MY136309A - Device for extracting electronic components - Google Patents

Device for extracting electronic components

Info

Publication number
MY136309A
MY136309A MYPI20034099A MYPI20034099A MY136309A MY 136309 A MY136309 A MY 136309A MY PI20034099 A MYPI20034099 A MY PI20034099A MY PI20034099 A MYPI20034099 A MY PI20034099A MY 136309 A MY136309 A MY 136309A
Authority
MY
Malaysia
Prior art keywords
extractor
extractors
electronic components
extracting
movements
Prior art date
Application number
MYPI20034099A
Inventor
Dromard Pascal
Froidevaux Claude
Original Assignee
Ismeca Semiconductor Holding
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ismeca Semiconductor Holding filed Critical Ismeca Semiconductor Holding
Publication of MY136309A publication Critical patent/MY136309A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Specific Conveyance Elements (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Manipulator (AREA)
  • Die Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

DEVICE COMPRISING AT LEAST ONE EXTRACTOR FOR EXTRACTING ELECTRONIC COMPONENTS FROM A CUTOUT WAFER, THE EXTRACTOR OR EXTRACTORS BEING ACTUATED BY A LINEAR ELECTROMAGNETIC TRANSDUCER. USE OF A LINEAR ELECTROMAGNETIC TRANSDUCER, PREFERABLY A VOICE COIL MOTOR, FOR GENERATING THE MOVEMENTS OF THE EXTRACTOR OR EXTRACTORS ALLOWS THE EXTRACTING DEVICE TO REACH VERY HIGH WORKING SPEEDS, EQUAL TO OR GREATER THAN THOSE OF MOST EXISTING PROCESSING LINES. USE OF THE SAME MOTORIZATION FOR THE ASPIRATION HEAD (11) REMOVING THE ELECTRONIC COMPONENT TO EXTRACT AS FOR THE EXTRACTOR OR EXTRACTORS ALLOWS THE SYNCHRONIZATION OF BOTH MOVEMENTS TO BE OPTIMIZED AND THE QUALITY OF THE EXTRACTION METHOD TO BE IMPROVED. (FIGURE 2)
MYPI20034099A 2002-11-04 2003-10-28 Device for extracting electronic components MY136309A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH18402002 2002-11-04
PCT/CH2003/000654 WO2004043125A1 (en) 2002-11-04 2003-09-30 Device for extracting electronic components

Publications (1)

Publication Number Publication Date
MY136309A true MY136309A (en) 2008-09-30

Family

ID=32304031

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20034099A MY136309A (en) 2002-11-04 2003-10-28 Device for extracting electronic components

Country Status (9)

Country Link
EP (1) EP1559303B1 (en)
JP (1) JP2006505133A (en)
KR (1) KR20050074981A (en)
CN (1) CN100431399C (en)
AT (1) ATE324774T1 (en)
AU (1) AU2003264230A1 (en)
DE (1) DE60304891T2 (en)
MY (1) MY136309A (en)
WO (1) WO2004043125A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY168113A (en) * 2013-01-25 2018-10-11 Exis Tech Sdn Bhd An apparatus for picking, placing and pressing semiconductor components

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL8103573A (en) * 1981-07-29 1983-02-16 Philips Nv DEVICE FOR AT THE SAME TIME FEEDING MULTIPLE ELECTRICAL AND / OR ELECTRONIC COMPONENTS IN TIRES AT A PARTICULAR POSITION.
CH664320A5 (en) * 1982-03-08 1988-02-29 Miroslav Tresky Dr Ing Mounting apparatus AN OBJECT WITH DIFFERENT IN ELECTRICAL AND ELECTRONIC CIRCUITS USUAL COMPONENTS.
US4472218A (en) * 1983-12-23 1984-09-18 At&T Technologies, Inc. Removing articles from an adhesive web
DE59204509D1 (en) * 1992-04-13 1996-01-11 Tresky Dr Ing Miroslav Ejection device for separating a chip from an adhesive carrier.

Also Published As

Publication number Publication date
DE60304891D1 (en) 2006-06-01
CN100431399C (en) 2008-11-05
CN1695413A (en) 2005-11-09
ATE324774T1 (en) 2006-05-15
EP1559303B1 (en) 2006-04-26
AU2003264230A1 (en) 2004-06-07
KR20050074981A (en) 2005-07-19
EP1559303A1 (en) 2005-08-03
DE60304891T2 (en) 2006-11-23
WO2004043125A1 (en) 2004-05-21
JP2006505133A (en) 2006-02-09

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