JP2006511801A5 - - Google Patents

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Publication number
JP2006511801A5
JP2006511801A5 JP2004563776A JP2004563776A JP2006511801A5 JP 2006511801 A5 JP2006511801 A5 JP 2006511801A5 JP 2004563776 A JP2004563776 A JP 2004563776A JP 2004563776 A JP2004563776 A JP 2004563776A JP 2006511801 A5 JP2006511801 A5 JP 2006511801A5
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JP
Japan
Prior art keywords
sensors
sensor
thickness
pair
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004563776A
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English (en)
Japanese (ja)
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JP2006511801A (ja
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Publication date
Priority claimed from US10/328,884 external-priority patent/US6894491B2/en
Application filed filed Critical
Publication of JP2006511801A publication Critical patent/JP2006511801A/ja
Publication of JP2006511801A5 publication Critical patent/JP2006511801A5/ja
Pending legal-status Critical Current

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JP2004563776A 2002-12-23 2003-12-17 相補的なセンサを用いた測定処理制御のための方法および装置 Pending JP2006511801A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/328,884 US6894491B2 (en) 2002-12-23 2002-12-23 Method and apparatus for metrological process control implementing complementary sensors
PCT/US2003/040391 WO2004059242A1 (en) 2002-12-23 2003-12-17 Method and apparatus for metrological process control implementing complimentary sensors

Publications (2)

Publication Number Publication Date
JP2006511801A JP2006511801A (ja) 2006-04-06
JP2006511801A5 true JP2006511801A5 (https=) 2006-06-01

Family

ID=32594613

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004563776A Pending JP2006511801A (ja) 2002-12-23 2003-12-17 相補的なセンサを用いた測定処理制御のための方法および装置

Country Status (8)

Country Link
US (2) US6894491B2 (https=)
EP (1) EP1576336A1 (https=)
JP (1) JP2006511801A (https=)
KR (1) KR20050086934A (https=)
CN (1) CN100347516C (https=)
AU (1) AU2003297336A1 (https=)
TW (1) TWI227775B (https=)
WO (1) WO2004059242A1 (https=)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6894491B2 (en) * 2002-12-23 2005-05-17 Lam Research Corporation Method and apparatus for metrological process control implementing complementary sensors
US7204639B1 (en) * 2003-09-26 2007-04-17 Lam Research Corporation Method and apparatus for thin metal film thickness measurement
US7667588B2 (en) * 2004-09-27 2010-02-23 Siemens Industry, Inc. Cage telemetry module and system
US7173418B2 (en) * 2005-06-30 2007-02-06 Lam Research Corporation Methods and apparatus for optimizing an electrical response to a set of conductive layers on a substrate
US7537511B2 (en) * 2006-03-14 2009-05-26 Micron Technology, Inc. Embedded fiber acoustic sensor for CMP process endpoint
JP2009076922A (ja) * 2007-09-24 2009-04-09 Applied Materials Inc 連続的半径測定によるウェハ縁の特徴付け
JP5513821B2 (ja) * 2009-09-17 2014-06-04 株式会社荏原製作所 渦電流センサ、研磨装置、めっき装置、研磨方法、めっき方法
US9275917B2 (en) 2013-10-29 2016-03-01 Applied Materials, Inc. Determination of gain for eddy current sensor
US9281253B2 (en) 2013-10-29 2016-03-08 Applied Materials, Inc. Determination of gain for eddy current sensor
US9636797B2 (en) 2014-02-12 2017-05-02 Applied Materials, Inc. Adjusting eddy current measurements
US10818564B2 (en) * 2016-03-11 2020-10-27 Applied Materials, Inc. Wafer processing tool having a micro sensor
JP2018083267A (ja) * 2016-11-25 2018-05-31 株式会社荏原製作所 研磨装置及び研磨方法
US11199605B2 (en) 2017-01-13 2021-12-14 Applied Materials, Inc. Resistivity-based adjustment of measurements from in-situ monitoring
TWI816620B (zh) 2017-04-21 2023-09-21 美商應用材料股份有限公司 使用神經網路來監測的拋光裝置
TWI825075B (zh) 2018-04-03 2023-12-11 美商應用材料股份有限公司 針對墊子厚度使用機器學習及補償的拋光裝置、拋光系統、方法及電腦儲存媒體
CN118943037A (zh) 2018-09-26 2024-11-12 应用材料公司 针对原位电磁感应监测的边缘重建中的基板掺杂的补偿
CN109341508B (zh) * 2018-12-12 2021-05-18 爱德森（厦门）电子有限公司 一种在役钢轨轨腰厚度非接触检测装置及方法
KR20250073489A (ko) 2020-05-14 2025-05-27 어플라이드 머티어리얼스, 인코포레이티드 연마 동안의 인-시튜 모니터링에 사용하기 위한 신경망을 훈련시키기 위한 기법 및 연마 시스템
JP7447284B2 (ja) 2020-06-24 2024-03-11 アプライド マテリアルズ インコーポレイテッド 研磨パッドの摩耗補償による基板層の厚さの決定
US20250087462A1 (en) * 2023-09-08 2025-03-13 Applied Materials, Inc. Radio-frequency (rf) matching network and tuning technique

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3815017A (en) * 1967-02-23 1974-06-04 M Brunner Beat frequency method and apparatus for measuring the thickness of a layer of material overlying a metallic surface
JPS63107022A (ja) * 1986-10-24 1988-05-12 Hitachi Ltd マスクとウエハ間の間隙測定装置
JPH0158110U (https=) * 1987-10-07 1989-04-11
JPH01129607U (https=) * 1988-02-18 1989-09-04
DE4327712C2 (de) * 1993-08-18 1997-07-10 Micro Epsilon Messtechnik Sensoranordnung und Verfahren zum Erfassen von Eigenschaften der Oberflächenschicht eines metallischen Targets
US5559428A (en) * 1995-04-10 1996-09-24 International Business Machines Corporation In-situ monitoring of the change in thickness of films
JPH08339982A (ja) * 1995-06-13 1996-12-24 Toshiba Corp 半導体製造装置及び半導体装置の製造方法
DE59610353D1 (de) * 1995-12-22 2003-05-22 Siemens Ag Bestimmung der dicke einer elektrisch leitfähigen schicht
JP3220937B2 (ja) * 1997-09-05 2001-10-22 株式会社東京精密 ウェーハ研磨装置
JP2000283702A (ja) * 1999-03-31 2000-10-13 Fotonikusu:Kk 距離センサおよび距離測定装置
JP3854056B2 (ja) * 1999-12-13 2006-12-06 株式会社荏原製作所 基板膜厚測定方法、基板膜厚測定装置、基板処理方法及び基板処理装置
US6894491B2 (en) * 2002-12-23 2005-05-17 Lam Research Corporation Method and apparatus for metrological process control implementing complementary sensors

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