WO2011099788A3 - Structure de dissipateur thermique - Google Patents
Structure de dissipateur thermique Download PDFInfo
- Publication number
- WO2011099788A3 WO2011099788A3 PCT/KR2011/000892 KR2011000892W WO2011099788A3 WO 2011099788 A3 WO2011099788 A3 WO 2011099788A3 KR 2011000892 W KR2011000892 W KR 2011000892W WO 2011099788 A3 WO2011099788 A3 WO 2011099788A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- heat sink
- heat
- sink structure
- magnesium alloy
- alloy material
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20127—Natural convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/02—Transmitters
- H04B1/03—Constructional details, e.g. casings, housings
- H04B1/036—Cooling arrangements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20154—Heat dissipaters coupled to components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
Abstract
La présente invention concerne une structure de dissipateur thermique, l'intégralité du dissipateur thermique étant réalisée à partir d'un matériau en alliage de magnésium, et le dissipateur thermique comportant une pluralité d'ailettes de dissipateur thermique formées sur une surface extérieure du dissipateur thermique ; et une plaque de diffusion de chaleur qui est agencée sur la position correspondant à la position d'un élément de génération de chaleur, et qui est réalisée à partir d'un matériau ayant un coefficient de transfert de chaleur supérieur à celui du matériau en alliage de magnésium, et qui est formée dans une partie du dissipateur thermique réalisée à partir du matériau en alliage de magnésium.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20100012272 | 2010-02-10 | ||
KR10-2010-0012272 | 2010-02-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2011099788A2 WO2011099788A2 (fr) | 2011-08-18 |
WO2011099788A3 true WO2011099788A3 (fr) | 2011-12-29 |
Family
ID=44368310
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2011/000892 WO2011099788A2 (fr) | 2010-02-10 | 2011-02-10 | Structure de dissipateur thermique |
Country Status (2)
Country | Link |
---|---|
KR (2) | KR101207934B1 (fr) |
WO (1) | WO2011099788A2 (fr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20170025469A (ko) | 2015-08-28 | 2017-03-08 | 건국대학교 글로컬산학협력단 | 방열판 및 이를 포함하는 투광등 |
KR102444136B1 (ko) | 2020-12-07 | 2022-09-19 | 주식회사 하우앳 | 방열 성능이 향상된 밀리미터파 송수신기 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20010107096A (ko) * | 2000-05-25 | 2001-12-07 | 유 병 권 | 전자기기용 방열판의 냉각방법 및 그 장치 |
KR20020015261A (ko) * | 2001-03-26 | 2002-02-27 | 이종만 | 휜의 인서트 사출을 이용한 방열판 제조방법 |
KR20020065256A (ko) * | 2001-02-06 | 2002-08-13 | 익스팬전자 주식회사 | 열전달 파이프를 구비한 히트싱크 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR19990012305U (ko) * | 1997-09-06 | 1999-04-06 | 윤종용 | 인쇄회로기판의 패턴을 이용한 방열구조 |
KR100355828B1 (ko) * | 2000-01-19 | 2002-11-04 | 엘지전자 주식회사 | 전기/전자 제품용 단일 모듈 시스템 |
-
2011
- 2011-02-10 KR KR1020110012001A patent/KR101207934B1/ko not_active IP Right Cessation
- 2011-02-10 WO PCT/KR2011/000892 patent/WO2011099788A2/fr active Application Filing
-
2012
- 2012-07-24 KR KR1020120080597A patent/KR101690086B1/ko active IP Right Grant
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20010107096A (ko) * | 2000-05-25 | 2001-12-07 | 유 병 권 | 전자기기용 방열판의 냉각방법 및 그 장치 |
KR20020065256A (ko) * | 2001-02-06 | 2002-08-13 | 익스팬전자 주식회사 | 열전달 파이프를 구비한 히트싱크 |
KR20020015261A (ko) * | 2001-03-26 | 2002-02-27 | 이종만 | 휜의 인서트 사출을 이용한 방열판 제조방법 |
Also Published As
Publication number | Publication date |
---|---|
KR101207934B1 (ko) | 2012-12-04 |
KR101690086B1 (ko) | 2016-12-27 |
KR20120090915A (ko) | 2012-08-17 |
KR20110093705A (ko) | 2011-08-18 |
WO2011099788A2 (fr) | 2011-08-18 |
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