CN1745609A - 具有导电轨迹的印刷板的金属化设备及相关金属化方法 - Google Patents
具有导电轨迹的印刷板的金属化设备及相关金属化方法 Download PDFInfo
- Publication number
- CN1745609A CN1745609A CNA2003801092636A CN200380109263A CN1745609A CN 1745609 A CN1745609 A CN 1745609A CN A2003801092636 A CNA2003801092636 A CN A2003801092636A CN 200380109263 A CN200380109263 A CN 200380109263A CN 1745609 A CN1745609 A CN 1745609A
- Authority
- CN
- China
- Prior art keywords
- fagging
- electrolysis tank
- pattern
- electromotive force
- roller
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001465 metallisation Methods 0.000 title claims description 21
- 238000000034 method Methods 0.000 title claims description 20
- 238000005868 electrolysis reaction Methods 0.000 claims description 72
- 239000002253 acid Substances 0.000 claims description 3
- OMZSGWSJDCOLKM-UHFFFAOYSA-N copper(II) sulfide Chemical compound [S-2].[Cu+2] OMZSGWSJDCOLKM-UHFFFAOYSA-N 0.000 claims description 3
- 238000007639 printing Methods 0.000 abstract description 25
- 238000005516 engineering process Methods 0.000 description 18
- 239000002184 metal Substances 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 125000006850 spacer group Chemical group 0.000 description 8
- 238000009413 insulation Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000000926 separation method Methods 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0657—Conducting rolls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR02/14916 | 2002-11-27 | ||
FR0214916A FR2847761B1 (fr) | 2002-11-27 | 2002-11-27 | Dispositif de metallisation de formes imprimees munies de pistes conductrices d'electricite et procede de metallisation associe |
Publications (1)
Publication Number | Publication Date |
---|---|
CN1745609A true CN1745609A (zh) | 2006-03-08 |
Family
ID=32241693
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNA2003801092636A Pending CN1745609A (zh) | 2002-11-27 | 2003-11-27 | 具有导电轨迹的印刷板的金属化设备及相关金属化方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20060151330A1 (fr) |
EP (1) | EP1568258A1 (fr) |
JP (1) | JP2006508249A (fr) |
CN (1) | CN1745609A (fr) |
AU (1) | AU2003295076A1 (fr) |
FR (1) | FR2847761B1 (fr) |
WO (1) | WO2004052062A1 (fr) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102560585A (zh) * | 2012-03-01 | 2012-07-11 | 湖北盛友钻石材料有限公司 | 一种金刚石线锯的制造方法及装置 |
CN104032344A (zh) * | 2014-06-23 | 2014-09-10 | 浙江纺织服装职业技术学院 | 一种镀银纱线的氯化银连续电镀设备 |
WO2021164474A1 (fr) * | 2020-02-20 | 2021-08-26 | 深圳市海瀚新能源技术有限公司 | Dispositif de revêtement conducteur, système de revêtement et procédé de revêtement pour film conducteur |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL1025446C2 (nl) * | 2004-02-09 | 2005-08-10 | Besi Plating B V | Werkwijze en inrichting voor het elektrolytisch doen toenemen van de dikte van een elektrisch geleidend patroon op een dielektrische drager alsmede dielektrische drager. |
JP6422783B2 (ja) * | 2015-01-09 | 2018-11-14 | シャープ株式会社 | ループアンテナおよびループアンテナの製造方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3661732A (en) * | 1970-06-01 | 1972-05-09 | Production Machinery Corp | Method and apparatus for electroplating |
US3746630A (en) * | 1970-12-08 | 1973-07-17 | Auric Corp | Apparatus for selective electroplating of strips |
US3729389A (en) * | 1970-12-10 | 1973-04-24 | Western Electric Co | Method of electroplating discrete conductive regions |
US3956077A (en) * | 1975-03-27 | 1976-05-11 | Western Electric Company, Inc. | Methods of providing contact between two members normally separable by an intervening member |
JPS54145965A (en) * | 1978-05-08 | 1979-11-14 | Nippon Mining Co | Method of and apparatus for producing board for printed circuit |
ATE31560T1 (de) * | 1983-11-10 | 1988-01-15 | Hoesch Ag | Verfahren und vorrichtung zum elektrolytischen abscheiden von metallen. |
IT1177925B (it) * | 1984-07-24 | 1987-08-26 | Centro Speriment Metallurg | Procedimento per elettrodeposizione in continuo di metalli ad elevata denista' di corrente di celle verticali e relativo dispositivo di attuazione |
US4652346A (en) * | 1984-12-31 | 1987-03-24 | Olin Corporation | Apparatus and process for the continuous plating of wide delicate metal foil |
DE3603856C2 (de) * | 1986-02-07 | 1994-05-05 | Bosch Gmbh Robert | Verfahren und Vorrichtung zur Galvanisierung von ebenen Werkstücken wie Leiterplatten |
JPH0233995A (ja) * | 1988-07-23 | 1990-02-05 | Alps Electric Co Ltd | フレキシブル回路基板の製造方法 |
US4944850A (en) * | 1989-12-18 | 1990-07-31 | Hewlett-Packard Company | Tape automated bonded (tab) circuit and method for making the same |
JP2000151082A (ja) * | 1998-11-17 | 2000-05-30 | Mitsumi Electric Co Ltd | 基板の導電パターンメッキ方法 |
US6582887B2 (en) * | 2001-03-26 | 2003-06-24 | Daniel Luch | Electrically conductive patterns, antennas and methods of manufacture |
-
2002
- 2002-11-27 FR FR0214916A patent/FR2847761B1/fr not_active Expired - Fee Related
-
2003
- 2003-11-27 WO PCT/FR2003/050141 patent/WO2004052062A1/fr active Application Filing
- 2003-11-27 AU AU2003295076A patent/AU2003295076A1/en not_active Abandoned
- 2003-11-27 US US10/536,288 patent/US20060151330A1/en not_active Abandoned
- 2003-11-27 JP JP2004556450A patent/JP2006508249A/ja not_active Withdrawn
- 2003-11-27 CN CNA2003801092636A patent/CN1745609A/zh active Pending
- 2003-11-27 EP EP03786076A patent/EP1568258A1/fr not_active Withdrawn
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102560585A (zh) * | 2012-03-01 | 2012-07-11 | 湖北盛友钻石材料有限公司 | 一种金刚石线锯的制造方法及装置 |
CN104032344A (zh) * | 2014-06-23 | 2014-09-10 | 浙江纺织服装职业技术学院 | 一种镀银纱线的氯化银连续电镀设备 |
CN104032344B (zh) * | 2014-06-23 | 2017-02-01 | 浙江纺织服装职业技术学院 | 一种镀银纱线的氯化银连续电镀设备 |
WO2021164474A1 (fr) * | 2020-02-20 | 2021-08-26 | 深圳市海瀚新能源技术有限公司 | Dispositif de revêtement conducteur, système de revêtement et procédé de revêtement pour film conducteur |
US11821100B2 (en) | 2020-02-20 | 2023-11-21 | Xiamen Hithium Energy Storage Technology Co., Ltd. | Conductive plating apparatus, plating system and plating method for conductive film |
Also Published As
Publication number | Publication date |
---|---|
US20060151330A1 (en) | 2006-07-13 |
EP1568258A1 (fr) | 2005-08-31 |
FR2847761A1 (fr) | 2004-05-28 |
FR2847761B1 (fr) | 2005-02-04 |
WO2004052062A1 (fr) | 2004-06-17 |
JP2006508249A (ja) | 2006-03-09 |
AU2003295076A1 (en) | 2004-06-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |