JP2006310568A - 発光装置 - Google Patents

発光装置 Download PDF

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Publication number
JP2006310568A
JP2006310568A JP2005131707A JP2005131707A JP2006310568A JP 2006310568 A JP2006310568 A JP 2006310568A JP 2005131707 A JP2005131707 A JP 2005131707A JP 2005131707 A JP2005131707 A JP 2005131707A JP 2006310568 A JP2006310568 A JP 2006310568A
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JP
Japan
Prior art keywords
light emitting
emitting device
led lamp
diffusion layer
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2005131707A
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English (en)
Japanese (ja)
Other versions
JP2006310568A5 (enExample
Inventor
Norifumi Hattori
徳文 服部
Yoshimasa Tatewaki
慶真 帯刀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyoda Gosei Co Ltd
Original Assignee
Toyoda Gosei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyoda Gosei Co Ltd filed Critical Toyoda Gosei Co Ltd
Priority to JP2005131707A priority Critical patent/JP2006310568A/ja
Publication of JP2006310568A publication Critical patent/JP2006310568A/ja
Publication of JP2006310568A5 publication Critical patent/JP2006310568A5/ja
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

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  • Led Device Packages (AREA)
JP2005131707A 2005-04-28 2005-04-28 発光装置 Withdrawn JP2006310568A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005131707A JP2006310568A (ja) 2005-04-28 2005-04-28 発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005131707A JP2006310568A (ja) 2005-04-28 2005-04-28 発光装置

Publications (2)

Publication Number Publication Date
JP2006310568A true JP2006310568A (ja) 2006-11-09
JP2006310568A5 JP2006310568A5 (enExample) 2007-09-06

Family

ID=37477120

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005131707A Withdrawn JP2006310568A (ja) 2005-04-28 2005-04-28 発光装置

Country Status (1)

Country Link
JP (1) JP2006310568A (enExample)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008075679A1 (ja) * 2006-12-20 2008-06-26 Showa Denko K.K. Ｉｉｉ族窒化物化合物半導体発光素子の製造方法、及びｉｉｉ族窒化物化合物半導体発光素子、並びにランプ
JP2009130299A (ja) * 2007-11-27 2009-06-11 Panasonic Electric Works Co Ltd 発光装置
JP2010129615A (ja) * 2008-11-25 2010-06-10 Toshiba Lighting & Technology Corp 発光装置及び照明装置
JP2010524220A (ja) * 2007-04-03 2010-07-15 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 光出力デバイス
JP2010177656A (ja) * 2009-02-02 2010-08-12 Samsung Electronics Co Ltd 発光ダイオードユニット及びこれを含む表示装置
JP2011526004A (ja) * 2009-07-22 2011-09-29 ネクソン カンパニー，リミテッド 面発光装置およびその製造方法
JP2020053690A (ja) * 2016-02-05 2020-04-02 マブン オプトロニックス カンパニー リミテッドＭａｖｅｎ Ｏｐｔｒｏｎｉｃｓ Ｃｏ．， Ｌｔｄ． ビーム成形構造体を備えた発光素子およびその製造方法
CN112259008A (zh) * 2020-11-10 2021-01-22 深圳市中科创激光技术有限公司 Led显示屏面罩结构及led显示屏
JP2022121517A (ja) * 2014-12-26 2022-08-19 日亜化学工業株式会社 光源および光源を備える発光装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63159859U (enExample) * 1987-04-07 1988-10-19
JP2000031547A (ja) * 1998-07-09 2000-01-28 Stanley Electric Co Ltd 面状光源
JP2004179644A (ja) * 2002-11-12 2004-06-24 Nichia Chem Ind Ltd 蛍光体積層構造及びそれを用いる光源

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63159859U (enExample) * 1987-04-07 1988-10-19
JP2000031547A (ja) * 1998-07-09 2000-01-28 Stanley Electric Co Ltd 面状光源
JP2004179644A (ja) * 2002-11-12 2004-06-24 Nichia Chem Ind Ltd 蛍光体積層構造及びそれを用いる光源

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8168460B2 (en) 2006-12-20 2012-05-01 Showa Denko K.K. Method for manufacturing group III nitride compound semiconductor light-emitting device, group III nitride compound semiconductor light-emitting device, and lamp
JP2008153603A (ja) * 2006-12-20 2008-07-03 Showa Denko Kk Ｉｉｉ族窒化物化合物半導体発光素子の製造方法、及びｉｉｉ族窒化物化合物半導体発光素子、並びにランプ
WO2008075679A1 (ja) * 2006-12-20 2008-06-26 Showa Denko K.K. Ｉｉｉ族窒化物化合物半導体発光素子の製造方法、及びｉｉｉ族窒化物化合物半導体発光素子、並びにランプ
JP2010524220A (ja) * 2007-04-03 2010-07-15 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 光出力デバイス
JP2009130299A (ja) * 2007-11-27 2009-06-11 Panasonic Electric Works Co Ltd 発光装置
JP2010129615A (ja) * 2008-11-25 2010-06-10 Toshiba Lighting & Technology Corp 発光装置及び照明装置
JP2010177656A (ja) * 2009-02-02 2010-08-12 Samsung Electronics Co Ltd 発光ダイオードユニット及びこれを含む表示装置
JP2011526004A (ja) * 2009-07-22 2011-09-29 ネクソン カンパニー，リミテッド 面発光装置およびその製造方法
JP2022121517A (ja) * 2014-12-26 2022-08-19 日亜化学工業株式会社 光源および光源を備える発光装置
JP7506328B2 (ja) 2014-12-26 2024-06-26 日亜化学工業株式会社 光源および光源を備える発光装置
JP2020053690A (ja) * 2016-02-05 2020-04-02 マブン オプトロニックス カンパニー リミテッドＭａｖｅｎ Ｏｐｔｒｏｎｉｃｓ Ｃｏ．， Ｌｔｄ． ビーム成形構造体を備えた発光素子およびその製造方法
JP7016467B2 (ja) 2016-02-05 2022-02-07 マブン オプトロニックス カンパニー リミテッド ビーム成形構造体を備えた発光素子およびその製造方法
CN112259008A (zh) * 2020-11-10 2021-01-22 深圳市中科创激光技术有限公司 Led显示屏面罩结构及led显示屏
CN112259008B (zh) * 2020-11-10 2022-10-18 深圳市中科创激光技术有限公司 Led显示屏面罩结构及led显示屏

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