CN1745609A - Metallization device for printed boards with conductive tracks and related metallization method - Google Patents
Metallization device for printed boards with conductive tracks and related metallization method Download PDFInfo
- Publication number
- CN1745609A CN1745609A CNA2003801092636A CN200380109263A CN1745609A CN 1745609 A CN1745609 A CN 1745609A CN A2003801092636 A CNA2003801092636 A CN A2003801092636A CN 200380109263 A CN200380109263 A CN 200380109263A CN 1745609 A CN1745609 A CN 1745609A
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- China
- Prior art keywords
- fagging
- electrolysis tank
- pattern
- electromotive force
- roller
- Prior art date
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- 238000001465 metallisation Methods 0.000 title claims description 21
- 238000000034 method Methods 0.000 title claims description 20
- 238000005868 electrolysis reaction Methods 0.000 claims description 72
- 239000002253 acid Substances 0.000 claims description 3
- OMZSGWSJDCOLKM-UHFFFAOYSA-N copper(II) sulfide Chemical compound [S-2].[Cu+2] OMZSGWSJDCOLKM-UHFFFAOYSA-N 0.000 claims description 3
- 238000007639 printing Methods 0.000 abstract description 25
- 238000005516 engineering process Methods 0.000 description 18
- 239000002184 metal Substances 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 125000006850 spacer group Chemical group 0.000 description 8
- 238000009413 insulation Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000000926 separation method Methods 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0657—Conducting rolls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention relates to a printed circuit having conductive tracks and obtainable by intaglio printing. Intaglio printing can be used to obtain conductive tracks of very thin thickness, so that said tracks have a high resistance. In order to reduce the resistance of the tracks (30) thus obtained, the invention comprises: at least two first electrodes (9, 8) are connected to opposite portions (17, 18) of the same track, while a central portion (19) of said track is immersed in the electrolytic bath (7). Furthermore, the electrolytic cell is connected to a second electrode (26), which second electrode (26) is in turn connected to a second potential (15) having a polarity opposite to the first potential (14) connected to the first electrode.
Description
Technical field
The present invention relates to a kind of metallization equipment and relevant method for metallising with printed panel (printed form) of conductive traces.The present invention relates more specifically to a kind of metallization equipment that is used for the conductive traces continuous pattern, and these conductive traces have low conductivity and are printed on the dielectric fagging.In one example, this pattern is specifically represented flat plane antenna.The field of the printed circuit that any technology (for example heliogravure technology, offset printing, tulle printing etc.) by the printing conductive track that the invention still further relates to obtains.
Background technology
In document EP-A-0 839,667 (D1), known a kind of technology of utilizing conductive ink or heliogravure printing technology to print.This printing technology is used and is carved roller and anti-roll, is furnished with the dielectric fagging at this between roller and this anti-roll, so that it is printed at quarter.To carve roller is designed to: partly immersing in the container that conductive ink is housed in the rotating shaft rotation of same roller.Anti-roll is designed to: also, the dielectric fagging is pressed onto on the roller at quarter in another rotating shaft rotation of this roller.To carve roller and anti-roll and be designed to match, make that carving roller can be printed onto the conductive ink track on the dielectric fagging.
The heliogravure printing technology receives special concern because of it can obtain accurate conductive traces.The heliogravure printing technology can also obtain the conductive traces of thickness very little (for example 1 μ m order of magnitude).But the conductive traces that obtains by the heliogravure printing technology has higher resistance.
Document US-A-4,119,516 (D2) have described a kind of electrolysis tech that can utilize makes metal be deposited on electrolysis installation on the different conductive traces.After printed circuit having been printed conductive traces, can use this equipment.The electrolysis installation of describing in document D2 has a negative electrode and an antianode, this negative electrode is designed to contact with conductive traces, this antianode is designed to be immersed in the electrolyte container that comprises electrolysis tank, this negative electrode is linked to each other with negative potential, this anode pair is linked to each other with positive potential, utilize DC voltage generator, electrolytic metal is deposited on the conductive traces.
Yet this metallization technology has such shortcoming: the metallization that is obtained can be subjected to the interference by the low conductivity of the printing conductive track of aforesaid printing technology acquisition.The distribution that consequently is deposited on the metal thickness on the track is relatively poor.Sometimes even this metallization process is stopped.
Therefore, the metallization printed circuit that obtains by this metallization technology can not play a role fully, thus can not be effectively from/by printed circuit (this printed circuit is relevant with the integrated circuit of for example smart card or electronic tag) transmission/detection electromagnetic signal.
Summary of the invention
Simultaneously can use the same printing technology (especially heliogravure printing technology) that is used for conductive traces in order to address the above problem, the invention provides a kind of metallized equipment that is used for, in equipment, at least two first arrangement of electrodes that will be connected with first electromotive force are partly located at two relative tracks with identical patterns, and described pattern is designed to partly immerse in the electrolysis tank between these two first electrodes.Described two first electrodes are manufactured be separated from each other a segment distance, this distance is less than or equal to a size of pattern, and this size records with respect to the moving direction of fagging in electrolysis tank.Or rather, these two first electrodes are separated from each other, its distance of separation is less than or equal to the length of the pattern that records with respect to the moving direction of fagging in groove, along the fagging between two first electrodes.Described two first electrode positions relative to each other can guarantee to make all tracks with identical patterns all to be metallized, and this is to realize by making these tracks be in equipotential by these first electrodes that contact with these patterns.Described two first electrodes are connected to first electromotive force that has with the second electromotive force opposite polarity, provide second electrode of second electromotive force to be connected to second electromotive force to described electrolysis tank being designed to.
Theme of the present invention is a kind of metallization equipment that is used to be covered with the dielectric fagging of conductive traces pattern, and this metallization equipment comprises:
Electrolysis unit;
This electrolysis unit comprises: electrolysis tank; First electrode links to each other with first potential source, and described first electromotive force has the polarity opposite with second electromotive force, and one or more second electrodes by described electrolysis unit impose on described electrolysis tank with second electromotive force, it is characterized in that:
The dielectric fagging immerses in the described electrolysis tank, is connected to first electromotive force and second electromotive force with making track short circuit with same pattern, and
At least two first electrodes link to each other with the relative pattern part of same pattern, and the mid portion of this same pattern immerses in this electrolysis tank.
Theme of the present invention still is a kind of method for metallising that is used to be covered with the dielectric fagging of conductive traces pattern, the method is characterized in that:
A) by the dielectric fagging is immersed in the electrolysis tank, and by track short circuit ground is connected to first potential source, make at least one conductive traces pattern experience the processing of electrolysis tank, the polarity of this first electromotive force is opposite with the polarity of second electromotive force that imposes on electrolysis tank; And
B) utilize at least two electrodes that first electromotive force is imposed on the relative pattern part of same pattern, the mid portion with described pattern immerses in the electrolysis tank simultaneously.
Description of drawings
After reading following explanation and research accompanying drawing, will understand the present invention better.These accompanying drawings only illustrate and unrestricted the present invention in the mode of example.These accompanying drawings illustrate:
Fig. 1 is the schematic diagram according to metallization equipment of the present invention;
Fig. 2 is the schematic diagram according to dielectric fagging of the present invention;
Fig. 3 is the schematic diagram according to the modified example of metallization equipment of the present invention.
Embodiment
Fig. 1 shows the metallization equipment 1 that is used for dielectric fagging 2 according to of the present invention.The dielectric fagging for example can be the dielectric substrate of being made by PET, PVC, Merlon, ABS, impregnated paper or non-impregnated paper, expoxy glass, polyimides, LCP etc.Dielectric fagging 2 forms (see figure 2) by a plurality of elements 3, and each element 3 is covered with conductive traces pattern 4.Can utilize at least one link track (for example 37) that each pattern is linked together.Conductive traces pattern 4 can be represented the printed circuit of flat plane antenna (as shown in Figure 2) or any other form.Can flat plane antenna be integrated in smart card or the electronic tag in simple mode, and utilize common process (for example line weldering, flip-chip installation etc.) that it is linked to each other with this integrated circuit.As shown in Figure 2, form flat plane antenna by continuous concentric volution, each volution forms conductive traces 30.
Can obtain the pattern of this conductive traces by the heliogravure printing technology of using gravure apparatus 5 (Fig. 1).Perhaps can obtain this conductive traces pattern by for example other technologies of aforesaid tulle printing or lithography technique.In one example, the heliogravure printing technology can obtain the thick track of 1 μ m, since extremely thin, so can obtain very high track density.
According to the present invention, metallization equipment 1 comprises electrolysis unit 6, and this electrolysis unit 6 can be arranged in the downstream of notch board photographic printing device 5.Electrolysis unit 6 comprises electrolysis tank 7, to soak dielectric fagging 2.Electrolysis unit 6 also comprises a plurality of first electrodes and at least one second electrode.In the preferred exemplary of Fig. 1, electrolysis unit comprises five first electrodes 8,9,10,11,12 (all linking together) and one second electrode 13.This first electrode makes these track short circuits, and by these tracks being connected to first potential source 14, and make these tracks can be in equipotential.Second electrode makes it possible to provide second potential source 15 to electrolysis tank 7.Electrical potential difference can be described as such generation: first electrode is connected to first electromotive force 14 that has with second electromotive force, 15 opposite polarities, and second electrode is linked to each other with second electromotive force 15.For example produce first electromotive force and second electromotive force by voltage rectifier 16 or voltage generator.
Preferably, form electrolysis tank 7 by structure, or form by any other solution that can in electrolytic process, discharge metal based on the copper sulfide in the acid medium.The polarity of the polarity of first electrode and second electrode depends on the character of the solution that comprises in the electrolysis tank.Forming by copper sulphate under the situation of solution, second electrode is being connected with positive electrode electromotive force 15, and first electrode is linked to each other with first electromotive force 14 of negative polarity, thereby copper ion is moved to these first electrodes in electrolytic process, moving to these tracks thus.Therefore, first electrode design is become to contact with these tracks, attract cationic negative electrode so make these tracks form, and second electrode forms the anionic anode of attraction.
Herein, with first arrangement of electrodes be: they are positioned at the outside of electrolysis tank.Between two first electrodes and electrolysis tank, carry out electrolytic treatments subsequently, then make at least one first electrode 8 (or 9) touch conductive traces pattern 4, and subsequently at least a portion of this conductive traces is immersed in the electrolysis tank 7.
Shown in the arrow among Fig. 1 and 2, two first electrodes 8 and 9 are separated from each other a segment distance, and this distance is less than or equal to the length 21 of the pattern 4 that the direction that moves with respect to this fagging records along fagging or insulation board.Particularly, two first electrodes 8 and 9 are connected to the relative pattern part 17 and 18 (Fig. 2) of same pattern 4 at least.Pattern 4 comprises first pattern part 17 and second pattern part 18, and each several part or each end are toward each other.Described two relative parts are by placed in the middle or center pattern part 19 is spaced apart.In the moving process of fagging 2, be connected to electrode 8 and immerse in the electrolysis tank 7 by first 17 pattern 4, at first first 17 is carried out electrolysis, and at last the second portion 18 of pattern 4 is carried out electrolysis.When utilizing 8 pairs of parts of electrode 18 to carry out electrolysis, then carry out electrolysis by 9 pairs of parts of electrode 17.
Metallization equipment also has the drive unit 22 that is used for plate 2 and from wherein passing in and out the continuous slot part of plate 2.This continuous slot part combines the metal deposit that can improve on track with the mobile phase of pattern in this groove.
According to first preferred embodiment of the present invention shown in Figure 1, drive unit 22 can be formed by a series of first rollers that are positioned at the described electrolysis tank outside (for example 8 to 11) and a series of second rollers 26 that are positioned at electrolysis tank.In the example depicted in fig. 1, drive unit is formed by for example 26 four second rollers.In a preferred embodiment of the invention, first roller is a metal, and forms first electrode 8,9,10,11 and 12.That second roller preferably insulate and guarantee: as in the moving process of described plate, this plate between at least two first electrodes to be immersed in electrolysis tank.All these rollers can be supported by same cross bar (not shown).Come drive plate 2 along the continuous passage from first roller to second roller etc.These continuous passages from first roller to second roller etc. can improve the metal deposit on the track when fagging is mobile electrolysis tank.If this plate is subjected to excessive tension force and this tension force may make its distortion, then can be installed in these rollers on the bearing and/or makes its motorization, thereby reduce the tension force between each roller.
In the modified example of present embodiment, drive unit can comprise first roller 8,9,10,11,12 of first series and install accordingly with first roller of this first series, and by first roller 27 of the second series of its support.First roller of first series is corresponding to aforesaid first roller, and first roller of second series is by being shown in dotted line among Fig. 1.These two series first rollers can make first 24 and/or second 25 experience electrolytic treatments of printing insulation board 2, and first and second is covered with at least one conductive traces pattern respectively.First roller of first series is arranged as: make first 24 and contact, and first roll forming of second series is become: make second 25 and contact with first roller of these second series with these first rollers.
Provide first electromotive force 14 to first roller, and preferably make the insulation of second roller.Shown in the dotted line among Fig. 1, also can provide first electromotive force to second roller.Like this, second roller is covered gradually by metal in electrolytic process, just can replace these second rollers regularly.
For driving described plate, with the roller motorization.Yet, only need with several roller motorizations, so that this plate is moved fully.The speed of rotation of dancer rools is enough to form desirable thickness thereby always make by the time.
In order to obtain to be printed with the dielectric fagging of conductive traces pattern, by carrying out the metallization process that following step obtains insulation board 2.At first, printing onboard with conductive traces pattern (interconnect or do not interconnect) by notch board photographic printing technology.For this reason, as previously mentioned, notch board photographic printing device 5 comprises carves roller 31 and anti-roll 32.Carve roller 31 and comprise opening 33, it is designed to conductive traces is printed on the fagging 2.Carve roller and anti-roll and support mutually with offseting, be furnished with the dielectric fagging therebetween.Carve roller and anti-roll around they axle rotations separately, can on insulation board A, obtain meticulous printing track simultaneously.Provide strigil 34 on the dielectric fagging, to obtain accurate printing track.Before anti-roll was imprinted on the pattern of conductive traces on the fagging that is compressed by this anti-roll, strigil 34 can be removed the unnecessary ink that is positioned at the opening outside of carving roller.
In case conductive traces is gone up in printing, then by with in the groove that the dielectric fagging immerses with second electromotive force with positive polarity links to each other, and by with the track short circuit be connected to first potential source with negative polarity, make these conductive traces experience the processing of electrolysis tanks 7.Utilize the distance of formerly demarcating to guarantee the continuity of the electrolysis on same pattern in the process that this plate moves between roller, described distance of formerly demarcating be and corresponding at least two first rollers of two first electrodes between distance, the distance between described two first rollers is such: the length 21 of the pattern 4 of the fagging that its corresponding length is less than or equal to the direction that moves with respect to this fagging in electrolysis tank, record along plate 2.
Also the roller that forms first electrode can be manufactured: the length that they record on respect to the direction vertical with the moving direction of fagging in groove equals the width 38 of pattern 4 at least, and this width of pattern 4 is to record on fagging with respect to the equidirectional vertical with the moving direction of fagging in groove.Or rather, with the perpendicular direction of the moving direction of fagging in the pond on, the length of first electrode or first roller can cover all tracks of this same pattern 4 at least.The length of first roller or first electrode depends on the number of the pattern that has on the fagging 2.
In this example, the number of repetition of electrolysis step is the number of the element 3 of immersion device 6, and this is the size that is less than or equal to pattern 4 because of the distance between first roller of measuring along fagging 28 and 9 (or 9 and 10,10 and 11,11 and 12).
According to the preferred embodiments of the present invention of Fig. 1, because for example 26 roller all is immersed in the same electrolysis tank, so in same electrolysis tank, repeat these steps.
As modified example, can use a series of spacer regions (compartment) 28, each spacer region comprises an electrolysis tank (Fig. 4).In this example, have a series of three spacer regions (for example 28) according to the metallization equipment of this modified example.These spacer regions are created as: make dielectric fagging 2 pass through via slit.According to the present invention, the size of each spacer region is all less than pattern 4.The track 30 of each fagging element is connected at least two first columnar electrodes 29 and 35.These first electrodes 29 and 35 contact with each track by being positioned at a plurality of of spacer region 28 outsides.In another example, available roller replaces these pieces. Interconnective electrode 29 and 35 contacts with part 18 and 17 respectively.Similar configuration also is applicable to other spacer regions.Fagging enter each spacer region during, guarantee itself and the contacting of electrolysis tank by electrode 36.
Can in Fig. 1, arrange the level sensor C of electrolysis tank, reduce that the reduction of this level will hinder the correct electrolysis to pattern 4 to prevent issuable level.
Preferably, carry out successively continuously and can finally realize correct metallized print steps 5 and electrolysis step 6, to interrupt the trace separation that (wrapping up) institute must cause in the middle of preventing.The translational speed of plate in print steps can be different with the translational speed of plate in electrolysis step; Can be the translational speed of plate
In the practice, to carry out to realize correct metallized electrolysis step 6 between the speed between 1 meter to 10 meters of the per minutes.
Claims (13)
1, a kind of metallization equipment (1) that is used to be covered with the dielectric fagging (2) of conductive traces pattern (4), this metallization equipment comprises:
Electrolysis unit (6);
This electrolysis unit comprises: electrolysis tank (7); First electrode (8,9,10,11,12) that links to each other with first potential source (14), described first electromotive force (14) has and the opposite polarity of second electromotive force (15), one or more second electrodes (13) by described electrolysis unit apply second electromotive force to described electrolysis tank, it is characterized in that:
Described dielectric fagging is dipped in the described electrolysis tank, makes the track of same pattern link to each other with the described second electromotive force short circuit with described first electromotive force, and
At least two described first electrodes are connected to the relative pattern part (17,18) of this same pattern, and the mid portion of this same pattern (19) is immersed in the described electrolysis tank.
2, equipment according to claim 1, its feature also is:
Described two first electrodes with less than with respect to the moving direction of described fagging in described electrolysis tank, along described fagging measure described pattern (4) length (21) distance and be separated from each other.
3, equipment according to claim 1 and 2 is characterized in that, also comprises:
The drive unit (22) that is used for described dielectric fagging, and
From wherein passing in and out the continuous electrolysis tank part of described fagging.
4, equipment according to claim 3 is characterized in that, also comprises:
Be positioned at a series of first rollers of described electrolysis tank outside and be positioned at a series of second rollers of described electrolysis tank inside;
Described dielectric fagging alternately passes through from described first roller to described second roller etc.;
Described first roller is provided with described first electromotive force;
Described second roller preferably insulate.
5, equipment according to claim 4, its feature are that also described roller is motorized.
6, according to each the described equipment in the claim 1 to 5, its feature is that also described electrolysis tank is based on the structure of the copper sulfide in the acid medium.
7, according to each the described equipment in the claim 1 to 6, its feature also is, described dielectric fagging is positioned between first electrode (27) of first electrode (8-12) of first series and second series.
8, according to each the described equipment in the claim 1 to 7, its feature is that also each of described these patterns connects track (37) by at least one and links together.
9, a kind of method for metallising that is used to be covered with the dielectric fagging (2) of conductive traces pattern (4) is characterized in that:
A) by described dielectric fagging is immersed in the electrolysis tank (7), and by described track short circuit is connected to first potential source (14), make at least one conductive traces pattern stand processing in the electrolysis tank (7), described first electromotive force (14) has and the opposite polarity of second electromotive force (15) that imposes on described electrolysis tank;
B) apply described first electromotive force by at least two electrodes to the relative pattern part (17,18) of same pattern, and the mid portion (19) of described pattern is immersed in the described electrolysis tank.
10, method according to claim 9, its feature also is:
Repeating step a) and step b).
11, method according to claim 10, its feature also is:
Use same electrolysis tank to carry out described repetition.
12, according to each the described method in the claim 9 to 11, its feature also is:
Described electrolysis tank is based on the structure of the copper sulfide in the acid medium.
13, according to each the described method in the claim 9 to 12, its feature also is:
Described step a) and step b) are with continuous in time between the speed of 1 meter to 10 meters of per minute.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR0214916A FR2847761B1 (en) | 2002-11-27 | 2002-11-27 | METALLIZING DEVICE FOR PRINTED FORMS HAVING ELECTRICALLY CONDUCTIVE SLIDES AND METHOD FOR METALLIZING THE SAME |
| FR02/14916 | 2002-11-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1745609A true CN1745609A (en) | 2006-03-08 |
Family
ID=32241693
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2003801092636A Pending CN1745609A (en) | 2002-11-27 | 2003-11-27 | Metallization device for printed boards with conductive tracks and related metallization method |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20060151330A1 (en) |
| EP (1) | EP1568258A1 (en) |
| JP (1) | JP2006508249A (en) |
| CN (1) | CN1745609A (en) |
| AU (1) | AU2003295076A1 (en) |
| FR (1) | FR2847761B1 (en) |
| WO (1) | WO2004052062A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102560585A (en) * | 2012-03-01 | 2012-07-11 | 湖北盛友钻石材料有限公司 | Method and device for manufacturing diamond wire saw |
| CN104032344A (en) * | 2014-06-23 | 2014-09-10 | 浙江纺织服装职业技术学院 | Silver chloride continuous electroplating equipment for silver-plated yarn |
| WO2021164474A1 (en) * | 2020-02-20 | 2021-08-26 | 深圳市海瀚新能源技术有限公司 | Coating conductive device, coating system and coating method for conductive film |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL1025446C2 (en) * | 2004-02-09 | 2005-08-10 | Besi Plating B V | Method and device for electrolytically increasing the thickness of an electrically conductive pattern on a dielectric support as well as dielectric support. |
| JP6422783B2 (en) * | 2015-01-09 | 2018-11-14 | シャープ株式会社 | Loop antenna and method of manufacturing loop antenna |
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| US3661732A (en) * | 1970-06-01 | 1972-05-09 | Production Machinery Corp | Method and apparatus for electroplating |
| US3746630A (en) * | 1970-12-08 | 1973-07-17 | Auric Corp | Apparatus for selective electroplating of strips |
| US3729389A (en) * | 1970-12-10 | 1973-04-24 | Western Electric Co | Method of electroplating discrete conductive regions |
| US3956077A (en) * | 1975-03-27 | 1976-05-11 | Western Electric Company, Inc. | Methods of providing contact between two members normally separable by an intervening member |
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| IT1177925B (en) * | 1984-07-24 | 1987-08-26 | Centro Speriment Metallurg | PROCEDURE FOR CONTINUOUS ELECTRODEPOSITION OF METALS WITH HIGH CURRENT DENISTA OF VERTICAL CELLS AND RELEVANT IMPLEMENTATION DEVICE |
| US4652346A (en) * | 1984-12-31 | 1987-03-24 | Olin Corporation | Apparatus and process for the continuous plating of wide delicate metal foil |
| DE3603856C2 (en) * | 1986-02-07 | 1994-05-05 | Bosch Gmbh Robert | Method and device for galvanizing flat workpieces such as printed circuit boards |
| JPH0233995A (en) * | 1988-07-23 | 1990-02-05 | Alps Electric Co Ltd | Manufacture of flexible circuit board |
| US4944850A (en) * | 1989-12-18 | 1990-07-31 | Hewlett-Packard Company | Tape automated bonded (tab) circuit and method for making the same |
| JP2000151082A (en) * | 1998-11-17 | 2000-05-30 | Mitsumi Electric Co Ltd | Conductive pattern plating method for board |
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2002
- 2002-11-27 FR FR0214916A patent/FR2847761B1/en not_active Expired - Fee Related
-
2003
- 2003-11-27 JP JP2004556450A patent/JP2006508249A/en not_active Withdrawn
- 2003-11-27 US US10/536,288 patent/US20060151330A1/en not_active Abandoned
- 2003-11-27 CN CNA2003801092636A patent/CN1745609A/en active Pending
- 2003-11-27 AU AU2003295076A patent/AU2003295076A1/en not_active Abandoned
- 2003-11-27 EP EP03786076A patent/EP1568258A1/en not_active Withdrawn
- 2003-11-27 WO PCT/FR2003/050141 patent/WO2004052062A1/en active Application Filing
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102560585A (en) * | 2012-03-01 | 2012-07-11 | 湖北盛友钻石材料有限公司 | Method and device for manufacturing diamond wire saw |
| CN104032344A (en) * | 2014-06-23 | 2014-09-10 | 浙江纺织服装职业技术学院 | Silver chloride continuous electroplating equipment for silver-plated yarn |
| CN104032344B (en) * | 2014-06-23 | 2017-02-01 | 浙江纺织服装职业技术学院 | Silver chloride continuous electroplating equipment for silver-plated yarn |
| WO2021164474A1 (en) * | 2020-02-20 | 2021-08-26 | 深圳市海瀚新能源技术有限公司 | Coating conductive device, coating system and coating method for conductive film |
| US11821100B2 (en) | 2020-02-20 | 2023-11-21 | Xiamen Hithium Energy Storage Technology Co., Ltd. | Conductive plating apparatus, plating system and plating method for conductive film |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1568258A1 (en) | 2005-08-31 |
| WO2004052062A1 (en) | 2004-06-17 |
| US20060151330A1 (en) | 2006-07-13 |
| FR2847761A1 (en) | 2004-05-28 |
| FR2847761B1 (en) | 2005-02-04 |
| JP2006508249A (en) | 2006-03-09 |
| AU2003295076A1 (en) | 2004-06-23 |
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