JP2006261608A - デバイス製造装置及び制御方法 - Google Patents

デバイス製造装置及び制御方法 Download PDF

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Publication number
JP2006261608A
JP2006261608A JP2005080595A JP2005080595A JP2006261608A JP 2006261608 A JP2006261608 A JP 2006261608A JP 2005080595 A JP2005080595 A JP 2005080595A JP 2005080595 A JP2005080595 A JP 2005080595A JP 2006261608 A JP2006261608 A JP 2006261608A
Authority
JP
Japan
Prior art keywords
chamber
load lock
environment
lock chamber
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2005080595A
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English (en)
Japanese (ja)
Other versions
JP2006261608A5 (https=
Inventor
Yuichi Takamura
裕一 高村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2005080595A priority Critical patent/JP2006261608A/ja
Priority to US11/376,240 priority patent/US20060207680A1/en
Publication of JP2006261608A publication Critical patent/JP2006261608A/ja
Publication of JP2006261608A5 publication Critical patent/JP2006261608A5/ja
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0466—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the load-lock chamber

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electron Beam Exposure (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2005080595A 2005-03-18 2005-03-18 デバイス製造装置及び制御方法 Withdrawn JP2006261608A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2005080595A JP2006261608A (ja) 2005-03-18 2005-03-18 デバイス製造装置及び制御方法
US11/376,240 US20060207680A1 (en) 2005-03-18 2006-03-16 Device manufacturing apparatus and method of controlling same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005080595A JP2006261608A (ja) 2005-03-18 2005-03-18 デバイス製造装置及び制御方法

Publications (2)

Publication Number Publication Date
JP2006261608A true JP2006261608A (ja) 2006-09-28
JP2006261608A5 JP2006261608A5 (https=) 2008-05-08

Family

ID=37009066

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005080595A Withdrawn JP2006261608A (ja) 2005-03-18 2005-03-18 デバイス製造装置及び制御方法

Country Status (2)

Country Link
US (1) US20060207680A1 (https=)
JP (1) JP2006261608A (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008277779A (ja) * 2007-04-06 2008-11-13 Canon Inc 雰囲気置換方法
JP2011091160A (ja) * 2009-10-21 2011-05-06 Ulvac Japan Ltd 基板搬送装置及び基板処理装置
JP2011228397A (ja) * 2010-04-16 2011-11-10 Hitachi High-Technologies Corp 真空処理装置

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5617708B2 (ja) * 2011-03-16 2014-11-05 東京エレクトロン株式会社 蓋体開閉装置
KR20180045316A (ko) * 2016-10-25 2018-05-04 삼성전자주식회사 설비 전방 단부 모듈 및 이를 포함하는 반도체 제조 장치
CN110770890B (zh) 2017-06-23 2023-09-08 应用材料公司 可索引侧储存仓设备、加热的侧储存仓设备、系统和方法
US10388547B2 (en) 2017-06-23 2019-08-20 Applied Materials, Inc. Side storage pods, equipment front end modules, and methods for processing substrates
JP7812776B2 (ja) * 2022-12-01 2026-02-10 東京エレクトロン株式会社 搬送モジュールおよび搬送方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6852194B2 (en) * 2001-05-21 2005-02-08 Tokyo Electron Limited Processing apparatus, transferring apparatus and transferring method
US20030029715A1 (en) * 2001-07-25 2003-02-13 Applied Materials, Inc. An Apparatus For Annealing Substrates In Physical Vapor Deposition Systems
KR100443121B1 (ko) * 2001-11-29 2004-08-04 삼성전자주식회사 반도체 공정의 수행 방법 및 반도체 공정 장치

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008277779A (ja) * 2007-04-06 2008-11-13 Canon Inc 雰囲気置換方法
JP2011091160A (ja) * 2009-10-21 2011-05-06 Ulvac Japan Ltd 基板搬送装置及び基板処理装置
JP2011228397A (ja) * 2010-04-16 2011-11-10 Hitachi High-Technologies Corp 真空処理装置

Also Published As

Publication number Publication date
US20060207680A1 (en) 2006-09-21

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