- 150000001875 compounds Chemical class 0.000 claims 1
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- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 230000002040 relaxant effect Effects 0.000 abstract 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 14
- 229910052710 silicon Inorganic materials 0.000 description 14
- 239000010703 silicon Substances 0.000 description 14
- 230000008569 process Effects 0.000 description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- 239000013078 crystal Substances 0.000 description 10
- 108091006146 Channels Proteins 0.000 description 9
- 102000004129 N-Type Calcium Channels Human genes 0.000 description 6
- 108090000699 N-Type Calcium Channels Proteins 0.000 description 6
- 235000012239 silicon dioxide Nutrition 0.000 description 5
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- 238000013461 design Methods 0.000 description 2
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- 239000012212 insulator Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229910021332 silicide Inorganic materials 0.000 description 2
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical group [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
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- 238000005516 engineering process Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78696—Thin film transistors, i.e. transistors with a channel being at least partly a thin film characterised by the structure of the channel, e.g. multichannel, transverse or longitudinal shape, length or width, doping structure, or the overlap or alignment between the channel and the gate, the source or the drain, or the contacting structure of the channel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66742—Thin film unipolar transistors
- H01L29/66772—Monocristalline silicon transistors on insulating substrates, e.g. quartz substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78606—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
- H01L29/78612—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device for preventing the kink- or the snapback effect, e.g. discharging the minority carriers of the channel region for preventing bipolar effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78684—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising semiconductor materials of Group IV not being silicon, or alloys including an element of the group IV, e.g. Ge, SiN alloys, SiC alloys
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- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Thin Film Transistor (AREA)
Abstract
Description
Claims (16)
- 基板上に形成された電界効果トランジスタであって、
絶縁層310が形成された基板301を有し、
前記絶縁層310上に形成された結晶性の活性領域302を有し、前記結晶性の活性領域302は、第一の濃度の局所的な再結合中心を有した第一の領域321と第二の濃度の再結合中心を有した第二の領域320とを備え、前記第二の濃度は前記第一の濃度よりも高いものであり、
ドレイン領域304及びソース領域303を有し、かつ、
ゲート絶縁層307によって前記活性領域302から電気的に絶縁されたゲート電極306を有する、電界効果トランジスタ。 - 前記局所的な再結合中心は、前記第二の領域320に実質的に点欠陥を有する、請求項1記載の電界効果トランジスタ。
- 前記点欠陥は、実質的に張力のかかっていない半導体層に含まれる、請求項2記載の電界効果トランジスタ。
- 前記第二の領域320のバンドギャップエネルギーは、前記第一の領域321のバンドギャップエネルギーよりも低い、請求項1記載の電界効果トランジスタ。
- 前記第二の領域320は、前記絶縁層310と接している、請求項1記載の電界効果トランジスタ。
- 前記第二の領域320は前記ソース領域303と接している、請求項1記載の電界効果トランジスタ。
- 前記第二の領域320は前記ドレイン領域304と接している、請求項1記載の電界効果トランジスタ。
- 前記第二の領域320は少なくとも二つの別の材料を有する、請求項1記載の電界効果トランジスタ。
- 前記第二の領域320はゲルマニウムを有する、請求項7記載の電界効果トランジスタ。
- 前記第二の領域320はSixGe1−x型化合物を有し、xは約0.2>x>0.8の範囲である、請求項9記載の電界効果トランジスタ。
- 前記点欠陥濃度は1012/cm3より高い、請求項2記載の電界効果トランジスタ。
- 前記第二の領域320は複数の副層を有する、請求項3記載の電界効果トランジスタ。
- 前記第二の領域320の前記点欠陥濃度は前記トランジスタ素子の深さ方向に沿って連続的に変化する、請求項1記載の電界効果トランジスタ。
- 基板301上にトランジスタ素子を形成する方法であって、
絶縁層310が形成された基板301を用意し、
第一および第二の結晶性の半導体層321、320を形成し、これら第一及び第二の単結晶性の半導体層は、前記第二の半導体層320に張力を生じさせるように格子定数が異なっており、
前記第一及び第二の結晶性の半導体層321、320内およびこれら半導体層上にトランジスタ素子を形成し、前記トランジスタ素子の形成中の一回以上の熱処理により前記張力が低減されて、前記第二の半導体層320に点欠陥密度を生成し、該点欠陥密度は前記第一の半導体層321の点欠陥密度よりも高くされている、方法。 - 前記第一および第二の半導体層321、320の形成では、
結晶性のドナー基板上に前記第二の半導体層320がエピタキシャル成長され、
前記第二の半導体層320を前記絶縁層310層上に位置させて前記基板301と前記結晶性のドナー基板とを互いに結合させる、請求項14記載の方法。 - 前記第二の半導体層320は、SixGe1−xの組成を有するシリコンゲルマニウム層を有し、xは約0.2>x>0.8の範囲である、請求項14記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10229003.2A DE10229003B4 (de) | 2002-06-28 | 2002-06-28 | Ein Verfahren zur Herstellung eines SOI-Feldeffekttransistorelements mit einem Rekombinationsgebiet |
US10/391,255 US6812074B2 (en) | 2002-06-28 | 2003-03-18 | SOI field effect transistor element having a recombination region and method of forming same |
PCT/US2003/020791 WO2004004015A2 (en) | 2002-06-28 | 2003-06-24 | Soi field effect transistor element having a recombination region and method of forming same |
Publications (3)
Publication Number | Publication Date |
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JP2006517338A true JP2006517338A (ja) | 2006-07-20 |
JP2006517338A5 JP2006517338A5 (ja) | 2006-08-31 |
JP4667865B2 JP4667865B2 (ja) | 2011-04-13 |
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JP2004518195A Expired - Lifetime JP4667865B2 (ja) | 2002-06-28 | 2003-06-24 | 異なる再結合中心密度を有する結晶性半導体層を備えた電界効果トランジスタ及びその形成方法 |
Country Status (7)
Country | Link |
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US (1) | US20050037548A1 (ja) |
EP (1) | EP1523775B1 (ja) |
JP (1) | JP4667865B2 (ja) |
CN (1) | CN100477271C (ja) |
AU (1) | AU2003267981A1 (ja) |
TW (1) | TWI282174B (ja) |
WO (1) | WO2004004015A2 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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US7709317B2 (en) * | 2005-11-14 | 2010-05-04 | International Business Machines Corporation | Method to increase strain enhancement with spacerless FET and dual liner process |
US7929343B2 (en) * | 2009-04-07 | 2011-04-19 | Micron Technology, Inc. | Methods, devices, and systems relating to memory cells having a floating body |
US8148780B2 (en) | 2009-03-24 | 2012-04-03 | Micron Technology, Inc. | Devices and systems relating to a memory cell having a floating body |
FR3051595B1 (fr) * | 2016-05-17 | 2022-11-18 | Soitec Silicon On Insulator | Procede de fabrication d'un substrat de type semi-conducteur contraint sur isolant |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06112491A (ja) * | 1992-08-10 | 1994-04-22 | Internatl Business Mach Corp <Ibm> | 電界効果トランジスタ |
JPH0750417A (ja) * | 1993-08-06 | 1995-02-21 | Canon Inc | 半導体装置 |
JPH09321307A (ja) * | 1996-05-29 | 1997-12-12 | Toshiba Corp | 半導体装置 |
JPH1174538A (ja) * | 1997-06-19 | 1999-03-16 | Matsushita Electric Ind Co Ltd | 半導体装置及びその製造方法 |
Family Cites Families (6)
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EP0616370B1 (en) * | 1993-03-16 | 2004-06-09 | Canon Kabushiki Kaisha | Semiconductor device comprising a lateral bipolar transistor including SiGe and method of manufacturing the same |
US6153920A (en) * | 1994-12-01 | 2000-11-28 | Lucent Technologies Inc. | Process for controlling dopant diffusion in a semiconductor layer and semiconductor device formed thereby |
US6337500B1 (en) * | 1997-06-19 | 2002-01-08 | Matsushita Electric Industrial Co., Ltd. | Semiconductor device and method for fabricating the same |
US6395587B1 (en) * | 2000-02-11 | 2002-05-28 | International Business Machines Corporation | Fully amorphized source/drain for leaky junctions |
US6593625B2 (en) * | 2001-06-12 | 2003-07-15 | International Business Machines Corporation | Relaxed SiGe layers on Si or silicon-on-insulator substrates by ion implantation and thermal annealing |
US6689671B1 (en) * | 2002-05-22 | 2004-02-10 | Advanced Micro Devices, Inc. | Low temperature solid-phase epitaxy fabrication process for MOS devices built on strained semiconductor substrate |
-
2003
- 2003-06-24 AU AU2003267981A patent/AU2003267981A1/en not_active Abandoned
- 2003-06-24 WO PCT/US2003/020791 patent/WO2004004015A2/en active Application Filing
- 2003-06-24 CN CNB038150360A patent/CN100477271C/zh not_active Expired - Lifetime
- 2003-06-24 JP JP2004518195A patent/JP4667865B2/ja not_active Expired - Lifetime
- 2003-06-24 EP EP03748928.3A patent/EP1523775B1/en not_active Expired - Lifetime
- 2003-06-24 TW TW092117061A patent/TWI282174B/zh not_active IP Right Cessation
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2004
- 2004-09-24 US US10/949,089 patent/US20050037548A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06112491A (ja) * | 1992-08-10 | 1994-04-22 | Internatl Business Mach Corp <Ibm> | 電界効果トランジスタ |
JPH0750417A (ja) * | 1993-08-06 | 1995-02-21 | Canon Inc | 半導体装置 |
JPH09321307A (ja) * | 1996-05-29 | 1997-12-12 | Toshiba Corp | 半導体装置 |
JPH1174538A (ja) * | 1997-06-19 | 1999-03-16 | Matsushita Electric Ind Co Ltd | 半導体装置及びその製造方法 |
Also Published As
Publication number | Publication date |
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WO2004004015A2 (en) | 2004-01-08 |
JP4667865B2 (ja) | 2011-04-13 |
EP1523775B1 (en) | 2013-07-31 |
AU2003267981A1 (en) | 2004-01-19 |
WO2004004015A3 (en) | 2004-04-08 |
TWI282174B (en) | 2007-06-01 |
TW200403852A (en) | 2004-03-01 |
EP1523775A2 (en) | 2005-04-20 |
CN1663052A (zh) | 2005-08-31 |
CN100477271C (zh) | 2009-04-08 |
US20050037548A1 (en) | 2005-02-17 |
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