JP2006253312A - プラズマ処理装置 - Google Patents

プラズマ処理装置 Download PDF

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Publication number
JP2006253312A
JP2006253312A JP2005065828A JP2005065828A JP2006253312A JP 2006253312 A JP2006253312 A JP 2006253312A JP 2005065828 A JP2005065828 A JP 2005065828A JP 2005065828 A JP2005065828 A JP 2005065828A JP 2006253312 A JP2006253312 A JP 2006253312A
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JP
Japan
Prior art keywords
dielectric
conductive layer
plasma processing
support member
processing apparatus
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Pending
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JP2005065828A
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English (en)
Japanese (ja)
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JP2006253312A5 (https=
Inventor
Shinsuke Oka
信介 岡
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to JP2005065828A priority Critical patent/JP2006253312A/ja
Publication of JP2006253312A publication Critical patent/JP2006253312A/ja
Publication of JP2006253312A5 publication Critical patent/JP2006253312A5/ja
Pending legal-status Critical Current

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  • Plasma Technology (AREA)
  • Chemical Vapour Deposition (AREA)
JP2005065828A 2005-03-09 2005-03-09 プラズマ処理装置 Pending JP2006253312A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005065828A JP2006253312A (ja) 2005-03-09 2005-03-09 プラズマ処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005065828A JP2006253312A (ja) 2005-03-09 2005-03-09 プラズマ処理装置

Publications (2)

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JP2006253312A true JP2006253312A (ja) 2006-09-21
JP2006253312A5 JP2006253312A5 (https=) 2008-04-17

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ID=37093487

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JP2005065828A Pending JP2006253312A (ja) 2005-03-09 2005-03-09 プラズマ処理装置

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009182023A (ja) * 2008-01-29 2009-08-13 Ulvac Japan Ltd 真空処理装置
JP2014160790A (ja) * 2013-01-24 2014-09-04 Tokyo Electron Ltd 基板処理装置及び載置台
JP2016191097A (ja) * 2015-03-31 2016-11-10 三菱重工食品包装機械株式会社 容器に成膜する装置および方法
KR20200094316A (ko) * 2019-01-30 2020-08-07 공주대학교 산학협력단 마이크로파를 이용한 가열장치
CN112420472A (zh) * 2019-08-23 2021-02-26 东京毅力科创株式会社 基片处理装置、基片处理装置的制造方法和维护方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0448596A (ja) * 1990-06-14 1992-02-18 Anelva Corp 真空容器のマイクロ波導入用窓
WO1998033362A1 (en) * 1997-01-29 1998-07-30 Tadahiro Ohmi Plasma device
JP2001192839A (ja) * 2000-01-04 2001-07-17 Sharp Corp プラズマプロセス装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0448596A (ja) * 1990-06-14 1992-02-18 Anelva Corp 真空容器のマイクロ波導入用窓
WO1998033362A1 (en) * 1997-01-29 1998-07-30 Tadahiro Ohmi Plasma device
JP2001192839A (ja) * 2000-01-04 2001-07-17 Sharp Corp プラズマプロセス装置

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009182023A (ja) * 2008-01-29 2009-08-13 Ulvac Japan Ltd 真空処理装置
JP2014160790A (ja) * 2013-01-24 2014-09-04 Tokyo Electron Ltd 基板処理装置及び載置台
JP2016191097A (ja) * 2015-03-31 2016-11-10 三菱重工食品包装機械株式会社 容器に成膜する装置および方法
KR20200094316A (ko) * 2019-01-30 2020-08-07 공주대학교 산학협력단 마이크로파를 이용한 가열장치
KR102155579B1 (ko) * 2019-01-30 2020-09-14 공주대학교 산학협력단 마이크로파를 이용한 가열장치
CN112420472A (zh) * 2019-08-23 2021-02-26 东京毅力科创株式会社 基片处理装置、基片处理装置的制造方法和维护方法
CN112420472B (zh) * 2019-08-23 2024-05-31 东京毅力科创株式会社 基片处理装置、基片处理装置的制造方法和维护方法

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