WO2011099788A3 - Structure de dissipateur thermique - Google Patents

Structure de dissipateur thermique Download PDF

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Publication number
WO2011099788A3
WO2011099788A3 PCT/KR2011/000892 KR2011000892W WO2011099788A3 WO 2011099788 A3 WO2011099788 A3 WO 2011099788A3 KR 2011000892 W KR2011000892 W KR 2011000892W WO 2011099788 A3 WO2011099788 A3 WO 2011099788A3
Authority
WO
WIPO (PCT)
Prior art keywords
heat sink
heat
sink structure
magnesium alloy
alloy material
Prior art date
Application number
PCT/KR2011/000892
Other languages
English (en)
Korean (ko)
Other versions
WO2011099788A2 (fr
Inventor
김윤용
Original Assignee
주식회사 케이엠더블유
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 케이엠더블유 filed Critical 주식회사 케이엠더블유
Publication of WO2011099788A2 publication Critical patent/WO2011099788A2/fr
Publication of WO2011099788A3 publication Critical patent/WO2011099788A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20127—Natural convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/02—Transmitters
    • H04B1/03—Constructional details, e.g. casings, housings
    • H04B1/036—Cooling arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20154—Heat dissipaters coupled to components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)

Abstract

La présente invention concerne une structure de dissipateur thermique, l'intégralité du dissipateur thermique étant réalisée à partir d'un matériau en alliage de magnésium, et le dissipateur thermique comportant une pluralité d'ailettes de dissipateur thermique formées sur une surface extérieure du dissipateur thermique ; et une plaque de diffusion de chaleur qui est agencée sur la position correspondant à la position d'un élément de génération de chaleur, et qui est réalisée à partir d'un matériau ayant un coefficient de transfert de chaleur supérieur à celui du matériau en alliage de magnésium, et qui est formée dans une partie du dissipateur thermique réalisée à partir du matériau en alliage de magnésium.
PCT/KR2011/000892 2010-02-10 2011-02-10 Structure de dissipateur thermique WO2011099788A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20100012272 2010-02-10
KR10-2010-0012272 2010-02-10

Publications (2)

Publication Number Publication Date
WO2011099788A2 WO2011099788A2 (fr) 2011-08-18
WO2011099788A3 true WO2011099788A3 (fr) 2011-12-29

Family

ID=44368310

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/000892 WO2011099788A2 (fr) 2010-02-10 2011-02-10 Structure de dissipateur thermique

Country Status (2)

Country Link
KR (2) KR101207934B1 (fr)
WO (1) WO2011099788A2 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170025469A (ko) 2015-08-28 2017-03-08 건국대학교 글로컬산학협력단 방열판 및 이를 포함하는 투광등
KR102444136B1 (ko) 2020-12-07 2022-09-19 주식회사 하우앳 방열 성능이 향상된 밀리미터파 송수신기

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010107096A (ko) * 2000-05-25 2001-12-07 유 병 권 전자기기용 방열판의 냉각방법 및 그 장치
KR20020015261A (ko) * 2001-03-26 2002-02-27 이종만 휜의 인서트 사출을 이용한 방열판 제조방법
KR20020065256A (ko) * 2001-02-06 2002-08-13 익스팬전자 주식회사 열전달 파이프를 구비한 히트싱크

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990012305U (ko) * 1997-09-06 1999-04-06 윤종용 인쇄회로기판의 패턴을 이용한 방열구조
KR100355828B1 (ko) * 2000-01-19 2002-11-04 엘지전자 주식회사 전기/전자 제품용 단일 모듈 시스템

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010107096A (ko) * 2000-05-25 2001-12-07 유 병 권 전자기기용 방열판의 냉각방법 및 그 장치
KR20020065256A (ko) * 2001-02-06 2002-08-13 익스팬전자 주식회사 열전달 파이프를 구비한 히트싱크
KR20020015261A (ko) * 2001-03-26 2002-02-27 이종만 휜의 인서트 사출을 이용한 방열판 제조방법

Also Published As

Publication number Publication date
KR101207934B1 (ko) 2012-12-04
KR101690086B1 (ko) 2016-12-27
KR20120090915A (ko) 2012-08-17
KR20110093705A (ko) 2011-08-18
WO2011099788A2 (fr) 2011-08-18

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