JP2006332506A - Package for housing electronic component, electronic device and its packaging structure - Google Patents

Package for housing electronic component, electronic device and its packaging structure Download PDF

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Publication number
JP2006332506A
JP2006332506A JP2005157074A JP2005157074A JP2006332506A JP 2006332506 A JP2006332506 A JP 2006332506A JP 2005157074 A JP2005157074 A JP 2005157074A JP 2005157074 A JP2005157074 A JP 2005157074A JP 2006332506 A JP2006332506 A JP 2006332506A
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electronic component
terminal electrode
electronic device
bonding material
bonding
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JP2005157074A
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Japanese (ja)
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Takeshi Hasegawa
剛 長谷川
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Kyocera Corp
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Kyocera Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

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  • Light Receiving Elements (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a package for mounting an electronic component which is excellent in reliability of joining to an external circuit board, an electronic device provided with the package for housing an electronic component, and a packaging structure of the electronic component. <P>SOLUTION: The package for housing an electronic component 3 which has a mounting section on which the electronic component 3 is mounted; is provided with an insulation substrate 1 provided with a terminal electrode 2a to be electrically connected to the electronic component 3, on the bottom surface; and a lid 5 attached on the insulation substrate 1 so as to cover the electronic component 3. In this package, the bottom region of the insulation substrate 1 is allowed to extend to the outside, and one end of the terminal electrode 2a is led out from the bottom surface to upper part along the surface of an extending section 1b. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、ラインセンサ、フォトダイオード、イメージセンサ等の光半導体素子を含む半導体素子やその他の電子部品を収納するのに使用される電子部品収納用パッケージ、該電子部品収納用パッケージに上記電子部品を搭載してなる電子装置、及び該電子装置を外部電気回路基板に接合材を介して実装してなる電子装置の実装構造体に関するものである。   The present invention relates to an electronic component storage package used for storing a semiconductor element including an optical semiconductor element such as a line sensor, a photodiode, and an image sensor, and other electronic components, and the electronic component storage package includes the electronic component. And an electronic device mounting structure in which the electronic device is mounted on an external electric circuit board via a bonding material.

ラインセンサ，フォトダイオード，イメージセンサ等の光半導体素子を含む半導体素子やその他の電子部品を搭載するための電子部品収納用パッケージは、電子部品の搭載部を有する絶縁基体と、搭載部から絶縁基体の下面に導出された配線導体と、配線導体の導出部分と接続するようにして絶縁基体の下面に形成された端子電極とを備えている。   An electronic component storage package for mounting a semiconductor element including an optical semiconductor element such as a line sensor, a photodiode, and an image sensor and other electronic components includes an insulating base having an electronic component mounting portion, and an insulating base from the mounting portion. And a terminal electrode formed on the lower surface of the insulating base so as to be connected to the lead portion of the wiring conductor.

かかる電子部品収納用パッケージを用いて電子装置を構成する場合は、前記絶縁基体の搭載部に電子部品が搭載され、必要に応じて蓋体が、樹脂層を介して絶縁基体の上面に接合され、これによって電子部品が気密封止される。また、電子部品の電極は配線導体に対し電気的に接続され、この配線導体を介して端子電極と電気的に接続される。   When an electronic device is configured using such an electronic component storage package, an electronic component is mounted on the mounting portion of the insulating base, and a lid is bonded to the upper surface of the insulating base via a resin layer as necessary. As a result, the electronic component is hermetically sealed. Moreover, the electrode of the electronic component is electrically connected to the wiring conductor, and is electrically connected to the terminal electrode through the wiring conductor.

このような電子装置は、端子電極を外部電気回路基板の回路導体の所定位置にはんだ等の導電性接合材を介して電気的・機械的に接続することによって外部電気回路基板上に実装され、光学センサ装置やカメラ付き携帯電話機等といった電子機器の部品として使用される。   Such an electronic device is mounted on the external electric circuit board by electrically and mechanically connecting the terminal electrode to a predetermined position of the circuit conductor of the external electric circuit board via a conductive bonding material such as solder, It is used as a part of electronic devices such as optical sensor devices and camera-equipped mobile phones.

なお、上述した従来の電子装置の実装構造体において、接合材は、端子電極と回路導体との間に介在され、その外方がいわゆるフィレット状に広がった形となる。
特開２００４−２２８９１号公報 In the mounting structure of the conventional electronic device described above, the bonding material is interposed between the terminal electrode and the circuit conductor, and the outside of the bonding material expands in a so-called fillet shape.
JP 2004-22891 A

しかしながら、上述した従来の電子装置においては、電子部品収納用パッケージの絶縁基体と外部回路基板との間に生じる熱応力等に起因して、回路導体と接合材と端子電極との間、或いは、接合材と外部回路基板との間で剥がれ等が発生し易く、信頼性を高く保つことが困難であった。   However, in the above-described conventional electronic device, due to thermal stress or the like generated between the insulating base of the electronic component storage package and the external circuit board, between the circuit conductor, the bonding material, and the terminal electrode, or Peeling easily occurs between the bonding material and the external circuit board, and it is difficult to maintain high reliability.

このような問題は、近年、特に顕著になっており、これは、電子装置として使用される環境が多岐に渡るようになり、温度変化の著しい環境、高温高湿環境等の厳しい環境下で使用されるケースが増えてきているためである。このような環境では、接合材の接合部に作用する熱応力が増大するため、信頼性を確保することがますます難しくなる。   In recent years, such problems have become particularly prominent, and this has led to a wide variety of environments used as electronic devices, which can be used in severe environments such as environments with significant temperature changes and high-temperature and high-humidity environments. This is because there are an increasing number of cases. In such an environment, it becomes more difficult to ensure reliability because the thermal stress acting on the joint of the joining material increases.

また、特にラインセンサ，フォトダイオード，イメージセンサ等の光半導体素子を電子部品として搭載する場合、画像の精細化および光検知の高精度化の要求に応じて光半導体素子の受光部（画素領域）の密度や受光部の外周部に形成された配線パターン等が大変精細に形成されており、それ故、例えば接合材と端子電極との間の接合面の剥がれがわずかなものであったとしても、変換された電気信号の外部電気回路基板に対する伝送の精度の低下等を生じ、電子装置および電子装置の実装構造体を含む電子機器の電気特性に大きな劣化を生じてしまう。   In particular, when an optical semiconductor element such as a line sensor, a photodiode, or an image sensor is mounted as an electronic component, a light receiving portion (pixel region) of the optical semiconductor element is required in response to a demand for finer images and higher accuracy of light detection. The wiring pattern and the like formed on the outer periphery of the light receiving portion are very finely formed. Therefore, for example, even if the peeling of the bonding surface between the bonding material and the terminal electrode is slight As a result, the accuracy of transmission of the converted electric signal to the external electric circuit board is lowered, and the electric characteristics of the electronic device including the electronic device and the mounting structure of the electronic device are greatly deteriorated.

本発明は、上記問題点に鑑み案出されたもので、その目的は、外部電気回路基板に対する接合の信頼性に優れた電子部品収納用パッケージ、電子装置及びその実装構造体を提供することにある。   The present invention has been devised in view of the above problems, and an object of the present invention is to provide an electronic component storage package, an electronic device, and a mounting structure thereof excellent in the reliability of bonding to an external electric circuit board. is there.

本発明の電子部品収納用パッケージは、電子部品が搭載される搭載部を有し、下面に前記電子部品と電気的に接続される端子電極が設けられている絶縁基体と、前記電子部品を覆うようにして前記絶縁基体に取着される蓋体と、を具備してなる電子部品収納用パッケージであって、前記絶縁基体の下部領域を外方へ延出せしめ、前記端子電極の一端を前記延出部の表面に沿って下面より上方へ導出させたことを特徴とするものである。   An electronic component storage package according to the present invention has a mounting portion on which an electronic component is mounted, covers an insulating base having a lower surface provided with a terminal electrode that is electrically connected to the electronic component, and covers the electronic component. In this way, the electronic component storage package comprises a lid attached to the insulating base, the lower region of the insulating base is extended outward, and one end of the terminal electrode is connected to the end of the terminal electrode. It is characterized in that it is led out from the lower surface along the surface of the extending portion.

また、本発明の電子部品収納用パッケージは、前記延出部の先端部が前記絶縁基体の上面外周よりも外方に位置していることを特徴とするものである。   The electronic component storage package according to the present invention is characterized in that a distal end portion of the extending portion is positioned outward from an outer periphery of an upper surface of the insulating base.

また、本発明の電子部品収納用パッケージは、前記端子電極の一端が前記延出部の端部を経由して前記延出部の上面まで導出されていることを特徴とするものである。   In the electronic component storage package according to the present invention, one end of the terminal electrode is led out to the upper surface of the extension through the end of the extension.

さらに、本発明の電子装置は、前記電子部品収納用パッケージの前記搭載部に電子部品を搭載して前記蓋体で覆ったことを特徴とするものである。   Furthermore, the electronic device of the present invention is characterized in that an electronic component is mounted on the mounting portion of the electronic component storage package and covered with the lid.

そして、本発明の電子装置の実装構造体は、前記電子装置の前記延出部を外部電気回路基板に対し接合材を介して接合するようにした電子装置の実装構造体において、前記延出部のうち少なくとも前記端子電極が形成されている領域を前記接合材によって覆い包んだことを特徴とするものである。   The electronic device mounting structure according to the present invention is the electronic device mounting structure in which the extending portion of the electronic device is bonded to an external electric circuit board via a bonding material. The region where at least the terminal electrode is formed is covered with the bonding material.

本発明によれば、絶縁基体の下部領域を外方へ延出せしめるとともに、端子電極の一端を延出部の表面に沿って下面より上方へ導出させるようにしたことから、接合材は、端子電極の導出部分に沿って、延出部の下面から側面等の上方へ回りこむようにして端子電極に接合される。これにより、接合材と端子電極との接合面は、熱応力等の応力が作用する方向に対して平行な面と直交する面等、異なる方向に沿った複数の面が組み合わされて形成されるようになり、応力による接合材の剥がれが有効に防止される。   According to the present invention, the lower region of the insulating base is extended outward, and one end of the terminal electrode is led out from the lower surface along the surface of the extended portion. Along the lead-out portion of the electrode, the terminal portion is joined to the terminal electrode so as to extend upward from the lower surface of the extending portion to the side surface or the like. Thereby, the bonding surface between the bonding material and the terminal electrode is formed by combining a plurality of surfaces along different directions such as a surface orthogonal to a surface parallel to a direction in which a stress such as thermal stress acts. Thus, peeling of the bonding material due to stress is effectively prevented.

また、端子電極の一端を延出部の表面に沿って導出した分、端子電極と接合材との接合面積を広く確保することができ、これによって電子装置を外部電気回路基板上に実装した際の接合信頼性が向上される。   In addition, since one end of the terminal electrode is led out along the surface of the extending portion, a large bonding area between the terminal electrode and the bonding material can be secured, and thus when the electronic device is mounted on the external electric circuit board The bonding reliability is improved.

さらに、本発明によれば、延出部の先端部を絶縁基体の上面外周よりも外方に位置させておくことにより、接合材による外部電気回路基板との接合において、接合状態を上方より確認することができ、接合材の量、厚み、外観形状の確認・外観検査を容易に行なうことができる。   Further, according to the present invention, the bonding state is confirmed from above in the bonding with the external electric circuit board by the bonding material by positioning the distal end portion of the extending portion outside the outer periphery of the upper surface of the insulating base. It is possible to easily confirm and inspect the amount, thickness, and appearance of the bonding material.

またさらに、本発明によれば、端子電極の一端を前記延出部の端部を経由して延出部の上面まで導出しておくことにより、接合材は、延出部の上面にまで回りこんで接合され、延出部を覆い包む形になる。この場合、接合材と端子電極との接合面積がより広く確保されるとともに、接合面と端子電極との接合面がさらに多くの面で構成されるようになり、外部電気回路基板に対する接合信頼性がさらに向上される。   Furthermore, according to the present invention, the bonding material is routed to the upper surface of the extension portion by leading one end of the terminal electrode to the upper surface of the extension portion via the end portion of the extension portion. They are joined together to cover the extension. In this case, the bonding area between the bonding material and the terminal electrode is ensured more widely, and the bonding surface between the bonding surface and the terminal electrode is configured with more surfaces, and the bonding reliability with respect to the external electric circuit board is increased. Is further improved.

以下、本発明を添付図面に基づいて詳細に説明する。図１は本発明の電子部品収納用パッケージおよびそれを使用した電子装置の実施の形態の一例を示す断面図、図２は本発明の電子装置における実装構造体の実施の形態の一例を示す断面図である。図１および図２において、同じ部位には同じ符号を付している。   Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a cross-sectional view showing an example of an embodiment of an electronic component storage package of the present invention and an electronic device using the same, and FIG. 2 is a cross section showing an example of an embodiment of a mounting structure in the electronic device of the present invention. FIG. 1 and 2, the same parts are denoted by the same reference numerals.

これらの図に示す電子部品収納用パッケージは、主に、電子部品３の搭載部を有する絶縁基体１と、絶縁基体１の下面に形成され電子部品３と電気的に接続される端子電極２ａと、蓋体５とで構成されている。そして、電子部品収納用パッケージの搭載部には電子部品３が搭載され、電子部品を蓋体５で覆うことにより電子装置９が形成されている。   The electronic component storage package shown in these drawings mainly includes an insulating substrate 1 having a mounting portion for the electronic component 3, and a terminal electrode 2a formed on the lower surface of the insulating substrate 1 and electrically connected to the electronic component 3. And the lid 5. The electronic component 3 is mounted on the mounting portion of the electronic component storage package, and the electronic device 9 is formed by covering the electronic component with the lid 5.

絶縁基体１は、例えば、平面視で正方形状や長方形状をなしており、その上面には凹部１ａが設けられるとともに、凹部１ａの底面が電子部品３を搭載するための搭載部となり、この搭載部には接着剤６を介して電子部品３が接合される。なお、接着剤６は、熱硬化型や紫外線硬化型等の有機樹脂、ガラス、ろう材等から成る。   The insulating substrate 1 has, for example, a square shape or a rectangular shape in plan view, and a concave portion 1a is provided on the upper surface thereof, and the bottom surface of the concave portion 1a serves as a mounting portion for mounting the electronic component 3, and this mounting is performed. The electronic component 3 is joined to the part via an adhesive 6. The adhesive 6 is made of a thermosetting type or ultraviolet curable type organic resin, glass, brazing material, or the like.

このような絶縁基体１は、例えば、アルミナ質焼結体（アルミナセラミックス），窒化アルミニウムセラミックス，炭化珪素セラミックス，窒化珪素セラミックス，ガラスセラミックス等のセラミックスや、エポキシ樹脂、ポリイミド樹脂、ポリエステル樹脂等の樹脂等から成る。   Such an insulating substrate 1 includes, for example, ceramics such as alumina sintered body (alumina ceramics), aluminum nitride ceramics, silicon carbide ceramics, silicon nitride ceramics, and glass ceramics, and resins such as epoxy resins, polyimide resins, and polyester resins. Etc.

なお、絶縁基体１は、アルミナ質焼結体から成る場合、まず、アルミナ，シリカ等の原料粉末を有機溶剤および上面樹脂バインダーとともにシート状に成形して、複数のセラミックグリーンシートを製作し、その後、一部のセラミックグリーンシートに打ち抜き加工を施して枠状のセラミックグリーンシートを得、次に枠状のセラミックグリーンシートが上層に位置するようにセラミックグリーンシートを積層し、これを原料粉末の組成に応じて例えば１３００℃〜１６００℃の温度で焼成することによって絶縁基体１が製造される。なお、ここで、板状のアルミナ質焼結体から成る絶縁基体１の上面、その外周部に沿って枠状のアルミナ質焼結体を接合してもよいことは言うまでもない。また、絶縁基体１は、平板状で、上面等に搭載部を有するようなものでもよい。   When the insulating substrate 1 is made of an alumina sintered body, first, raw powders such as alumina and silica are formed into a sheet shape together with an organic solvent and an upper surface resin binder to produce a plurality of ceramic green sheets. The ceramic green sheet is punched to obtain a frame-shaped ceramic green sheet, and then the ceramic green sheet is laminated so that the frame-shaped ceramic green sheet is located in the upper layer. Insulating substrate 1 is manufactured by firing at a temperature of 1300 ° C. to 1600 ° C., for example. Here, it goes without saying that the frame-like alumina sintered body may be joined along the upper surface of the insulating substrate 1 made of a plate-like alumina sintered body and the outer periphery thereof. The insulating substrate 1 may be a flat plate having a mounting portion on the upper surface or the like.

また、絶縁基体１の下面には端子電極２ａが設けられている。   A terminal electrode 2 a is provided on the lower surface of the insulating substrate 1.

端子電極２ａは搭載部に搭載される電子部品３と電気的に接続され、この電子部品３を外部電気回路基板１０の回路導体１１に電気的に接続するための外部端子として機能する。   The terminal electrode 2 a is electrically connected to the electronic component 3 mounted on the mounting portion, and functions as an external terminal for electrically connecting the electronic component 3 to the circuit conductor 11 of the external electric circuit board 10.

端子電極２ａは、タングステン，モリブデン，マンガン，銅，銀，パラジウム，白金，金等の金属材料から成り、メタライズ層，めっき層，蒸着層，金属箔層等の形態で形成される。端子電極２ａは、例えばタングステンのメタライズ層からなる場合であれば、タングステンの粉末を有機溶剤，樹脂バインダーとともに混練した金属ペーストを、絶縁基体１となるセラミックグリーンシートにスクリーン印刷法等により印刷することにより形成される。また、端子電極２ａの露出表面に金めっきや錫めっき等のめっき層を被着させておいてもよい。   The terminal electrode 2a is made of a metal material such as tungsten, molybdenum, manganese, copper, silver, palladium, platinum, or gold, and is formed in the form of a metallized layer, a plating layer, a vapor deposition layer, a metal foil layer, or the like. If the terminal electrode 2a is made of, for example, a tungsten metallized layer, a metal paste obtained by kneading tungsten powder together with an organic solvent and a resin binder is printed on a ceramic green sheet serving as the insulating substrate 1 by a screen printing method or the like. It is formed by. Further, a plating layer such as gold plating or tin plating may be deposited on the exposed surface of the terminal electrode 2a.

電子部品３と端子電極２ａとの電気的な接続は、例えば、配線導体２を介して行なわれる。   The electrical connection between the electronic component 3 and the terminal electrode 2a is performed through the wiring conductor 2, for example.

本実施形態において、配線導体２は、搭載部の周辺に形成された段状部の上面から絶縁基体１の下面の端子電極２ａにかけて形成されている。配線導体２のうち搭載部の周辺に露出している部位に、凹部１ａ内に収容される電子部品３の電極４がボンディングワイヤ８を介して電気的に接続される。なお、電子部品３と配線導体２との電気的な接続は、ボンディングワイヤ８に限らず、金属バンプや導電性接着剤等を介して行なわれてもよい。   In the present embodiment, the wiring conductor 2 is formed from the upper surface of the stepped portion formed around the mounting portion to the terminal electrode 2 a on the lower surface of the insulating base 1. The electrode 4 of the electronic component 3 accommodated in the recess 1 a is electrically connected to the portion of the wiring conductor 2 exposed around the mounting portion via the bonding wire 8. The electrical connection between the electronic component 3 and the wiring conductor 2 is not limited to the bonding wire 8 and may be performed via a metal bump, a conductive adhesive, or the like.

配線導体２は、端子電極２ａと同様の材料、方法により形成することができる。すなわち、タングステン，モリブデン，マンガン，銅，銀，パラジウム，白金，金等の金属材料から成り、メタライズ層，めっき層，蒸着層，金属箔層等の形態で絶縁基体１の所定部位に形成される。配線導体２は、例えばタングステンのメタライズ層からなる場合であれば、タングステンの粉末を有機溶剤，樹脂バインダーとともに混練した金属ペーストを、絶縁基体１となるセラミックグリーンシートにスクリーン印刷法等により印刷することにより形成される。また、配線導体２の露出表面に金めっきや錫めっき等のめっき層を被着させておいてもよい。   The wiring conductor 2 can be formed by the same material and method as the terminal electrode 2a. That is, it is made of a metal material such as tungsten, molybdenum, manganese, copper, silver, palladium, platinum, or gold, and is formed on a predetermined portion of the insulating substrate 1 in the form of a metallized layer, a plating layer, a vapor deposition layer, a metal foil layer, or the like. . If the wiring conductor 2 is made of, for example, a tungsten metallized layer, a metal paste obtained by kneading tungsten powder together with an organic solvent and a resin binder is printed on a ceramic green sheet serving as the insulating substrate 1 by screen printing or the like. It is formed by. Further, a plating layer such as gold plating or tin plating may be deposited on the exposed surface of the wiring conductor 2.

なお、ボンディングワイヤ８は、その長さを０．３ｍｍ〜５．０ｍｍとすることが好ましい。ボンディングワイヤ８の長さが０．３ｍｍ未満では、ボンディングワイヤ８が短すぎて十分なループを形成することが困難となり、電子部品３の電極４と配線導体２とを確実に接続することが困難となり、また、ボンディングワイヤ８の長さが５．０ｍｍを超えると、ボンディングワイヤ８が長くなりすぎループが不要に高くなる傾向があり、不要なインダクタンスが発生して高周波信号の伝送特性が劣化するおそれがあるからである。   The bonding wire 8 preferably has a length of 0.3 mm to 5.0 mm. If the length of the bonding wire 8 is less than 0.3 mm, it is difficult to form a sufficient loop because the bonding wire 8 is too short, and it is difficult to reliably connect the electrode 4 of the electronic component 3 and the wiring conductor 2. If the length of the bonding wire 8 exceeds 5.0 mm, the bonding wire 8 becomes too long and the loop tends to become unnecessarily high, and unnecessary inductance is generated to deteriorate the transmission characteristics of the high frequency signal. Because there is a fear.

また、絶縁基体１上に搭載される電子部品３は、例えば、平面視して正方形や長方形状の外観を有し、かかる電子部品３としては、例えば、ラインセンサ，ＰＤ（Photodiode Device），イメージセンサ，ＣＣＤ（Charge Coupled Device）等の受光素子や、ＥＰＲＯＭ（Erasable and Programmable ROM）等の受光部を有する光半導体素子、半導体集積回路素子、およびコンデンサ部品、抵抗部品、水晶振動子、フィルター等の受動部品等が用いられる。   The electronic component 3 mounted on the insulating base 1 has, for example, a square or rectangular appearance in plan view. Examples of the electronic component 3 include a line sensor, a PD (Photodiode Device), and an image. Sensors, light receiving elements such as CCD (Charge Coupled Device), optical semiconductor elements having a light receiving portion such as EPROM (Erasable and Programmable ROM), semiconductor integrated circuit elements, capacitor parts, resistor parts, crystal resonators, filters, etc. Passive components are used.

このような電子部品３として光半導体素子を採用する場合、その上面には受光部が設けられ、その周囲には、先に述べたボンディングワイヤ８が接続される電源用や信号用等の電極４が設けられている。   When an optical semiconductor element is employed as such an electronic component 3, a light receiving portion is provided on the upper surface thereof, and an electrode 4 for a power source or a signal, to which the bonding wire 8 described above is connected, is provided around the light receiving portion. Is provided.

一方、蓋体５には、全体若しくは一部が透光性部材から成る透光性のものや、金属材料，セラミック材料から成るものが用いられる。図１に示した電子装置９において、電子部品３が光半導体素子の場合であれば、蓋体５は、ガラス，石英，サファイア，透明樹脂等の透光性材料を板状に成形したものである。また、図示しないが、絶縁基体１が平板状である場合には、凹形状の蓋体を用いてもよい。この場合には、蓋体５の一部が透光性部材から成り、上面若しくは下面の少なくとも一方に紫外線を遮断するための光学膜を形成してもよい。   On the other hand, the lid 5 is made of a translucent material that is entirely or partly composed of a translucent member, a metal material, or a ceramic material. In the electronic device 9 shown in FIG. 1, if the electronic component 3 is an optical semiconductor element, the lid 5 is formed by forming a light-transmitting material such as glass, quartz, sapphire, or transparent resin into a plate shape. is there. Although not shown, when the insulating substrate 1 has a flat plate shape, a concave lid may be used. In this case, a part of the lid 5 may be made of a translucent member, and an optical film for blocking ultraviolet rays may be formed on at least one of the upper surface and the lower surface.

蓋体５は、例えば、樹脂層７を介して接合することにより、絶縁基体１の上面に取着され、これによって電子部品３の搭載部が気密封止される。樹脂層７の材質としては、例えば、アクリル系樹脂，エポキシ系樹脂，フェノール系樹脂，クレゾール系樹脂等の樹脂接着剤が用いられる。   The lid 5 is attached to the upper surface of the insulating base 1 by bonding through, for example, the resin layer 7, thereby hermetically sealing the mounting portion of the electronic component 3. As a material of the resin layer 7, for example, a resin adhesive such as an acrylic resin, an epoxy resin, a phenol resin, or a cresol resin is used.

樹脂層７は、例えば、電子部品３がイメージセンサ、ラインセンサ等の光半導体素子の場合、余計な外光を遮断するために、黒色，茶褐色，暗褐色，暗緑色，濃青色等の暗色系の顔料や染料が混入される。また、樹脂層７は、ガラスやセラミック等の無機材料から成るフィラー粉末を添加しておいてもよい。   For example, when the electronic component 3 is an optical semiconductor element such as an image sensor or a line sensor, the resin layer 7 is a dark color system such as black, brown, dark brown, dark green, or dark blue in order to block extraneous light. Of pigments and dyes. The resin layer 7 may be added with filler powder made of an inorganic material such as glass or ceramic.

また、電子部品３が光半導体素子で、樹脂層７が透明な樹脂接着剤から成る場合、樹脂層７の屈折率が透明な蓋体５の屈折率と等しくなるようにしておくことが好ましい。この場合、樹脂層７と蓋体５との界面における光の反射や散乱等を抑制することができ、電子部品３に余計な反射光や散乱光が入射することを抑制することが可能となる。また、樹脂層７が透明な樹脂接着剤から成る場合、その内部に含まれる気泡の体積が３０体積％以下であることが好ましい。気泡の体積が３０体積％を超えると、樹脂層７の接合力が低下するとともに、気泡によって電子部品３に余計な反射光や散乱光が入射する可能性がある。樹脂層７に含まれる気泡の割合を小さくするためには、減圧室や真空装置内で樹脂層７を取り扱う方法や、予め樹脂層７に含まれる気泡を真空脱泡する方法等がある。   When the electronic component 3 is an optical semiconductor element and the resin layer 7 is made of a transparent resin adhesive, it is preferable that the refractive index of the resin layer 7 is equal to the refractive index of the transparent lid 5. In this case, reflection or scattering of light at the interface between the resin layer 7 and the lid 5 can be suppressed, and it is possible to suppress the incident of extra reflected light or scattered light on the electronic component 3. . Moreover, when the resin layer 7 consists of a transparent resin adhesive, it is preferable that the volume of the bubble contained in the inside is 30 volume% or less. If the volume of the bubbles exceeds 30% by volume, the bonding force of the resin layer 7 is reduced, and extra reflected light or scattered light may be incident on the electronic component 3 due to the bubbles. In order to reduce the ratio of bubbles contained in the resin layer 7, there are a method of handling the resin layer 7 in a decompression chamber or a vacuum apparatus, a method of vacuum defoaming bubbles contained in the resin layer 7 in advance, and the like.

ここで、蓋体５の外周部に遮光性の樹脂膜を貼り付けておいてもよい。このような構成により、電子部品３（光半導体素子）に余計な外光が入射されることを抑えることができる。   Here, a light-shielding resin film may be attached to the outer peripheral portion of the lid 5. With such a configuration, it is possible to prevent extraneous external light from entering the electronic component 3 (optical semiconductor element).

そして、上述した絶縁基体１の搭載部に搭載される電子部品３は配線導体２を介して端子電極２ａと電気的に接続され、電子部品を蓋体５で覆うことにより電子装置９が形成される。このような電子装置９を外部電気回路基板１０上に実装する場合は、電子装置９をの端子電極２ａを外部電気回路基板１０の回路導体１１に接合材１２を介して接合することにより行われる。   The electronic component 3 mounted on the mounting portion of the insulating base 1 described above is electrically connected to the terminal electrode 2a through the wiring conductor 2, and the electronic device 9 is formed by covering the electronic component with the lid 5. The When such an electronic device 9 is mounted on the external electric circuit board 10, the terminal electrode 2 a of the electronic device 9 is bonded to the circuit conductor 11 of the external electric circuit board 10 via the bonding material 12. .

なお、上述の接合材１２としては、例えばＳｎ−Ｐｂ半田等の半田が用いられる。   In addition, as the above-described bonding material 12, for example, solder such as Sn—Pb solder is used.

例えば、接合材１２として半田を用いる場合、端子電極２ａと回路導体１１とを半田ペーストを介して位置合わせし、リフロー炉等の加熱手段で加熱することにより電子装置９（電子部品収納用パッケージ）と外部電気回路基板１０とが接合材１２を介して接合される。   For example, when solder is used as the bonding material 12, the terminal electrode 2 a and the circuit conductor 11 are aligned via a solder paste, and heated by heating means such as a reflow furnace, so that the electronic device 9 (electronic component storage package). And the external electric circuit board 10 are bonded via the bonding material 12.

またさらに、本発明の電子部品収納用パッケージおよび電子装置９においては、絶縁基体１の下部領域が外方へ延出されており、この延出部１ｂの表面に沿って、端子電極２ａが絶縁基体１の下面より上方へ導出されている。   Furthermore, in the electronic component storage package and the electronic device 9 according to the present invention, the lower region of the insulating substrate 1 extends outward, and the terminal electrode 2a is insulated along the surface of the extending portion 1b. It is led upward from the lower surface of the substrate 1.

かかる構成となすことにより、接合材１２は、端子電極２ａの導出されている部分に沿って、延出部１ｂの下面から側面等の上方に回りこむようにして端子電極２ａに接合される。そのため、接合材１２と端子電極２ａとの接合面は、熱応力等の応力が作用する方向に対して平行な面と直交する面等、異なる方向に沿った複数の面が組み合わされて形成されるようになり、応力による接合材１２の剥がれが有効に防止される。   With such a configuration, the bonding material 12 is bonded to the terminal electrode 2a so as to wrap around the side surface or the like from the lower surface of the extending portion 1b along the portion where the terminal electrode 2a is led out. Therefore, the bonding surface between the bonding material 12 and the terminal electrode 2a is formed by combining a plurality of surfaces along different directions such as a surface orthogonal to a surface parallel to a direction in which a stress such as thermal stress acts. Thus, peeling of the bonding material 12 due to stress is effectively prevented.

また、端子電極２ａが延出部１ｂの表面に沿って絶縁基体１の下面より上方へ導出されている分、端子電極２ａと接合材１２との接合面積は広く確保され、接合材１２と端子電極２ａとの接合面積、及び接合材１２の体積も十分に大きく確保される。したがって、電子装置を外部電気回路基板１０に対して良好かつ強固に接合することができ、電子装置の接合信頼性を向上させることが可能となる。   Further, since the terminal electrode 2a is led out from the lower surface of the insulating base 1 along the surface of the extending portion 1b, a large bonding area between the terminal electrode 2a and the bonding material 12 is secured, and the bonding material 12 and the terminal The bonding area with the electrode 2a and the volume of the bonding material 12 are sufficiently large. Therefore, the electronic device can be bonded to the external electric circuit board 10 in a good and strong manner, and the bonding reliability of the electronic device can be improved.

なお、絶縁基体１の下部領域の外方への延出は、例えば、絶縁基体１となるセラミックグリーンシートのうち、最下層に位置するものの外寸を上層のものよりも大きくしておいて、最下層のセラミックグリーンシートの外縁が外側に出るようにして積層することにより行なわれる。また、最下層のみに限らず、最下層から上側に続く複数の層の外寸を同様に大きくしておいてもよい。   In addition, the outward extension of the lower region of the insulating substrate 1 may be performed by, for example, setting the outer dimension of the ceramic green sheet that is to be the insulating substrate 1 to be larger than that of the upper layer, The lowermost ceramic green sheet is laminated so that the outer edge is exposed to the outside. Further, not only the lowermost layer but also the outer dimensions of a plurality of layers continuing from the lowermost layer to the upper side may be similarly increased.

また、端子電極２ａの、延出部１ｂの表面に沿った導出は、例えば、端子電極２ａとなる金属ペーストを、セラミックグリーンシートの延出部１ｂとなる部位の表面に沿って、下面から端部の下端を経由して上側に向けて延びるように印刷しておくことにより行なわれる。   Further, the lead-out of the terminal electrode 2a along the surface of the extending portion 1b is performed, for example, by applying a metal paste that becomes the terminal electrode 2a from the lower surface along the surface of the portion that becomes the extending portion 1b of the ceramic green sheet. This is done by printing so as to extend upward via the lower end of the part.

本発明の電子部品収納用パッケージおよび電子装置９において、延出部１ｂの先端部は絶縁基体１の上面外周よりも外方に位置していることが好ましい。   In the electronic component storage package and the electronic device 9 according to the present invention, it is preferable that the distal end portion of the extending portion 1 b is located outside the outer periphery of the upper surface of the insulating base 1.

かかる構成により、接合材１２による外部電気回路基板１０との接合において、上方から接合材１２の状態（接合材と、延出部で上方に導出された端子電極とが接合されている状態）を確認することができ、接合状態（接合材の量、厚み、外観形状）の確認・外観検査を容易に行なうことができる。   With this configuration, in the joining with the external electric circuit board 10 by the joining material 12, the state of the joining material 12 from above (the joining material and the terminal electrode led upward at the extending portion is joined). It can be confirmed, and confirmation / appearance inspection of the joining state (amount of joining material, thickness, appearance shape) can be easily performed.

また、本発明の電子部品収納用パッケージおよび電子装置９において、端子電極２ａの一端が延出部１ｂの端部を経由して延出部１ｂの上面まで導出されていることが好ましい。   In the electronic component storage package and the electronic device 9 according to the present invention, it is preferable that one end of the terminal electrode 2a is led out to the upper surface of the extending portion 1b via the end portion of the extending portion 1b.

かかる構成により、接合材１２は、延出部１ｂの上面にまで回りこむようにして接合され、延出部１ｂを覆い包む形となる。この場合、接合材１２と端子電極２ａとの接合面積はより広く確保されるとともに、接合面と端子電極２ａとの接合面がさらに多くの面で構成されるようになり、外部電気回路基板１０に対する電子装置の接合信頼性がさらに向上される。   With this configuration, the bonding material 12 is bonded so as to wrap around the upper surface of the extending portion 1b, and covers the extending portion 1b. In this case, the bonding area between the bonding material 12 and the terminal electrode 2a is ensured to be larger, and the bonding surface between the bonding surface and the terminal electrode 2a is configured with more surfaces. The junction reliability of the electronic device with respect to is further improved.

なお、このように接合材１２で延出部を覆い包むような場合、接合材１２の量は、端子電極２ａの絶縁基体１下面に位置する部位と回路導体１１との間に接合材１２を介在させるような場合（つまり、従来の技術で用いられていた程度の接合材の量）に対して、１．２倍〜３倍倍程度の量（体積）としておくことが望ましい。   When the extending portion is covered with the bonding material 12 in this way, the amount of the bonding material 12 is such that the bonding material 12 is placed between the portion of the terminal electrode 2 a located on the lower surface of the insulating base 1 and the circuit conductor 11. It is desirable that the amount (volume) is about 1.2 to 3 times as large as the case of interposition (that is, the amount of the bonding material used in the prior art).

また、延出部１ｂの大きさとしては、例えば、絶縁基体１がアルミナ質焼結体で接合材が半田（Ｓｎ−Ｐｂ）で、絶縁基体の外寸が８〜２０ｍｍ程度である場合、延出方向の長さ０．３〜２．０ｍｍ、厚み０．５〜２．０ｍｍが好ましい。   In addition, the size of the extending portion 1b is, for example, when the insulating base 1 is an alumina sintered body, the bonding material is solder (Sn-Pb), and the outer dimension of the insulating base is about 8 to 20 mm. The length in the outgoing direction is preferably 0.3 to 2.0 mm and the thickness is 0.5 to 2.0 mm.

長さが０．３ｍｍ未満では延出部１ｂを接合材１２によって覆い包む形状での接合が十分行なわれず、また、長さが２．０ｍｍを超える場合では、絶縁基体１の外形寸法の増大化につながってしまい、近年の電子装置９の小型化の流れに相反してしまうことになるからである。   If the length is less than 0.3 mm, the extension portion 1b is not sufficiently bonded in a shape covering the bonding material 12, and if the length exceeds 2.0 mm, the outer dimension of the insulating substrate 1 is increased. This is because it conflicts with the recent trend of miniaturization of the electronic device 9.

さらに、厚みが０．５ｍｍ以下では、絶縁基体１の本体に対する延出部１ｂの強度が低くなり、絶縁基体１の取り扱いや電子装置９として取り扱う場合、また、外部電気回路基板１０への接合後に、延出部１ｂと絶縁基体１本体との境部において、クラックの発生や破断が発生しやくなり、電子部品収納用パッケージおよび電子装置９としての機械的な強度が低くなる傾向がある。厚みが２．０ｍｍを超える場合には、絶縁基体１（電子装置９）の外部電気回路基板１０への接合において、延出部１ｂを覆い包む形状での接合材１２による接合が接合材１２の量の点で困難となり、多くの量の接合材１２を使用しなければならず、接合時に接合材１２の流れ出し量が多くなる傾向があり、隣接した端子電極間で接合材１２のショート（電気的短絡）が発生する可能性がある。   Further, when the thickness is 0.5 mm or less, the strength of the extending portion 1b with respect to the main body of the insulating base 1 is low, and when the insulating base 1 is handled or handled as the electronic device 9, or after joining to the external electric circuit board 10 At the boundary between the extending portion 1b and the insulating base 1 main body, cracks and breakage tend to occur, and the mechanical strength of the electronic component storage package and the electronic device 9 tends to be low. When the thickness exceeds 2.0 mm, when the insulating base 1 (electronic device 9) is bonded to the external electric circuit board 10, the bonding with the bonding material 12 in a shape covering and covering the extending portion 1b is performed on the bonding material 12. It becomes difficult in terms of amount, and a large amount of the bonding material 12 must be used, and the amount of flow of the bonding material 12 tends to increase during bonding, and the bonding material 12 is short-circuited between adjacent terminal electrodes (electricity). Short circuit) may occur.

またさらに、端子電極２ａとしては、例えば、絶縁基体１がアルミナ質焼結体で、接合材が半田（Ｓｎ−Ｐｂ）で、絶縁基体の外寸が８〜２０ｍｍ程度である場合、延出部１ｂの上面の端子電極の長さを０．３〜２．０ｍｍとし、延出部１ｂの下面の端子電極は、長さ０．５〜２．０ｍｍ、幅０．２〜１．０ｍｍ程度が好ましい。長さ０．５ｍｍ、幅０．２ｍｍ未満では、電子装置１としての絶縁基体１の外部電気回路基板１０への接合の信頼性が低下してしまい、長さ２．０ｍｍ、幅１．０ｍｍを超える場合では電子装置の小型化に伴う端子狭ピッチ化の点で不利になる。   Furthermore, as the terminal electrode 2a, for example, when the insulating base 1 is an alumina sintered body, the bonding material is solder (Sn-Pb), and the outer dimension of the insulating base is about 8 to 20 mm, the extension portion The length of the terminal electrode on the upper surface of 1b is 0.3 to 2.0 mm, and the terminal electrode on the lower surface of the extending portion 1b is about 0.5 to 2.0 mm in length and about 0.2 to 1.0 mm in width. preferable. If the length is less than 0.5 mm and the width is less than 0.2 mm, the reliability of bonding of the insulating substrate 1 as the electronic device 1 to the external electric circuit board 10 is lowered, and the length is 2.0 mm and the width is 1.0 mm. In the case of exceeding, it becomes disadvantageous in terms of narrowing the terminal pitch accompanying downsizing of the electronic device.

なお、延出部１ｂは、端子電極２ａが形成される部位のみに限らず、絶縁基体１の下面の全周にわたって連続させて形成してもよい。また、絶縁基体１の下面の全周にわたって形成する場合、一部に非形成部を設けてもよい。   The extending portion 1b is not limited to the portion where the terminal electrode 2a is formed, but may be formed continuously over the entire circumference of the lower surface of the insulating substrate 1. Moreover, when forming over the perimeter of the lower surface of the insulation base | substrate 1, you may provide a non-formation part in one part.

そして、上述した電子装置９の端子電極２ａは、外部電気回路基板１０の回路導体１１とはんだ等の接合材１２を介して接合され、これによって電子部品３の電極４と外部電気回路基板１０の回路導体１１とが電気的・機械的に接続される。   The terminal electrode 2a of the electronic device 9 described above is bonded to the circuit conductor 11 of the external electric circuit board 10 via the bonding material 12 such as solder, whereby the electrode 4 of the electronic component 3 and the external electric circuit board 10 are connected. The circuit conductor 11 is electrically and mechanically connected.

電子装置９が実装された外部電気回路基板１０は、バーコードリーダやスキャナ、コピー機、ＦＡＸ機、携帯電話、デジタルカメラ、コンピュータ、計測器、等の電子機器に部品として組み込まれて使用される。   The external electric circuit board 10 on which the electronic device 9 is mounted is used by being incorporated as a component in an electronic device such as a barcode reader, a scanner, a copier, a FAX machine, a mobile phone, a digital camera, a computer, or a measuring instrument. .

例えば、電子部品３として光半導体素子が封止されている場合、光学式読み取り装置（バーコードリーダーやスキャナ等）のセンサ部分、撮像部分等として使用される。   For example, when an optical semiconductor element is sealed as the electronic component 3, it is used as a sensor portion, an imaging portion, or the like of an optical reading device (such as a barcode reader or a scanner).

なお、絶縁基体１を外部回路基板１０に接合するための接合材１２としては、例えば、Ｓｎ−Ｐｂ系、Ｓｎ−Ａｇ−Ｃｕ系、Ｓｎ−Ｃｕ系、Ｓｎ系、Ａｕ−Ｓｎ系等のはんだ材料が使用される。   As the bonding material 12 for bonding the insulating substrate 1 to the external circuit board 10, for example, Sn-Pb-based, Sn-Ag-Cu-based, Sn-Cu-based, Sn-based, Au-Sn-based solder, etc. Material is used.

絶縁基体１の延出部１ｂ（端子電極２ａ）と外部電気回路基板１０の回路導体１１との接合材１２による接合では、例えば、外部回路基板１０の回路導体１１への接合材１２のスクリーン印刷法やディスペンス法等で接合材１２の塗布量を調整することにより調整することができる。   In joining by the joining material 12 of the extension part 1b (terminal electrode 2a) of the insulating substrate 1 and the circuit conductor 11 of the external electric circuit board 10, for example, screen printing of the joining material 12 to the circuit conductor 11 of the external circuit board 10 is performed. It can be adjusted by adjusting the coating amount of the bonding material 12 by a method or a dispensing method.

以上のような電子装置９の実装構造体によれば、延出部１ｂが接合材１２によって覆い包まれているので、電子装置９と外部電気回路基板１０との間に応力が生じたとしても、接合材１２を介した両者の接合を長期にわたって確保することができる。   According to the mounting structure of the electronic device 9 as described above, since the extending portion 1b is covered with the bonding material 12, even if a stress is generated between the electronic device 9 and the external electric circuit board 10. In addition, it is possible to ensure the bonding of both through the bonding material 12 over a long period of time.

また、接合材１２と外部電気回路基板１０の回路導体１１との接合部において、絶縁基体１と外部電気回路基板１０との熱膨張の違いによる応力ひずみにより、接合材１２（接合部）の弾性変形に対する接合強度が高くなり、回路導体２ａと接合材１２との間の接合部の破断をより有効に防止することができる。   Further, at the joint between the bonding material 12 and the circuit conductor 11 of the external electric circuit board 10, the elasticity of the bonding material 12 (bonding part) is caused by stress strain due to the difference in thermal expansion between the insulating base 1 and the external electric circuit board 10. The bonding strength against deformation is increased, and breakage of the bonded portion between the circuit conductor 2a and the bonding material 12 can be more effectively prevented.

その結果、電子装置９の外部電気回路基板１０に対する接合の長期信頼性に優れた実装構造体を提供することができる。この場合、例えば、温度変化の著しい環境、高温高湿環境等の厳しい環境下例えば、道路に設置される認識カメラ、自動車に搭載されるカメラ、火山活動の監視，土石流等の監視に使われる自然災害監視用カメラ、等で使用されるような電子機器であっても、長期にわたって電気的な特性が安定した、長期信頼性に優れた電子機器を構成することができる。   As a result, it is possible to provide a mounting structure excellent in long-term reliability of bonding of the electronic device 9 to the external electric circuit board 10. In this case, for example, in a severe environment such as a temperature change environment, a high temperature and high humidity environment, for example, a recognition camera installed on a road, a camera mounted on a car, a volcano activity monitoring, a debris flow monitoring, etc. Even an electronic device used in a disaster monitoring camera or the like can be configured with an electronic device that has stable electrical characteristics over a long period of time and excellent in long-term reliability.

なお、外部電気回路基板１０は、例えば、ガラス繊維にエポキシ樹脂が含浸されて成るガラスエポキシ基板等の基板に、金属箔やめっき層の形態で銅、金等の金属材料で回路導体１１が形成されて製作されたものである。   The external electric circuit board 10 is formed of a metal conductor such as copper or gold in the form of a metal foil or plating layer on a substrate such as a glass epoxy board formed by impregnating glass fiber with an epoxy resin. It was made.

本発明の電子部品収納用パッケージおよびそれを使用した電子装置の実施の形態の一例を示す断面図である。It is sectional drawing which shows an example of embodiment of the electronic component storage package of this invention, and an electronic apparatus using the same. 本発明の電子装置における実装構造の実施の形態の一例を示す断面図である。It is sectional drawing which shows an example of embodiment of the mounting structure in the electronic device of this invention.

符号の説明Explanation of symbols

１・・・絶縁基体
１ａ・・凹部
１ｂ・・延出部
２・・・配線導体
２ａ・・端子電極
３・・・電子部品
４・・・電極
５・・・蓋体
６・・・接着剤
７・・・接合材（樹脂層）
８・・・ボンディングワイヤ
９・・・電子装置
１０・・外部電気回路基板
１１・・回路導体
１２・・接合材 DESCRIPTION OF SYMBOLS 1 ... Insulation base | substrate 1a ... Recessed part 1b ... Extension part 2 ... Wiring conductor 2a ... Terminal electrode 3 ... Electronic component 4 ... Electrode 5 ... Cover body 6 ... Adhesive 7. Bonding material (resin layer)
8 ... Bonding wire 9 ... Electronic device 10 ... External electric circuit board 11 ... Circuit conductor 12 ... Bonding material

Claims (5)

電子部品が搭載される搭載部を有し、下面に前記電子部品と電気的に接続される端子電極が設けられている絶縁基体と、
前記電子部品を覆うようにして前記絶縁基体に取着される蓋体と、を具備してなる電子部品収納用パッケージであって、
前記絶縁基体の下部領域を外方へ延出せしめ、前記端子電極の一端を前記延出部の表面に沿って下面より上方へ導出させたことを特徴とする電子部品収納用パッケージ。 An insulating substrate having a mounting portion on which an electronic component is mounted and having a terminal electrode electrically connected to the electronic component on a lower surface;
An electronic component storage package comprising a lid attached to the insulating base so as to cover the electronic component,
A package for storing electronic parts, wherein a lower region of the insulating base is extended outward, and one end of the terminal electrode is led out from a lower surface along the surface of the extended portion. 前記延出部の先端部が前記絶縁基体の上面外周よりも外方に位置していることを特徴とする請求項１に記載の電子部品収納用パッケージ。 2. The electronic component storage package according to claim 1, wherein a distal end portion of the extending portion is located outward from an outer periphery of an upper surface of the insulating base. 前記端子電極の一端が前記延出部の端部を経由して前記延出部の上面まで導出されていることを特徴とする請求項１または請求項２記載の電子部品収納用パッケージ。 3. The electronic component storage package according to claim 1, wherein one end of the terminal electrode is led out to an upper surface of the extension portion through an end portion of the extension portion. 請求項１乃至請求項３のいずれかに記載の電子部品収納用パッケージの前記搭載部に電子部品を搭載して前記蓋体で覆ったことを特徴とする電子装置。 An electronic device comprising an electronic component mounted on the mounting portion of the electronic component storage package according to claim 1 and covered with the lid. 請求項４に記載の電子装置の前記延出部を外部電気回路基板に対し接合材を介して接合するようにした電子装置の実装構造体において、前記延出部のうち少なくとも前記端子電極が形成されている領域を前記接合材によって覆い包んだことを特徴とする電子装置の実装構造体。 The electronic device mounting structure according to claim 4, wherein the extended portion of the electronic device is bonded to an external electric circuit board via a bonding material, and at least the terminal electrode is formed in the extended portion. A mounting structure of an electronic device, wherein a region that is covered is covered with the bonding material.
JP2005157074A 2005-05-30 2005-05-30 Package for housing electronic component, electronic device and its packaging structure Pending JP2006332506A (en)

Priority Applications (1)

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