JP2006511801A - 相補的なセンサを用いた測定処理制御のための方法および装置 - Google Patents

相補的なセンサを用いた測定処理制御のための方法および装置 Download PDF

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Publication number
JP2006511801A
JP2006511801A JP2004563776A JP2004563776A JP2006511801A JP 2006511801 A JP2006511801 A JP 2006511801A JP 2004563776 A JP2004563776 A JP 2004563776A JP 2004563776 A JP2004563776 A JP 2004563776A JP 2006511801 A JP2006511801 A JP 2006511801A
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Japan
Prior art keywords
sensors
sensor
wafer
layer
thickness
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JP2004563776A
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Japanese (ja)
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JP2006511801A5 (https=
Inventor
ゴットキス・イヒエル
キストラー・ロッドニー
オウクザーズ・アレクサンダー
ヘンカー・デイビッド
ブライト・ニコラス・ジェイ．
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Lam Research Corp
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Lam Research Corp
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Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of JP2006511801A publication Critical patent/JP2006511801A/ja
Publication of JP2006511801A5 publication Critical patent/JP2006511801A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
    • G01B7/06—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/238—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
JP2004563776A 2002-12-23 2003-12-17 相補的なセンサを用いた測定処理制御のための方法および装置 Pending JP2006511801A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/328,884 US6894491B2 (en) 2002-12-23 2002-12-23 Method and apparatus for metrological process control implementing complementary sensors
PCT/US2003/040391 WO2004059242A1 (en) 2002-12-23 2003-12-17 Method and apparatus for metrological process control implementing complimentary sensors

Publications (2)

Publication Number Publication Date
JP2006511801A true JP2006511801A (ja) 2006-04-06
JP2006511801A5 JP2006511801A5 (https=) 2006-06-01

Family

ID=32594613

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004563776A Pending JP2006511801A (ja) 2002-12-23 2003-12-17 相補的なセンサを用いた測定処理制御のための方法および装置

Country Status (8)

Country Link
US (2) US6894491B2 (https=)
EP (1) EP1576336A1 (https=)
JP (1) JP2006511801A (https=)
KR (1) KR20050086934A (https=)
CN (1) CN100347516C (https=)
AU (1) AU2003297336A1 (https=)
TW (1) TWI227775B (https=)
WO (1) WO2004059242A1 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009500829A (ja) * 2005-06-30 2009-01-08 ラム リサーチ コーポレーション 導電層の電気的応答を最適化するための方法、及びその装置
JP2009076922A (ja) * 2007-09-24 2009-04-09 Applied Materials Inc 連続的半径測定によるウェハ縁の特徴付け
JP2011064590A (ja) * 2009-09-17 2011-03-31 Ebara Corp 渦電流センサ、研磨装置、めっき装置、研磨方法、めっき方法

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6894491B2 (en) * 2002-12-23 2005-05-17 Lam Research Corporation Method and apparatus for metrological process control implementing complementary sensors
US7204639B1 (en) * 2003-09-26 2007-04-17 Lam Research Corporation Method and apparatus for thin metal film thickness measurement
US7667588B2 (en) * 2004-09-27 2010-02-23 Siemens Industry, Inc. Cage telemetry module and system
US7537511B2 (en) * 2006-03-14 2009-05-26 Micron Technology, Inc. Embedded fiber acoustic sensor for CMP process endpoint
US9275917B2 (en) 2013-10-29 2016-03-01 Applied Materials, Inc. Determination of gain for eddy current sensor
US9281253B2 (en) 2013-10-29 2016-03-08 Applied Materials, Inc. Determination of gain for eddy current sensor
US9636797B2 (en) 2014-02-12 2017-05-02 Applied Materials, Inc. Adjusting eddy current measurements
US10818564B2 (en) * 2016-03-11 2020-10-27 Applied Materials, Inc. Wafer processing tool having a micro sensor
JP2018083267A (ja) * 2016-11-25 2018-05-31 株式会社荏原製作所 研磨装置及び研磨方法
US11199605B2 (en) 2017-01-13 2021-12-14 Applied Materials, Inc. Resistivity-based adjustment of measurements from in-situ monitoring
TWI816620B (zh) 2017-04-21 2023-09-21 美商應用材料股份有限公司 使用神經網路來監測的拋光裝置
TWI825075B (zh) 2018-04-03 2023-12-11 美商應用材料股份有限公司 針對墊子厚度使用機器學習及補償的拋光裝置、拋光系統、方法及電腦儲存媒體
CN118943037A (zh) 2018-09-26 2024-11-12 应用材料公司 针对原位电磁感应监测的边缘重建中的基板掺杂的补偿
CN109341508B (zh) * 2018-12-12 2021-05-18 爱德森（厦门）电子有限公司 一种在役钢轨轨腰厚度非接触检测装置及方法
KR20250073489A (ko) 2020-05-14 2025-05-27 어플라이드 머티어리얼스, 인코포레이티드 연마 동안의 인-시튜 모니터링에 사용하기 위한 신경망을 훈련시키기 위한 기법 및 연마 시스템
JP7447284B2 (ja) 2020-06-24 2024-03-11 アプライド マテリアルズ インコーポレイテッド 研磨パッドの摩耗補償による基板層の厚さの決定
US20250087462A1 (en) * 2023-09-08 2025-03-13 Applied Materials, Inc. Radio-frequency (rf) matching network and tuning technique

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63107022A (ja) * 1986-10-24 1988-05-12 Hitachi Ltd マスクとウエハ間の間隙測定装置
JPH0158110U (https=) * 1987-10-07 1989-04-11
JPH01129607U (https=) * 1988-02-18 1989-09-04
JPH08285514A (ja) * 1995-04-10 1996-11-01 Internatl Business Mach Corp <Ibm> フィルム厚の変化のその場での監視方法
JPH08339982A (ja) * 1995-06-13 1996-12-24 Toshiba Corp 半導体製造装置及び半導体装置の製造方法
JPH1177519A (ja) * 1997-09-05 1999-03-23 Tokyo Seimitsu Co Ltd ウェーハ研磨装置
JP2000283702A (ja) * 1999-03-31 2000-10-13 Fotonikusu:Kk 距離センサおよび距離測定装置
JP2001235311A (ja) * 1999-12-13 2001-08-31 Ebara Corp 基板膜厚測定方法、基板膜厚測定装置及び基板処理装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3815017A (en) * 1967-02-23 1974-06-04 M Brunner Beat frequency method and apparatus for measuring the thickness of a layer of material overlying a metallic surface
DE4327712C2 (de) * 1993-08-18 1997-07-10 Micro Epsilon Messtechnik Sensoranordnung und Verfahren zum Erfassen von Eigenschaften der Oberflächenschicht eines metallischen Targets
DE59610353D1 (de) * 1995-12-22 2003-05-22 Siemens Ag Bestimmung der dicke einer elektrisch leitfähigen schicht
US6894491B2 (en) * 2002-12-23 2005-05-17 Lam Research Corporation Method and apparatus for metrological process control implementing complementary sensors

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63107022A (ja) * 1986-10-24 1988-05-12 Hitachi Ltd マスクとウエハ間の間隙測定装置
JPH0158110U (https=) * 1987-10-07 1989-04-11
JPH01129607U (https=) * 1988-02-18 1989-09-04
JPH08285514A (ja) * 1995-04-10 1996-11-01 Internatl Business Mach Corp <Ibm> フィルム厚の変化のその場での監視方法
JPH08339982A (ja) * 1995-06-13 1996-12-24 Toshiba Corp 半導体製造装置及び半導体装置の製造方法
JPH1177519A (ja) * 1997-09-05 1999-03-23 Tokyo Seimitsu Co Ltd ウェーハ研磨装置
JP2000283702A (ja) * 1999-03-31 2000-10-13 Fotonikusu:Kk 距離センサおよび距離測定装置
JP2001235311A (ja) * 1999-12-13 2001-08-31 Ebara Corp 基板膜厚測定方法、基板膜厚測定装置及び基板処理装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009500829A (ja) * 2005-06-30 2009-01-08 ラム リサーチ コーポレーション 導電層の電気的応答を最適化するための方法、及びその装置
JP2009076922A (ja) * 2007-09-24 2009-04-09 Applied Materials Inc 連続的半径測定によるウェハ縁の特徴付け
JP2011064590A (ja) * 2009-09-17 2011-03-31 Ebara Corp 渦電流センサ、研磨装置、めっき装置、研磨方法、めっき方法

Also Published As

Publication number Publication date
US6922053B2 (en) 2005-07-26
CN1732369A (zh) 2006-02-08
WO2004059242A1 (en) 2004-07-15
US6894491B2 (en) 2005-05-17
TW200422588A (en) 2004-11-01
CN100347516C (zh) 2007-11-07
AU2003297336A1 (en) 2004-07-22
US20040119468A1 (en) 2004-06-24
EP1576336A1 (en) 2005-09-21
US20050007107A1 (en) 2005-01-13
TWI227775B (en) 2005-02-11
KR20050086934A (ko) 2005-08-30

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