JP2006269868A5 - - Google Patents

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Publication number
JP2006269868A5
JP2006269868A5 JP2005087715A JP2005087715A JP2006269868A5 JP 2006269868 A5 JP2006269868 A5 JP 2006269868A5 JP 2005087715 A JP2005087715 A JP 2005087715A JP 2005087715 A JP2005087715 A JP 2005087715A JP 2006269868 A5 JP2006269868 A5 JP 2006269868A5
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JP
Japan
Prior art keywords
zones
zone
heating
processing
amount
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Application number
JP2005087715A
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English (en)
Japanese (ja)
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JP4634197B2 (ja
JP2006269868A (ja
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Priority to JP2005087715A priority Critical patent/JP4634197B2/ja
Priority claimed from JP2005087715A external-priority patent/JP4634197B2/ja
Publication of JP2006269868A publication Critical patent/JP2006269868A/ja
Publication of JP2006269868A5 publication Critical patent/JP2006269868A5/ja
Application granted granted Critical
Publication of JP4634197B2 publication Critical patent/JP4634197B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2005087715A 2005-03-25 2005-03-25 基板処理装置、半導体装置の製造方法 Expired - Lifetime JP4634197B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005087715A JP4634197B2 (ja) 2005-03-25 2005-03-25 基板処理装置、半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005087715A JP4634197B2 (ja) 2005-03-25 2005-03-25 基板処理装置、半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2006269868A JP2006269868A (ja) 2006-10-05
JP2006269868A5 true JP2006269868A5 (enExample) 2008-05-08
JP4634197B2 JP4634197B2 (ja) 2011-02-16

Family

ID=37205486

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005087715A Expired - Lifetime JP4634197B2 (ja) 2005-03-25 2005-03-25 基板処理装置、半導体装置の製造方法

Country Status (1)

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JP (1) JP4634197B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010027846A (ja) * 2008-07-18 2010-02-04 Kokusai Electric Semiconductor Service Inc 基板処理装置および半導体装置の製造方法
JP5026549B2 (ja) * 2010-04-08 2012-09-12 シャープ株式会社 加熱制御システム、それを備えた成膜装置、および温度制御方法
US12278127B2 (en) * 2022-06-08 2025-04-15 Applied Materials, Inc. Auto fine-tuner for desired temperature profile
CN120432384B (zh) * 2025-07-08 2025-09-23 季华实验室 一种半导体退火方法、系统及存储介质

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000049096A (ja) * 1998-07-31 2000-02-18 Kokusai Electric Co Ltd 成膜方法
JP2001318702A (ja) * 2000-05-08 2001-11-16 Yamatake Corp 制御システム
JP3833479B2 (ja) * 2001-01-25 2006-10-11 株式会社山武 制御装置
JP2003022978A (ja) * 2001-07-10 2003-01-24 Hitachi Kokusai Electric Inc 基板処理装置
JP4262908B2 (ja) * 2001-08-10 2009-05-13 東京エレクトロン株式会社 熱処理装置及び熱処理方法

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