JP2006344646A - 多層基板及び半導体パッケージ - Google Patents

多層基板及び半導体パッケージ Download PDF

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Publication number
JP2006344646A
JP2006344646A JP2005166808A JP2005166808A JP2006344646A JP 2006344646 A JP2006344646 A JP 2006344646A JP 2005166808 A JP2005166808 A JP 2005166808A JP 2005166808 A JP2005166808 A JP 2005166808A JP 2006344646 A JP2006344646 A JP 2006344646A
Authority
JP
Japan
Prior art keywords
porous fluororesin
base material
circuit board
adhesive
porous
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005166808A
Other languages
English (en)
Japanese (ja)
Inventor
Yuichi Idomoto
祐一 井戸本
Yasuhiro Okuda
泰弘 奥田
Yasuhito Masuda
泰人 増田
Fumihiro Hayashi
文弘 林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP2005166808A priority Critical patent/JP2006344646A/ja
Priority to PCT/JP2006/309888 priority patent/WO2006132063A1/fr
Priority to TW095119508A priority patent/TW200644193A/zh
Publication of JP2006344646A publication Critical patent/JP2006344646A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49833—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the chip support structure consisting of a plurality of insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Combinations Of Printed Boards (AREA)
JP2005166808A 2005-06-07 2005-06-07 多層基板及び半導体パッケージ Pending JP2006344646A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2005166808A JP2006344646A (ja) 2005-06-07 2005-06-07 多層基板及び半導体パッケージ
PCT/JP2006/309888 WO2006132063A1 (fr) 2005-06-07 2006-05-11 Substrat multicouche et ensemble semi-conducteur
TW095119508A TW200644193A (en) 2005-06-07 2006-06-02 Multilayers board and semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005166808A JP2006344646A (ja) 2005-06-07 2005-06-07 多層基板及び半導体パッケージ

Publications (1)

Publication Number Publication Date
JP2006344646A true JP2006344646A (ja) 2006-12-21

Family

ID=37498268

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005166808A Pending JP2006344646A (ja) 2005-06-07 2005-06-07 多層基板及び半導体パッケージ

Country Status (3)

Country Link
JP (1) JP2006344646A (fr)
TW (1) TW200644193A (fr)
WO (1) WO2006132063A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013508970A (ja) * 2009-11-03 2013-03-07 インテル コーポレイション マイクロエレクトロニクス・パッケージ及びその製造方法
US9736924B2 (en) 2013-02-26 2017-08-15 Tatsuta Electric Wire & Cable Co., Ltd. Reinforcing member for flexible printed wiring board, flexible printed wiring board, and shield printed wiring board

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018212277A1 (fr) * 2017-05-18 2018-11-22 信越ポリマー株式会社 Connecteur électrique et son procédé de production

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05175650A (ja) * 1991-12-25 1993-07-13 Tokuyama Soda Co Ltd 回路基板の製造方法
JP2000082553A (ja) * 1998-09-08 2000-03-21 Tokyo Cosmos Electric Co Ltd Ｉｃ用ソケット
JP2005039241A (ja) * 2003-06-24 2005-02-10 Ngk Spark Plug Co Ltd 半導体素子付き中継基板、中継基板付き基板、半導体素子と中継基板と基板とからなる構造体
JP2005046993A (ja) * 2003-06-06 2005-02-24 Sumitomo Electric Ind Ltd 穿孔された多孔質樹脂基材及び穿孔内壁面を導電化した多孔質樹脂基材の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05175650A (ja) * 1991-12-25 1993-07-13 Tokuyama Soda Co Ltd 回路基板の製造方法
JP2000082553A (ja) * 1998-09-08 2000-03-21 Tokyo Cosmos Electric Co Ltd Ｉｃ用ソケット
JP2005046993A (ja) * 2003-06-06 2005-02-24 Sumitomo Electric Ind Ltd 穿孔された多孔質樹脂基材及び穿孔内壁面を導電化した多孔質樹脂基材の製造方法
JP2005039241A (ja) * 2003-06-24 2005-02-10 Ngk Spark Plug Co Ltd 半導体素子付き中継基板、中継基板付き基板、半導体素子と中継基板と基板とからなる構造体

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013508970A (ja) * 2009-11-03 2013-03-07 インテル コーポレイション マイクロエレクトロニクス・パッケージ及びその製造方法
US9736924B2 (en) 2013-02-26 2017-08-15 Tatsuta Electric Wire & Cable Co., Ltd. Reinforcing member for flexible printed wiring board, flexible printed wiring board, and shield printed wiring board
US9867280B2 (en) 2013-02-26 2018-01-09 Tatsuta Electric Wire And Cable Co., Ltd. Reinforcing member for flexible printed wiring board flexible printed wiring board, and shield printed wiring board

Also Published As

Publication number Publication date
WO2006132063A1 (fr) 2006-12-14
TW200644193A (en) 2006-12-16

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