CN100347516C - 用于实施互补传感器的测量过程控制的方法和设备 - Google Patents

用于实施互补传感器的测量过程控制的方法和设备 Download PDF

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Publication number
CN100347516C
CN100347516C CNB2003801074568A CN200380107456A CN100347516C CN 100347516 C CN100347516 C CN 100347516C CN B2003801074568 A CNB2003801074568 A CN B2003801074568A CN 200380107456 A CN200380107456 A CN 200380107456A CN 100347516 C CN100347516 C CN 100347516C
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China
Prior art keywords
sensors
sensor
wafer
thickness
signal
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Expired - Fee Related
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CNB2003801074568A
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English (en)
Chinese (zh)
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CN1732369A (zh
Inventor
Y·戈特基斯
R·基斯特勒
A·奥夫查尔茨
D·亨克尔
N·J·布赖特
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Applied Materials Inc
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Lam Research Corp
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
    • G01B7/06—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/238—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
CNB2003801074568A 2002-12-23 2003-12-17 用于实施互补传感器的测量过程控制的方法和设备 Expired - Fee Related CN100347516C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/328,884 2002-12-23
US10/328,884 US6894491B2 (en) 2002-12-23 2002-12-23 Method and apparatus for metrological process control implementing complementary sensors

Publications (2)

Publication Number Publication Date
CN1732369A CN1732369A (zh) 2006-02-08
CN100347516C true CN100347516C (zh) 2007-11-07

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Family Applications (1)

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CNB2003801074568A Expired - Fee Related CN100347516C (zh) 2002-12-23 2003-12-17 用于实施互补传感器的测量过程控制的方法和设备

Country Status (8)

Country Link
US (2) US6894491B2 (https=)
EP (1) EP1576336A1 (https=)
JP (1) JP2006511801A (https=)
KR (1) KR20050086934A (https=)
CN (1) CN100347516C (https=)
AU (1) AU2003297336A1 (https=)
TW (1) TWI227775B (https=)
WO (1) WO2004059242A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109341508A (zh) * 2018-12-12 2019-02-15 爱德森（厦门）电子有限公司 一种在役钢轨轨腰厚度非接触检测装置及方法

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6894491B2 (en) * 2002-12-23 2005-05-17 Lam Research Corporation Method and apparatus for metrological process control implementing complementary sensors
US7204639B1 (en) * 2003-09-26 2007-04-17 Lam Research Corporation Method and apparatus for thin metal film thickness measurement
US7667588B2 (en) * 2004-09-27 2010-02-23 Siemens Industry, Inc. Cage telemetry module and system
US7173418B2 (en) * 2005-06-30 2007-02-06 Lam Research Corporation Methods and apparatus for optimizing an electrical response to a set of conductive layers on a substrate
US7537511B2 (en) * 2006-03-14 2009-05-26 Micron Technology, Inc. Embedded fiber acoustic sensor for CMP process endpoint
JP2009076922A (ja) * 2007-09-24 2009-04-09 Applied Materials Inc 連続的半径測定によるウェハ縁の特徴付け
JP5513821B2 (ja) * 2009-09-17 2014-06-04 株式会社荏原製作所 渦電流センサ、研磨装置、めっき装置、研磨方法、めっき方法
US9275917B2 (en) 2013-10-29 2016-03-01 Applied Materials, Inc. Determination of gain for eddy current sensor
US9281253B2 (en) 2013-10-29 2016-03-08 Applied Materials, Inc. Determination of gain for eddy current sensor
US9636797B2 (en) 2014-02-12 2017-05-02 Applied Materials, Inc. Adjusting eddy current measurements
US10818564B2 (en) * 2016-03-11 2020-10-27 Applied Materials, Inc. Wafer processing tool having a micro sensor
JP2018083267A (ja) * 2016-11-25 2018-05-31 株式会社荏原製作所 研磨装置及び研磨方法
US11199605B2 (en) 2017-01-13 2021-12-14 Applied Materials, Inc. Resistivity-based adjustment of measurements from in-situ monitoring
TWI816620B (zh) 2017-04-21 2023-09-21 美商應用材料股份有限公司 使用神經網路來監測的拋光裝置
TWI825075B (zh) 2018-04-03 2023-12-11 美商應用材料股份有限公司 針對墊子厚度使用機器學習及補償的拋光裝置、拋光系統、方法及電腦儲存媒體
CN118943037A (zh) 2018-09-26 2024-11-12 应用材料公司 针对原位电磁感应监测的边缘重建中的基板掺杂的补偿
KR20250073489A (ko) 2020-05-14 2025-05-27 어플라이드 머티어리얼스, 인코포레이티드 연마 동안의 인-시튜 모니터링에 사용하기 위한 신경망을 훈련시키기 위한 기법 및 연마 시스템
JP7447284B2 (ja) 2020-06-24 2024-03-11 アプライド マテリアルズ インコーポレイテッド 研磨パッドの摩耗補償による基板層の厚さの決定
US20250087462A1 (en) * 2023-09-08 2025-03-13 Applied Materials, Inc. Radio-frequency (rf) matching network and tuning technique

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3815017A (en) * 1967-02-23 1974-06-04 M Brunner Beat frequency method and apparatus for measuring the thickness of a layer of material overlying a metallic surface
US5525903A (en) * 1993-08-18 1996-06-11 Micro-Epsilon Messtechnik Gmbh & Co. Kg Eddy current method of acquiring the surface layer properties of a metallic target
US5559428A (en) * 1995-04-10 1996-09-24 International Business Machines Corporation In-situ monitoring of the change in thickness of films
US6040694A (en) * 1995-12-22 2000-03-21 Siemens Aktiengesellschaft Method and device for determining the thickness of an electrically conductive layer

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63107022A (ja) * 1986-10-24 1988-05-12 Hitachi Ltd マスクとウエハ間の間隙測定装置
JPH0158110U (https=) * 1987-10-07 1989-04-11
JPH01129607U (https=) * 1988-02-18 1989-09-04
JPH08339982A (ja) * 1995-06-13 1996-12-24 Toshiba Corp 半導体製造装置及び半導体装置の製造方法
JP3220937B2 (ja) * 1997-09-05 2001-10-22 株式会社東京精密 ウェーハ研磨装置
JP2000283702A (ja) * 1999-03-31 2000-10-13 Fotonikusu:Kk 距離センサおよび距離測定装置
JP3854056B2 (ja) * 1999-12-13 2006-12-06 株式会社荏原製作所 基板膜厚測定方法、基板膜厚測定装置、基板処理方法及び基板処理装置
US6894491B2 (en) * 2002-12-23 2005-05-17 Lam Research Corporation Method and apparatus for metrological process control implementing complementary sensors

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3815017A (en) * 1967-02-23 1974-06-04 M Brunner Beat frequency method and apparatus for measuring the thickness of a layer of material overlying a metallic surface
US5525903A (en) * 1993-08-18 1996-06-11 Micro-Epsilon Messtechnik Gmbh & Co. Kg Eddy current method of acquiring the surface layer properties of a metallic target
US5559428A (en) * 1995-04-10 1996-09-24 International Business Machines Corporation In-situ monitoring of the change in thickness of films
US6040694A (en) * 1995-12-22 2000-03-21 Siemens Aktiengesellschaft Method and device for determining the thickness of an electrically conductive layer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109341508A (zh) * 2018-12-12 2019-02-15 爱德森（厦门）电子有限公司 一种在役钢轨轨腰厚度非接触检测装置及方法

Also Published As

Publication number Publication date
US6922053B2 (en) 2005-07-26
CN1732369A (zh) 2006-02-08
WO2004059242A1 (en) 2004-07-15
US6894491B2 (en) 2005-05-17
TW200422588A (en) 2004-11-01
AU2003297336A1 (en) 2004-07-22
US20040119468A1 (en) 2004-06-24
EP1576336A1 (en) 2005-09-21
US20050007107A1 (en) 2005-01-13
TWI227775B (en) 2005-02-11
JP2006511801A (ja) 2006-04-06
KR20050086934A (ko) 2005-08-30

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