TWM304025U - Improved assembly of fins and base of heat dissipation device - Google Patents
Improved assembly of fins and base of heat dissipation device Download PDFInfo
- Publication number
- TWM304025U TWM304025U TW95213607U TW95213607U TWM304025U TW M304025 U TWM304025 U TW M304025U TW 95213607 U TW95213607 U TW 95213607U TW 95213607 U TW95213607 U TW 95213607U TW M304025 U TWM304025 U TW M304025U
- Authority
- TW
- Taiwan
- Prior art keywords
- base
- fins
- heat dissipation
- dissipation device
- improved assembly
- Prior art date
Links
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
8、如由μ + , 101年〇3月26日修正替換 組人請專利範圍第i或2項所述散 且δ改良,該底座係一平面狀的矩形實心金屬座體。 、如申請專利範圍第2項所述散熱器韓片與底座的組合 改良,S亥底座係一圓柱形的實心金屬座體。 1〇、如申請專利範圍第9項所述散熱器鰭片與底座的組合 改良’該底座係一體成型而設有一鎖合底座。8. If the replacement is made by μ + , 101, 〇 March 26, the group is requested to modify the δ and the δ according to the patent range i or 2, and the base is a flat rectangular solid metal seat. According to the combination of the radiator Korean piece and the base described in the second application of the patent scope, the S Hai base is a cylindrical solid metal seat. 1. A combination of a heat sink fin and a base as described in claim 9 of the patent application. The base is integrally formed and provided with a lock base.
15 S15 S
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW95213607U TWM304025U (en) | 2006-08-02 | 2006-08-02 | Improved assembly of fins and base of heat dissipation device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW95213607U TWM304025U (en) | 2006-08-02 | 2006-08-02 | Improved assembly of fins and base of heat dissipation device |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM304025U true TWM304025U (en) | 2007-01-01 |
Family
ID=38318214
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW95213607U TWM304025U (en) | 2006-08-02 | 2006-08-02 | Improved assembly of fins and base of heat dissipation device |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWM304025U (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI400425B (en) * | 2010-11-24 | 2013-07-01 | Auras Technology Ltd | Method and Structure of Flat Heat Conveying Pipe Fastening Cooling Fin |
TWI468638B (en) * | 2011-09-01 | 2015-01-11 | Kunshan Lemtech Prec Engineering Co Ltd | Radiator fin and base stamping combination method |
TWI468636B (en) * | 2011-11-09 | 2015-01-11 | Cooler Master Dev Corp | Heat dissipating fin, heat dissipating device and method of manufacturing the same |
TWI731479B (en) * | 2019-08-13 | 2021-06-21 | 黃崇賢 | Stamping and riveting structure of radiating fin |
-
2006
- 2006-08-02 TW TW95213607U patent/TWM304025U/en not_active IP Right Cessation
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI400425B (en) * | 2010-11-24 | 2013-07-01 | Auras Technology Ltd | Method and Structure of Flat Heat Conveying Pipe Fastening Cooling Fin |
TWI468638B (en) * | 2011-09-01 | 2015-01-11 | Kunshan Lemtech Prec Engineering Co Ltd | Radiator fin and base stamping combination method |
TWI468636B (en) * | 2011-11-09 | 2015-01-11 | Cooler Master Dev Corp | Heat dissipating fin, heat dissipating device and method of manufacturing the same |
TWI731479B (en) * | 2019-08-13 | 2021-06-21 | 黃崇賢 | Stamping and riveting structure of radiating fin |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MC4K | Revocation of granted utility model |