JP2006502248A5 - - Google Patents
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- Publication number
- JP2006502248A5 JP2006502248A5 JP2003563809A JP2003563809A JP2006502248A5 JP 2006502248 A5 JP2006502248 A5 JP 2006502248A5 JP 2003563809 A JP2003563809 A JP 2003563809A JP 2003563809 A JP2003563809 A JP 2003563809A JP 2006502248 A5 JP2006502248 A5 JP 2006502248A5
- Authority
- JP
- Japan
- Prior art keywords
- thermal interface
- interface material
- mixture
- resin
- rubber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims 7
- 239000011347 resin Substances 0.000 claims 7
- 229920005989 resin Polymers 0.000 claims 7
- 239000000203 mixture Substances 0.000 claims 6
- 150000001412 amines Chemical class 0.000 claims 3
- 150000001875 compounds Chemical class 0.000 claims 3
- 239000011231 conductive filler Substances 0.000 claims 3
- 229910052751 metal Inorganic materials 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 239000012782 phase change material Substances 0.000 claims 2
- 239000000843 powder Substances 0.000 claims 2
- 229920006395 saturated elastomer Polymers 0.000 claims 2
- 229910052582 BN Inorganic materials 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- -1 boron nitride compound Chemical class 0.000 claims 1
- 239000003054 catalyst Substances 0.000 claims 1
- 238000004132 cross linking Methods 0.000 claims 1
- 229920001971 elastomer Polymers 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 239000000080 wetting agent Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/047,617 US6673434B2 (en) | 1999-12-01 | 2002-01-14 | Thermal interface materials |
| PCT/US2003/001094 WO2003064148A1 (en) | 2002-01-14 | 2003-01-13 | Thermal interface materials |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006502248A JP2006502248A (ja) | 2006-01-19 |
| JP2006502248A5 true JP2006502248A5 (https=) | 2006-03-02 |
Family
ID=27658138
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003563809A Pending JP2006502248A (ja) | 2002-01-14 | 2003-01-13 | サーマルインターフェイス材料 |
Country Status (8)
| Country | Link |
|---|---|
| US (4) | US6673434B2 (https=) |
| EP (1) | EP1483110A4 (https=) |
| JP (1) | JP2006502248A (https=) |
| KR (1) | KR100685013B1 (https=) |
| CN (2) | CN100351075C (https=) |
| SG (1) | SG160196A1 (https=) |
| TW (1) | TWI308171B (https=) |
| WO (1) | WO2003064148A1 (https=) |
Families Citing this family (60)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6706219B2 (en) * | 1999-09-17 | 2004-03-16 | Honeywell International Inc. | Interface materials and methods of production and use thereof |
| US6797382B2 (en) * | 1999-12-01 | 2004-09-28 | Honeywell International Inc. | Thermal interface materials |
| US6673434B2 (en) * | 1999-12-01 | 2004-01-06 | Honeywell International, Inc. | Thermal interface materials |
| US7608324B2 (en) * | 2001-05-30 | 2009-10-27 | Honeywell International Inc. | Interface materials and methods of production and use thereof |
| DE10151036A1 (de) * | 2001-10-16 | 2003-05-08 | Siemens Ag | Isolator für ein organisches Elektronikbauteil |
| US6761813B2 (en) * | 2002-01-31 | 2004-07-13 | Intel Corporation | Heat transfer through covalent bonding of thermal interface material |
| US6956739B2 (en) * | 2002-10-29 | 2005-10-18 | Parker-Hannifin Corporation | High temperature stable thermal interface material |
| US7210227B2 (en) * | 2002-11-26 | 2007-05-01 | Intel Corporation | Decreasing thermal contact resistance at a material interface |
| JP2005146057A (ja) * | 2003-11-12 | 2005-06-09 | Polymatech Co Ltd | 高熱伝導性成形体及びその製造方法 |
| CN100389166C (zh) * | 2004-04-29 | 2008-05-21 | 鸿富锦精密工业（深圳）有限公司 | 一种热界面材料及其制造方法 |
| US20050280987A1 (en) * | 2004-06-07 | 2005-12-22 | Kwitek Benjamin J | Phase change materials as a heat sink for computers |
| US7269015B2 (en) * | 2005-02-01 | 2007-09-11 | Tyco Electronics Corporation | Heat sink interface insert |
| CN100543103C (zh) * | 2005-03-19 | 2009-09-23 | 清华大学 | 热界面材料及其制备方法 |
| CN1841713A (zh) | 2005-03-31 | 2006-10-04 | 清华大学 | 热界面材料及其制作方法 |
| US20060261469A1 (en) * | 2005-05-23 | 2006-11-23 | Taiwan Semiconductor Manufacturing Co., Ltd. | Sealing membrane for thermal interface material |
| CN1927987A (zh) * | 2005-09-06 | 2007-03-14 | 鸿富锦精密工业（深圳）有限公司 | 热界面材料及其制备方法 |
| WO2007053571A2 (en) * | 2005-11-01 | 2007-05-10 | Techfilm, Llc | Thermal interface material with multiple size distribution thermally conductive fillers |
| CN1978583A (zh) * | 2005-12-09 | 2007-06-13 | 富准精密工业(深圳)有限公司 | 热介面材料 |
| TWI291480B (en) * | 2005-12-20 | 2007-12-21 | Ind Tech Res Inst | Composition for thermal interface materials |
| WO2008030910A1 (en) * | 2006-09-08 | 2008-03-13 | Lord Corporation | Flexible microelectronics adhesive |
| US20080166552A1 (en) * | 2006-11-06 | 2008-07-10 | Arlon, Inc. | Silicone based compositions for thermal interface materials |
| US8702919B2 (en) * | 2007-08-13 | 2014-04-22 | Honeywell International Inc. | Target designs and related methods for coupled target assemblies, methods of production and uses thereof |
| JP2010539706A (ja) * | 2007-09-11 | 2010-12-16 | ダウ コーニング コーポレーション | 放熱材料、該放熱材料を含む電子デバイス、ならびにそれらの調製方法および使用方法 |
| CN101803009B (zh) * | 2007-09-11 | 2012-07-04 | 陶氏康宁公司 | 组合物，包括这种组合物的热界面材料,及其制备方法和用途 |
| US7808099B2 (en) | 2008-05-06 | 2010-10-05 | International Business Machines Corporation | Liquid thermal interface having mixture of linearly structured polymer doped crosslinked networks and related method |
| US8143523B2 (en) | 2008-10-21 | 2012-03-27 | Baker Hughes Incorporated | Downhole cable with thermally conductive polymer composites |
| US20100112360A1 (en) * | 2008-10-31 | 2010-05-06 | Delano Andrew D | Layered thermal interface systems methods of production and uses thereof |
| US8138239B2 (en) * | 2008-12-23 | 2012-03-20 | Intel Corporation | Polymer thermal interface materials |
| WO2010104542A1 (en) | 2009-03-02 | 2010-09-16 | Honeywell International Inc. | Thermal interface material and method of making and using the same |
| KR101563042B1 (ko) | 2009-10-27 | 2015-10-23 | 헨켈 아이피 앤드 홀딩 게엠베하 | 에폭시화 너트쉘 오일을 포함하는 열전재 |
| US10087351B2 (en) | 2010-02-23 | 2018-10-02 | Laird Technologies, Inc. | Materials including thermally reversible gels |
| US9771508B2 (en) | 2010-02-23 | 2017-09-26 | Laird Technologies, Inc. | Thermal interface materials including thermally reversible gels |
| US9260645B2 (en) * | 2010-02-23 | 2016-02-16 | Laird Technologies, Inc. | Thermal interface materials including thermally reversible gels |
| WO2012142613A1 (en) | 2011-04-14 | 2012-10-18 | Ada Technologies, Inc. | Thermal interface materials and systems and devices containing the same |
| EP2828889B1 (en) * | 2012-03-22 | 2015-09-02 | Koninklijke Philips N.V. | Thermal interface material |
| US8587945B1 (en) * | 2012-07-27 | 2013-11-19 | Outlast Technologies Llc | Systems structures and materials for electronic device cooling |
| KR101522787B1 (ko) * | 2013-11-21 | 2015-05-26 | 삼성전기주식회사 | 부품 내장 인쇄회로기판 |
| CN103059578B (zh) * | 2013-01-22 | 2015-04-22 | 慈溪市东南复合材料有限公司 | 一种用于感温元件上的感温蜡混合物 |
| US9515004B2 (en) * | 2013-03-15 | 2016-12-06 | Laird Technologies, Inc. | Thermal interface materials |
| US9269603B2 (en) | 2013-05-09 | 2016-02-23 | Globalfoundries Inc. | Temporary liquid thermal interface material for surface tension adhesion and thermal control |
| DE102013215255A1 (de) * | 2013-08-02 | 2015-02-05 | Siemens Aktiengesellschaft | Elektronisches oder elektrisches Bauteil mit PCM-haltiger Kühlung |
| CN105899714B (zh) | 2013-12-05 | 2018-09-21 | 霍尼韦尔国际公司 | 具有经调节的pH的甲基磺酸亚锡溶液 |
| KR20160122172A (ko) | 2014-02-13 | 2016-10-21 | 허니웰 인터내셔날 인코포레이티드 | 압축성 열전도 재료 |
| PL3166999T3 (pl) | 2014-07-07 | 2023-07-03 | Honeywell International Inc. | Materiał termoprzewodzący ze zmiataczem jonów |
| EP3227399B1 (en) * | 2014-12-05 | 2021-07-14 | Honeywell International Inc. | High performance thermal interface materials with low thermal impedance |
| CN104650817A (zh) * | 2015-02-12 | 2015-05-27 | 平湖阿莱德实业有限公司 | 一种导热相变材料及其生产方法 |
| US10312177B2 (en) | 2015-11-17 | 2019-06-04 | Honeywell International Inc. | Thermal interface materials including a coloring agent |
| EP3426746B1 (en) * | 2016-03-08 | 2021-07-14 | Honeywell International Inc. | Phase change material |
| US10501671B2 (en) | 2016-07-26 | 2019-12-10 | Honeywell International Inc. | Gel-type thermal interface material |
| GB2578987B (en) | 2017-09-01 | 2023-02-08 | Rogers Corp | Fusible phase-change powders for thermal management, methods of manufacture thereof, and articles containing the powders |
| US11041103B2 (en) * | 2017-09-08 | 2021-06-22 | Honeywell International Inc. | Silicone-free thermal gel |
| US10428256B2 (en) | 2017-10-23 | 2019-10-01 | Honeywell International Inc. | Releasable thermal gel |
| US10567084B2 (en) | 2017-12-18 | 2020-02-18 | Honeywell International Inc. | Thermal interface structure for optical transceiver modules |
| CN108003406A (zh) * | 2017-12-20 | 2018-05-08 | 深圳德邦界面材料有限公司 | 一种耐温导热相变材料及其制备方法 |
| US11072706B2 (en) | 2018-02-15 | 2021-07-27 | Honeywell International Inc. | Gel-type thermal interface material |
| CN109881297B (zh) * | 2019-03-01 | 2022-06-28 | 苏州城邦达益材料科技有限公司 | 一种电学性能可变的组合物、纳米纤维及其制备方法 |
| US11373921B2 (en) | 2019-04-23 | 2022-06-28 | Honeywell International Inc. | Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing |
| WO2022015958A1 (en) * | 2020-07-16 | 2022-01-20 | Rogers Corporation | Thermally conductive phase-change composition, methods of manufacture thereof, and articles including the composition |
| KR102550466B1 (ko) * | 2021-07-29 | 2023-07-03 | 서울과학기술대학교 산학협력단 | 방열 페이스트, 방열 필름 및 그의 제조방법 |
| WO2025264732A1 (en) * | 2024-06-17 | 2025-12-26 | Henkel Ag & Co. Kgaa | Thermal interface materials |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4842911A (en) | 1983-09-02 | 1989-06-27 | The Bergquist Company | Interfacing for heat sinks |
| EP0170063B1 (en) * | 1984-07-31 | 1988-08-24 | Mitsubishi Petrochemical Co., Ltd. | Copper-type conductive coating composition |
| US5094769A (en) | 1988-05-13 | 1992-03-10 | International Business Machines Corporation | Compliant thermally conductive compound |
| CN1020826C (zh) * | 1990-01-24 | 1993-05-19 | 阎宝连 | 导热绝缘硅板及其制法 |
| US5674930A (en) * | 1991-04-04 | 1997-10-07 | Nof Corporation | Thermoplastic resin compositions |
| US5194480A (en) | 1991-05-24 | 1993-03-16 | W. R. Grace & Co.-Conn. | Thermally conductive elastomer |
| US5591789A (en) * | 1995-06-07 | 1997-01-07 | International Business Machines Corporation | Polyester dispersants for high thermal conductivity paste |
| JP3461651B2 (ja) * | 1996-01-24 | 2003-10-27 | 電気化学工業株式会社 | 六方晶窒化ほう素粉末及びその用途 |
| JP3911777B2 (ja) * | 1996-10-15 | 2007-05-09 | 東レ株式会社 | 半導体装置用接着剤組成物およびそれを用いた半導体装置用接着剤シート |
| US6432497B2 (en) | 1997-07-28 | 2002-08-13 | Parker-Hannifin Corporation | Double-side thermally conductive adhesive tape for plastic-packaged electronic components |
| JPH1145965A (ja) * | 1997-07-28 | 1999-02-16 | Kyocera Corp | 伝熱性化合物およびこれを用いた半導体装置 |
| US5989459A (en) | 1999-03-09 | 1999-11-23 | Johnson Matthey, Inc. | Compliant and crosslinkable thermal interface materials |
| US6238596B1 (en) * | 1999-03-09 | 2001-05-29 | Johnson Matthey Electronics, Inc. | Compliant and crosslinkable thermal interface materials |
| US6162663A (en) | 1999-04-20 | 2000-12-19 | Schoenstein; Paul G. | Dissipation of heat from a circuit board having bare silicon chips mounted thereon |
| JP3435097B2 (ja) * | 1999-05-25 | 2003-08-11 | 富士高分子工業株式会社 | 熱伝導性組成物 |
| US6706219B2 (en) * | 1999-09-17 | 2004-03-16 | Honeywell International Inc. | Interface materials and methods of production and use thereof |
| US6605238B2 (en) * | 1999-09-17 | 2003-08-12 | Honeywell International Inc. | Compliant and crosslinkable thermal interface materials |
| JP2003509578A (ja) * | 1999-09-21 | 2003-03-11 | サンーゴバン セラミックス アンド プラスティクス，インコーポレイティド | 熱管理のための疎水性化合物における熱伝導性材料 |
| JP2001214075A (ja) * | 2000-02-04 | 2001-08-07 | Jsr Corp | 高熱伝導性シート用組成物、高熱伝導性シート、高熱伝導性シートの製造方法および高熱伝導性シートを用いた放熱構造 |
| US6673434B2 (en) * | 1999-12-01 | 2004-01-06 | Honeywell International, Inc. | Thermal interface materials |
| US6797382B2 (en) * | 1999-12-01 | 2004-09-28 | Honeywell International Inc. | Thermal interface materials |
| US6627704B2 (en) * | 1999-12-01 | 2003-09-30 | General Electric Company | Poly(arylene ether)-containing thermoset composition, method for the preparation thereof, and articles derived therefrom |
| US6451422B1 (en) | 1999-12-01 | 2002-09-17 | Johnson Matthey, Inc. | Thermal interface materials |
| EP1401641A4 (en) * | 2001-05-30 | 2007-12-12 | Honeywell Int Inc | BONDING MATERIALS AND MANUFACTURING METHOD AND USE THEREOF |
| JP2002373921A (ja) * | 2001-06-15 | 2002-12-26 | Toray Ind Inc | 半導体装置用接着剤シートおよびそれを用いた部品ならびに半導体装置 |
| JP2003036279A (ja) | 2001-07-25 | 2003-02-07 | Cdi:Kk | 三次元ｃａｄシステム |
-
2002
- 2002-01-14 US US10/047,617 patent/US6673434B2/en not_active Expired - Lifetime
-
2003
- 2003-01-13 SG SG200605471-2A patent/SG160196A1/en unknown
- 2003-01-13 KR KR1020047010914A patent/KR100685013B1/ko not_active Expired - Lifetime
- 2003-01-13 CN CNB038056798A patent/CN100351075C/zh not_active Expired - Lifetime
- 2003-01-13 JP JP2003563809A patent/JP2006502248A/ja active Pending
- 2003-01-13 EP EP03717872A patent/EP1483110A4/en not_active Withdrawn
- 2003-01-13 CN CN2007101622755A patent/CN101126016B/zh not_active Expired - Lifetime
- 2003-01-13 WO PCT/US2003/001094 patent/WO2003064148A1/en not_active Ceased
- 2003-01-14 TW TW92100737A patent/TWI308171B/zh not_active IP Right Cessation
- 2003-11-17 US US10/715,719 patent/US6908669B2/en not_active Expired - Fee Related
-
2005
- 2005-06-20 US US11/156,698 patent/US7244491B2/en not_active Expired - Fee Related
-
2007
- 2007-05-30 US US11/809,131 patent/US7867609B2/en not_active Expired - Lifetime
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