JP2006510221A - オーバーモールド・プラスチック・パッケージ用ヒートシンクまたはフラグ用の微小モールドロック - Google Patents

オーバーモールド・プラスチック・パッケージ用ヒートシンクまたはフラグ用の微小モールドロック Download PDF

Info

Publication number
JP2006510221A
JP2006510221A JP2004560294A JP2004560294A JP2006510221A JP 2006510221 A JP2006510221 A JP 2006510221A JP 2004560294 A JP2004560294 A JP 2004560294A JP 2004560294 A JP2004560294 A JP 2004560294A JP 2006510221 A JP2006510221 A JP 2006510221A
Authority
JP
Japan
Prior art keywords
heat sink
main channel
mold
plastic molding
mold lock
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004560294A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006510221A5 (enExample
Inventor
ジェイ． エリオット、アレクサンダー
マーリンガム、エル．エム．
エム． ストローム、ウィリアム
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NXP USA Inc
Original Assignee
NXP USA Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NXP USA Inc filed Critical NXP USA Inc
Publication of JP2006510221A publication Critical patent/JP2006510221A/ja
Publication of JP2006510221A5 publication Critical patent/JP2006510221A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4878—Mechanical treatment, e.g. deforming
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
JP2004560294A 2002-12-13 2003-09-30 オーバーモールド・プラスチック・パッケージ用ヒートシンクまたはフラグ用の微小モールドロック Pending JP2006510221A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/318,699 US7091602B2 (en) 2002-12-13 2002-12-13 Miniature moldlocks for heatsink or flag for an overmolded plastic package
PCT/US2003/030859 WO2004055889A1 (en) 2002-12-13 2003-09-30 Miniature moldlocks for heatsink or flag for an overmolded plastic package

Publications (2)

Publication Number Publication Date
JP2006510221A true JP2006510221A (ja) 2006-03-23
JP2006510221A5 JP2006510221A5 (enExample) 2006-11-24

Family

ID=32506436

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004560294A Pending JP2006510221A (ja) 2002-12-13 2003-09-30 オーバーモールド・プラスチック・パッケージ用ヒートシンクまたはフラグ用の微小モールドロック

Country Status (7)

Country Link
US (2) US7091602B2 (enExample)
JP (1) JP2006510221A (enExample)
KR (1) KR101017533B1 (enExample)
CN (1) CN100407412C (enExample)
AU (1) AU2003277127A1 (enExample)
TW (1) TWI321834B (enExample)
WO (1) WO2004055889A1 (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005327767A (ja) * 2004-05-12 2005-11-24 Dowa Mining Co Ltd 窪み加工銅板もしくは銅合金板、その製造方法、および順送金型
JP2013157536A (ja) * 2012-01-31 2013-08-15 Shinko Electric Ind Co Ltd リードフレーム及びその製造方法と半導体装置及びその製造方法
JP2017005124A (ja) * 2015-06-11 2017-01-05 Ｓｈマテリアル株式会社 リードフレーム、リードフレームの製造方法、および半導体装置
WO2024075445A1 (ja) * 2022-10-06 2024-04-11 富士電機株式会社 半導体モジュール、半導体装置、及び車両
WO2024090029A1 (ja) * 2022-10-25 2024-05-02 富士電機株式会社 半導体モジュール、半導体装置、及び車両

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7091602B2 (en) * 2002-12-13 2006-08-15 Freescale Semiconductor, Inc. Miniature moldlocks for heatsink or flag for an overmolded plastic package
SG157957A1 (en) * 2003-01-29 2010-01-29 Interplex Qlp Inc Package for integrated circuit die
US7061025B2 (en) * 2003-03-10 2006-06-13 Mccolloch Lawrence R Optoelectronic device packaging assemblies and methods of making the same
US7446411B2 (en) * 2005-10-24 2008-11-04 Freescale Semiconductor, Inc. Semiconductor structure and method of assembly
US8030742B2 (en) * 2007-11-30 2011-10-04 Infineon Technologies Electronic device having profiled elements extending from planar surfaces
US7834431B2 (en) * 2008-04-08 2010-11-16 Freescale Semiconductor, Inc. Leadframe for packaged electronic device with enhanced mold locking capability
US8124447B2 (en) * 2009-04-10 2012-02-28 Advanced Semiconductor Engineering, Inc. Manufacturing method of advanced quad flat non-leaded package
CN101882609A (zh) * 2009-05-08 2010-11-10 飞思卡尔半导体公司 用于半导体封装体的引线框
CN102969297A (zh) * 2012-11-20 2013-03-13 无锡市威海达机械制造有限公司 一种浇铸槽型引线框架结构
JP6195771B2 (ja) * 2013-10-02 2017-09-13 株式会社三井ハイテック リードフレーム及びその製造方法並びにそれを用いた半導体装置
US9685351B2 (en) 2014-07-18 2017-06-20 Nxp Usa, Inc. Wire bond mold lock method and structure
US9659843B2 (en) 2014-11-05 2017-05-23 Infineon Technologies Ag Lead frame strip with molding compound channels
KR102427092B1 (ko) * 2015-10-16 2022-08-01 삼성전자주식회사 열 정보 표지를 갖는 반도체 장치
CN105575822B (zh) * 2015-12-28 2018-01-30 四川金湾电子有限责任公司 一种半导体引线框架正面燕尾槽冲压方法
US10998255B2 (en) * 2018-07-12 2021-05-04 Nxp Usa, Inc. Overmolded microelectronic packages containing knurled flanges and methods for the production thereof
EP3850657A4 (en) * 2018-09-11 2022-06-15 RJR Technologies, Inc. VOID PACKING WITH IMPROVED CONNECTIONS BETWEEN COMPONENTS
US11837532B2 (en) * 2020-01-15 2023-12-05 Texas Instruments Incorporated Leadframe with delamination resistant feature
CN117444534A (zh) * 2023-10-26 2024-01-26 广东华智芯电子科技有限公司 纯铜热沉块体及其制备方法、电子封装材料

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5315763A (en) 1976-07-28 1978-02-14 Hitachi Ltd Resin sealed type semiconductor device
JP2570037B2 (ja) * 1990-12-03 1997-01-08 モトローラ・インコーポレイテッド 分離型ヒートシンク・ボンディングパッドを有する半導体パッケージ
JP2698259B2 (ja) * 1991-11-27 1998-01-19 三洋電機株式会社 ヒートシンクの製造方法
US5278446A (en) * 1992-07-06 1994-01-11 Motorola, Inc. Reduced stress plastic package
JPH07161896A (ja) 1993-12-02 1995-06-23 Hitachi Cable Ltd リードフレームとその製造方法
US5701034A (en) 1994-05-03 1997-12-23 Amkor Electronics, Inc. Packaged semiconductor die including heat sink with locking feature
JPH08148629A (ja) * 1994-09-20 1996-06-07 Fujitsu Ltd 半導体装置及びその製造方法及び半導体装置用基板
US5535515A (en) * 1995-03-13 1996-07-16 Jacoby; John Method of manufacturing a stress-free heatsink assembly
KR100230515B1 (ko) * 1997-04-04 1999-11-15 윤종용 요철이 형성된 리드 프레임의 제조방법
US6376914B2 (en) * 1999-12-09 2002-04-23 Atmel Corporation Dual-die integrated circuit package
US6294409B1 (en) 2000-01-27 2001-09-25 Siliconware Precisionware Industries Co., Ltd. Method of forming a constricted-mouth dimple structure on a leadframe die pad
DE10054081A1 (de) * 2000-10-31 2002-05-08 Heraeus Gmbh W C Verfahren zur Herstellung eines Metallträgerrahmens, Metallrägerrahmen und seine Verwendung
US7091602B2 (en) * 2002-12-13 2006-08-15 Freescale Semiconductor, Inc. Miniature moldlocks for heatsink or flag for an overmolded plastic package

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005327767A (ja) * 2004-05-12 2005-11-24 Dowa Mining Co Ltd 窪み加工銅板もしくは銅合金板、その製造方法、および順送金型
JP2013157536A (ja) * 2012-01-31 2013-08-15 Shinko Electric Ind Co Ltd リードフレーム及びその製造方法と半導体装置及びその製造方法
JP2017005124A (ja) * 2015-06-11 2017-01-05 Ｓｈマテリアル株式会社 リードフレーム、リードフレームの製造方法、および半導体装置
WO2024075445A1 (ja) * 2022-10-06 2024-04-11 富士電機株式会社 半導体モジュール、半導体装置、及び車両
WO2024090029A1 (ja) * 2022-10-25 2024-05-02 富士電機株式会社 半導体モジュール、半導体装置、及び車両
JPWO2024090029A1 (enExample) * 2022-10-25 2024-05-02

Also Published As

Publication number Publication date
US20060220187A1 (en) 2006-10-05
US8310042B2 (en) 2012-11-13
AU2003277127A1 (en) 2004-07-09
KR20050089825A (ko) 2005-09-08
KR101017533B1 (ko) 2011-02-28
WO2004055889A1 (en) 2004-07-01
US20040113262A1 (en) 2004-06-17
TW200419739A (en) 2004-10-01
TWI321834B (en) 2010-03-11
CN100407412C (zh) 2008-07-30
US7091602B2 (en) 2006-08-15
CN1714445A (zh) 2005-12-28

Similar Documents

Publication Publication Date Title
JP2006510221A (ja) オーバーモールド・プラスチック・パッケージ用ヒートシンクまたはフラグ用の微小モールドロック
EP1905077B1 (en) Semiconductor device
US6873041B1 (en) Power semiconductor package with strap
US7732899B1 (en) Etch singulated semiconductor package
US7166926B2 (en) Method for producing semiconductor device and semiconductor device
US8350369B2 (en) High power semiconductor package
KR970010678B1 (ko) 리드 프레임 및 이를 이용한 반도체 패키지
US6847103B1 (en) Semiconductor package with exposed die pad and body-locking leadframe
EP0577966A1 (en) Reduced stress plastic package
US12308339B2 (en) Method of manufacturing a package using a clip having at least one locking recess
US6893898B2 (en) Semiconductor device and a method of manufacturing the same
JPH043450A (ja) 樹脂封止型半導体装置
KR20190068468A (ko) 공기 캐비티를 갖는 반도체 패키지
CN101814463A (zh) 半导体封装结构及其制造方法
JP3934079B2 (ja) 半導体装置
US7582974B2 (en) Semiconductor device and method of manufacturing same
US20080157297A1 (en) Stress-Resistant Leadframe and Method
JP4840305B2 (ja) 半導体装置の製造方法
JP4760543B2 (ja) モールドパッケージおよびその製造方法
US20120248589A1 (en) Lead frame with coined inner leads
WO2008155726A2 (en) A carrier for electric packages and a method of structuring a carrier
JP2003218312A (ja) 半導体装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20061002

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20061002

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20090817

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090901

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20091127

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20100112