WO2011099788A3 - Heat sink structure - Google Patents

Heat sink structure Download PDF

Info

Publication number
WO2011099788A3
WO2011099788A3 PCT/KR2011/000892 KR2011000892W WO2011099788A3 WO 2011099788 A3 WO2011099788 A3 WO 2011099788A3 KR 2011000892 W KR2011000892 W KR 2011000892W WO 2011099788 A3 WO2011099788 A3 WO 2011099788A3
Authority
WO
WIPO (PCT)
Prior art keywords
heat sink
heat
sink structure
magnesium alloy
alloy material
Prior art date
Application number
PCT/KR2011/000892
Other languages
French (fr)
Korean (ko)
Other versions
WO2011099788A2 (en
Inventor
김윤용
Original Assignee
주식회사 케이엠더블유
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 케이엠더블유 filed Critical 주식회사 케이엠더블유
Publication of WO2011099788A2 publication Critical patent/WO2011099788A2/en
Publication of WO2011099788A3 publication Critical patent/WO2011099788A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20127—Natural convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/02—Transmitters
    • H04B1/03—Constructional details, e.g. casings, housings
    • H04B1/036—Cooling arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20154—Heat dissipaters coupled to components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)

Abstract

The present invention relates to a heat sink structure, wherein the whole of the heat sink is made of a magnesium alloy material, and the heat sink comprises a plurality of heat-dissipating fins formed on an outer surface of the heat sink; and a heat-diffusion plate which is arranged at the position corresponding to the position of a heat-generating element, and which is made of a material having a higher coefficient of heat transfer than that of the magnesium alloy material, and which is formed in a portion of the heat sink made of the magnesium alloy material.
PCT/KR2011/000892 2010-02-10 2011-02-10 Heat sink structure WO2011099788A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20100012272 2010-02-10
KR10-2010-0012272 2010-02-10

Publications (2)

Publication Number Publication Date
WO2011099788A2 WO2011099788A2 (en) 2011-08-18
WO2011099788A3 true WO2011099788A3 (en) 2011-12-29

Family

ID=44368310

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/000892 WO2011099788A2 (en) 2010-02-10 2011-02-10 Heat sink structure

Country Status (2)

Country Link
KR (2) KR101207934B1 (en)
WO (1) WO2011099788A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170025469A (en) 2015-08-28 2017-03-08 건국대학교 글로컬산학협력단 Heatsink and floodlight having the same
KR102444136B1 (en) 2020-12-07 2022-09-19 주식회사 하우앳 Millimeter wave transceiver with improved heat dissipation

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010107096A (en) * 2000-05-25 2001-12-07 유 병 권 The cooling method and device of heat protect board for eiectronic machine
KR20020015261A (en) * 2001-03-26 2002-02-27 이종만 Method of fin insert injection molding for Heat sink
KR20020065256A (en) * 2001-02-06 2002-08-13 익스팬전자 주식회사 Heat sink having heat transfer pipe

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990012305U (en) * 1997-09-06 1999-04-06 윤종용 Heat dissipation structure using pattern of printed circuit board
KR100355828B1 (en) * 2000-01-19 2002-11-04 엘지전자 주식회사 One module system for electric and electronic products

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010107096A (en) * 2000-05-25 2001-12-07 유 병 권 The cooling method and device of heat protect board for eiectronic machine
KR20020065256A (en) * 2001-02-06 2002-08-13 익스팬전자 주식회사 Heat sink having heat transfer pipe
KR20020015261A (en) * 2001-03-26 2002-02-27 이종만 Method of fin insert injection molding for Heat sink

Also Published As

Publication number Publication date
KR101207934B1 (en) 2012-12-04
KR20120090915A (en) 2012-08-17
KR101690086B1 (en) 2016-12-27
WO2011099788A2 (en) 2011-08-18
KR20110093705A (en) 2011-08-18

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