CN1745609A - 具有导电轨迹的印刷板的金属化设备及相关金属化方法 - Google Patents

具有导电轨迹的印刷板的金属化设备及相关金属化方法 Download PDF

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Publication number
CN1745609A
CN1745609A CNA2003801092636A CN200380109263A CN1745609A CN 1745609 A CN1745609 A CN 1745609A CN A2003801092636 A CNA2003801092636 A CN A2003801092636A CN 200380109263 A CN200380109263 A CN 200380109263A CN 1745609 A CN1745609 A CN 1745609A
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CN
China
Prior art keywords
fagging
electrolysis tank
pattern
electromotive force
roller
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2003801092636A
Other languages
English (en)
Chinese (zh)
Inventor
克里斯托夫·马蒂厄
让-雅克·米施勒
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FCI SA
Original Assignee
FCI SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FCI SA filed Critical FCI SA
Publication of CN1745609A publication Critical patent/CN1745609A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0657—Conducting rolls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
CNA2003801092636A 2002-11-27 2003-11-27 具有导电轨迹的印刷板的金属化设备及相关金属化方法 Pending CN1745609A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR02/14916 2002-11-27
FR0214916A FR2847761B1 (fr) 2002-11-27 2002-11-27 Dispositif de metallisation de formes imprimees munies de pistes conductrices d'electricite et procede de metallisation associe

Publications (1)

Publication Number Publication Date
CN1745609A true CN1745609A (zh) 2006-03-08

Family

ID=32241693

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2003801092636A Pending CN1745609A (zh) 2002-11-27 2003-11-27 具有导电轨迹的印刷板的金属化设备及相关金属化方法

Country Status (7)

Country Link
US (1) US20060151330A1 (fr)
EP (1) EP1568258A1 (fr)
JP (1) JP2006508249A (fr)
CN (1) CN1745609A (fr)
AU (1) AU2003295076A1 (fr)
FR (1) FR2847761B1 (fr)
WO (1) WO2004052062A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102560585A (zh) * 2012-03-01 2012-07-11 湖北盛友钻石材料有限公司 一种金刚石线锯的制造方法及装置
CN104032344A (zh) * 2014-06-23 2014-09-10 浙江纺织服装职业技术学院 一种镀银纱线的氯化银连续电镀设备
WO2021164474A1 (fr) * 2020-02-20 2021-08-26 深圳市海瀚新能源技术有限公司 Dispositif de revêtement conducteur, système de revêtement et procédé de revêtement pour film conducteur

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1025446C2 (nl) * 2004-02-09 2005-08-10 Besi Plating B V Werkwijze en inrichting voor het elektrolytisch doen toenemen van de dikte van een elektrisch geleidend patroon op een dielektrische drager alsmede dielektrische drager.
JP6422783B2 (ja) * 2015-01-09 2018-11-14 シャープ株式会社 ループアンテナおよびループアンテナの製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3661732A (en) * 1970-06-01 1972-05-09 Production Machinery Corp Method and apparatus for electroplating
US3746630A (en) * 1970-12-08 1973-07-17 Auric Corp Apparatus for selective electroplating of strips
US3729389A (en) * 1970-12-10 1973-04-24 Western Electric Co Method of electroplating discrete conductive regions
US3956077A (en) * 1975-03-27 1976-05-11 Western Electric Company, Inc. Methods of providing contact between two members normally separable by an intervening member
JPS54145965A (en) * 1978-05-08 1979-11-14 Nippon Mining Co Method of and apparatus for producing board for printed circuit
ATE31560T1 (de) * 1983-11-10 1988-01-15 Hoesch Ag Verfahren und vorrichtung zum elektrolytischen abscheiden von metallen.
IT1177925B (it) * 1984-07-24 1987-08-26 Centro Speriment Metallurg Procedimento per elettrodeposizione in continuo di metalli ad elevata denista' di corrente di celle verticali e relativo dispositivo di attuazione
US4652346A (en) * 1984-12-31 1987-03-24 Olin Corporation Apparatus and process for the continuous plating of wide delicate metal foil
DE3603856C2 (de) * 1986-02-07 1994-05-05 Bosch Gmbh Robert Verfahren und Vorrichtung zur Galvanisierung von ebenen Werkstücken wie Leiterplatten
JPH0233995A (ja) * 1988-07-23 1990-02-05 Alps Electric Co Ltd フレキシブル回路基板の製造方法
US4944850A (en) * 1989-12-18 1990-07-31 Hewlett-Packard Company Tape automated bonded (tab) circuit and method for making the same
JP2000151082A (ja) * 1998-11-17 2000-05-30 Mitsumi Electric Co Ltd 基板の導電パターンメッキ方法
US6582887B2 (en) * 2001-03-26 2003-06-24 Daniel Luch Electrically conductive patterns, antennas and methods of manufacture

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102560585A (zh) * 2012-03-01 2012-07-11 湖北盛友钻石材料有限公司 一种金刚石线锯的制造方法及装置
CN104032344A (zh) * 2014-06-23 2014-09-10 浙江纺织服装职业技术学院 一种镀银纱线的氯化银连续电镀设备
CN104032344B (zh) * 2014-06-23 2017-02-01 浙江纺织服装职业技术学院 一种镀银纱线的氯化银连续电镀设备
WO2021164474A1 (fr) * 2020-02-20 2021-08-26 深圳市海瀚新能源技术有限公司 Dispositif de revêtement conducteur, système de revêtement et procédé de revêtement pour film conducteur
US11821100B2 (en) 2020-02-20 2023-11-21 Xiamen Hithium Energy Storage Technology Co., Ltd. Conductive plating apparatus, plating system and plating method for conductive film

Also Published As

Publication number Publication date
US20060151330A1 (en) 2006-07-13
EP1568258A1 (fr) 2005-08-31
FR2847761A1 (fr) 2004-05-28
FR2847761B1 (fr) 2005-02-04
WO2004052062A1 (fr) 2004-06-17
JP2006508249A (ja) 2006-03-09
AU2003295076A1 (en) 2004-06-23

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication