JP2006330773A - 無線タグチップ装着方法及び無線タグチップへの管理情報書込み方法 - Google Patents
無線タグチップ装着方法及び無線タグチップへの管理情報書込み方法 Download PDFInfo
- Publication number
- JP2006330773A JP2006330773A JP2005148865A JP2005148865A JP2006330773A JP 2006330773 A JP2006330773 A JP 2006330773A JP 2005148865 A JP2005148865 A JP 2005148865A JP 2005148865 A JP2005148865 A JP 2005148865A JP 2006330773 A JP2006330773 A JP 2006330773A
- Authority
- JP
- Japan
- Prior art keywords
- tag chip
- wireless tag
- rfid tag
- chip
- management
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07758—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07758—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
- G06K19/0776—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag the adhering arrangement being a layer of adhesive, so that the record carrier can function as a sticker
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
【解決手段】 流動性物質18に多数の超小型の無線タグチップ11を混入してほぼ均一に分散させた無線タグチップ混入流動性物質19を作る。この無線タグチップ混入流動性物質19をディスペンサ等の塗布手段や印刷手段に収容して、トレイ17(管理対象物)の空きスペースに少なくとも1個の無線タグチップ11が含まれるように無線タグチップ混入流動性物質19を少量付着させた後、この無線タグチップ混入流動性物質19を流動性物質18の種類に応じた方法で固化(硬化)させることで、トレイ17の空きスペースに少なくとも1個の無線タグチップ11を装着する。この後、リーダライタからトレイ17の部品ID等の管理情報のデータを送信して無線タグチップ11に当該管理情報を書き込む。
【選択図】 図4
Description
Claims (4)
- 管理対象物に無線タグチップを装着する無線タグチップ装着方法において、
流動性物質に多数の無線タグチップを混入して無線タグチップ混入流動性物質を作り、この無線タグチップ混入流動性物質を前記管理対象物に少なくとも1個の無線タグチップが含まれるように付着させて固化させることで、該無線タグチップを該管理対象物に装着することを特徴とする無線タグチップ装着方法。 - 前記流動性物質は、印刷用インク又は接着剤であることを特徴とする請求項1に記載の無線タグチップ装着方法。
- 前記管理対象物は、電子部品実装機にセットする部品供給装置、該部品供給装置にセットするトレイ、リール、カートリッジ、該部品供給装置から供給される電子部品、回路基板のいずれか少なくとも1つであることを特徴とする請求項1又は2に記載の無線タグチップ装着方法。
- 請求項1乃至3のいずれかに記載の無線タグチップ装着方法によって前記管理対象物に装着した前記無線タグチップに内蔵された書き換え可能な不揮発性メモリにデータ書込み装置によって当該管理対象物の管理情報を無線で送信して書き込むことを特徴とする無線タグチップへの管理情報書込み方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005148865A JP2006330773A (ja) | 2005-05-23 | 2005-05-23 | 無線タグチップ装着方法及び無線タグチップへの管理情報書込み方法 |
CN2006100848800A CN1870883B (zh) | 2005-05-23 | 2006-05-23 | 无线标签芯片的安装方法以及向其写入管理信息的方法 |
US11/438,343 US20060267775A1 (en) | 2005-05-23 | 2006-05-23 | Method of mounting radio tag chips and method of writing management information onto radio tag chips |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005148865A JP2006330773A (ja) | 2005-05-23 | 2005-05-23 | 無線タグチップ装着方法及び無線タグチップへの管理情報書込み方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2006330773A true JP2006330773A (ja) | 2006-12-07 |
Family
ID=37444401
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005148865A Pending JP2006330773A (ja) | 2005-05-23 | 2005-05-23 | 無線タグチップ装着方法及び無線タグチップへの管理情報書込み方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20060267775A1 (ja) |
JP (1) | JP2006330773A (ja) |
CN (1) | CN1870883B (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ITPI20100025A1 (it) * | 2010-03-10 | 2011-09-11 | Daniele Murabito | Supporto per la memorizzazione dati su documenti cartacei. |
EP3047713B1 (en) * | 2013-09-18 | 2019-11-13 | Mycronic AB | Method, system and device for redistribution of components and bins in smd warehouse |
US9092714B1 (en) * | 2014-05-15 | 2015-07-28 | Northup Grumman Systems Corporation | Smart energized tapes for FOD-free aircraft applications |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04167500A (ja) * | 1990-10-30 | 1992-06-15 | Omron Corp | プリント基板管理システム |
JP2003067703A (ja) * | 2001-08-24 | 2003-03-07 | Toppan Printing Co Ltd | Icを含有したコーティング組成物 |
JP2004015037A (ja) * | 2002-06-04 | 2004-01-15 | Fuji Mach Mfg Co Ltd | 記憶機能付き電子部品パッケージ、電子部品組み立て機及び電子部品の実装方法、並びに、電子部品パッケージに設けられた不揮発性強誘電体メモリ |
JP2004280676A (ja) * | 2003-03-18 | 2004-10-07 | Nihon Yamamura Glass Co Ltd | リターナブル容器管理システム及び当該システムによって管理されるrfidチップ付きリターナブル容器 |
JP2005101576A (ja) * | 2003-08-26 | 2005-04-14 | Matsushita Electric Ind Co Ltd | 部品照合方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6140146A (en) * | 1999-08-03 | 2000-10-31 | Intermec Ip Corp. | Automated RFID transponder manufacturing on flexible tape substrates |
US7068170B2 (en) * | 2004-03-26 | 2006-06-27 | The Boeing Company | RFID embedded materials |
US7248164B2 (en) * | 2005-02-07 | 2007-07-24 | Regard Joseph T | Radio frequency identification bag tracking and recycling system, and bag counting rack associated therewith |
-
2005
- 2005-05-23 JP JP2005148865A patent/JP2006330773A/ja active Pending
-
2006
- 2006-05-23 CN CN2006100848800A patent/CN1870883B/zh active Active
- 2006-05-23 US US11/438,343 patent/US20060267775A1/en not_active Abandoned
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04167500A (ja) * | 1990-10-30 | 1992-06-15 | Omron Corp | プリント基板管理システム |
JP2003067703A (ja) * | 2001-08-24 | 2003-03-07 | Toppan Printing Co Ltd | Icを含有したコーティング組成物 |
JP2004015037A (ja) * | 2002-06-04 | 2004-01-15 | Fuji Mach Mfg Co Ltd | 記憶機能付き電子部品パッケージ、電子部品組み立て機及び電子部品の実装方法、並びに、電子部品パッケージに設けられた不揮発性強誘電体メモリ |
JP2004280676A (ja) * | 2003-03-18 | 2004-10-07 | Nihon Yamamura Glass Co Ltd | リターナブル容器管理システム及び当該システムによって管理されるrfidチップ付きリターナブル容器 |
JP2005101576A (ja) * | 2003-08-26 | 2005-04-14 | Matsushita Electric Ind Co Ltd | 部品照合方法 |
Also Published As
Publication number | Publication date |
---|---|
CN1870883A (zh) | 2006-11-29 |
US20060267775A1 (en) | 2006-11-30 |
CN1870883B (zh) | 2010-11-03 |
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