WO2011099788A2 - Structure de dissipateur thermique - Google Patents

Structure de dissipateur thermique Download PDF

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Publication number
WO2011099788A2
WO2011099788A2 PCT/KR2011/000892 KR2011000892W WO2011099788A2 WO 2011099788 A2 WO2011099788 A2 WO 2011099788A2 KR 2011000892 W KR2011000892 W KR 2011000892W WO 2011099788 A2 WO2011099788 A2 WO 2011099788A2
Authority
WO
WIPO (PCT)
Prior art keywords
heat
heat sink
diffusion plate
alloy material
structure according
Prior art date
Application number
PCT/KR2011/000892
Other languages
English (en)
Korean (ko)
Other versions
WO2011099788A3 (fr
Inventor
김윤용
Original Assignee
주식회사 케이엠더블유
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 케이엠더블유 filed Critical 주식회사 케이엠더블유
Publication of WO2011099788A2 publication Critical patent/WO2011099788A2/fr
Publication of WO2011099788A3 publication Critical patent/WO2011099788A3/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a heat sink structure, and more particularly, to a heat sink structure suitable for use in a base station or a repeater for wireless communication.
  • various electrical and electronic components have parts that generate considerably high heat depending on the type of the corresponding components, and a heat dissipation structure for efficiently dissipating heat generated by such heat generating elements is required.
  • transmission systems such as base stations and repeaters for wireless communication use high-power and high-power amplifiers, especially in high-power power amplifiers (ie transistors), which are key components of the amplifier.
  • the heat generated acts as a major factor in degrading the device's performance or causing malfunctions and component damage.
  • a device which normally requires a heat dissipation process is provided with a heat sink having a plurality of heat dissipation fins in its exterior.
  • the heat sink is usually heat dissipation efficiency in proportion to the size, number, total area, etc. of the heat sink, but the design of the heat sink is limited in accordance with the requirements of miniaturization and light weight of the device is installed.
  • the demand for miniaturization and weight reduction is a very important requirement in devices installed at a high place compared to the ground such as a mobile communication base station or a repeater.
  • an object of the present invention is to provide a heat sink structure for increasing the heat dissipation efficiency, to bring down the size and weight.
  • Another object of the present invention is to provide a heat sink structure that can simplify the mounting operation of the heating element.
  • the present invention for achieving the above object in the structure of the heat sink,
  • a plurality of heat dissipation fins formed on an outer surface thereof;
  • the material having a heat transfer coefficient higher than the material of the magnesium alloy characterized in that it comprises a heat diffusion plate implemented on a portion of the inner surface.
  • the heat sink is formed to include the heat diffusion plate as an integrated body by using an insert injection method.
  • the thermal diffusion plate is implemented with a copper alloy material.
  • the heating element is installed in a manner that is directly soldered to the thermal diffusion plate.
  • the heat sink structure according to the present invention can increase the heat dissipation efficiency, bring down the size and light weight, and also can be directly soldered to the heat generating element when the heat diffusion plate is implemented in a copper alloy material, the mounting of the heating element Work will be simpler.
  • FIG. 1 is a schematic perspective view of a heat sink structure according to an embodiment of the present invention.
  • FIG. 2 is a cross-sectional view of a portion A-A 'in FIG. 1
  • FIG. 3 is a plan view of the thermal diffusion plate of FIG.
  • FIG. 1 is a schematic perspective view of a heat sink structure according to an embodiment of the present invention
  • FIG. 2 is a cross-sectional view of a portion AA ′ of FIG. 1
  • FIG. 3 is a plan view of the heat diffusion plate 12 of FIG. 1.
  • the heat sink 10 according to an embodiment of the present invention includes a plurality of heat dissipation fins 101 formed on an outer air contact surface, and an inner surface of the heat sink 22 and / or The printed circuit board 20 on which the heat generating element 22 is mounted is mounted.
  • the material of the heat sink 10 is typically not a material of the aluminum alloy used in a wireless base station or repeater, magnesium (alloy) is mainly used in accordance with the characteristics of the present invention.
  • magnesium alloy
  • the magnesium material is lighter than the aluminum material, since the heat transfer coefficient is smaller than that of the aluminum material, there is a possibility that heat generated from the installed heating element 22 may not be transferred as well as the aluminum material.
  • the portion in which the heat generating element 22 is installed in the heat sink 10 is implemented with a copper alloy (eg, brass) material having a relatively high heat transfer coefficient so that heat transfer can be performed well. That is, some of the inner surface of the heat sink 10 may be implemented as a thermal diffusion plate 12 of a copper alloy material. Since the heat diffusion plate 12 is made of a material having a high heat transfer coefficient, the heat diffusion plate 12 serves to quickly diffuse heat generated from the heat generating element 22 in the heat sink 10. In particular, the thermal diffusion plate 12 serves to reduce heat generated per unit area by diffusing heat generated in a relatively small area such as the heat generating element 22 by a large area of the thermal diffusion plate 12. In addition, by transferring heat to the remaining heat sink 10 through the area widened by the heat diffusion plate 12, it serves to accelerate heat dissipation.
  • a copper alloy eg, brass
  • the planar shape of the thermal diffusion plate 12 may have a form in which a plurality of fin structures 121 are formed on the outer circumferential surface, in particular, as shown in FIG. 3, which corresponds to the thermal diffusion plate 12 and the heat sink 10. This is to widen the contact surface with the other parts of the), so that the heat transfer can be made more smoothly. In this case, it is important that the heat diffusion plate 12 is in close contact with the rest of the heat sink 10 so that efficient heat transfer is achieved.
  • the heat spreader 10 uses the insert injection method. It is formed to include the plate integrally. That is, the heat spreader 10 may be formed by manufacturing a thermal diffusion plate 12 made of a copper alloy in advance and fixing it at a proper position of a mold for forming the heat sink 10, and then injecting an injection of magnesium material into the mold. have.
  • the thermal diffusion plate 12 may be implemented in any other material having a higher heat transfer coefficient than the magnesium alloy material in addition to the copper alloy material.
  • it may be implemented in an aluminum alloy material.
  • the copper alloy material is implemented to facilitate the work.
  • the heat generating element 22 may be mounted on the inner surface of the heat sink 10 through the printed circuit board 20, but the heat sink 10 may be provided in advance on the printed circuit board for more efficient heat dissipation. It can also be mounted in such a way that it can be soldered directly. At this time, in order to perform the soldering operation on the aluminum material, the plating operation such as tin plating should be performed in advance, but such a plating operation is not required for the copper alloy material. Therefore, when the thermal diffusion plate 12 is implemented with a copper alloy material, the soldering operation of the heating element 22 may be more easily performed.
  • the printed circuit board 20 may be mounted to the heat sink 10 by screwing.
  • the heat spreader 10 integrally integrates the heat spreader plate 12 using an insert injection method for efficient heat transfer between the heat spreader plate 12 and the contact surface between the remaining portions of the heat sink 10.
  • the heat diffusion plate may be mounted to the heat dissipation plate (mounting portion) separately formed by a forced press-fit method, a screw coupling method, or a welding method.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)

Abstract

La présente invention concerne une structure de dissipateur thermique, l'intégralité du dissipateur thermique étant réalisée à partir d'un matériau en alliage de magnésium, et le dissipateur thermique comportant une pluralité d'ailettes de dissipateur thermique formées sur une surface extérieure du dissipateur thermique ; et une plaque de diffusion de chaleur qui est agencée sur la position correspondant à la position d'un élément de génération de chaleur, et qui est réalisée à partir d'un matériau ayant un coefficient de transfert de chaleur supérieur à celui du matériau en alliage de magnésium, et qui est formée dans une partie du dissipateur thermique réalisée à partir du matériau en alliage de magnésium.
PCT/KR2011/000892 2010-02-10 2011-02-10 Structure de dissipateur thermique WO2011099788A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2010-0012272 2010-02-10
KR20100012272 2010-02-10

Publications (2)

Publication Number Publication Date
WO2011099788A2 true WO2011099788A2 (fr) 2011-08-18
WO2011099788A3 WO2011099788A3 (fr) 2011-12-29

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ID=44368310

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/000892 WO2011099788A2 (fr) 2010-02-10 2011-02-10 Structure de dissipateur thermique

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KR (2) KR101207934B1 (fr)
WO (1) WO2011099788A2 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170025469A (ko) 2015-08-28 2017-03-08 건국대학교 글로컬산학협력단 방열판 및 이를 포함하는 투광등
KR102444136B1 (ko) 2020-12-07 2022-09-19 주식회사 하우앳 방열 성능이 향상된 밀리미터파 송수신기

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010107096A (ko) * 2000-05-25 2001-12-07 유 병 권 전자기기용 방열판의 냉각방법 및 그 장치
KR20020015261A (ko) * 2001-03-26 2002-02-27 이종만 휜의 인서트 사출을 이용한 방열판 제조방법
KR20020065256A (ko) * 2001-02-06 2002-08-13 익스팬전자 주식회사 열전달 파이프를 구비한 히트싱크

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990012305U (ko) * 1997-09-06 1999-04-06 윤종용 인쇄회로기판의 패턴을 이용한 방열구조
KR100355828B1 (ko) * 2000-01-19 2002-11-04 엘지전자 주식회사 전기/전자 제품용 단일 모듈 시스템

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010107096A (ko) * 2000-05-25 2001-12-07 유 병 권 전자기기용 방열판의 냉각방법 및 그 장치
KR20020065256A (ko) * 2001-02-06 2002-08-13 익스팬전자 주식회사 열전달 파이프를 구비한 히트싱크
KR20020015261A (ko) * 2001-03-26 2002-02-27 이종만 휜의 인서트 사출을 이용한 방열판 제조방법

Also Published As

Publication number Publication date
KR20110093705A (ko) 2011-08-18
KR101690086B1 (ko) 2016-12-27
KR101207934B1 (ko) 2012-12-04
KR20120090915A (ko) 2012-08-17
WO2011099788A3 (fr) 2011-12-29

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