JP2006245561A - 放熱金属表面の薄膜構造およびその製造方法 - Google Patents

放熱金属表面の薄膜構造およびその製造方法 Download PDF

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Publication number
JP2006245561A
JP2006245561A JP2006027578A JP2006027578A JP2006245561A JP 2006245561 A JP2006245561 A JP 2006245561A JP 2006027578 A JP2006027578 A JP 2006027578A JP 2006027578 A JP2006027578 A JP 2006027578A JP 2006245561 A JP2006245561 A JP 2006245561A
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JP
Japan
Prior art keywords
heat dissipation
thin film
heat
metal body
diamond
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006027578A
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English (en)
Japanese (ja)
Inventor
Ming-Hang Hwang
明漢 黄
Yu-Chiang Cheng
裕強 鄭
Chao-Yi Chen
兆逸 陳
Hsin-Lung Kuo
欣▲りゅう▼ 郭
Bin-Wei Lee
秉蔚 李
惟中 ▲しょう▼
Wei-Chung Hsiao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Getac Technology Corp
Original Assignee
Mitac Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitac Technology Corp filed Critical Mitac Technology Corp
Publication of JP2006245561A publication Critical patent/JP2006245561A/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3732—Diamonds
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
JP2006027578A 2005-03-02 2006-02-03 放熱金属表面の薄膜構造およびその製造方法 Pending JP2006245561A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094106361A TW200632128A (en) 2005-03-02 2005-03-02 Heat dissipation metal of surface plating film structure and manufacturing method thereof

Publications (1)

Publication Number Publication Date
JP2006245561A true JP2006245561A (ja) 2006-09-14

Family

ID=36848306

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006027578A Pending JP2006245561A (ja) 2005-03-02 2006-02-03 放熱金属表面の薄膜構造およびその製造方法

Country Status (3)

Country Link
JP (1) JP2006245561A (de)
DE (1) DE102006007527A1 (de)
TW (1) TW200632128A (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105386003A (zh) * 2015-12-02 2016-03-09 哈尔滨工业大学 一种三维结构石墨烯增强铜基复合材料的制备方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160021788A1 (en) * 2014-07-16 2016-01-21 General Electric Company Electronic device assembly

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105386003A (zh) * 2015-12-02 2016-03-09 哈尔滨工业大学 一种三维结构石墨烯增强铜基复合材料的制备方法
CN105386003B (zh) * 2015-12-02 2018-01-30 哈尔滨工业大学 一种三维结构石墨烯增强铜基复合材料的制备方法

Also Published As

Publication number Publication date
TW200632128A (en) 2006-09-16
DE102006007527A1 (de) 2006-09-07

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