CN1638952A - 热界面材料 - Google Patents
热界面材料 Download PDFInfo
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- CN1638952A CN1638952A CNA038056798A CN03805679A CN1638952A CN 1638952 A CN1638952 A CN 1638952A CN A038056798 A CNA038056798 A CN A038056798A CN 03805679 A CN03805679 A CN 03805679A CN 1638952 A CN1638952 A CN 1638952A
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C08L15/00—Compositions of rubber derivatives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
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- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
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- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/08—Copolymers of ethene
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- C08L23/0815—Copolymers of ethene with aliphatic 1-olefins
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- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/02—Materials undergoing a change of physical state when used
- C09K5/06—Materials undergoing a change of physical state when used the change of state being from liquid to solid or vice versa
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- C09K5/08—Materials not undergoing a change of physical state when used
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- C08K3/38—Boron-containing compounds
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- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
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- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
- C08L61/26—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
- F28D20/02—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F2013/005—Thermal joints
- F28F2013/006—Heat conductive materials
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- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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Abstract
可交联的热界面材料通过混合至少一种橡胶化合物、至少一种胺树脂和至少一种导热性填料来生产。该界面材料采取液体或“软凝胶”的形式。凝胶状态通过在至少一种橡胶化合物组合物和至少一种胺树脂组合物之间的交联反应所引起。一旦已经制备了包括至少一种橡胶化合物、至少一种胺树脂和至少一种导热性填料的基础组合物,该组合物必须与电子元件、出售商或电子产品的要求进行对比,以确定是否需要相变材料来改变组合物的一些物理性能。用于形成本文所公开的可交联的热界面材料的方法包括a)提供至少一种饱和橡胶化合物,b)提供至少一种胺树脂,c)让该至少一种饱和橡胶化合物和该至少一种胺树脂交联以形成交联的橡胶-树脂混合物,d)将至少一种导热性填料加入到交联的橡胶-树脂混合物中,和e)将润湿剂添加到交联的橡胶-树脂混合物中。该方法也可进一步包括将至少一种相变材料添加到交联的橡胶-树脂混合物中。所考虑的热界面材料能够作为可分配的液体浆料、凝胶、胶带或膜的形式提供。这里所述的热界面材料的应用包括将该材料引入到层状材料、电子元件或成品电子产品中。
Description
本申请是1999年12月1日提交的US实用新型申请序列号09/452483的部分继续申请并要求了它的权益,其全部内容被引入这里供参考。
发明领域
本发明的领域是在电子元件和层状材料应用中的界面材料。
发明背景
电子元件用于不断增加的消费品和商业电子产品。这些消费品和商品的一些例子是电视、个人电脑、互联网服务器、手机、传呼机、掌上编制器(palm-type organizers)、便携式收音机、汽车用立体声收音机或遥控器。随着这些消费品和商业电子产品需求的增加,还要求同样这些产品变得更小、更功能化、且对于消费者和商家来说更便携。
作为这些产品的尺寸减少的结果,包括该产品的元件必须也变得更小。需要减少尺寸或按比例缩小的那些元件中的一些例子是印刷电路或接线板、电阻器、布线、键盘、触垫和芯片封装。
因此,元件被破坏并进行研究来确定是否有更好的构造材料和方法,使得这些元件可以缩减尺寸而满足更小电子元件的需要。在层状元件中,一个目标似乎是减少层数,同时提高剩余层的功能和耐久性。然而这一任务是困难的,因为一般应该存在几层以及这些层的组分,以便操作该设备。
同样,随着电子设备变得更小且在更高速度下操作,以热量形式散发的能量急剧地增加。在工业中普遍的实践是使用热油脂,或油脂状材料,单独或在该设备的载体上,来转移横穿物理界面所散逸的多余热量。最常用类型的热界面材料是热油脂、相变材料和弹性体胶带。热油脂或相变材料具有比弹性体胶带更低的耐热性,因为其具有以非常薄的层铺展的能力并在相邻表面之间提供紧密接触。典型的热阻抗值是0.6-1.6℃cm2/w。然而,热油脂的严重缺点是在热循环如65℃到150℃之后,或当用于VLSI芯片时在功率循环之后,热性能显著地劣化。也已经发现,当表面平面性的大偏差引起在电子设备中的配合表面之间形成缝隙时或当由于其它原因如制造公差等而引起在配合表面之间的大缝隙时,这些材料的特性劣化。当这些材料的热可转移性受破坏时,使用它们的电子设备的性能受到不利影响。
因此,仍然需要:a)设计和生产热界面材料和层状材料,它们满足消费品技术规格而同时减少设备尺寸和层数;和b)开发用于生产所需热界面材料和层状材料以及包括所述热界面材料和层状材料的元件的可靠方法。
发明概述
所考虑的可交联的热界面材料是通过混合至少一种橡胶化合物、至少一种胺树脂和至少一种导热性填料来生产。所述的界面材料采取液体或“软凝胶”的形式。凝胶状态通过在至少一种橡胶化合物组合物和至少一种胺树脂组合物之间的交联反应所引起。更具体地说,该胺树脂被引入到橡胶组合物中使在橡胶化合物上的伯羟基交联,由此形成软的凝胶相。因此,需要考虑的是橡胶化合物中的至少一些包括至少一个末端羟基基团。
胺或胺型树脂被添加或引入到橡胶组合物或橡胶化合物的混合物中,主要用于促进在胺树脂和在至少一种橡胶化合物上的伯或末端羟基之间的交联反应。在胺树脂和橡胶化合物之间的交联反应导致在混合物中形成“软凝胶”相,而不是液态。
一旦已经制备了包括至少一种橡胶化合物、至少一种胺树脂和至少一种导热性填料的基础组合物,该组合物必须与电子元件、出售商或电子产品的要求进行对比,以确定是否需要相变材料来改变组合物的一些物理性能。
相变材料可用于热界面材料应用中,因为当它们在固体和液体形式之间来回变化时它们贮存和释放热量。相变材料在它转变成固态时散发热量,而当它回到液体时,它吸收热量。相变温度即熔化温度,在该温度下发生热吸收和热排斥。
用于形成本文所公开的可交联的热界面材料的方法包括a)提供至少一种饱和橡胶化合物,b)提供至少一种胺树脂,c)让该至少一种饱和橡胶化合物和该至少一种胺树脂交联以形成交联的橡胶-树脂混合物,d)将至少一种导热性填料加入到交联的橡胶-树脂混合物中,和e)将润湿剂添加到交联的橡胶-树脂混合物中。该方法也可进一步包括将至少一种相变材料添加到交联的橡胶-树脂混合物中。
所考虑的热界面材料能够作为可分配的液体浆料提供,从而通过分配方法被施涂并然后根据需要加以固化。它也能够作为高度顺从性的、固化的、弹性体膜或片提供,以预先施加于界面上,如吸热层。它能够进一步作为可通过任何合适的分配方法施涂于表面上的软凝胶或液体被提供和生产。甚至进一步,该材料能够作为胶带提供,它能够直接应用于分界面或电子元件。
本文所述的热界面材料的应用包括将该材料引入到层状材料,电子元件或成品电子产品中。
本发明的各种目标、特征、方面和优点将从下面本发明优选实施方案的详细说明变得更清楚。
发明详述
所考虑的可交联的热界面材料是通过混合至少一种橡胶化合物、至少一种胺树脂和至少一种导热性填料来生产的。所述的界面材料采取液体或“软凝胶”的形式。本文使用的“软凝胶”是指一种胶体,其中分散相与连续相相结合而形成粘性的“胶状”产品。凝胶状态通过在至少一种橡胶化合物组合物和至少一种胺树脂组合物之间的交联反应所引起。更具体地说,该胺树脂被引入到橡胶组合物中使在橡胶化合物上的伯羟基交联,由此形成软的凝胶相。因此,需要考虑的是橡胶化合物中的至少一些包括至少一个末端羟基基团。这里使用的短语“伯羟基”是指羟基处于分子或化合物上的末端位置。该橡胶化合物还可包括也能够与胺树脂发生交联反应的附加的仲、叔或另外的内部羟基。该附加交联是理想的,这取决于在其中引入了凝胶的产品或元件所需要的最终凝胶状态。
需要考虑的是该橡胶化合物可以是“可自交联的”,即它们能够与其它橡胶化合物进行分子间交联或与它们本身进行分子内交联,这取决于组合物的其它组分。还要考虑的是,该橡胶化合物能够通过胺树脂化合物交联并也与它们本身或其它橡胶化合物产生一些自交联活性。
在优选实施方案中,所使用的橡胶组合物或化合物可以是饱和的或不饱和的。饱和橡胶化合物在这一应用中是优选的,因为它们对热氧化降解不太敏感。可使用的饱和橡胶的例子是乙丙橡胶(EPR,EPDM),聚乙烯/丁烯,聚乙烯-丁烯-苯乙烯,聚乙烯-丙烯-苯乙烯,氢化聚烷二烯(polyalkyldiene)“单醇”(如氢化聚丁二烯单醇,氢化聚丙二烯单醇,氢化聚戊二烯单醇),氢化聚烷二烯“二醇”(如氢化聚丁二烯二醇,氢化聚丙二烯二醇,氢化聚戊二烯二醇)和氢化聚异戊二烯。然而,如果化合物是不饱和的,最优选的是该化合物经历加氢过程以断裂或消除至少一些双键。这里使用的短语“加氢过程”是指不饱和有机化合物与氢反应:氢直接加成到一些或全部的双键上,形成饱和产品(加成氢化),或完全地断裂该双键,据此该片段进一步与氢反应(氢解)。不饱和橡胶和橡胶化合物的例子是聚丁二烯,聚异戊二烯,聚苯乙烯-丁二烯和其它不饱和橡胶,橡胶化合物或橡胶化合物的混合物/组合。
这里使用的术语“顺从性的”包括材料的性质,它在室温下屈服和可成型,与在室温下为固体和不屈服相反。这里使用的术语“可交联的”是指还没有交联的那些材料或化合物。
每一类型的一种以上的橡胶可以相掺混以生产可交联的热界面材料;然而,可以考虑的是,在优选的热界面材料中,橡胶化合物或组分中的至少一种将是饱和化合物。含有烯烃或不饱和的界面材料,有合适的热填料,显示了低于0.5cm2℃/w的热容量。与热油脂不同,材料的热性能在IC设备中热循环或流动循环之后没有降低,因为液体烯烃和液体烯烃混合物(如包括胺树脂的那些)会在热活化之后交联形成软凝胶。另外,当用作界面材料时,它不会象热油脂那样在使用中“冲出”并且在热循环中不显示界面层离。
胺或胺型树脂被添加或引入到橡胶组合物或橡胶化合物的混合物中,主要用于促进在胺树脂和在至少一种橡胶化合物上的伯或末端羟基之间的交联反应。在胺树脂和橡胶化合物之间的交联反应会在混合物中产生“软凝胶”相,而不是液态。在胺树脂和橡胶组合物之间和/或在橡胶化合物本身之间的交联反应程度决定了软凝胶的稠度。例如,如果该胺树脂和橡胶化合物进行最小量的交联(供交联用的位点的10%实际上用于该交联反应),则软凝胶是更“液体状”的。然而,如果该胺树脂和橡胶化合物进行较大量的交联(供交联用的位点的40-60%实际上用于该交联反应并且可能在橡胶化合物本身之间有可测量程度的分子间或分子内交联),则凝胶变得更加稠厚和更加“固体状”。
胺和氨基树脂是在树脂骨架的任何部分上包括至少一个胺取代基团的那些树脂。胺和氨基树脂也可以是由脲、硫脲、蜜胺或有关化合物与醛类,特别是甲醛的反应形成的合成树脂。典型的和所考虑的胺树脂是伯胺树脂,仲胺树脂,叔胺树脂,缩水甘油基胺环氧树脂,烷氧基苄基胺树脂,环氧基胺树脂,蜜胺树脂,烷基化蜜胺树脂,和蜜胺-丙烯酸树脂。蜜胺树脂在这里所述的几个所考虑的实施方案中是特别有用和优选的,因为a)它们是环型化合物,该环含有三个碳和三个氮原子,b)它们能够通过缩合反应而容易地与其它化合物和分子相结合,c)它们能够与其它分子和化合物反应以促进链生长和交联,d)它们比尿素树脂更耐水和耐热,e)它们能够作为水溶性的糊浆或作为可分散在水中的不溶性粉末使用,和f)它们具有高熔点(大于325℃并且是相对不燃的)。烷基化蜜胺树脂,如丁基化蜜胺树脂,是通过在树脂形成过程中引入烷基醇类来形成的。它们可溶于油漆和瓷漆溶剂以及表面涂料中。
分散在热界面材料或混合物中的热填料颗粒应该有利地具有高热导率。合适的填料材料包括金属类,如银、铜、铝,和它们的合金;以及其它化合物,如氮化硼、氮化铝、涂银的铜、涂银的铝和碳纤维。氮化硼和银或氮化硼和银/铜的组合也提供增强的热导率。用量为至少20wt%的氮化硼和用量为至少约60wt%的银是特别有用的。优选地,使用具有大于约20和最优选至少约40w/m℃的热导率的填料。最佳地,希望填料具有不少于约80w/m℃热导率。
这里使用的术语“金属”是指处于元素周期表的d-区和f-区中的那些元素,以及具有类金属性能的那些元素,如硅和锗。这里使用的短语“d-区”是指在包围元素的原子核的3d,4d,5d和6d轨道上具有填充的电子的那些元素。这里使用的短语“f-区”是指在包围元素的原子核的4f和5f轨道上具有填充电子的那些元素,包括镧系元素和锕系元素。优选的金属包括铟、银、铜、铝、锡、铋、镓和它们的合金,涂银的铜和涂银的铝。该术语“金属”还包括合金、金属/金属复合材料、金属陶瓷复合材料、金属聚合物复合材料、以及其它金属复合材料。这里使用的术语“化合物”是指具有恒定组成的物质,它能够通过化学过程分裂成元素。
特别有效的填料包括称作“蒸气生长碳纤维”(VGCF)的特殊形式的碳纤维,如从Applied Sciences,Inc.,Cedarville,Ohio获得的。VGCF,或“碳微纤维”,是由热处理获得的高度石墨化类型(热导率=1900w/m℃)。约0.5wt%碳微纤维的添加提供了显著提高的热导率。此类纤维能够以各种长度和直径获取;即,1毫米(mm)至数十厘米(cm)的长度和小于0.1至大于100μm的直径。一种有用形式的VGCF具有不大于约1μm的直径和约50-100μm的长度,并且具有比直径大于5μm的其它普通碳纤维大了约两或三倍的热导率。
难以将大量的VGCF引入到聚合物体系和界面体系中,如早已讨论的氢化橡胶和树脂组合。当碳微纤维,例如(约1μm,或更小)被添加到聚合物中时,它们无法充分混合,主要因为大量的纤维必须被添加到聚合物中以获得在热导率上有意义的有益改进。然而,我们已经发现,较大量碳微纤维能够添加到具有较大量的其它常规填料的聚合物体系中。更大量的碳微纤维能够在添加其它纤维时被添加到聚合物中,它们能够单独添加到聚合物中,因此提供了对于改进热界面材料的热导率而言的更大益处。理想地,碳微纤维与聚合物的比率在0.05-0.50(重量)范围内。
一旦已经制备了包括至少一种橡胶化合物、至少一种胺树脂和至少一种导热性填料的基础组合物,该组合物必须与电子元件、出售商或电子产品的要求进行对比,以确定是否需要附加的相变材料来改变组合物的一些物理性能。具体地说,如果元件或产品的需要都要求组合物或界面材料是“软凝胶”形式的或多少有点液态形式的,则不需要添加附加的相变材料。然而,如果该元件、层状材料或产品要求该组合物或材料更象固体,则应该添加至少一种相变材料。
这里所考虑的相变材料包括蜡、聚合物蜡或它们的混合物,如石蜡。石蜡是具有通式CnH2n+2和具有约20℃-100℃的熔点的固体烃类的混合物。聚合物蜡典型地是聚乙烯蜡、聚丙烯蜡,并且具有约40℃-160℃的熔点。
相变材料可用于热界面材料应用中,因为当它们在固体和液体形式之间来回变化时贮存和释放热量。随着相变材料变化为固态,它放出热量。随着它回到液体状态,它吸收热量。该相变温度即为熔化温度,在该温度下发生热吸收和热排斥。
然而石蜡型相变材料具有几个缺点。它们本身可以是非常脆的并且难以处置。它们也倾向于在热循环中从它们所应用的设备的缝隙中冲出,非常象油脂。根据本发明的橡胶-树脂改性的石蜡聚合物蜡体系避免了这些问题并提供了显著改进的处置容易性,能够以柔性胶带或固体层形式制造,并且在压力下不会汲出或渗出。虽然该橡胶-树脂-蜡混合物具有相同的或几乎相同的温度,但是它们的熔体粘度高得多并且它们容易迁移。另外,该橡胶-蜡-树脂混合物能够设计成自交联型,确保消除在某些应用中的汲出问题。所考虑的相变材料的例子是malenized石蜡、聚乙烯-马来酸酐蜡和聚丙烯-马来酸酐蜡。橡胶-树脂-蜡混合物在约50-150℃之间的温度下功能性地形成交联的橡胶-树脂网络。
引入附加的填料、物质或颗粒,如填料颗粒、润湿剂或抗氧化剂也是有利的。基本上球形的填料颗粒能够被添加到界面混合物中以最大程度地提高充填密度。另外,基本上球形或类似形状可在压缩过程中提供对厚度的一些控制。对于在橡胶材料中的填料来说有用的典型颗粒尺寸可以是在约1-20μm范围内,其中最大值约100μm。
填料颗粒的分散能够通过官能化有机金属偶联剂或“润湿”剂,如有机硅烷、有机钛酸酯、有机锆等的添加来促进。有机钛酸酯用作润湿增强剂以降低浆料粘度和提高填料用量。可使用的有机钛酸酯是异丙基三异硬脂基钛酸酯。有机钛酸酯的一般结构是RO-Ti(OXRY),其中RO是可水解的基团,而X和Y是粘结剂官能团。
抗氧化剂也可添加,以抑制固化的橡胶凝胶或固体组合物的氧化和热降解。典型的有用的抗氧化剂包括Irganox 1076,酚型或Irganox565,胺型,(在0.01%-约1wt%),可以从Ciba Giegy of Hawthorne,N.Y商购。典型的固化促进剂包括叔胺,如二癸基甲基胺,(在50ppm-0.5wt%)。
至少一种催化剂也可添加到热界面材料或组合物中,以促进在至少一种橡胶化合物、至少一种胺树脂、至少一种相变材料,或全部三者之间的交联或链反应。这里使用的术语“催化剂”是指显著影响化学反应的速率但本身不消耗或经历化学变化的物质或条件。催化剂可以是无机、有机或有机基团和金属卤化物的组合。虽然不是物质,但是光和热也能够用作催化剂。在所考虑的实施方案中,催化剂是酸。在优选实施方案中,催化剂是有机酸,如羧酸:乙酸、甲酸、苯甲酸、水杨酸,二羧酸:草酸、邻苯二甲酸、癸二酸、己二酸、油酸、棕榈酸、硬脂酸、苯基硬脂酸,氨基酸和磺酸。
用于形成本文所公开的可交联的热界面材料的方法包括a)提供至少一种饱和橡胶化合物,b)提供至少一种胺树脂,c)让该至少一种饱和橡胶化合物和该至少一种胺树脂交联以形成交联的橡胶-树脂混合物,d)将至少一种导热性填料加入到交联的橡胶-树脂混合物中,和e)将润湿剂添加到交联的橡胶-树脂混合物中。该方法也可进一步包括将至少一种相变材料添加到交联的橡胶-树脂混合物中。如这里所讨论,液体和固体热界面混合物、材料和组合物能够通过使用所考虑的方法,连同胶带、电子元件、层材料和电子产品一起来形成。
所考虑的热界面材料能够作为可分配的液体浆料提供,从而通过分配方法被施涂并然后根据需要加以固化。它也能够作为高度顺从性的、固化的、弹性体膜或片提供,以预先施加于界面上,如吸热层。它能够进一步作为可通过任何合适的分配方法施涂于表面上的软凝胶或液体被提供和生产。更进一步,该材料能够作为胶带提供,它能够直接应用于分界面或电子元件。
这里所述的所考虑的热界面材料的应用包括将该材料引入到层状材料、电子元件或成品电子产品中。这里所考虑的电子元件一般认为包括用于电子型产品中的任何层状元件。所考虑的电子元件包括电路板、芯片封装件、分隔片、电路板的介电元件、印刷线路板和电路板的其它元件,如电容器、感应器和电阻器。
电子型产品可在它们随时可用于工业或由其它消费者使用的意义上是“成品(finished)”。成品消费产品的例子是电视、电脑、手机、传呼机、掌上型编制器、便携式收音机、汽车用立体声收音机和遥控器。也在考虑之列的是潜在地用于成品产品中的“中间体”产品,如电路板、芯片封装件和键盘。
电子产品也可包括在从概念模型到最终的按比例放大产品/实物模型的任何发展阶段的原型元件。原型元件可以或可以不含有在成品产品中预计的全部实际元件,并且原型元件可具有一些由复合材料构造的元件,以便在最初试验的同时消除它们对其它元件的最初影响。
为了说明本发明,通过混合在实施例A-F中描述的组分来制备几个实施例。正如在这些表中所示,组合物的性能,包括粘度、产品形式、热阻抗、弹性模量和热导率都报告在内。
所示实施例包括一种或多种任选的添加剂,例如抗氧化剂、润湿性增强剂、固化促进剂、粘度降低剂和交联助剂。此类添加剂的用量可以变化,但是一般它们以下列大致的量存在(wt%):填料至多占总量(填料加上橡胶)的95%;润湿性增强剂(占总量的)0.1-1%;抗氧化剂(占总量的)0.01-1%;固化促进剂(占总量的)50ppm-0.5%;粘度降低剂0.2-15%;和交联助剂0.1-2%。应当指出,添加至少约0.5%碳纤维会显著地提高热导率。
组成(wt%) | A | B | C | D | E | F |
氢化聚丁烯单醇 | 7.5 | 6.3 | 10 | 11.33 | 5 | 18 |
氢化聚丁二烯二醇 | 无 | 无 | 2 | 无 | 无 | 无 |
石蜡 | 3.1 | 2.2 | 无 | 无 | 无 | 无 |
丁基化蜜胺树脂 | 1.7 | 0.4 | 1.33 | 2 | 1 | 4 |
有机钛酸酯 | 1.5 | 1.0 | 6.67 | 6.67 | 4 | 8 |
磺酸催化剂 | 0.1 | 无 | 无 | 无 | 无 | 无 |
酚类抗氧化剂 | 0.1 | 0.1 | 无 | 无 | 无 | 无 |
铝粉 | 86 | 90 | 80 | 80 | 无 | 无 |
银粉 | 无 | 无 | 无 | 无 | 90 | 无 |
氮化硼 | 无 | 无 | 无 | 无 | 无 | 70 |
产品形式 | 胶带 | 胶带 | 液体 | 液体 | 液体 | 液体 |
热阻抗(℃cm2/w) | 0.25 | 0.18 | 0.25 | 0.25 | 0.3 | 0.35 |
热导率(w.m/℃) | 3.0 | 5.0 | 2.8 | 2.8 | 2.3 | 2.0 |
弹性模量,Pa | 300000 | 270000 | 500000 | 300000 | 280000 | 270000 |
粘度,Pa.s | N/A | N/A | 200 | 160 | 150 | 220 |
因此已经公开了热界面材料的具体实例和应用。然而,本领域中的技术人员会理解,在不脱离这里的发明概念的前提下对于早已描述过的那些的更多改进都是可能的。因此,本发明的主题不受限制,仅仅限制在所附权利要求的范围内。而且,在解释说明书和权利要求时,全部的术语应该在上下文一致地以最宽可能的方式来解释。尤其,该术语“包括”和“包含”应该解释为,对于以非排他的方式所提及的元素、组分或步骤,表明所提到的元素、组分或步骤可以与非特意地提到的其它元素、组分或步骤一起存在,或一起使用,或相结合。
Claims (33)
1.一种可交联的热界面材料,它包括至少一种橡胶化合物,至少一种胺树脂和至少一种导热性填料。
2.权利要求1的热界面材料,进一步包括至少一种相变材料。
3.权利要求1的热界面材料,其中至少一种橡胶化合物包括至少一个端羟基。
4.权利要求3的热界面材料,其中至少一种橡胶化合物包括至少一种饱和化合物。
5.权利要求4的热界面材料,其中至少一种橡胶化合物包括氢化聚烷二烯单醇,氢化聚烷二烯二醇,或它们的组合或混合物。
6.权利要求5的热界面材料,其中氢化聚烷二烯单醇包括氢化聚丁二烯单醇。
7.权利要求5的热界面材料,其中氢化聚烷二烯二醇包括氢化聚丁二烯二醇。
8.权利要求1的热界面材料,其中至少一种胺树脂包括蜜胺树脂。
9.权利要求8的热界面材料,其中蜜胺树脂包括烷基化蜜胺树脂。
10.权利要求9的热界面材料,其中烷基化蜜胺树脂包括丁基化蜜胺树脂。
11.权利要求1的热界面材料,其中至少一种导热性填料包括金属粉末、氮化硼化合物或它们的组合或混合物。
12.权利要求11的热界面材料,其中金属粉末包括铝粉、银粉、铜粉或它们的组合或混合物。
13.权利要求2的热界面材料,其中至少一种相变材料包括蜡。
14.权利要求13的热界面材料,其中蜡包括石蜡。
15.权利要求1的热界面材料,进一步包括至少一种催化材料。
16.权利要求2的热界面材料,进一步包括至少一种催化材料。
17.权利要求15或16中一项的热界面材料,其中至少一种催化材料包括磺酸催化剂。
18.权利要求1或2中一项的热界面材料,进一步包括至少一种润湿剂。
19.权利要求18的热界面材料,其中润湿剂包括有机钛酸酯。
20.一种包括权利要求1的热界面材料的层状元件。
21.一种包括权利要求1的热界面材料的电子元件。
22.一种包括权利要求2的热界面材料的层状元件。
23.一种包括权利要求2的热界面材料的电子元件。
24.一种包括权利要求1的热界面材料的液体组合物。
25.一种包括权利要求2的热界面材料的固体组合物。
26.一种包括权利要求2的热界面材料的胶带。
25.一种形成可交联的热界面材料的方法,包括:
提供至少一种饱和橡胶化合物;
提供至少一种胺树脂;
让至少一种饱和橡胶化合物和至少一种胺树脂交联而形成交联的橡胶-树脂混合物;
向交联的橡胶-树脂混合物中添加至少一种导热性填料;和
向交联的橡胶-树脂混合物中添加润湿剂。
26.权利要求25的方法,进一步包括将至少一种相变材料添加在交联的橡胶-树脂混合物中。
27.一种由权利要求25的方法形成的液体热界面组合物。
28.一种由权利要求26的方法形成的固体热界面组合物。
29.一种包括权利要求28的热界面组合物的胶带。
30.一种包括权利要求27的热界面材料的电子元件。
31.一种包括权利要求28的热界面材料的电子元件。
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EP1401641A4 (en) * | 2001-05-30 | 2007-12-12 | Honeywell Int Inc | BONDING MATERIALS AND MANUFACTURING METHOD AND USE THEREOF |
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JP2003036279A (ja) | 2001-07-25 | 2003-02-07 | Cdi:Kk | 三次元cadシステム |
-
2002
- 2002-01-14 US US10/047,617 patent/US6673434B2/en not_active Expired - Lifetime
-
2003
- 2003-01-13 KR KR1020047010914A patent/KR100685013B1/ko active IP Right Grant
- 2003-01-13 JP JP2003563809A patent/JP2006502248A/ja active Pending
- 2003-01-13 CN CN2007101622755A patent/CN101126016B/zh not_active Expired - Lifetime
- 2003-01-13 WO PCT/US2003/001094 patent/WO2003064148A1/en active Application Filing
- 2003-01-13 CN CNB038056798A patent/CN100351075C/zh not_active Expired - Lifetime
- 2003-01-13 SG SG200605471-2A patent/SG160196A1/en unknown
- 2003-01-13 EP EP03717872A patent/EP1483110A4/en not_active Withdrawn
- 2003-01-14 TW TW92100737A patent/TWI308171B/zh not_active IP Right Cessation
- 2003-11-17 US US10/715,719 patent/US6908669B2/en not_active Expired - Fee Related
-
2005
- 2005-06-20 US US11/156,698 patent/US7244491B2/en not_active Expired - Fee Related
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2007
- 2007-05-30 US US11/809,131 patent/US7867609B2/en not_active Expired - Lifetime
Cited By (11)
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CN105210465A (zh) * | 2013-03-15 | 2015-12-30 | 天津莱尔德电子材料有限公司 | 热界面材料 |
CN104661432A (zh) * | 2013-11-21 | 2015-05-27 | 三星电机株式会社 | 电子元件嵌入式印刷电路板 |
CN112080258A (zh) * | 2014-12-05 | 2020-12-15 | 霍尼韦尔国际公司 | 具有低热阻的高性能热界面材料 |
CN104650817A (zh) * | 2015-02-12 | 2015-05-27 | 平湖阿莱德实业有限公司 | 一种导热相变材料及其生产方法 |
CN109072051A (zh) * | 2016-03-08 | 2018-12-21 | 霍尼韦尔国际公司 | 相变材料 |
CN109072051B (zh) * | 2016-03-08 | 2023-12-26 | 霍尼韦尔国际公司 | 相变材料 |
CN111051392A (zh) * | 2017-09-08 | 2020-04-21 | 霍尼韦尔国际公司 | 不含硅氧烷的热凝胶 |
US11041103B2 (en) | 2017-09-08 | 2021-06-22 | Honeywell International Inc. | Silicone-free thermal gel |
CN111051392B (zh) * | 2017-09-08 | 2022-08-30 | 霍尼韦尔国际公司 | 不含硅氧烷的热凝胶 |
US11072706B2 (en) | 2018-02-15 | 2021-07-27 | Honeywell International Inc. | Gel-type thermal interface material |
US11373921B2 (en) | 2019-04-23 | 2022-06-28 | Honeywell International Inc. | Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing |
Also Published As
Publication number | Publication date |
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US20070241307A1 (en) | 2007-10-18 |
US7244491B2 (en) | 2007-07-17 |
EP1483110A1 (en) | 2004-12-08 |
US20020132896A1 (en) | 2002-09-19 |
US20060057364A1 (en) | 2006-03-16 |
CN101126016B (zh) | 2012-10-24 |
WO2003064148A1 (en) | 2003-08-07 |
US6908669B2 (en) | 2005-06-21 |
KR100685013B1 (ko) | 2007-02-20 |
US20040137216A1 (en) | 2004-07-15 |
US7867609B2 (en) | 2011-01-11 |
JP2006502248A (ja) | 2006-01-19 |
CN100351075C (zh) | 2007-11-28 |
SG160196A1 (en) | 2010-04-29 |
TW200404868A (en) | 2004-04-01 |
EP1483110A4 (en) | 2007-06-27 |
CN101126016A (zh) | 2008-02-20 |
US6673434B2 (en) | 2004-01-06 |
KR20040081453A (ko) | 2004-09-21 |
TWI308171B (en) | 2009-04-01 |
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