JP2006313844A - 窒化物半導体素子の製法 - Google Patents
窒化物半導体素子の製法 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 142
- 150000004767 nitrides Chemical class 0.000 title claims abstract description 97
- 238000000034 method Methods 0.000 title claims abstract description 28
- 230000008569 process Effects 0.000 title abstract description 6
- 239000000758 substrate Substances 0.000 claims abstract description 44
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 28
- 238000010438 heat treatment Methods 0.000 claims abstract description 23
- 229910052749 magnesium Inorganic materials 0.000 claims abstract description 22
- 238000004519 manufacturing process Methods 0.000 claims abstract description 20
- 230000003213 activating effect Effects 0.000 claims abstract description 4
- 239000013078 crystal Substances 0.000 claims description 22
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 claims description 16
- 230000001678 irradiating effect Effects 0.000 claims description 6
- 230000010355 oscillation Effects 0.000 claims description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract description 39
- 229910052757 nitrogen Inorganic materials 0.000 abstract description 19
- 238000000137 annealing Methods 0.000 abstract description 9
- 238000005530 etching Methods 0.000 abstract description 6
- 230000015572 biosynthetic process Effects 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 156
- 239000000370 acceptor Substances 0.000 description 23
- 150000001875 compounds Chemical class 0.000 description 11
- 239000010408 film Substances 0.000 description 11
- 229910052594 sapphire Inorganic materials 0.000 description 11
- 239000010980 sapphire Substances 0.000 description 11
- 239000007789 gas Substances 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- 239000001257 hydrogen Substances 0.000 description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 5
- 230000007547 defect Effects 0.000 description 5
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- 229910019080 Mg-H Inorganic materials 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000002019 doping agent Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 229910002704 AlGaN Inorganic materials 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 239000012159 carrier gas Substances 0.000 description 3
- 229910021478 group 5 element Inorganic materials 0.000 description 3
- 238000005224 laser annealing Methods 0.000 description 3
- 230000004913 activation Effects 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 150000002431 hydrogen Chemical class 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 2
- IBEFSUTVZWZJEL-UHFFFAOYSA-N trimethylindium Chemical compound C[In](C)C IBEFSUTVZWZJEL-UHFFFAOYSA-N 0.000 description 2
- MHYQBXJRURFKIN-UHFFFAOYSA-N C1(C=CC=C1)[Mg] Chemical compound C1(C=CC=C1)[Mg] MHYQBXJRURFKIN-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910004349 Ti-Al Inorganic materials 0.000 description 1
- 229910004692 Ti—Al Inorganic materials 0.000 description 1
- 238000002679 ablation Methods 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000010494 dissociation reaction Methods 0.000 description 1
- 230000005593 dissociations Effects 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- -1 for example Substances 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 231100000989 no adverse effect Toxicity 0.000 description 1
- 125000002524 organometallic group Chemical group 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
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- H01L33/005—Processes
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Abstract
【解決手段】 基板1上に窒化物半導体からなる半導体積層部6を形成し、その半導体積層部6の表面側から、λ=h・c/E以下(EはMgとHとの結合を切り離し得るエネルギー)の波長λのレーザ光を照射する。その後に、300〜400℃の熱処理を行う。そして、通常の窒化物半導体LEDの製造工程と同様に透光性導電層7を設け、半導体積層部6の一部をエッチングにより除去して露出するn形層3にn側電極9を、透光性導電層7の表面にp側電極8を形成する。
【選択図】 図1
Description
λ=h・c/E
ただし、λはレーザ光の発振波長、hはプランク定数、cは光速、EはMgとHとの結合を切り離し得るエネルギーをそれぞれ示す
以下の波長のレーザ光を照射し、その後に300〜400℃の熱処理を行うことにより、窒化物半導体発光素子を得ることができる。
2 低温バッファ層
3 n形層
4 活性層
5 p形層
6 半導体積層部
7 透光性導電層
8 p側電極
9 n側電極
10 単結晶緩衝層
Claims (3)
- 基板上にMOCVD法により窒化物半導体層を成長して少なくとも表面側にp形窒化物半導体層を有する窒化物半導体素子の製法であって、前記p形層とするためアクセプタがドーピングされた窒化物半導体層に、該窒化物半導体層のアクセプタであるMgとHとの結合エネルギーより大きいエネルギーを有するレーザ光を照射することにより前記MgとHとの結合を切り離し、引き続き300〜400℃の熱処理をすることにより前記切り離されたHを前記窒化物半導体層から放出し、前記アクセプタを活性化することを特徴とする窒化物半導体素子の製法。
- 基板上に窒化物半導体からなるn形層、活性層およびp形層をこの順でMOCVD法によりエピタキシャル成長して発光層を形成するように半導体積層部を形成し、該半導体積層部の表面側から
λ=h・c/E
ただし、λはレーザ光の発振波長、hはプランク定数、cは光速、EはMgとHとの結合を切り離し得るエネルギーをそれぞれ示す
以下の波長のレーザ光を照射し、その後に300〜400℃の熱処理を行うことにより発光素子を形成することを特徴とする窒化物半導体素子の製法。 - 窒化物半導体と格子整合しない基板の表面にPLD法を用いてAlxGayIn1-x-yN(0≦x≦1、0≦y≦1、0≦x+y≦1)からなり、該AlxGayIn1-x-yNのa軸およびc軸が整列した単結晶の緩衝層を成長し、該単結晶の緩衝層上に窒化物半導体結晶層をMOCVD法により成長する請求項1または2記載の窒化物半導体素子の製法。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005136179A JP4451811B2 (ja) | 2005-05-09 | 2005-05-09 | 窒化物半導体素子の製法 |
TW095115621A TW200705717A (en) | 2005-05-09 | 2006-05-02 | Process for fabricating nitride semiconductor element |
US11/920,043 US7718450B2 (en) | 2005-05-09 | 2006-05-08 | Method for manufacturing nitride semiconductor device |
EP06746072A EP1881536A1 (en) | 2005-05-09 | 2006-05-08 | Method of producing nitride semiconductor element |
PCT/JP2006/309241 WO2006120999A1 (ja) | 2005-05-09 | 2006-05-08 | 窒化物半導体素子の製法 |
CNA2006800160663A CN101176213A (zh) | 2005-05-09 | 2006-05-08 | 氮化物半导体元件的制造方法 |
KR1020077025880A KR20080003870A (ko) | 2005-05-09 | 2006-05-08 | 질화물 반도체 소자의 제법 |
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JP2005136179A JP4451811B2 (ja) | 2005-05-09 | 2005-05-09 | 窒化物半導体素子の製法 |
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JP2006313844A true JP2006313844A (ja) | 2006-11-16 |
JP4451811B2 JP4451811B2 (ja) | 2010-04-14 |
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JP2005136179A Expired - Fee Related JP4451811B2 (ja) | 2005-05-09 | 2005-05-09 | 窒化物半導体素子の製法 |
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Country | Link |
---|---|
US (1) | US7718450B2 (ja) |
EP (1) | EP1881536A1 (ja) |
JP (1) | JP4451811B2 (ja) |
KR (1) | KR20080003870A (ja) |
CN (1) | CN101176213A (ja) |
TW (1) | TW200705717A (ja) |
WO (1) | WO2006120999A1 (ja) |
Cited By (5)
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JP2009246034A (ja) * | 2008-03-28 | 2009-10-22 | Furukawa Electric Co Ltd:The | 電界効果トランジスタの製造方法 |
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KR101405693B1 (ko) | 2007-11-26 | 2014-06-10 | 엘지이노텍 주식회사 | 반도체 발광소자 및 그 제조방법 |
WO2015114711A1 (ja) * | 2014-01-29 | 2015-08-06 | パナソニックIpマネジメント株式会社 | 半導体発光素子およびその駆動回路 |
JP2020501345A (ja) * | 2016-10-28 | 2020-01-16 | ルミレッズ リミテッド ライアビリティ カンパニー | 紫外線照射下で発光デバイスを成長させる方法 |
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JP5732684B2 (ja) * | 2010-03-05 | 2015-06-10 | 並木精密宝石株式会社 | 単結晶基板、単結晶基板の製造方法、多層膜付き単結晶基板の製造方法および素子製造方法 |
JP5874173B2 (ja) * | 2011-02-25 | 2016-03-02 | 富士通株式会社 | 化合物半導体装置及びその製造方法 |
US8399367B2 (en) * | 2011-06-28 | 2013-03-19 | Nitride Solutions, Inc. | Process for high-pressure nitrogen annealing of metal nitrides |
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JP6292104B2 (ja) * | 2014-11-17 | 2018-03-14 | 三菱電機株式会社 | 窒化物半導体装置の製造方法 |
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WO2023149433A1 (ja) * | 2022-02-01 | 2023-08-10 | 公立大学法人大阪 | 発光素子の製造方法及び発光素子 |
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JP2000058919A (ja) * | 1998-08-13 | 2000-02-25 | Toshiba Corp | 半導体素子及びその製造方法 |
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Cited By (7)
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KR101405693B1 (ko) | 2007-11-26 | 2014-06-10 | 엘지이노텍 주식회사 | 반도체 발광소자 및 그 제조방법 |
JP2009246034A (ja) * | 2008-03-28 | 2009-10-22 | Furukawa Electric Co Ltd:The | 電界効果トランジスタの製造方法 |
CN103021844A (zh) * | 2011-09-26 | 2013-04-03 | 比亚迪股份有限公司 | 一种外延片退火方法 |
WO2015114711A1 (ja) * | 2014-01-29 | 2015-08-06 | パナソニックIpマネジメント株式会社 | 半導体発光素子およびその駆動回路 |
JPWO2015114711A1 (ja) * | 2014-01-29 | 2017-03-23 | パナソニックIpマネジメント株式会社 | 半導体発光素子およびその駆動回路 |
JP2020501345A (ja) * | 2016-10-28 | 2020-01-16 | ルミレッズ リミテッド ライアビリティ カンパニー | 紫外線照射下で発光デバイスを成長させる方法 |
JP7050060B2 (ja) | 2016-10-28 | 2022-04-07 | ルミレッズ リミテッド ライアビリティ カンパニー | 紫外線照射下で発光デバイスを成長させる方法 |
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US7718450B2 (en) | 2010-05-18 |
KR20080003870A (ko) | 2008-01-08 |
CN101176213A (zh) | 2008-05-07 |
TW200705717A (en) | 2007-02-01 |
US20090068779A1 (en) | 2009-03-12 |
JP4451811B2 (ja) | 2010-04-14 |
EP1881536A1 (en) | 2008-01-23 |
WO2006120999A1 (ja) | 2006-11-16 |
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