JP2006349812A - Mother board, substrate for electrooptical apparatus and method of manufacturing thereof, electrooptical apparatus, and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To miniaturize substrates for electrooptical apparatus and to inspect the quality of pixels with high accuracy in a mother board including the substrates for electrooptical apparatus such as TFT array substrates. <P>SOLUTION: The mother board includes a plurality of substrates for electrooptical apparatus respectively provided with a plurality of scanning lines and a plurality of signal lines arrayed so as to intersect with each other within a pixel array area on a substrate and a plurality of pixel parts formed correspondingly to respective intersects between the plurality of signal lines and the plurality of scanning lines and arrayed on a plane with mutual gaps. Further the mother board includes a plurality of inspection circuits respectively formed so as to be divided at least partially from the plurality of substrates for electrooptical apparatus on the substrates with the gaps, respectively connected to the plurality of signal lines and allowed to be used for respectively determining the quality of respective pixel parts through the plurality of signal lines. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a substrate for an electro-optical device used in an electro-optical device such as a liquid crystal device, a method for manufacturing the same, and a technical field of a mother substrate.

  An electro-optical device such as a liquid crystal device includes a step of inspecting a substrate for an electro-optical device such as a TFT array substrate on which a thin film transistor (hereinafter referred to as “TFT”) is formed, a TFT array substrate, a liquid crystal, and the like. And a step of enclosing a liquid crystal between opposing substrates on which an opposing electrode for driving the electro-optical element is formed. The inspection of whether or not the finished liquid crystal device operates normally is performed based on whether or not the image displayed by the completed liquid crystal device is correctly displayed. In such an electro-optical device, if a defect of the TFT formed on the TFT array substrate is not detected in the process of inspecting the TFT array substrate, the defect is detected by the inspection performed on the liquid crystal device which is the finished product. Will be.

  As countermeasures when a defect is detected in the finished liquid crystal device, measures such as exchanging the TFT array substrate after repairing the liquid crystal from the liquid crystal device or repairing the defective part can be considered. These measures are practically difficult to adopt in view of a decrease in yield and an increase in cost when manufacturing the product. In addition, the process after forming the TFT array substrate becomes a useless process, and there is a problem in that the yield is reduced and the cost is increased when manufacturing an electro-optical device such as a liquid crystal device.

  As one means for solving such a problem, for example, Patent Document 1 discloses that a pixel corresponds to every intersection of two signal lines and scanning lines electrically connected to a comparator in a pixel array. Disclosed is a technique for inspecting whether or not a pixel is defective by comparing potential information supplied to two pixels when the electro-optical device substrate is formed.

JP 2004-226551 A

  However, according to the technique disclosed in Patent Document 1 described above, the comparator remains on the electro-optical device substrate even after being used for inspection, and the electro-optical device substrate cannot be downsized. There is a problem. In addition, since pixels on different electro-optical device substrates on the wafer are inspected by different comparators during the manufacturing process, the inspection standards are different from each other, and high-precision inspection is performed. There is also a technical problem that makes it difficult.

  The present invention has been made in view of the above-described conventional problems. For example, a mother substrate capable of downsizing an electro-optical device substrate and inspecting pixel quality with high accuracy. It is an object of the present invention to provide an electro-optical device substrate, a manufacturing method thereof, an electro-optical device, and an electronic apparatus.

  In order to solve the above problems, a first mother substrate of the present invention includes a plurality of scanning lines and a plurality of signal lines arranged on the substrate so as to intersect with each other in the pixel array region, and the plurality of the plurality of scanning lines. A plurality of pixel portions provided corresponding to intersections of the signal lines and the plurality of scanning lines, respectively, and a plurality of electro-optical device substrates arranged in a plane with a gap between each other; Each of the plurality of electro-optical device substrates is provided on the substrate so as to be at least partially separable, and is connected to the plurality of signal lines, and the quality of the pixel portion is determined via the plurality of signal lines. And a plurality of inspection circuits used for determination.

  The first mother substrate of the present invention includes a plurality of electro-optical device substrates. For example, a liquid crystal or the like is provided between each electro-optical device substrate cut out by scribing or dicing and a counter substrate. An electro-optical device is formed by sandwiching the electro-optical material. During the operation of the electro-optical device, for example, an image signal is supplied to each pixel portion via a data line by a signal line driving circuit. At the same time, a scanning signal is supplied to each pixel portion via a scanning line by a Y-driver circuit or a scanning line driving circuit. For example, a thin film transistor for pixel switching (hereinafter referred to as “TFT” as appropriate) provided for each pixel portion has a gate connected to a scanning line, and selectively supplies an image signal to a pixel electrode in accordance with the scanning signal. To do. Accordingly, for example, by driving an electro-optical material such as liquid crystal sandwiched between the pixel electrode and the counter electrode in each pixel portion, active matrix driving is possible.

  In particular, the present invention includes a plurality of inspection circuits that are respectively connected to a plurality of signal lines of a plurality of electro-optical device substrates and used to judge the quality of the pixel portion through the plurality of signal lines. It is out. The plurality of inspection circuits are used, for example, when determining whether each pixel unit is good or bad by comparing a potential signal output from a certain pixel unit via a corresponding signal line with a reference signal. In the potential signal output from the pixel portion, the inspection signal supplied to all or a part of the plurality of pixel portions at the time of inspection reflects the presence or absence of defects such as charge leakage in the pixel portion, that is, the quality of the pixel portion. Is a signal obtained as a result. The reference signal is, for example, a reference signal supplied from the outside, and serves as a reference when evaluating the inspection signal and the potential signal output from the pixel unit. With such an inspection circuit, it is possible to inspect a plurality of pixel portions provided on each of the plurality of electro-optical device substrates in the state of a mother substrate or a wafer substrate. That is, a defect in the pixel portion can be detected at an early stage in the manufacturing process. Therefore, for example, useless manufacturing processes such as assembling an electro-optical device using an electro-optical device substrate including a defective pixel portion can be omitted, leading to reduction in manufacturing cost and improvement in quality.

  Further, in the present invention, in particular, a plurality of electro-optical device substrates are arranged in a plane with a gap between each other, and the plurality of inspection circuits have a plurality of electric circuits on the substrate in such a gap. They are provided so as to be at least partially separable from the optical device substrate. Therefore, after the inspection or when the plurality of electro-optical device substrates are cut out from the mother substrate by scribing or dicing, respectively, at least a part of each of the plurality of inspection circuits is separated from the electro-optical device substrate. Can be reduced in size.

  As described above, according to the mother substrate of the present invention, it is possible to detect a defect in the pixel portion at an early stage in the manufacturing process and to reduce the size of the electro-optical device.

  In order to solve the above problems, a second mother substrate of the present invention includes a plurality of scanning lines and a plurality of signal lines arranged on the substrate so as to intersect with each other in the pixel array region, and the plurality of signal lines. A plurality of electro-optical device substrates each having a plurality of pixel portions provided corresponding to intersections of signal lines and the plurality of scanning lines, and two electro-optics among the plurality of electro-optical device substrates The device substrate is provided corresponding to a set of electro-optic device substrates configured as a set, and is electrically connected to the plurality of signal lines in the same set in common, and And a plurality of inspection circuits used when determining the quality of the pixel portion via a plurality of signal lines.

  The second mother substrate of the present invention includes a plurality of electro-optical device substrates, such as a liquid crystal between each electro-optical device substrate cut out by scribing or dicing and a counter substrate. An electro-optical device is formed by sandwiching the electro-optical material. During the operation of the electro-optical device, for example, an image signal is supplied to each pixel portion via a data line by a signal line driving circuit. At the same time, a scanning signal is supplied to each pixel portion via a scanning line by a Y-driver circuit or a scanning line driving circuit. For example, a pixel switching TFT provided for each pixel portion has a gate connected to a scanning line, and selectively supplies an image signal to a pixel electrode in accordance with the scanning signal. Accordingly, for example, by driving an electro-optical material such as liquid crystal sandwiched between the pixel electrode and the counter electrode in each pixel portion, active matrix driving is possible.

  In the present invention, in particular, a plurality of inspection circuits are provided corresponding to sets of electro-optical device substrates each including two electro-optical device substrates among the plurality of electro-optical device substrates. Yes. The plurality of inspection circuits are electrically connected in common to a plurality of signal lines in the same set, and determine the quality of the pixel portion through the plurality of signal lines. In other words, one inspection circuit is provided for each set of electro-optical device substrates, and the quality of each pixel portion of the electro-optical device substrate in the same set is determined by this one inspection circuit. That is, the inspection circuit is shared by each of the electro-optical device substrates in the same set. Therefore, it is necessary to provide the inspection circuit as compared with the case where the inspection circuit is not shared, that is, when one inspection circuit is provided corresponding to one electro-optical device substrate. Less area or space on the mother substrate is required. Accordingly, the number of substrates for electro-optical devices that can be included per one mother substrate is increased, and a larger number of substrates for electro-optical devices can be manufactured. Thereby, manufacturing efficiency improves and it leads also to reduction of manufacturing cost.

  In addition, one inspection circuit is provided for each set of electro-optical device substrates, and each pixel portion of the electro-optical device substrate in the same set can be inspected by one inspection circuit. . Therefore, two electro-optical device substrates for each group can be inspected according to the same standard. If each of the two electro-optical device substrates is inspected by a separate inspection circuit, a measurement error or inspection accuracy caused by a difference in the inspection circuit, in other words, a difference in inspection standard. A drop will occur. However, according to the present invention, each of the electro-optical device substrates in the same set is inspected according to the same standard. Therefore, when an inspection circuit is provided on each of the electro-optical device substrates, the inspection is performed. In comparison, inspection can be performed with high accuracy.

  As described above, according to the second mother substrate of the present invention, the manufacturing efficiency is improved and the manufacturing cost is reduced. In addition, it is possible to inspect with higher accuracy than in the case where an inspection circuit is provided on each of the electro-optical device substrates.

  In one aspect of the second mother substrate of the present invention, the plurality of electro-optical device substrates are arranged in a plane on the substrate with a gap therebetween, and the plurality of inspection circuits include the gaps. Are provided so as to be at least partially separable from the plurality of electro-optical device substrates.

  According to this aspect, the plurality of inspection circuits can be separated from the electro-optical device substrate by cutting, for example, by scribing or dicing. Therefore, after the inspection or when the plurality of electro-optical device substrates are cut out from the mother substrate by, for example, scribing or dicing, respectively, at least a part of each of the plurality of inspection circuits is separated from the electro-optical device substrate. The size of the apparatus can be reduced.

  In another aspect of the second mother substrate of the present invention, the plurality of inspection circuits are provided for each set of a plurality of signal lines each including two signal lines of the plurality of signal lines. It is a differential amplifier circuit for amplifying inspection signals supplied to the pixel portion, which are electrically connected one by one.

  According to this aspect, the inspection circuit is a differential amplifier circuit. Specifically, one signal line is provided for each set of a plurality of signal lines each including two signal lines out of a plurality of signal lines. A potential signal is supplied to the differential amplifier circuit from the pixel portion to be inspected via one of the signal lines. Further, a reference signal having a reference potential is supplied through the other signal line among the signal lines in the same group. The potential difference between the potential signal and the reference signal supplied in this way is amplified by a differential amplifier circuit. For this reason, even if the potential difference between these signals is very small, the quality of the pixel portion can be reliably determined. Note that the amplified signal may be supplied to, for example, a test circuit that is provided outside and determines the quality of the pixel portion.

  In addition, since such a differential amplifier circuit can amplify the potential difference if it can be electrically connected to two signal lines, a plurality of signals of each of the electro-optical device substrates in the same set can be amplified. It is easy to connect and share a common electrical line. Accordingly, it is possible to easily realize inspection of pixel portions of two different electro-optical device substrates, that is, sharing of one differential amplifier circuit, with one differential amplifier circuit.

  In another aspect of the second mother substrate of the present invention, one of the two electro-optical device substrates is planarly viewed on the substrate as the corresponding inspection circuit. On the other hand, it is arranged symmetrically with the other substrate for the electro-optical device.

  According to this aspect, the inspection circuit and the electro-optical device substrate can be efficiently arranged in the region on the mother substrate. Therefore, the number of substrates for electro-optical devices that can be included per one mother substrate is increased, and a larger number of substrates for electro-optical devices can be manufactured. Thereby, manufacturing efficiency improves and it leads also to reduction of manufacturing cost.

  In addition, a routing portion for routing a signal line for connection between the pixel portion and the inspection circuit can be shortened. Therefore, it is possible to prevent an increase in wiring capacity due to a long routing portion. Therefore, it is possible to reduce the sensitivity at the time of inspection due to the wiring capacitance, specifically, to prevent the change of the potential signal from being detected due to a defect such as a minute charge leak in the pixel portion, for example. .

  In the above aspect in which the two electro-optical device substrates are arranged symmetrically with each other, the plurality of electro-optical device substrates each include a signal line driving circuit for driving the plurality of signal lines. The signal line driving circuit provided on the one electro-optical device substrate is provided on the other electro-optical device substrate with respect to the corresponding inspection circuit when viewed in plan on the substrate. The signal line drive circuit may be arranged symmetrically.

  With this configuration, any of the two electro-optical device substrates in the same set can be electrically connected to the inspection circuit without sandwiching the signal line driving circuit in the middle. Therefore, electrical influence from the signal line driver circuit can be reduced. Further, it is not necessary to make wiring complicated.

  In another aspect of the second mother substrate of the present invention, when viewed in plan on the substrate, it is disposed between each of the plurality of electro-optical device substrates and the corresponding inspection circuit, The apparatus further includes a switching element electrically connected in the middle of the plurality of signal lines, and switching means for switching between the on state and the off state of the switching element.

  According to this aspect, when inspecting the quality of the pixel unit, for example, by switching the switching element to the ON state, the pixel unit and the inspection unit are connected via the plurality of signal lines so that the potential signal can be supplied to the inspection circuit. It is possible to conduct between the circuits. The switching element is switched between an on state and an off state by the switching means. When the potential signal is supplied to the inspection circuit, the signal line can be supplied to the inspection circuit in accordance with the timing at which the potential signal is supplied to the inspection circuit.

  In the aspect further including the switching element and the switching unit described above, the plurality of electro-optical device substrates are planarly arranged on the substrate with a gap therebetween, and the switching element and the switching unit include: Each of the plurality of electro-optical device substrates may be provided on the substrate in the gap so as to be at least partially separable.

  With this configuration, the electro-optical device can be reduced in size by separating the switching element and the switching unit from the electro-optical device substrate.

  In order to solve the above problems, an electro-optical device substrate of the present invention includes a plurality of scanning lines and a plurality of signal lines disposed on the substrate so as to intersect with each other in the pixel array region, and the plurality of signal lines. A plurality of pixel portions provided corresponding to intersections of the signal lines and the plurality of scanning lines; an inspection circuit provided outside the substrate; and used for inspecting the plurality of pixel portions; In order to control the electrical connection with the plurality of signal lines, a switching element electrically connected to the plurality of signal lines and switching means for switching between the ON state and the OFF state of the switching element are provided.

  According to the electro-optical device substrate of the present invention, for example, an electro-optical device is formed by sandwiching an electro-optical material such as liquid crystal between the counter substrate and the counter substrate. During the operation of the electro-optical device, for example, an image signal is supplied to each pixel portion via a data line by a signal line driving circuit. At the same time, a scanning signal is supplied to each pixel portion via a scanning line by a Y-driver circuit or a scanning line driving circuit. For example, a pixel switching TFT provided for each pixel portion has a gate connected to a scanning line, and selectively supplies an image signal to a pixel electrode in accordance with the scanning signal. Accordingly, for example, by driving an electro-optical material such as liquid crystal sandwiched between the pixel electrode and the counter electrode in each pixel portion, active matrix driving is possible.

  Particularly in the present invention, the plurality of pixel portions are used for inspecting the plurality of pixel portions, and the plurality of signal lines are controlled in order to control electrical connection between the inspection circuit provided outside the substrate and the plurality of signal lines. A switching element electrically connected to the signal line; and switching means for switching the switching element between an on state and an off state. Therefore, by electrically connecting the pixel portion and the inspection circuit for performing inspection based on the potential signal from the pixel portion, for example, through the switching element, an early stage of the manufacturing process, for example, a plurality of arrays on the mother substrate In such a state, the defect of the pixel portion can be inspected. The switching element is switched between an on state and an off state by the switching means. Therefore, when the potential signal from the pixel portion is supplied to the inspection circuit, the signal line can be supplied to the inspection circuit in accordance with the timing at which the potential signal is supplied to the inspection circuit.

  In addition, by turning off the switching element after the inspection, for example, it is possible to prevent adjacent signal lines from being short-circuited, that is, electrically short-circuited.

  In order to solve the above-described problems, an electro-optical device of the present invention includes the above-described substrate for an electro-optical device of the present invention.

  According to the electro-optical device of the present invention, since the electro-optical device substrate of the present invention described above is provided, it is possible to inspect defects in the pixel portion at an early stage of the manufacturing process. Therefore, the manufacturing efficiency is improved and the manufacturing cost is reduced.

  In order to solve the above problems, an electronic apparatus according to the present invention includes the above-described electro-optical device according to the present invention (including various aspects thereof).

  Since the electronic apparatus of the present invention includes the above-described electro-optical device of the present invention, a projection display device, a television, a mobile phone, an electronic notebook, a word processor, a view capable of performing high-quality image display. Various electronic devices such as a finder type or a monitor direct-view type video tape recorder, a workstation, a videophone, a POS terminal, and a touch panel can be realized. In addition, as an electronic apparatus of the present invention, for example, an electrophoretic device such as an electronic paper, an electron emission device (Field Emission Display and a Conduction Electron-Emitter Display), an electrophoretic device, and a display device using the electron emission device are realized. Is also possible. Since such an electronic apparatus includes the above-described electro-optical device substrate, the manufacturing efficiency is improved.

  In order to solve the above problems, a method for manufacturing a substrate for an electro-optical device of the present invention includes a plurality of scanning lines and a plurality of signal lines arranged on the substrate so as to intersect with each other in the pixel array region, A mother substrate including a plurality of electro-optical device substrates each including a plurality of pixel portions provided corresponding to intersections of the plurality of signal lines and the plurality of scanning lines, and arranged in a plane with a gap therebetween. The electro-optical device manufacturing method for manufacturing the electro-optical device by cutting the plurality of electro-optical device substrates from the substrate, each provided on the substrate in the gap, and connected to the plurality of signal lines And an inspection step of inspecting the electro-optic device substrate by a plurality of inspection circuits used when determining the quality of the pixel portion via the plurality of signal lines, and the plurality of the substrates together with the substrate in the gap. A test circuit and a dividing step of at least partially separated from the electro-optical device substrate.

  According to the method for manufacturing a substrate for an electro-optical device of the present invention, for example, the quality of the pixel unit is determined in a state where the substrate for the electro-optical device is arranged on a mother substrate or a wafer substrate, that is, at an early stage in the manufacturing process. The plurality of pixel portions provided on each of the plurality of electro-optical device substrates are respectively inspected by the plurality of inspection circuits. Therefore, for example, useless manufacturing processes such as assembling an electro-optical device using an electro-optical device substrate including a defective pixel portion can be omitted, leading to reduction in manufacturing cost and improvement in quality.

  Further, after the inspection or when the plurality of electro-optical device substrates are cut out from the mother substrate by scribing or dicing, respectively, at least a part of each of the plurality of inspection circuits is separated from the electro-optical device substrate. Can be reduced in size.

  In an aspect of the method for manufacturing a substrate for an electro-optical device according to the aspect of the invention, the inspection step is performed for each set of a plurality of signal lines each including two signal lines among the plurality of signal lines. Inspecting the electro-optical device substrate by the inspection circuit including differential amplifier circuits electrically connected to each other.

  According to this aspect, it is possible to reliably determine whether the pixel portion is good or bad even if the pixel portion has a defect, for example, charge leakage in the pixel portion is very small.

  In addition, it is easy to commonly connect the plurality of signal lines of the electro-optical device substrates in the same set in common to share the differential amplifier circuit. Therefore, it is possible to prevent a measurement error or a decrease in inspection accuracy due to a difference in inspection standard.

  Such an operation and other advantages of the present invention will become apparent from the embodiments described below.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, a TFT array substrate is taken as an example of a plurality of electro-optical device substrates included in the mother substrate of the present invention.

(First embodiment)
First, the overall configuration of a liquid crystal device including a TFT array substrate included in the mother substrate according to the present embodiment will be described with reference to FIGS. FIG. 1 is a plan view showing the overall configuration of the liquid crystal device according to this embodiment, and FIG. 2 is a cross-sectional view taken along the line HH ′ of FIG.

  1 and 2, in the liquid crystal device including the TFT array substrate included in the mother substrate according to the present embodiment, the TFT array substrate 10 and the counter substrate 20 are arranged to face each other. A liquid crystal layer 50 is sealed between the TFT array substrate 10 and the counter substrate 20, and the TFT array substrate 10 and the counter substrate 20 are included in an image display region 10a as an example of the “pixel array region” according to the present invention. They are bonded to each other by a sealing material 52 provided in a surrounding sealing region.

  In FIG. 1, a light-shielding frame light-shielding film 53 that defines the frame area of the image display region 10a is provided on the counter substrate 20 side in parallel with the inside of the seal region where the sealing material 52 is disposed. In the peripheral region, the region located outside the sealing region where the sealing material 52 is disposed, the X-driver circuit 101 and the external circuit connection terminal 102 as an example of the “signal line driving circuit” according to the present invention are TFTs. It is provided along one side of the array substrate 10. The sampling circuit 110 is provided so as to be covered with the frame light shielding film 53 on the inner side of the seal region along the one side. The Y-driver circuit (or scanning line driving circuit) 104 is provided so as to be covered with the frame light-shielding film 53 inside the seal region along two sides adjacent to the one side. On the TFT array substrate 10, vertical conduction terminals 106 for connecting the two substrates with the vertical conduction material 107 are arranged in regions facing the four corner portions of the counter substrate 20. Thus, electrical conduction can be established between the TFT array substrate 10 and the counter substrate 20.

  On the TFT array substrate 10, a lead wiring 90 is formed for electrically connecting the external circuit connection terminal 102 to the X-driver circuit 101, the Y-driver circuit 104, the vertical conduction terminal 106, and the like. .

  In FIG. 2, on the TFT array substrate 10, a laminated structure in which wiring such as a pixel switching TFT (Thin Film Transistor) as a driving element, a scanning line, and a data line is formed. In the image display area 10a, a pixel electrode 9a is provided in an upper layer of wiring such as a pixel switching TFT, a scanning line, and a data line. An alignment film is formed on the pixel electrode 9a. On the other hand, on the counter substrate 20, in addition to the counter electrode 21, a lattice-shaped or striped light-shielding film 23 and an alignment film are formed on the uppermost layer portion. The liquid crystal layer 50 is made of, for example, a liquid crystal in which one or several types of nematic liquid crystals are mixed, and takes a predetermined alignment state between the pair of alignment films.

  Next, the overall configuration of the mother substrate according to the present embodiment will be described with reference to FIG. FIG. 3 is a block diagram showing the arrangement of the TFT array substrate and the inspection circuit in an arbitrary region on the mother substrate. In FIG. 3, only main elements necessary for explanation are shown, and other elements are omitted.

  In FIG. 3, the mother substrate 100 includes a plurality of TFT array substrates 10 and a plurality of inspection circuits 4.

  The plurality of TFT array substrates 10 are arranged in a plane on the substrate with a gap therebetween. Specifically, in FIG. 3, they are arranged along the X direction and the Y direction, respectively.

  As will be described later, the plurality of inspection circuits 4 are circuits for determining whether or not the pixel portion including the pixel electrode 9a and the like provided in the image display area 10a on the TFT array substrate 10 is good. The plurality of inspection circuits 4 are respectively provided in the gap regions 4a formed by the plurality of TFT array substrates 10 along the X direction in FIG. Further, the plurality of inspection circuits 4 are respectively provided corresponding to the sets of TFT array substrates 10 configured by combining two TFT array substrates among the plurality of TFT array substrates 10. That is, as shown in FIG. 3, the TFT array substrate 10A and the TFT array substrate 10B are taken as one set, and one inspection circuit 4 is provided for each set.

  Next, the circuit configuration of the TFT array substrate and the inspection circuit will be described with reference to FIG. FIG. 4 is a circuit diagram showing the electrical configuration of an arbitrary set of TFT array substrates 10 and an inspection circuit corresponding thereto. FIG. 5 is a circuit diagram showing an electrical configuration of the pixel portion. FIG. 6 is a circuit diagram showing an electrical configuration of the pull-down circuit. FIG. 7 is a conceptual diagram illustrating a state of the pixel portion to which a signal is supplied in advance at the time of inspection. FIG. 8 is a circuit diagram showing an electrical configuration of the pull-up circuit. The circuit configurations of the TFT array substrate 10A and the TFT array substrate 10B are the same. In the following, for the sake of simplicity, the odd-numbered number (that is, the scanning line Gj (j = 1, 2,..., N; an integer greater than or equal to 2)) is viewed from the left side in the drawing (that is, an integer of 2 or more). Pixel portions provided corresponding to the signal lines Soi (i = 1, 2,..., M; m is an integer of 2 or more) arranged in the first, third, fifth,. , And signal lines Sei (i = 1, 2,..., M; m is an integer) arranged in the even number (0th, 2, 4th,...) Are set as reference potentials. A description will be given on the assumption that

  In FIG. 4, the TFT array substrate 10 of this embodiment (that is, the TFT array substrate 10A or the TFT array substrate 10B, hereinafter the same) includes a Y-driver circuit 104, an X-driver circuit 101, a sampling circuit 110, and a pixel unit. 70.

  The Y-driver circuit 104 sequentially supplies a switching signal for each scanning line when the pixel unit 70 is inspected. Here, the switching signal is a signal different from the scanning signal for image display supplied to the pixel unit 70 when displaying an image, and an inspection signal described later supplied in advance to the pixel unit 70 is used as the pixel signal. This is a signal for switching the switching element included in the pixel unit 70 to the on state.

  The X-driver circuit 101 supplies a sampling signal to the sampling switch 111 that constitutes the sampling circuit 110, and switches the sampling switch 111 to an on state. Here, the “sampling signal” is different from a signal supplied from the X-driver circuit 101 to the sampling circuit 110 when an image is displayed, and is a high potential signal or a low potential signal output from a differential amplifier circuit 15 described later. This is a signal for individually outputting a potential signal to an external test circuit for each of the signal lines Soi and Sei.

  When the pixel unit 70 is inspected, the sampling circuit 110 outputs a potential signal corresponding to the signal lines Soi and Sei to which the pixel unit 70 to be inspected is electrically connected, and the image signal supply line 112. A high potential signal or a low potential signal is output to an external test circuit via

  The pixel unit 70 is provided in the image display region 10a corresponding to the intersection of the signal lines Soi and Sei and the scanning line Gj.

  As shown in FIG. 5, the pixel unit 70 includes a TFT 73, a liquid crystal element 72, and a storage capacitor 73.

  The TFT 71 has a source electrically connected to the signal line Soi or Sei, and a gate electrically connected to the scanning line Gj. The TFT 71 is switched on and off by a switching signal supplied from the Y-driver circuit 104. The pixel unit 70 outputs a potential signal to the signal line Soi and outputs a second potential signal to the signal line Sei. The liquid crystal element 72 has a liquid crystal injected between the TFT array substrate 10 and a counter substrate disposed so as to correspond to the TFT array substrate 10, and a pair of electrodes for sandwiching the liquid crystal. The storage capacitor 73 temporarily holds an image signal supplied to the pixel unit 70 when image display is performed, and enables active matrix driving of the plurality of pixel units 70.

  Referring back to FIG. 4, in particular, in the mother substrate of this embodiment, the inspection circuit 4 is provided corresponding to a set of TFT array substrates 10 configured with the TFT array substrates 10 </ b> A and 10 </ b> B as a set.

  The inspection circuit 4 includes a plurality of differential amplifier circuits 15, a first drive signal supply circuit 21, a second drive signal supply circuit 22, TFTs 13p and 13n, a connection circuit 26 which is an example of the “switching means” of the present invention, a switching element. 6. A plurality of signal lines Soi and a plurality of signal lines Sei are provided. Hereinafter, the relationship between the inspection circuit 4 and the TFT array substrate 10A will be described. The relationship between the inspection circuit 4 and the TFT array substrate 10B is the same as the relationship between the inspection circuit 4 and the TFT array substrate 10A.

  A plurality of signal lines Soi and Sei are extended from the image display region 10 a to the differential amplifier circuit 15, and are electrically connected to connection points So and Se of the differential amplifier circuit 15, respectively. The signal lines Soi and Sei intersect the plurality of scanning lines Gj (j = 1, 2,..., N; n is an integer of 2 or more) provided in the image display area 10a. It extends in the image display area. The pixel portion 70 provided in the image display region 10a is arranged in accordance with the intersection of the signal lines Soi and Sei and the plurality of scanning lines Gj, and is electrically connected to the signal lines Soi and Sei.

  The connection circuit 26 includes a test signal supply line 45 electrically connected to the test circuit via a test circuit connection gate terminal, and a pull-down circuit 35. The test signal supply line 45 supplies a series of test signals supplied from the test circuit to the switching element 6 when the pixel unit 70 is inspected. The pull-down circuit 35 stabilizes the potential of the test signal supply line 45 so that the test signal supplied to the switching element 6 via the test signal supply line 45 does not fluctuate.

  As shown in FIG. 6, the pull-down circuit 35 includes a TFT 135 having a gate electrically connected to the power supply VDD, a grounded source, and a drain electrically connected to the test signal supply line 45. This reduces the fluctuation of the potential of the test signal supply line 45 when the test signal is supplied. Note that the pull-down circuit 32 has the same circuit configuration as the pull-down circuit 35.

  In FIG. 4 again, the switching element 6 is provided in the middle of each of the signal lines Soi and Sei. The switching element 6 is provided on the side close to the differential amplifier circuit 15 when viewed from the pixel portion 70, and includes a plurality of TFTs 14 electrically connected in the middle of each of the signal lines Soi and Sei. The plurality of TFTs 14 are collectively switched on according to a test signal supplied from the test circuit via the test signal supply line 45 when the pixel unit 70 is inspected. Thereby, a supply path for the potential signal supplied to the differential amplifier circuit 15 through each of the signal lines Soi and Sei can be secured, and the TFT 71 provided in the pixel portion 70 described above with reference to FIG. As long as the first potential signal and the second potential signal are switched from each pixel unit 70 to each differential amplifier circuit 15 through each of the signal lines Soi and Sei.

  Here, at the time of inspection, an inspection signal and a reference signal having a predetermined potential are supplied to the plurality of pixel units 70 in advance. In the present embodiment, as shown in FIG. 7, the pixel portion 70 provided corresponding to the signal line Soi has a potential higher than an intermediate potential (indicated as “M” in FIG. 7) as a reference potential. (Hereinafter referred to as “HIGH potential” as appropriate. In FIG. 7, it is indicated as “H”), and an intermediate potential reference signal is supplied to the pixel portion 70 provided corresponding to the signal line Sei. Is done. In the present embodiment, the intermediate potential is half of the power supply voltage Vdd of the power supply VDD, that is, Vdd / 2. Therefore, in the image display area 10a, the columns of the pixel portions 70 supplied with the intermediate potential signal and the columns of the pixel portions 70 supplied with the HIGH potential signal are alternately arranged.

  The first potential signal is a signal obtained by reading the inspection signal that has been supplied to the pixel unit 70 in advance from the pixel unit 70, and is different from the potential of the inspection signal, that is, the HIGH potential, depending on the malfunction that has occurred in the pixel unit 70. Output with potential. The second potential signal is a signal in which the reference signal previously supplied to the pixel unit 70 is read from the pixel unit 70, and is supplied to the differential amplifier circuit 15 through the signal line Sei simultaneously with the first potential signal. The The second potential signal, that is, the potential of the reference signal is output as an intermediate potential. The intermediate potential is a reference potential to be compared when the first differential amplifier circuit 15 determines the level of the potential of the first potential signal. The first potential signal may be a signal supplied to all or a part of the plurality of pixel units 70, and the second potential signal may be a signal supplied from the outside. In this case, since the second signal as the reference signal can be stably supplied from the outside, it is possible to more reliably determine whether the pixel unit 70 is good or bad.

  The first drive signal supply circuit 21 includes a first drive signal supply line 41 and a pull-up circuit 31. The first drive signal supply line 41 is electrically connected to the gate of the TFT 13p electrically connected to the differential amplifier circuit 15, and supplies the first drive signal SApE supplied from the outside to the gate of the TFT 13p. . The first drive signal SApE is a drive signal for driving the differential amplifier circuit 15. As will be described later, the differential amplifier circuit 15 has a high potential among signals input to the connection points So and Se. It functions as a sense amplifier that raises the potential of a signal it has and lowers the potential of a low signal. The TFT 13p is a p-channel TFT, and the TFT 13p is turned on when the first drive signal SApE is supplied to the gate, and supplies the power supply VDD to the connection terminal Sp of the differential amplifier circuit 15.

  As shown in FIG. 8, the pull-up circuit 31 includes a p-channel TFT 131 whose gate is grounded. The TFT 131 supplies the power VDD to the first drive signal supply line 41 for the first differential amplifier circuit.

  The second drive signal supply circuit 22 includes a second drive signal supply line 42 and a pull-down circuit 32. The second drive signal supply line 42 is electrically connected to the gate of the TFT 13n electrically connected to the differential amplifier circuit 15, and supplies the second drive signal SAnE supplied from the outside to the gate of the TFT 13n. . The TFT 13n is an n-channel TFT and is turned on when the second drive signal SAnE is supplied to the gate, and supplies the power supply VDD to the differential amplifier circuit 15. The pull-down circuit 32 maintains the potential of the second drive signal supply line 42.

  One differential amplifier circuit 15 is provided for each set of signal lines, each including the signal lines Soi and Sei. When the switching element 6 is turned on, the first and second potential signals are supplied from the signal lines Soi and Sei to the connection points So and Se of the differential amplifier circuit 15, respectively. The differential amplifier circuit 15 compares the first and second potential signals, and outputs a high potential signal or a low potential signal to the test circuit that is a determination unit via each of the signal lines Soi and Sei.

  Next, the configuration of the differential amplifier circuit will be described in detail with reference to FIG. FIG. 9 is a circuit diagram showing an electrical configuration of the differential amplifier circuit.

  In FIG. 9, the differential amplifier circuit 15 is a cross-coupled differential amplifier circuit including p-channel TFTs 51 and 52 and n-channel TFTs 53 and 54. More specifically, a series circuit in which the TFTs 51 and 52 are electrically connected in series and a series circuit in which the TFTs 53 and 54 are electrically connected in series are electrically connected in parallel. The gate of the TFT 51 is electrically connected to the connection point So between the TFTs 52 and 54. The gate of the TFT 52 is electrically connected to the connection point Se between the TFTs 51 and 53. The gate of the TFT 53 is electrically connected to the connection point So between the TFTs 52 and 54. The gate of the TFT 54 is electrically connected to the connection point Se between the TFTs 51 and 53. The connection point So is electrically connected to the signal line Soi, and the connection point Se is electrically connected to the signal line Sei. The connection point Sp between the TFTs 51 and 52 is electrically connected to the drain of the TFT 13p. A connection point Sn between the TFTs 53 and 54 is electrically connected to the drain of the TFT 13n.

  When the first potential signal has a slightly higher potential than the second potential signal, the differential amplifier circuit 15 applies a high potential signal whose potential is higher than that of the first potential signal to the signal line Soi. For example, the data is output to a test circuit as determination means. Thus, according to the high potential signal whose potential is increased, it is possible to clarify that the potential of the first potential signal is higher than the potential of the second potential signal. When the first potential signal has a slightly lower potential than the second potential signal, the differential amplifier circuit 15 applies a low potential signal whose potential is lower than that of the first potential signal to the signal line Soi. Output via. According to such a low potential signal, it is possible to clarify that the potential of the first potential signal is lower than the potential of the second potential signal.

  The second potential signal supplied to the differential amplifier circuit 15 via the signal line Sei is a reference potential that serves as a reference when the potential of the first potential signal is increased or decreased. The first potential signal is a signal that reflects whether or not the pixel portion 70 electrically connected to the signal line Soi has a defect, that is, the quality of the pixel portion 70, and the second potential signal and the first potential signal. Is slightly smaller than the potential that fluctuates depending on the wiring capacitance of these signal lines. The differential amplifier circuit 15 outputs a high potential signal or a low potential signal so that the level relationship between the potential of the first potential signal and the second potential signal can be clearly determined.

  Based on the high-potential signal or the low-potential signal output in this way, for example, a test circuit as a determination unit determines whether or not a defect has occurred in the pixel unit 70. More specifically, if the high-potential signal is output from the differential amplifier circuit 15 when the potential of the inspection signal that is the source of the first potential signal is higher than the intermediate potential, it is electrically connected to the signal line Soi. The test circuit determines that there is no malfunction in the pixel unit 70, that is, the pixel unit 70 to which the inspection signal that is the basis of the first potential signal is supplied. Similarly, when the potential of the inspection signal that is the source of the first potential signal is lower than the potential of the second potential signal, if the low potential signal is output from the differential amplifier circuit 15, it is electrically connected to the first signal line. The test circuit determines that no defect has occurred in the pixel unit 70 that has been supplied, that is, the pixel unit 70 to which the inspection signal that is the basis of the first potential signal has been supplied.

  If the first low potential signal is output from the differential amplifier circuit 15 when the potential of the inspection signal that is the basis of the first potential signal is higher than the potential of the second potential signal, the signal is connected to the signal line Soi. The test circuit determines that some trouble has occurred in the pixel unit 70, that is, the pixel unit 70 to which the inspection signal that is the basis of the first potential signal is supplied. If the high potential signal is output from the differential amplifier circuit 15 when the potential of the inspection signal that is the basis of the first potential signal is lower than the potential of the second potential signal, the pixel unit 70 that is electrically connected to the signal line Soi. That is, the test circuit determines that some trouble has occurred in the pixel unit 70 to which the inspection signal that is the basis of the first potential signal is supplied.

  As described above, the plurality of inspection circuits 4 each including the plurality of differential amplifier circuits 15 can respectively determine the quality of the plurality of pixel portions 70 included in each of the plurality of TFT array substrates.

  Referring again to FIG. 4, in the present embodiment, in particular, the inspection circuit 4 is provided in correspondence with each set of TFT array substrates 10 configured with the TFT array substrates 10A and 10B as one set. The plurality of differential amplifier circuits 15 constituting the inspection circuit 4 are electrically connected in common to a plurality of signal lines in the same set. That is, the signal line Sei included in the TFT array substrate 10A and the signal line Sei included in the TFT array substrate 10B are connected to the connection point Se of the common differential amplifier circuit 15, respectively. In other words, one inspection circuit 4 is provided for each set of the TFT array substrate 10A and the TFT array substrate 10B, and the single inspection circuit 4 determines the quality of each pixel unit 70 of the TFT array substrates 10A and 10B. To do. That is, the inspection circuit 4 is shared by the TFT array substrates 10A and 10B. Therefore, it is necessary to provide the inspection circuit 4 as compared with the case where the inspection circuit 4 is not shared, that is, when one inspection circuit 4 is provided corresponding to one TFT array substrate 10. Less area or space on the mother board is required. Therefore, the number of TFT array substrates 10 that can be included per one mother substrate is increased, and more TFT array substrates 10 can be manufactured. Thereby, manufacturing efficiency improves and it leads also to reduction of manufacturing cost.

  In addition, one inspection circuit 4 is provided for each set of TFT array substrates 10A and 10B, and each pixel portion 70 of the TFT array substrates 10A and 10B can be inspected by one inspection circuit 4. Therefore, the pixel unit 70 for each set of the TFT array substrates 10A and 10B can be inspected according to the same standard. If each of the two TFT array substrates 10A and 10B is inspected by another inspection circuit 4, a measurement error or inspection accuracy due to a difference in the inspection circuit 4, in other words, a difference in inspection standard. Will be reduced. However, according to the mother substrate 100 of the present embodiment, each TFT array substrate in the same set is inspected according to the same standard, so that one inspection circuit 4 is provided for each TFT array substrate 10 and inspected. Compared to the case, the inspection can be performed with high accuracy.

  As described above, according to the mother substrate 100 of the present embodiment, the manufacturing efficiency is improved and the manufacturing cost is reduced. In addition, it is possible to inspect with higher accuracy than in the case where one inspection circuit is provided on each of the plurality of TFT array substrates 10 for inspection.

  Referring back to FIG. 4, particularly in this embodiment, the plurality of inspection circuits 4, the switching elements 6, and the connection circuit 26 can be separated from the TFT array substrate 10 by cutting, for example, by scribing or dicing. Therefore, after inspection or when the plurality of TFT array substrates 10 are cut out from the mother substrate 100 by, for example, scribing or dicing, at least a part of each of the plurality of inspection circuits 4, the switching elements 6, and the connection circuits 26 is removed. The electro-optical device can be reduced in size by dividing from the above.

  Next, a first modification and a second modification will be described with reference to FIGS. 10 and 11 respectively. FIG. 10 is a circuit diagram having the same concept as in FIG. 4 according to the first modification. FIG. 11 is a block diagram having the same concept as in FIG. 3 according to the second modification.

  As shown in FIG. 10 as a first modification, the plurality of TFT array substrates 10 may each include a switching element 6 and a connection circuit 26. That is, when the plurality of TFT array substrates 10 are cut out from the mother substrate 100 by, for example, scribing or dicing, only the inspection circuit 4 may be divided so that the TFT array substrate 10 includes the switching element 6 and the connection circuit 26. In this way, it is possible to prevent the adjacent signal lines from being short-circuited, that is, electrically short-circuited, for example, by turning off the switching element 6 after the inspection.

  As shown in FIG. 11 as a second modified example, unlike the present embodiment, even when the inspection circuit 4 is provided on each of the plurality of TFT array substrates 10, at least a part of the inspection circuit 4 is disposed in the TFT array. By separating from the substrate 10, the electro-optical device can be reduced in size.

  Referring back to FIG. 3, particularly in the present embodiment, the mother substrate 100 includes one TFT array substrate 10 </ b> A out of a set of two TFT array substrates 10 </ b> A and 10 </ b> B. On the other hand, it is arranged symmetrically with the other TFT array substrate 10B. Therefore, the inspection circuit 4 and the TFT array substrate 10 can be efficiently arranged in the region on the mother substrate 100. Therefore, the number of TFT array substrates 10 that can be included per one mother substrate 100 is increased, and more TFT array substrates 10 can be manufactured. Thereby, manufacturing efficiency improves and it leads also to reduction of manufacturing cost.

  In addition, by arranging the inspection circuit 4 and the TFT array substrate 10 in this way, a routing portion for routing a signal line for connection between the pixel unit 70 and the inspection circuit 4 can be shortened. Therefore, it is possible to prevent an increase in wiring capacity due to a long routing portion. Therefore, it is possible to reduce the sensitivity at the time of inspection due to the wiring capacitance, specifically, to prevent the change of the potential signal from being detected due to a defect such as a minute charge leak in the pixel unit 70, for example. it can.

  Further, particularly in the present embodiment, the X-driver circuit 101 provided on one TFT array substrate 10A has a plan view on the substrate, and the other TFT array substrate 10B is opposed to the corresponding inspection circuit 4. The X-driver circuit 101 is arranged symmetrically. Therefore, both of the two TFT array substrates 10A and 10B in the same set can be electrically connected to the inspection circuit 4 without sandwiching the X-driver circuit 101 in the middle. Therefore, the electrical influence from the X-driver circuit 101 can be reduced. Further, it is not necessary to make wiring complicated.

(Method of manufacturing substrate for electro-optical device)
Next, a manufacturing method of the TFT array substrate according to the present embodiment will be described with reference to FIG. FIG. 12 is a flowchart showing the flow of the manufacturing method of the TFT array substrate according to this embodiment.

  As shown in FIG. 12, according to the manufacturing method of the TFT array substrate according to the present embodiment, first, the pixel unit 70, the X-driver circuit 101, the Y-driver circuit 101, etc. are formed on the substrate on which the mother substrate 100 is formed. Various elements are formed, and an inspection circuit 4 including a plurality of differential amplifier circuits 15 is formed in the gap region 4a shown in FIG. 3 (step S10). At this time, the various elements are formed in the region where the TFT array substrate 10 is to be formed, and as shown in FIG. 3, the plurality of TFT array substrates 10 are composed of the TFT array substrates 10A and 10B in the gap region 4a. Are formed so as to be symmetric.

  Next, the plurality of inspection circuits 4 inspect the pass / fail of the pixel unit 70 that each of the plurality of TFT array substrates 10 has (step S20). Here, before the plurality of TFT array substrates 10 are cut out from the mother substrate 100, the inspection of the pixel portions 70 included in each of the plurality of TFT array substrates 10 is performed, and thus, for example, a TFT array substrate including the defective pixel portion 70 Thus, a useless manufacturing process such as assembling a liquid crystal device using 10 can be omitted, leading to a reduction in manufacturing cost and an improvement in quality. Further, the inspection is performed by sharing the plurality of differential amplifier circuits 15 by the set of the TFT array substrates 10A and 10B, that is, the inspection standard is used in common, so that a measurement error caused by a difference in the inspection standard is performed. Or the fall of inspection accuracy can be prevented.

  Next, the plurality of TFT array substrates 10 are cut out from the mother substrate 100 by, for example, scribing or dicing (step S30). At this time, the liquid crystal device can be reduced in size by separating at least a part of each of the plurality of inspection circuits 4 from the TFT array substrate 10.

(Electronics)
Next, the case where the liquid crystal device which is the above-described electro-optical device is applied to various electronic devices will be described.

  First, a projector using this liquid crystal device as a light valve will be described. FIG. 13 is a plan view showing a configuration example of the projector. As shown in FIG. 13, a projector 1100 includes a lamp unit 1102 made of a white light source such as a halogen lamp. The projection light emitted from the lamp unit 1102 is separated into three primary colors of RGB by four mirrors 1106 and two dichroic mirrors 1108 arranged in the light guide 1104, and serves as a light valve corresponding to each primary color. The light enters the liquid crystal panels 1110R, 1110B, and 1110G.

  The configurations of the liquid crystal panels 1110R, 1110B, and 1110G are the same as those of the liquid crystal device described above, and are driven by R, G, and B primary color signals supplied from the image signal processing circuit. The light modulated by these liquid crystal panels enters the dichroic prism 1112 from three directions. In this dichroic prism 1112, R and B light is refracted at 90 degrees, while G light travels straight. Accordingly, as a result of the synthesis of the images of the respective colors, a color image is projected onto the screen or the like via the projection lens 1114.

  Here, paying attention to the display images by the liquid crystal panels 1110R, 1110B, and 1110G, the display image by the liquid crystal panel 1110G needs to be horizontally reversed with respect to the display images by the liquid crystal panels 1110R, 1110B.

  Note that since light corresponding to the primary colors R, G, and B is incident on the liquid crystal panels 1110R, 1110B, and 1110G by the dichroic mirror 1108, it is not necessary to provide a color filter.

  Next, an example in which the liquid crystal device is applied to a mobile personal computer will be described. FIG. 14 is a perspective view showing the configuration of this personal computer. In FIG. 14, the computer 1200 includes a main body 1204 provided with a keyboard 1202 and a liquid crystal display unit 1206. The liquid crystal display unit 1206 is configured by adding a backlight to the back surface of the liquid crystal device 1005 described above.

  Further, an example in which the liquid crystal device is applied to a mobile phone will be described. FIG. 15 is a perspective view showing the configuration of this mobile phone. In FIG. 15, a cellular phone 1300 includes a reflective liquid crystal device 1005 together with a plurality of operation buttons 1302. In the reflective liquid crystal device 1005, a front light is provided on the front surface thereof as necessary.

  In addition to the electronic devices described with reference to FIGS. 13 to 15, a liquid crystal television, a viewfinder type, a monitor direct view type video tape recorder, a car navigation device, a pager, an electronic notebook, a calculator, a word processor, a work Stations, videophones, POS terminals, devices equipped with touch panels, and the like. Needless to say, the present invention can be applied to these various electronic devices.

  In addition to the liquid crystal device described in the above embodiment, the present invention also includes a reflective liquid crystal device (LCOS) in which elements are formed on a silicon substrate, a plasma display (PDP), a field emission display (FED, SED), The present invention can also be applied to an organic EL display, DMD (Digital Micro mirror Device) and the like.

  The present invention is not limited to the above-described embodiment, and can be appropriately changed without departing from the gist or concept of the invention that can be read from the claims and the entire specification. An optical device substrate and a manufacturing method thereof, and an electro-optical device and an electronic apparatus are also included in the technical scope of the present invention.

It is a top view which shows the whole structure of the liquid crystal device which concerns on 1st Embodiment. It is sectional drawing of HH 'of FIG. It is a block diagram which shows the arrangement | sequence of the TFT array board | substrate and test | inspection circuit in the arbitrary areas on a mother board | substrate. It is a circuit diagram which shows the electric structure of the test | inspection circuit corresponding to the group of arbitrary TFT array substrates, and this. It is a circuit diagram which shows the electrical constitution of a pixel part. It is a circuit diagram which shows the electric constitution of a pull-down circuit. It is a conceptual diagram which shows the state of the pixel part to which the signal was supplied previously at the time of an inspection. It is a circuit diagram which shows the electrical structure of a pull-up circuit. It is a circuit diagram which shows the electric constitution of a differential amplifier circuit. It is a circuit diagram with the same meaning as FIG. 4 which concerns on a 1st modification. It is a block diagram with the same meaning as FIG. 3 which concerns on a 2nd modification. It is a flowchart which shows the flow of the manufacturing method of the TFT array substrate which concerns on 1st Embodiment. It is a top view which shows the structure of the projector which is an example of the electronic device to which the electro-optical apparatus is applied. 1 is a perspective view showing a configuration of a personal computer as an example of an electronic apparatus to which an electro-optical device is applied. It is a perspective view which shows the structure of the mobile telephone which is an example of the electronic device to which the electro-optical apparatus is applied.

Explanation of symbols

9a ... pixel electrode, 4 ... inspection circuit, 6 ... switching element, 10 ... TFT array substrate, 10a ... image display area, 15 ... differential amplifier circuit, 20 ... counter substrate, 25 ... precharge circuit, 50 ... liquid crystal layer, 70 ... Pixel unit, 73 ... Storage capacitor, 101 ... X-driver circuit, 104 ... Y-driver circuit, 110 ... Sampling circuit,
Soi, Sei ... signal lines

Claims (13)

A plurality of scanning lines and a plurality of signal lines arranged on the substrate so as to intersect with each other in the pixel array region, and provided corresponding to the intersection of the plurality of signal lines and the plurality of scanning lines. A plurality of pixel units, and a plurality of electro-optical device substrates arranged in a plane with a gap between each other;
The pixel unit is provided on the substrate in the gap so as to be at least partially separable from the plurality of electro-optic device substrates, and is connected to the plurality of signal lines and through the plurality of signal lines. A mother board comprising: a plurality of inspection circuits that are used when judging the quality of each. A plurality of scanning lines and a plurality of signal lines arranged on the substrate so as to intersect with each other in the pixel array region, and provided corresponding to the intersection of the plurality of signal lines and the plurality of scanning lines. A plurality of electro-optical device substrates each having a plurality of pixel portions;
Among the plurality of electro-optic device substrates, the plurality of electro-optic device substrates are provided corresponding to a set of electro-optic device substrates, and the plurality of signals related to the same set are provided. And a plurality of inspection circuits that are respectively electrically connected in common to the lines and used to determine the quality of the pixel portion via the plurality of signal lines. The plurality of electro-optical device substrates are arranged in a plane on the substrate with a gap therebetween,
The mother substrate according to claim 2, wherein the plurality of inspection circuits are provided on the substrate in the gap so as to be at least partially separable from the plurality of electro-optical device substrates. .   The plurality of inspection circuits are supplied to the pixel unit, which is electrically connected to each of a plurality of signal lines each including two signal lines of the plurality of signal lines. 4. The mother board according to claim 2, wherein the mother board is a differential amplifier circuit for amplifying the inspection signal.   Of the two electro-optical device substrates, one electro-optical device substrate is arranged symmetrically with respect to the corresponding inspection circuit when viewed in plan on the substrate. The mother board according to claim 2, wherein the mother board is formed. Each of the plurality of electro-optical device substrates includes a signal line driving circuit for driving the plurality of signal lines.
The signal line drive circuit provided on the one electro-optical device substrate is provided on the other electro-optical device substrate with respect to the corresponding inspection circuit when viewed in plan on the substrate. 6. The mother board according to claim 5, wherein the mother board is disposed symmetrically with the signal line driving circuit. When viewed in plan on the substrate, it is arranged between each of the plurality of electro-optical device substrates and the corresponding inspection circuit, and is electrically connected in the middle of the plurality of signal lines. A switching element;
The mother board according to any one of claims 2 to 6, further comprising switching means for switching between an on state and an off state of the switching element. The plurality of electro-optical device substrates are arranged in a plane on the substrate with a gap therebetween,
The mother according to claim 7, wherein the switching element and the switching unit are provided on the substrate in the gap so as to be at least partially separable from the plurality of electro-optical device substrates. substrate. On the board
A plurality of scanning lines and a plurality of signal lines arranged to cross each other in the pixel array region;
A plurality of pixel portions provided corresponding to intersections of the plurality of signal lines and the plurality of scanning lines;
The plurality of signal lines are electrically connected to the plurality of signal lines in order to control the electrical connection between the plurality of signal lines and the inspection circuit provided outside the substrate. A switching element connected to
A substrate for an electro-optical device, comprising: switching means for switching between an on state and an off state of the switching element.   An electro-optical device comprising the electro-optical device substrate according to claim 9.   An electronic apparatus comprising the electro-optical device according to claim 10. A plurality of scanning lines and a plurality of signal lines arranged on the substrate so as to intersect with each other in the pixel array region, and provided corresponding to the intersection of the plurality of signal lines and the plurality of scanning lines. An electro-optical device for manufacturing an electro-optical device by cutting out a plurality of electro-optical device substrates from a mother substrate including a plurality of electro-optical device substrates each having a plurality of pixel portions and arranged in a plane with a gap therebetween A device manufacturing method comprising:
The plurality of inspection circuits are provided on the substrate in the gap, respectively, and are connected to the plurality of signal lines and used to determine the quality of the pixel portion through the plurality of signal lines. An inspection process for inspecting an electro-optical device substrate;
A dividing step of at least partially dividing the plurality of inspection circuits together with the substrate in the gap from the electro-optical device substrate.   The inspection step includes a differential amplifier circuit that is electrically connected to each of a plurality of signal lines each including a pair of two signal lines among the plurality of signal lines. The method for manufacturing a substrate for an electro-optical device according to claim 12, further comprising a step of inspecting the substrate for an electro-optical device by a circuit.

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