JP2006502539A - 発光ディスプレイの製造方法 - Google Patents
発光ディスプレイの製造方法 Download PDFInfo
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- JP2006502539A JP2006502539A JP2004541060A JP2004541060A JP2006502539A JP 2006502539 A JP2006502539 A JP 2006502539A JP 2004541060 A JP2004541060 A JP 2004541060A JP 2004541060 A JP2004541060 A JP 2004541060A JP 2006502539 A JP2006502539 A JP 2006502539A
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- light
- light emitting
- substrate
- emitting display
- manufacturing
- Prior art date
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 40
- 239000000463 material Substances 0.000 claims abstract description 34
- 238000000034 method Methods 0.000 claims abstract description 29
- 239000000758 substrate Substances 0.000 claims abstract description 22
- 239000007788 liquid Substances 0.000 claims abstract description 20
- 230000004888 barrier function Effects 0.000 claims abstract description 12
- 230000002209 hydrophobic effect Effects 0.000 claims abstract description 12
- 239000012530 fluid Substances 0.000 claims abstract description 7
- 239000003086 colorant Substances 0.000 claims abstract description 4
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical group C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 claims description 14
- 230000008569 process Effects 0.000 claims description 7
- 239000005871 repellent Substances 0.000 claims description 4
- 238000005192 partition Methods 0.000 claims description 3
- 230000002940 repellent Effects 0.000 claims description 3
- 238000003682 fluorination reaction Methods 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 2
- 230000001846 repelling effect Effects 0.000 abstract description 6
- 239000000126 substance Substances 0.000 abstract description 3
- 230000008901 benefit Effects 0.000 abstract description 2
- 238000007641 inkjet printing Methods 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 49
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 6
- 229910052750 molybdenum Inorganic materials 0.000 description 6
- 239000011733 molybdenum Substances 0.000 description 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- 238000000059 patterning Methods 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 238000004528 spin coating Methods 0.000 description 3
- 238000001039 wet etching Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 2
- 229910052788 barium Inorganic materials 0.000 description 2
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000010849 ion bombardment Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920000553 poly(phenylenevinylene) Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- -1 polyphenylene vinylene Polymers 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000004811 fluoropolymer Substances 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005661 hydrophobic surface Effects 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 231100000989 no adverse effect Toxicity 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/17—Passive-matrix OLED displays
- H10K59/173—Passive-matrix OLED displays comprising banks or shadow masks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/191—Deposition of organic active material characterised by provisions for the orientation or alignment of the layer to be deposited
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/351—Thickness
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
Claims (10)
- 複数の発光素子を基板上に有する発光ディスプレイの製造方法であって、前記基板上または前記基板を覆うように、少なくとも1の分割手段が設けられ、該分割手段は、前記発光素子を形成する液体発光物質の成膜される区画を少なくとも部分的に区切り、
少なくとも1の前記分割手段の少なくとも一部は、前記液体発光物質と反発しあうことを特徴とする、製造方法。 - 反発部分は疎水性材料を有することを特徴とする請求項1に記載の製造方法。
- 前記区画は、レジスト構造部によって区切られ、前記反発部分は、局部的フッ素化、フッ素樹脂の付与または撥水プライマの付与によって、前記レジスト構造部に設置されることを特徴とする請求項2に記載の製造方法。
- 前記撥水プライマは、ヘキサメチルジシラザンであることを特徴とする請求項3に記載の製造方法。
- 異なる色の光を生じるように適合された異なる液体発光物質が、異なる区画に成膜されることを特徴とする請求項1に記載の製造方法。
- 前記液体発光物質は、転写プロセスによって前記区画に成膜されることを特徴とする請求項1に記載の製造方法。
- 複数の発光素子を基板上に有する発光ディスプレイであって、前記発光素子は、発光体を有する前記基板上のまたは前記基板を覆う区画によって位置が定められ、
前記区画の少なくともいくつかは、疎水性流体バリアによって、少なくとも部分的に区切られることを特徴とする、発光ディスプレイ。 - 前記疎水性流体バリアは、レジスト構造部上またはレジスト構造部を覆うように設置され、当該発光ディスプレイはさらに、前記発光素子を駆動する第1および第2の電極を有することを特徴とする請求項7に記載の発光ディスプレイ。
- 当該ディスプレイは、カラーディスプレイであることを特徴とする請求項7に記載の発光ディスプレイ。
- 請求項7に記載の発光ディスプレイを有する電子機器。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP02079149 | 2002-10-07 | ||
PCT/IB2003/004155 WO2004032573A1 (en) | 2002-10-07 | 2003-09-18 | Method for manufacturing a light emitting display |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2006502539A true JP2006502539A (ja) | 2006-01-19 |
Family
ID=32050062
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004541060A Pending JP2006502539A (ja) | 2002-10-07 | 2003-09-18 | 発光ディスプレイの製造方法 |
Country Status (8)
Country | Link |
---|---|
US (2) | US20060022581A1 (ja) |
EP (1) | EP1559299A1 (ja) |
JP (1) | JP2006502539A (ja) |
KR (1) | KR20050051683A (ja) |
CN (1) | CN1689377B (ja) |
AU (1) | AU2003263478A1 (ja) |
TW (1) | TW200417284A (ja) |
WO (1) | WO2004032573A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010108674A (ja) * | 2008-10-29 | 2010-05-13 | Hitachi Displays Ltd | 有機エレクトロルミネッセンス表示装置及びその製造方法 |
JP2013542569A (ja) * | 2010-10-12 | 2013-11-21 | コーニンクレッカ フィリップス エヌ ヴェ | カプセル化を伴う有機電子デバイス |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101187205B1 (ko) * | 2006-06-09 | 2012-10-02 | 삼성디스플레이 주식회사 | 박막 트랜지스터 표시판 및 그 제조 방법 |
KR20130043482A (ko) * | 2011-10-20 | 2013-04-30 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
KR101941178B1 (ko) | 2012-09-28 | 2019-01-23 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 유기 발광 표시 장치의 제조 방법 |
CN105374852B (zh) * | 2015-11-16 | 2019-10-11 | Tcl集团股份有限公司 | 一种无像素bank的印刷型发光显示器及其制作方法 |
CN105489611A (zh) * | 2015-11-26 | 2016-04-13 | Tcl集团股份有限公司 | 一种印刷型发光显示器及其制作方法 |
CN105552103A (zh) * | 2015-12-25 | 2016-05-04 | Tcl集团股份有限公司 | 印刷型发光显示器及其制备方法 |
CN107403828B (zh) * | 2017-07-31 | 2020-04-28 | 京东方科技集团股份有限公司 | 一种显示面板及其制作方法 |
CN109309112B (zh) * | 2018-09-18 | 2021-03-26 | 京东方科技集团股份有限公司 | 一种阵列基板及其制作方法、显示面板、显示装置 |
CN110165062B (zh) * | 2019-03-07 | 2021-01-05 | 合肥视涯技术有限公司 | 一种有机发光显示装置及其形成方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2906006B2 (ja) * | 1992-10-15 | 1999-06-14 | 東京エレクトロン株式会社 | 処理方法及びその装置 |
JPH0766287A (ja) * | 1993-08-23 | 1995-03-10 | Matsushita Electric Ind Co Ltd | 半導体装置及びその製造方法 |
JP3174999B2 (ja) * | 1995-08-03 | 2001-06-11 | キヤノン株式会社 | 電子放出素子、電子源、それを用いた画像形成装置、及びそれらの製造方法 |
CN100550472C (zh) * | 1998-03-17 | 2009-10-14 | 精工爱普生株式会社 | 薄膜构图的衬底及其表面处理 |
JP3646510B2 (ja) * | 1998-03-18 | 2005-05-11 | セイコーエプソン株式会社 | 薄膜形成方法、表示装置およびカラーフィルタ |
AU781789B2 (en) * | 1999-12-21 | 2005-06-16 | Flexenable Limited | Solution processing |
JP2002237383A (ja) * | 2000-03-31 | 2002-08-23 | Seiko Epson Corp | 有機el素子の製造方法、有機el素子 |
TW490997B (en) * | 2000-03-31 | 2002-06-11 | Seiko Epson Corp | Method of manufacturing organic EL element, and organic EL element |
GB0109295D0 (en) * | 2001-04-12 | 2001-05-30 | Univ Cambridge Tech | Optoelectronic devices and a method for producing the same |
JP4054850B2 (ja) * | 2002-02-15 | 2008-03-05 | 株式会社ブイ・テクノロジー | 有機エレクトロルミネッセンス露光装置の製造方法 |
US20050175777A1 (en) * | 2002-05-27 | 2005-08-11 | Koninkilijke Phillips Electronics N.V. | Method of providing a substrate surface with a patterned layer |
US6943066B2 (en) * | 2002-06-05 | 2005-09-13 | Advantech Global, Ltd | Active matrix backplane for controlling controlled elements and method of manufacture thereof |
-
2003
- 2003-09-18 AU AU2003263478A patent/AU2003263478A1/en not_active Abandoned
- 2003-09-18 WO PCT/IB2003/004155 patent/WO2004032573A1/en active Application Filing
- 2003-09-18 JP JP2004541060A patent/JP2006502539A/ja active Pending
- 2003-09-18 CN CN038238632A patent/CN1689377B/zh not_active Expired - Fee Related
- 2003-09-18 KR KR1020057005892A patent/KR20050051683A/ko not_active Application Discontinuation
- 2003-09-18 US US10/530,302 patent/US20060022581A1/en not_active Abandoned
- 2003-09-18 EP EP03799014A patent/EP1559299A1/en not_active Withdrawn
- 2003-10-03 TW TW092127452A patent/TW200417284A/zh unknown
-
2009
- 2009-04-15 US US12/424,519 patent/US20090209161A1/en not_active Abandoned
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010108674A (ja) * | 2008-10-29 | 2010-05-13 | Hitachi Displays Ltd | 有機エレクトロルミネッセンス表示装置及びその製造方法 |
JP2013542569A (ja) * | 2010-10-12 | 2013-11-21 | コーニンクレッカ フィリップス エヌ ヴェ | カプセル化を伴う有機電子デバイス |
Also Published As
Publication number | Publication date |
---|---|
AU2003263478A1 (en) | 2004-04-23 |
US20090209161A1 (en) | 2009-08-20 |
KR20050051683A (ko) | 2005-06-01 |
TW200417284A (en) | 2004-09-01 |
EP1559299A1 (en) | 2005-08-03 |
WO2004032573A1 (en) | 2004-04-15 |
CN1689377A (zh) | 2005-10-26 |
US20060022581A1 (en) | 2006-02-02 |
CN1689377B (zh) | 2010-10-13 |
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