JP2006324589A5 - - Google Patents

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Publication number
JP2006324589A5
JP2006324589A5 JP2005148246A JP2005148246A JP2006324589A5 JP 2006324589 A5 JP2006324589 A5 JP 2006324589A5 JP 2005148246 A JP2005148246 A JP 2005148246A JP 2005148246 A JP2005148246 A JP 2005148246A JP 2006324589 A5 JP2006324589 A5 JP 2006324589A5
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JP
Japan
Prior art keywords
resin
resin body
led
wiring board
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005148246A
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English (en)
Japanese (ja)
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JP2006324589A (ja
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Publication date
Application filed filed Critical
Priority to JP2005148246A priority Critical patent/JP2006324589A/ja
Priority claimed from JP2005148246A external-priority patent/JP2006324589A/ja
Publication of JP2006324589A publication Critical patent/JP2006324589A/ja
Publication of JP2006324589A5 publication Critical patent/JP2006324589A5/ja
Pending legal-status Critical Current

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JP2005148246A 2005-05-20 2005-05-20 Ｌｅｄ装置およびその製造方法 Pending JP2006324589A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005148246A JP2006324589A (ja) 2005-05-20 2005-05-20 Ｌｅｄ装置およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005148246A JP2006324589A (ja) 2005-05-20 2005-05-20 Ｌｅｄ装置およびその製造方法

Publications (2)

Publication Number Publication Date
JP2006324589A JP2006324589A (ja) 2006-11-30
JP2006324589A5 true JP2006324589A5 (enExample) 2009-08-27

Family

ID=37544015

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005148246A Pending JP2006324589A (ja) 2005-05-20 2005-05-20 Ｌｅｄ装置およびその製造方法

Country Status (1)

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JP (1) JP2006324589A (enExample)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
US9711703B2 (en) 2007-02-12 2017-07-18 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
US8604506B2 (en) 2007-02-22 2013-12-10 Sharp Kabushiki Kaisha Surface mounting type light emitting diode and method for manufacturing the same
JP5106094B2 (ja) * 2007-02-22 2012-12-26 シャープ株式会社 表面実装型発光ダイオードおよびその製造方法
JP4869165B2 (ja) * 2007-06-28 2012-02-08 昭和電工株式会社 発光装置の製造方法
JP5169263B2 (ja) * 2008-02-01 2013-03-27 日亜化学工業株式会社 発光装置の製造方法及び発光装置
US8049237B2 (en) 2007-12-28 2011-11-01 Nichia Corporation Light emitting device
US8247827B2 (en) * 2008-09-30 2012-08-21 Bridgelux, Inc. LED phosphor deposition
US8368112B2 (en) 2009-01-14 2013-02-05 Cree Huizhou Opto Limited Aligned multiple emitter package
JP2010245128A (ja) * 2009-04-01 2010-10-28 Showa Denko Kk 樹脂体形成方法、発光体製造方法、樹脂体形成装置及び発光体製造装置
JP2010272653A (ja) * 2009-05-20 2010-12-02 Showa Denko Kk 樹脂体形成装置、発光体製造装置、樹脂体形成方法、及び発光体製造方法
TWI447893B (en) * 2009-06-24 2014-08-01 Led package structure for increasing light-emitting efficiency and controlling light-projecting angle and method for manufacturing the same
TWI364122B (en) * 2009-07-06 2012-05-11 Led package structure for increasing light-emitting efficiency and controlling light-projecting angle and method for manufacturing the same
TWI354365B (en) * 2009-08-26 2011-12-11 Quasioptical led package structure for increasing
JP5648422B2 (ja) * 2010-10-29 2015-01-07 日亜化学工業株式会社 発光装置及びその製造方法
JP2012099544A (ja) * 2010-10-29 2012-05-24 Nichia Chem Ind Ltd 発光装置の製造方法
EP2448028B1 (en) 2010-10-29 2017-05-31 Nichia Corporation Light emitting apparatus and production method thereof
JP5173004B1 (ja) * 2011-09-14 2013-03-27 シャープ株式会社 植物栽培用の発光装置およびその製造方法
JP2014044970A (ja) * 2011-12-14 2014-03-13 Mitsubishi Electric Corp 発光装置及び発光装置の製造方法
CN104871323B (zh) 2012-12-28 2018-07-13 夏普株式会社 发光装置
US20150327446A1 (en) 2013-02-15 2015-11-19 Sharp Kabushiki Kaisha Led light source for plant cultivation
US9601670B2 (en) 2014-07-11 2017-03-21 Cree, Inc. Method to form primary optic with variable shapes and/or geometries without a substrate
US10622522B2 (en) 2014-09-05 2020-04-14 Theodore Lowes LED packages with chips having insulated surfaces
JP2019071352A (ja) * 2017-10-10 2019-05-09 シチズン電子株式会社 照明装置とその製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH058445A (ja) * 1991-06-29 1993-01-19 Kyocera Corp 画像装置
JP3431038B2 (ja) * 1994-02-18 2003-07-28 ローム株式会社 発光装置とその製造方法およびｌｅｄヘッドの製造方法
JPH09148633A (ja) * 1995-11-28 1997-06-06 Matsushita Electron Corp 発光ダイオード整列光源
US6633030B2 (en) * 2001-08-31 2003-10-14 Fiarchild Semiconductor Surface mountable optocoupler package

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