ATE324774T1 - Einrichtung zum extrahieren elektronischer komponenten - Google Patents

Einrichtung zum extrahieren elektronischer komponenten

Info

Publication number
ATE324774T1
ATE324774T1 AT03810356T AT03810356T ATE324774T1 AT E324774 T1 ATE324774 T1 AT E324774T1 AT 03810356 T AT03810356 T AT 03810356T AT 03810356 T AT03810356 T AT 03810356T AT E324774 T1 ATE324774 T1 AT E324774T1
Authority
AT
Austria
Prior art keywords
extractor
electronic components
electromagnetic transducer
movements
extracting electronic
Prior art date
Application number
AT03810356T
Other languages
English (en)
Inventor
Pascal Dromard
Claude Froidevaux
Original Assignee
Ismeca Semiconductor Holding
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ismeca Semiconductor Holding filed Critical Ismeca Semiconductor Holding
Application granted granted Critical
Publication of ATE324774T1 publication Critical patent/ATE324774T1/de

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67144Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67132Apparatus for placing on an insulating substrate, e.g. tape

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Specific Conveyance Elements (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Manipulator (AREA)
  • Die Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
AT03810356T 2002-11-04 2003-09-30 Einrichtung zum extrahieren elektronischer komponenten ATE324774T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH18402002 2002-11-04

Publications (1)

Publication Number Publication Date
ATE324774T1 true ATE324774T1 (de) 2006-05-15

Family

ID=32304031

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03810356T ATE324774T1 (de) 2002-11-04 2003-09-30 Einrichtung zum extrahieren elektronischer komponenten

Country Status (9)

Country Link
EP (1) EP1559303B1 (de)
JP (1) JP2006505133A (de)
KR (1) KR20050074981A (de)
CN (1) CN100431399C (de)
AT (1) ATE324774T1 (de)
AU (1) AU2003264230A1 (de)
DE (1) DE60304891T2 (de)
MY (1) MY136309A (de)
WO (1) WO2004043125A1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY168113A (en) * 2013-01-25 2018-10-11 Exis Tech Sdn Bhd An apparatus for picking, placing and pressing semiconductor components

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL8103573A (nl) * 1981-07-29 1983-02-16 Philips Nv Inrichting voor het tegelijkertijd toevoeren van meerdere in banden verpakte electrische en/of electronische onderdelen aan een bepaalde positie.
CH664320A5 (de) * 1982-03-08 1988-02-29 Miroslav Tresky Dr Ing Vorrichtung zum bestuecken eines objektes mit verschiedenen in elektrischen und elektronischen schaltkreisen ueblichen komponenten.
US4472218A (en) * 1983-12-23 1984-09-18 At&T Technologies, Inc. Removing articles from an adhesive web
DE59204509D1 (de) * 1992-04-13 1996-01-11 Tresky Dr Ing Miroslav Ausstossvorrichtung zum Abtrennen eines Chips von einem adhäsiven Träger.

Also Published As

Publication number Publication date
DE60304891D1 (de) 2006-06-01
CN100431399C (zh) 2008-11-05
CN1695413A (zh) 2005-11-09
EP1559303B1 (de) 2006-04-26
AU2003264230A1 (en) 2004-06-07
MY136309A (en) 2008-09-30
KR20050074981A (ko) 2005-07-19
EP1559303A1 (de) 2005-08-03
DE60304891T2 (de) 2006-11-23
WO2004043125A1 (fr) 2004-05-21
JP2006505133A (ja) 2006-02-09

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Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties