JP2006508249A - 導電性トラックを備えた印刷版の金属被覆装置及び関連する金属被覆方法 - Google Patents
導電性トラックを備えた印刷版の金属被覆装置及び関連する金属被覆方法 Download PDFInfo
- Publication number
- JP2006508249A JP2006508249A JP2004556450A JP2004556450A JP2006508249A JP 2006508249 A JP2006508249 A JP 2006508249A JP 2004556450 A JP2004556450 A JP 2004556450A JP 2004556450 A JP2004556450 A JP 2004556450A JP 2006508249 A JP2006508249 A JP 2006508249A
- Authority
- JP
- Japan
- Prior art keywords
- metal coating
- pattern
- potential
- electrodes
- electrolytic cell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000034 method Methods 0.000 title claims abstract description 18
- 238000007639 printing Methods 0.000 title description 27
- 239000002184 metal Substances 0.000 claims description 36
- 229910052751 metal Inorganic materials 0.000 claims description 36
- 238000000576 coating method Methods 0.000 claims description 29
- 238000005868 electrolysis reaction Methods 0.000 claims description 24
- 239000011248 coating agent Substances 0.000 claims description 23
- 229910000365 copper sulfate Inorganic materials 0.000 claims description 4
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 4
- 230000002378 acidificating effect Effects 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 238000007646 gravure printing Methods 0.000 abstract description 16
- 238000005516 engineering process Methods 0.000 description 9
- 238000001465 metallisation Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 3
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 2
- 229910001431 copper ion Inorganic materials 0.000 description 2
- 230000001939 inductive effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000007645 offset printing Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0657—Conducting rolls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0214916A FR2847761B1 (fr) | 2002-11-27 | 2002-11-27 | Dispositif de metallisation de formes imprimees munies de pistes conductrices d'electricite et procede de metallisation associe |
PCT/FR2003/050141 WO2004052062A1 (fr) | 2002-11-27 | 2003-11-27 | Dispositif de metallisation de formes imprimees munies de pistes conductrices d'electricite et procede de metallisation associe |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2006508249A true JP2006508249A (ja) | 2006-03-09 |
Family
ID=32241693
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004556450A Withdrawn JP2006508249A (ja) | 2002-11-27 | 2003-11-27 | 導電性トラックを備えた印刷版の金属被覆装置及び関連する金属被覆方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20060151330A1 (fr) |
EP (1) | EP1568258A1 (fr) |
JP (1) | JP2006508249A (fr) |
CN (1) | CN1745609A (fr) |
AU (1) | AU2003295076A1 (fr) |
FR (1) | FR2847761B1 (fr) |
WO (1) | WO2004052062A1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016129310A (ja) * | 2015-01-09 | 2016-07-14 | シャープ株式会社 | ループアンテナおよびループアンテナの製造方法 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL1025446C2 (nl) * | 2004-02-09 | 2005-08-10 | Besi Plating B V | Werkwijze en inrichting voor het elektrolytisch doen toenemen van de dikte van een elektrisch geleidend patroon op een dielektrische drager alsmede dielektrische drager. |
CN102560585B (zh) * | 2012-03-01 | 2014-10-15 | 湖北盛友钻石材料有限公司 | 一种金刚石线锯的制造方法 |
CN104032344B (zh) * | 2014-06-23 | 2017-02-01 | 浙江纺织服装职业技术学院 | 一种镀银纱线的氯化银连续电镀设备 |
WO2021164474A1 (fr) * | 2020-02-20 | 2021-08-26 | 深圳市海瀚新能源技术有限公司 | Dispositif de revêtement conducteur, système de revêtement et procédé de revêtement pour film conducteur |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3661732A (en) * | 1970-06-01 | 1972-05-09 | Production Machinery Corp | Method and apparatus for electroplating |
US3746630A (en) * | 1970-12-08 | 1973-07-17 | Auric Corp | Apparatus for selective electroplating of strips |
US3729389A (en) * | 1970-12-10 | 1973-04-24 | Western Electric Co | Method of electroplating discrete conductive regions |
US3956077A (en) * | 1975-03-27 | 1976-05-11 | Western Electric Company, Inc. | Methods of providing contact between two members normally separable by an intervening member |
JPS54145965A (en) * | 1978-05-08 | 1979-11-14 | Nippon Mining Co | Method of and apparatus for producing board for printed circuit |
ATE31560T1 (de) * | 1983-11-10 | 1988-01-15 | Hoesch Ag | Verfahren und vorrichtung zum elektrolytischen abscheiden von metallen. |
IT1177925B (it) * | 1984-07-24 | 1987-08-26 | Centro Speriment Metallurg | Procedimento per elettrodeposizione in continuo di metalli ad elevata denista' di corrente di celle verticali e relativo dispositivo di attuazione |
US4652346A (en) * | 1984-12-31 | 1987-03-24 | Olin Corporation | Apparatus and process for the continuous plating of wide delicate metal foil |
DE3603856C2 (de) * | 1986-02-07 | 1994-05-05 | Bosch Gmbh Robert | Verfahren und Vorrichtung zur Galvanisierung von ebenen Werkstücken wie Leiterplatten |
JPH0233995A (ja) * | 1988-07-23 | 1990-02-05 | Alps Electric Co Ltd | フレキシブル回路基板の製造方法 |
US4944850A (en) * | 1989-12-18 | 1990-07-31 | Hewlett-Packard Company | Tape automated bonded (tab) circuit and method for making the same |
JP2000151082A (ja) * | 1998-11-17 | 2000-05-30 | Mitsumi Electric Co Ltd | 基板の導電パターンメッキ方法 |
US6582887B2 (en) * | 2001-03-26 | 2003-06-24 | Daniel Luch | Electrically conductive patterns, antennas and methods of manufacture |
-
2002
- 2002-11-27 FR FR0214916A patent/FR2847761B1/fr not_active Expired - Fee Related
-
2003
- 2003-11-27 WO PCT/FR2003/050141 patent/WO2004052062A1/fr active Application Filing
- 2003-11-27 AU AU2003295076A patent/AU2003295076A1/en not_active Abandoned
- 2003-11-27 US US10/536,288 patent/US20060151330A1/en not_active Abandoned
- 2003-11-27 JP JP2004556450A patent/JP2006508249A/ja not_active Withdrawn
- 2003-11-27 CN CNA2003801092636A patent/CN1745609A/zh active Pending
- 2003-11-27 EP EP03786076A patent/EP1568258A1/fr not_active Withdrawn
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016129310A (ja) * | 2015-01-09 | 2016-07-14 | シャープ株式会社 | ループアンテナおよびループアンテナの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US20060151330A1 (en) | 2006-07-13 |
EP1568258A1 (fr) | 2005-08-31 |
FR2847761A1 (fr) | 2004-05-28 |
FR2847761B1 (fr) | 2005-02-04 |
WO2004052062A1 (fr) | 2004-06-17 |
CN1745609A (zh) | 2006-03-08 |
AU2003295076A1 (en) | 2004-06-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20060901 |
|
A761 | Written withdrawal of application |
Free format text: JAPANESE INTERMEDIATE CODE: A761 Effective date: 20061206 |