TW200513661A - Contactless method and apparatus for inspecting electrical connection part - Google Patents

Contactless method and apparatus for inspecting electrical connection part

Info

Publication number
TW200513661A
TW200513661A TW093120717A TW93120717A TW200513661A TW 200513661 A TW200513661 A TW 200513661A TW 093120717 A TW093120717 A TW 093120717A TW 93120717 A TW93120717 A TW 93120717A TW 200513661 A TW200513661 A TW 200513661A
Authority
TW
Taiwan
Prior art keywords
electrical connection
connection part
lead
conductive pattern
circuit
Prior art date
Application number
TW093120717A
Other languages
Chinese (zh)
Other versions
TWI284744B (en
Inventor
Shigetaka Kobayashi
Takehiko Wada
Eisaku Kojima
Original Assignee
Chi Mei Optoelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chi Mei Optoelectronics Corp filed Critical Chi Mei Optoelectronics Corp
Publication of TW200513661A publication Critical patent/TW200513661A/en
Application granted granted Critical
Publication of TWI284744B publication Critical patent/TWI284744B/en

Links

Landscapes

  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Liquid Crystal (AREA)

Abstract

To solve the problem wherein connection between liquid crystal cells and driver ICs in a liquid crystal display apparatus cannot be inspected without supplying power to the apparatus. The solution to the problem is to provide a circuit substrate 10. A plurality of capacitive circuit components are connected in parallel and orderly aligned on an insulating substrate 12, and a conductive pattern 18 is connected to one end of each circuit component on the circuit board 10 such that a high-frequency magnetic field generation mechanism and a pickup coil 34 are adjacent to an electrical connection part of the circuit substrate 10. The electrical connection part is electrically connected with a lead 28a of an electronic component 24 where the lead 28a is above the conductive pattern 18 and a conductive adhesive 22 is located between the lead and the conductive pattern. On the basis of changes in a high-frequency current passing through the pickup coil 34, the quality of connection of the electrical connection parts is determined.
TW93120717A 2003-07-10 2004-07-09 Contactless method and apparatus for inspecting electrical connection part TWI284744B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003194966A JP4586124B2 (en) 2003-07-10 2003-07-10 Non-contact inspection method and non-contact inspection device for electrical connection

Publications (2)

Publication Number Publication Date
TW200513661A true TW200513661A (en) 2005-04-16
TWI284744B TWI284744B (en) 2007-08-01

Family

ID=34205948

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93120717A TWI284744B (en) 2003-07-10 2004-07-09 Contactless method and apparatus for inspecting electrical connection part

Country Status (2)

Country Link
JP (1) JP4586124B2 (en)
TW (1) TWI284744B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI412759B (en) * 2008-05-28 2013-10-21 Nihon Micronics Kk Sensor substrate and inspection apparatus
CN103698644A (en) * 2013-12-18 2014-04-02 马震远 Hall sensor array-based PCB (printed circuit board) short-circuit detection method and detection device

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100796171B1 (en) * 2006-07-20 2008-01-21 마이크로 인스펙션 주식회사 Contact type single side probe and inspection apparatus and method for open/short test of conductive lines used thereof
KR100799161B1 (en) * 2006-07-20 2008-01-29 마이크로 인스펙션 주식회사 Non-contact type single side probe and inspection apparatus and method for open/short test of pattern electrodes used thereof
JP5501735B2 (en) * 2009-11-05 2014-05-28 日置電機株式会社 Circuit board inspection apparatus and circuit board inspection method
JP6502080B2 (en) * 2014-12-16 2019-04-17 日置電機株式会社 Data generation apparatus and data generation method

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6211174A (en) * 1985-07-01 1987-01-20 Hitachi Electronics Eng Co Ltd Apparatus for inspecting soldering of electric parts
JPH0521025Y2 (en) * 1986-01-22 1993-05-31
JPS62187258A (en) * 1986-02-14 1987-08-15 Sumitomo Bakelite Co Ltd Inspecting method for circuit board
JPS6491056A (en) * 1987-10-01 1989-04-10 Hitachi Construction Machinery Ultrasonic measurement system
JPH01199132A (en) * 1988-02-04 1989-08-10 Ono Sokki Co Ltd Method for extracting error waveform of engagement transmission
JP2519141B2 (en) * 1991-08-28 1996-07-31 株式会社荏原製作所 Magnetic bearing device
JPH05322855A (en) * 1992-05-22 1993-12-07 Ishikawajima Harima Heavy Ind Co Ltd Automatic eddy current flaw detector
JP3313165B2 (en) * 1992-11-24 2002-08-12 本田技研工業株式会社 Method of bonding fiber-reinforced plastic member and method of detecting defective bonding of fiber-reinforced plastic member containing adhesive layer
JPH0836191A (en) * 1994-07-21 1996-02-06 Sanyo Electric Co Ltd Display device, method for inspecting display device and inspection apparatus
JP2001296326A (en) * 2000-04-18 2001-10-26 Odp:Kk Method and apparatus for inspection of defect

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI412759B (en) * 2008-05-28 2013-10-21 Nihon Micronics Kk Sensor substrate and inspection apparatus
CN103698644A (en) * 2013-12-18 2014-04-02 马震远 Hall sensor array-based PCB (printed circuit board) short-circuit detection method and detection device
CN103698644B (en) * 2013-12-18 2016-06-01 马震远 Based on PCB method for detecting short circuit and the detection device of hall sensing device array

Also Published As

Publication number Publication date
TWI284744B (en) 2007-08-01
JP2005030850A (en) 2005-02-03
JP4586124B2 (en) 2010-11-24

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees