SG160196A1 - Thermal interface materials - Google Patents

Thermal interface materials

Info

Publication number
SG160196A1
SG160196A1 SG200605471-2A SG2006054712A SG160196A1 SG 160196 A1 SG160196 A1 SG 160196A1 SG 2006054712 A SG2006054712 A SG 2006054712A SG 160196 A1 SG160196 A1 SG 160196A1
Authority
SG
Singapore
Prior art keywords
composition
thermal interface
rubber compound
resin
amine resin
Prior art date
Application number
SG200605471-2A
Other languages
English (en)
Inventor
My Nguyen
Original Assignee
Honeywell Int Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell Int Inc filed Critical Honeywell Int Inc
Publication of SG160196A1 publication Critical patent/SG160196A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L15/00—Compositions of rubber derivatives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L21/00—Compositions of unspecified rubbers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/08—Copolymers of ethene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/08—Copolymers of ethene
    • C08L23/0807—Copolymers of ethene with unsaturated hydrocarbons only containing four or more carbon atoms
    • C08L23/0815—Copolymers of ethene with unsaturated hydrocarbons only containing four or more carbon atoms with aliphatic 1-olefins containing one carbon-to-carbon double bond
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/02—Materials undergoing a change of physical state when used
    • C09K5/06—Materials undergoing a change of physical state when used the change of state being from liquid to solid or vice versa
    • C09K5/063—Materials absorbing or liberating heat during crystallisation; Heat storage materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • H10W40/735—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state by melting or evaporation of solids
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08C—TREATMENT OR CHEMICAL MODIFICATION OF RUBBERS
    • C08C19/00—Chemical modification of rubber
    • C08C19/02—Hydrogenation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/08—Copolymers of ethene
    • C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing atoms other than carbon or hydrogen
    • C08L23/0869—Copolymers of ethene with unsaturated hydrocarbons containing atoms other than carbon or hydrogen with unsaturated acids, e.g. [meth]acrylic acid; with unsaturated esters, e.g. [meth]acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2312/00—Crosslinking
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
    • C08L61/26—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds
    • C08L61/28—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds with melamine
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
    • F28D20/02—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F2013/005—Thermal joints
    • F28F2013/006—Heat conductive materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/252—Glass or ceramic [i.e., fired or glazed clay, cement, etc.] [porcelain, quartz, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/256—Heavy metal or aluminum or compound thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/258—Alkali metal or alkaline earth metal or compound thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/266—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension of base or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31826—Of natural rubber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/60—Nonwoven fabric [i.e., nonwoven strand or fiber material]
    • Y10T442/608—Including strand or fiber material which is of specific structural definition
    • Y10T442/609—Cross-sectional configuration of strand or fiber material is specified
    • Y10T442/61—Cross-sectional configuration varies longitudinally along strand or fiber material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T442/60—Nonwoven fabric [i.e., nonwoven strand or fiber material]
    • Y10T442/643—Including parallel strand or fiber material within the nonwoven fabric
    • Y10T442/644—Parallel strand or fiber material is glass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/60—Nonwoven fabric [i.e., nonwoven strand or fiber material]
    • Y10T442/647—Including a foamed layer or component
    • Y10T442/652—Nonwoven fabric is coated, impregnated, or autogenously bonded
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/60—Nonwoven fabric [i.e., nonwoven strand or fiber material]
    • Y10T442/647—Including a foamed layer or component
    • Y10T442/652—Nonwoven fabric is coated, impregnated, or autogenously bonded
    • Y10T442/653—Including particulate material other than fiber

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
SG200605471-2A 2002-01-14 2003-01-13 Thermal interface materials SG160196A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/047,617 US6673434B2 (en) 1999-12-01 2002-01-14 Thermal interface materials

Publications (1)

Publication Number Publication Date
SG160196A1 true SG160196A1 (en) 2010-04-29

Family

ID=27658138

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200605471-2A SG160196A1 (en) 2002-01-14 2003-01-13 Thermal interface materials

Country Status (8)

Country Link
US (4) US6673434B2 (https=)
EP (1) EP1483110A4 (https=)
JP (1) JP2006502248A (https=)
KR (1) KR100685013B1 (https=)
CN (2) CN100351075C (https=)
SG (1) SG160196A1 (https=)
TW (1) TWI308171B (https=)
WO (1) WO2003064148A1 (https=)

Families Citing this family (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6706219B2 (en) * 1999-09-17 2004-03-16 Honeywell International Inc. Interface materials and methods of production and use thereof
US6797382B2 (en) * 1999-12-01 2004-09-28 Honeywell International Inc. Thermal interface materials
US6673434B2 (en) * 1999-12-01 2004-01-06 Honeywell International, Inc. Thermal interface materials
US7608324B2 (en) * 2001-05-30 2009-10-27 Honeywell International Inc. Interface materials and methods of production and use thereof
DE10151036A1 (de) * 2001-10-16 2003-05-08 Siemens Ag Isolator für ein organisches Elektronikbauteil
US6761813B2 (en) * 2002-01-31 2004-07-13 Intel Corporation Heat transfer through covalent bonding of thermal interface material
US6956739B2 (en) * 2002-10-29 2005-10-18 Parker-Hannifin Corporation High temperature stable thermal interface material
US7210227B2 (en) * 2002-11-26 2007-05-01 Intel Corporation Decreasing thermal contact resistance at a material interface
JP2005146057A (ja) * 2003-11-12 2005-06-09 Polymatech Co Ltd 高熱伝導性成形体及びその製造方法
CN100389166C (zh) * 2004-04-29 2008-05-21 鸿富锦精密工业（深圳）有限公司 一种热界面材料及其制造方法
US20050280987A1 (en) * 2004-06-07 2005-12-22 Kwitek Benjamin J Phase change materials as a heat sink for computers
US7269015B2 (en) * 2005-02-01 2007-09-11 Tyco Electronics Corporation Heat sink interface insert
CN100543103C (zh) * 2005-03-19 2009-09-23 清华大学 热界面材料及其制备方法
CN1841713A (zh) 2005-03-31 2006-10-04 清华大学 热界面材料及其制作方法
US20060261469A1 (en) * 2005-05-23 2006-11-23 Taiwan Semiconductor Manufacturing Co., Ltd. Sealing membrane for thermal interface material
CN1927987A (zh) * 2005-09-06 2007-03-14 鸿富锦精密工业（深圳）有限公司 热界面材料及其制备方法
WO2007053571A2 (en) * 2005-11-01 2007-05-10 Techfilm, Llc Thermal interface material with multiple size distribution thermally conductive fillers
CN1978583A (zh) * 2005-12-09 2007-06-13 富准精密工业(深圳)有限公司 热介面材料
TWI291480B (en) * 2005-12-20 2007-12-21 Ind Tech Res Inst Composition for thermal interface materials
WO2008030910A1 (en) * 2006-09-08 2008-03-13 Lord Corporation Flexible microelectronics adhesive
US20080166552A1 (en) * 2006-11-06 2008-07-10 Arlon, Inc. Silicone based compositions for thermal interface materials
US8702919B2 (en) * 2007-08-13 2014-04-22 Honeywell International Inc. Target designs and related methods for coupled target assemblies, methods of production and uses thereof
JP2010539706A (ja) * 2007-09-11 2010-12-16 ダウ コーニング コーポレーション 放熱材料、該放熱材料を含む電子デバイス、ならびにそれらの調製方法および使用方法
CN101803009B (zh) * 2007-09-11 2012-07-04 陶氏康宁公司 组合物，包括这种组合物的热界面材料,及其制备方法和用途
US7808099B2 (en) 2008-05-06 2010-10-05 International Business Machines Corporation Liquid thermal interface having mixture of linearly structured polymer doped crosslinked networks and related method
US8143523B2 (en) 2008-10-21 2012-03-27 Baker Hughes Incorporated Downhole cable with thermally conductive polymer composites
US20100112360A1 (en) * 2008-10-31 2010-05-06 Delano Andrew D Layered thermal interface systems methods of production and uses thereof
US8138239B2 (en) * 2008-12-23 2012-03-20 Intel Corporation Polymer thermal interface materials
WO2010104542A1 (en) 2009-03-02 2010-09-16 Honeywell International Inc. Thermal interface material and method of making and using the same
KR101563042B1 (ko) 2009-10-27 2015-10-23 헨켈 아이피 앤드 홀딩 게엠베하 에폭시화 너트쉘 오일을 포함하는 열전재
US10087351B2 (en) 2010-02-23 2018-10-02 Laird Technologies, Inc. Materials including thermally reversible gels
US9771508B2 (en) 2010-02-23 2017-09-26 Laird Technologies, Inc. Thermal interface materials including thermally reversible gels
US9260645B2 (en) * 2010-02-23 2016-02-16 Laird Technologies, Inc. Thermal interface materials including thermally reversible gels
WO2012142613A1 (en) 2011-04-14 2012-10-18 Ada Technologies, Inc. Thermal interface materials and systems and devices containing the same
EP2828889B1 (en) * 2012-03-22 2015-09-02 Koninklijke Philips N.V. Thermal interface material
US8587945B1 (en) * 2012-07-27 2013-11-19 Outlast Technologies Llc Systems structures and materials for electronic device cooling
KR101522787B1 (ko) * 2013-11-21 2015-05-26 삼성전기주식회사 부품 내장 인쇄회로기판
CN103059578B (zh) * 2013-01-22 2015-04-22 慈溪市东南复合材料有限公司 一种用于感温元件上的感温蜡混合物
US9515004B2 (en) * 2013-03-15 2016-12-06 Laird Technologies, Inc. Thermal interface materials
US9269603B2 (en) 2013-05-09 2016-02-23 Globalfoundries Inc. Temporary liquid thermal interface material for surface tension adhesion and thermal control
DE102013215255A1 (de) * 2013-08-02 2015-02-05 Siemens Aktiengesellschaft Elektronisches oder elektrisches Bauteil mit PCM-haltiger Kühlung
CN105899714B (zh) 2013-12-05 2018-09-21 霍尼韦尔国际公司 具有经调节的pH的甲基磺酸亚锡溶液
KR20160122172A (ko) 2014-02-13 2016-10-21 허니웰 인터내셔날 인코포레이티드 압축성 열전도 재료
PL3166999T3 (pl) 2014-07-07 2023-07-03 Honeywell International Inc. Materiał termoprzewodzący ze zmiataczem jonów
EP3227399B1 (en) * 2014-12-05 2021-07-14 Honeywell International Inc. High performance thermal interface materials with low thermal impedance
CN104650817A (zh) * 2015-02-12 2015-05-27 平湖阿莱德实业有限公司 一种导热相变材料及其生产方法
US10312177B2 (en) 2015-11-17 2019-06-04 Honeywell International Inc. Thermal interface materials including a coloring agent
EP3426746B1 (en) * 2016-03-08 2021-07-14 Honeywell International Inc. Phase change material
US10501671B2 (en) 2016-07-26 2019-12-10 Honeywell International Inc. Gel-type thermal interface material
GB2578987B (en) 2017-09-01 2023-02-08 Rogers Corp Fusible phase-change powders for thermal management, methods of manufacture thereof, and articles containing the powders
US11041103B2 (en) * 2017-09-08 2021-06-22 Honeywell International Inc. Silicone-free thermal gel
US10428256B2 (en) 2017-10-23 2019-10-01 Honeywell International Inc. Releasable thermal gel
US10567084B2 (en) 2017-12-18 2020-02-18 Honeywell International Inc. Thermal interface structure for optical transceiver modules
CN108003406A (zh) * 2017-12-20 2018-05-08 深圳德邦界面材料有限公司 一种耐温导热相变材料及其制备方法
US11072706B2 (en) 2018-02-15 2021-07-27 Honeywell International Inc. Gel-type thermal interface material
CN109881297B (zh) * 2019-03-01 2022-06-28 苏州城邦达益材料科技有限公司 一种电学性能可变的组合物、纳米纤维及其制备方法
US11373921B2 (en) 2019-04-23 2022-06-28 Honeywell International Inc. Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing
WO2022015958A1 (en) * 2020-07-16 2022-01-20 Rogers Corporation Thermally conductive phase-change composition, methods of manufacture thereof, and articles including the composition
KR102550466B1 (ko) * 2021-07-29 2023-07-03 서울과학기술대학교 산학협력단 방열 페이스트, 방열 필름 및 그의 제조방법
WO2025264732A1 (en) * 2024-06-17 2025-12-26 Henkel Ag & Co. Kgaa Thermal interface materials

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5194480A (en) * 1991-05-24 1993-03-16 W. R. Grace & Co.-Conn. Thermally conductive elastomer
US5989459A (en) * 1999-03-09 1999-11-23 Johnson Matthey, Inc. Compliant and crosslinkable thermal interface materials

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4842911A (en) 1983-09-02 1989-06-27 The Bergquist Company Interfacing for heat sinks
EP0170063B1 (en) * 1984-07-31 1988-08-24 Mitsubishi Petrochemical Co., Ltd. Copper-type conductive coating composition
US5094769A (en) 1988-05-13 1992-03-10 International Business Machines Corporation Compliant thermally conductive compound
CN1020826C (zh) * 1990-01-24 1993-05-19 阎宝连 导热绝缘硅板及其制法
US5674930A (en) * 1991-04-04 1997-10-07 Nof Corporation Thermoplastic resin compositions
US5591789A (en) * 1995-06-07 1997-01-07 International Business Machines Corporation Polyester dispersants for high thermal conductivity paste
JP3461651B2 (ja) * 1996-01-24 2003-10-27 電気化学工業株式会社 六方晶窒化ほう素粉末及びその用途
JP3911777B2 (ja) * 1996-10-15 2007-05-09 東レ株式会社 半導体装置用接着剤組成物およびそれを用いた半導体装置用接着剤シート
US6432497B2 (en) 1997-07-28 2002-08-13 Parker-Hannifin Corporation Double-side thermally conductive adhesive tape for plastic-packaged electronic components
JPH1145965A (ja) * 1997-07-28 1999-02-16 Kyocera Corp 伝熱性化合物およびこれを用いた半導体装置
US6238596B1 (en) * 1999-03-09 2001-05-29 Johnson Matthey Electronics, Inc. Compliant and crosslinkable thermal interface materials
US6162663A (en) 1999-04-20 2000-12-19 Schoenstein; Paul G. Dissipation of heat from a circuit board having bare silicon chips mounted thereon
JP3435097B2 (ja) * 1999-05-25 2003-08-11 富士高分子工業株式会社 熱伝導性組成物
US6706219B2 (en) * 1999-09-17 2004-03-16 Honeywell International Inc. Interface materials and methods of production and use thereof
US6605238B2 (en) * 1999-09-17 2003-08-12 Honeywell International Inc. Compliant and crosslinkable thermal interface materials
JP2003509578A (ja) * 1999-09-21 2003-03-11 サンーゴバン セラミックス アンド プラスティクス，インコーポレイティド 熱管理のための疎水性化合物における熱伝導性材料
JP2001214075A (ja) * 2000-02-04 2001-08-07 Jsr Corp 高熱伝導性シート用組成物、高熱伝導性シート、高熱伝導性シートの製造方法および高熱伝導性シートを用いた放熱構造
US6673434B2 (en) * 1999-12-01 2004-01-06 Honeywell International, Inc. Thermal interface materials
US6797382B2 (en) * 1999-12-01 2004-09-28 Honeywell International Inc. Thermal interface materials
US6627704B2 (en) * 1999-12-01 2003-09-30 General Electric Company Poly(arylene ether)-containing thermoset composition, method for the preparation thereof, and articles derived therefrom
US6451422B1 (en) 1999-12-01 2002-09-17 Johnson Matthey, Inc. Thermal interface materials
EP1401641A4 (en) * 2001-05-30 2007-12-12 Honeywell Int Inc BONDING MATERIALS AND MANUFACTURING METHOD AND USE THEREOF
JP2002373921A (ja) * 2001-06-15 2002-12-26 Toray Ind Inc 半導体装置用接着剤シートおよびそれを用いた部品ならびに半導体装置
JP2003036279A (ja) 2001-07-25 2003-02-07 Cdi:Kk 三次元ｃａｄシステム

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5194480A (en) * 1991-05-24 1993-03-16 W. R. Grace & Co.-Conn. Thermally conductive elastomer
US5989459A (en) * 1999-03-09 1999-11-23 Johnson Matthey, Inc. Compliant and crosslinkable thermal interface materials

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CN101126016A (zh) 2008-02-20
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US7867609B2 (en) 2011-01-11
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US7244491B2 (en) 2007-07-17
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