JP2006505133A - 電子部品抜き取り装置 - Google Patents

電子部品抜き取り装置 Download PDF

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Publication number
JP2006505133A
JP2006505133A JP2004549000A JP2004549000A JP2006505133A JP 2006505133 A JP2006505133 A JP 2006505133A JP 2004549000 A JP2004549000 A JP 2004549000A JP 2004549000 A JP2004549000 A JP 2004549000A JP 2006505133 A JP2006505133 A JP 2006505133A
Authority
JP
Japan
Prior art keywords
electronic component
extraction
extracting
suction head
delivery device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004549000A
Other languages
English (en)
Japanese (ja)
Inventor
ドロマール，パスカル
フロワドゥヴォ，クロード
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ismeca Semiconductor Holding SA
Original Assignee
Ismeca Semiconductor Holding SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ismeca Semiconductor Holding SA filed Critical Ismeca Semiconductor Holding SA
Publication of JP2006505133A publication Critical patent/JP2006505133A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Specific Conveyance Elements (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Manipulator (AREA)
  • Die Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2004549000A 2002-11-04 2003-09-30 電子部品抜き取り装置 Pending JP2006505133A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH18402002 2002-11-04
PCT/CH2003/000654 WO2004043125A1 (fr) 2002-11-04 2003-09-30 Dispositif pour l'extraction de composants electroniques

Publications (1)

Publication Number Publication Date
JP2006505133A true JP2006505133A (ja) 2006-02-09

Family

ID=32304031

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004549000A Pending JP2006505133A (ja) 2002-11-04 2003-09-30 電子部品抜き取り装置

Country Status (9)

Country Link
EP (1) EP1559303B1 (de)
JP (1) JP2006505133A (de)
KR (1) KR20050074981A (de)
CN (1) CN100431399C (de)
AT (1) ATE324774T1 (de)
AU (1) AU2003264230A1 (de)
DE (1) DE60304891T2 (de)
MY (1) MY136309A (de)
WO (1) WO2004043125A1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY168113A (en) * 2013-01-25 2018-10-11 Exis Tech Sdn Bhd An apparatus for picking, placing and pressing semiconductor components

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL8103573A (nl) * 1981-07-29 1983-02-16 Philips Nv Inrichting voor het tegelijkertijd toevoeren van meerdere in banden verpakte electrische en/of electronische onderdelen aan een bepaalde positie.
CH664320A5 (de) * 1982-03-08 1988-02-29 Miroslav Tresky Dr Ing Vorrichtung zum bestuecken eines objektes mit verschiedenen in elektrischen und elektronischen schaltkreisen ueblichen komponenten.
US4472218A (en) * 1983-12-23 1984-09-18 At&T Technologies, Inc. Removing articles from an adhesive web
DE59204509D1 (de) * 1992-04-13 1996-01-11 Tresky Dr Ing Miroslav Ausstossvorrichtung zum Abtrennen eines Chips von einem adhäsiven Träger.

Also Published As

Publication number Publication date
DE60304891D1 (de) 2006-06-01
CN100431399C (zh) 2008-11-05
CN1695413A (zh) 2005-11-09
ATE324774T1 (de) 2006-05-15
EP1559303B1 (de) 2006-04-26
AU2003264230A1 (en) 2004-06-07
MY136309A (en) 2008-09-30
KR20050074981A (ko) 2005-07-19
EP1559303A1 (de) 2005-08-03
DE60304891T2 (de) 2006-11-23
WO2004043125A1 (fr) 2004-05-21

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