US20120211203A1 - Heat Dissipating Apparatus and Method for Improving the Same - Google Patents

Heat Dissipating Apparatus and Method for Improving the Same Download PDF

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Publication number
US20120211203A1
US20120211203A1 US13/398,985 US201213398985A US2012211203A1 US 20120211203 A1 US20120211203 A1 US 20120211203A1 US 201213398985 A US201213398985 A US 201213398985A US 2012211203 A1 US2012211203 A1 US 2012211203A1
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United States
Prior art keywords
heat
dissipating
absorbing part
insulating section
dissipating apparatus
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Abandoned
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US13/398,985
Inventor
Yu-Wei Chang
Chao-Tsai Chung
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Pegatron Corp
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Pegatron Corp
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Assigned to PEGATRON CORPORATION reassignment PEGATRON CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHANG, YU-WEI, CHUNG, CHAO-TSAI
Publication of US20120211203A1 publication Critical patent/US20120211203A1/en
Abandoned legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • This invention relates to a heat dissipating apparatus and, more particularly, to a heat dissipating apparatus and a method for improving the same.
  • the electronic apparatus tend towards the thin-type.
  • the trend of a computer main body or a notebook is to make it lighter and thinner.
  • the thinner electronic apparatus not only save the occupied space but also can facilitate carry and operation for a user.
  • the heat dissipating module includes a copper block for contacting a chip of the electronic apparatus, an elastic sheet, a heat pipe, a fin, and a fan, and therefore the assembly height of the heat dissipating elements including the chip, the copper block, the elastic sheet, and the heat pipe is too high. Containing space of the electronic apparatus has to be increased to contain the assembled heat dissipating elements. Accordingly, the volume of the electronic apparatus is increased, thus deviating from the appeal of thin-type electronic apparatus.
  • eccentric technology may be used. That is, the copper block for contacting the heat source extends to be connected with the heat pipe, thus allowing the heat pipe not to be stacked over the heat source. Although the height can be reduced, large thermal resistance is generated between two extending end points of the copper block, thus deteriorating the heat transfer efficiency of the heat dissipating module.
  • one embodiment of the invention provides a heat dissipating apparatus for contacting a heat source.
  • the heat dissipating apparatus includes a heat pipe.
  • the heat pipe includes a heat-insulating section, a heat-absorbing part, and a heat-dissipating part.
  • the heat-absorbing part is connected with one end of the heat-insulating section.
  • the heat-absorbing part for contacting the heat source is thinner than the heat-insulating section.
  • the heat-dissipating part is connected with the other end of the heat-insulating section.
  • the heat-absorbing part may be formed by punching one end of the heat-insulating section thus to form a solid sheet.
  • the heat dissipating apparatus may further include a fin disposed at the heat-dissipating part.
  • the fin may be formed by extending the heat-dissipating part.
  • the heat dissipating apparatus may further include a fastening portion fastening the heat-absorbing part on the heat source.
  • the embodiment of the invention further provides a method for improving a heat dissipating apparatus.
  • the method includes the following steps.
  • a heat pipe is provided. One end of the heat pipe is punched to form a heat-absorbing part, and the other end of the heat pipe is a heat-dissipating part.
  • a heat-insulating section is formed between the heat-dissipating part and the heat-absorbing part, and the heat-absorbing part is thinner than the heat-insulating section.
  • the heat-absorbing part is contact with a heat source thus to cool the heat source.
  • the heat-absorbing part in the step of punching the heat pipe, may form a solid sheet.
  • the method may further include a step of providing a fin disposed at the heat-dissipating part.
  • the fin may be formed by extending the heat-dissipating part.
  • the method may further include a step of providing a fastening portion fastening the heat-absorbing part on the heat source.
  • one end of the heat-insulating section is punched to form a heat-absorbing part, and the heat-absorbing part forms a solid sheet, thus allowing the heat-absorbing part is thinner than the heat-insulating section. Accordingly, the assembly height of the heat dissipating apparatus can be reduced. Since the heat-absorbing part is punched to form the solid sheet, the strength of the heat-absorbing part can be enhanced, thus replacing the conventional copper block while the heat dissipation efficiency is not deteriorated.
  • FIG. 1 is a schematic diagram showing a heat pipe according to one embodiment of the invention
  • FIG. 2 is a schematic diagram showing a heat-absorbing part and a heat-insulating section according to one embodiment of the invention
  • FIG. 3 is an exploded diagram showing a heat dissipating apparatus according to one embodiment of the invention.
  • FIG. 4 is an overall structure diagram showing a heat dissipating apparatus according to one embodiment of the invention.
  • FIG. 5 is a flow chart showing a method for improving a heat dissipating apparatus according to one embodiment of the invention.
  • FIG. 1 is a schematic diagram showing a heat pipe according to one embodiment of the invention.
  • a heat dissipating apparatus according to the embodiment of the invention is used for contacting a heat source.
  • the heat dissipating apparatus includes a heat pipe 10 including a heat-insulating section 20 , a heat-absorbing part 30 , and a heat-dissipating part 40 .
  • FIG. 2 is a schematic diagram showing a heat-absorbing part and a heat-insulating section according to one embodiment of the invention. Please refer to FIG. 1 and FIG. 2 together.
  • the heat-insulating section 20 is about strip-shaped.
  • the heat-insulating section 20 is flat.
  • the invention is not limited thereto.
  • the heat-insulating section 20 can be cylindrical.
  • the heat-insulating section 20 may be a tubular vacuum-sealed casing, and the inner wall of the casing has capillary structure such as sintered powder, groove structure, or mesh structure.
  • the heat-insulating section 20 may be made of metal such as copper, aluminum, or other material with high thermal conductivity.
  • the heat-absorbing part 30 is connected with one end of the heat-insulating section 20 .
  • the heat-absorbing part 30 is formed by punching one end of the heat-insulating section 20 , thus allowing the heat-absorbing part 30 to be thinner than the heat-insulating section 20 .
  • the heat-insulating section 20 is flat, and one end of the heat-insulating section 20 is punched by an external force to compress the interior space of the tubular casing until no interior space is remained, thus forming a solid sheet. Accordingly, the heat-absorbing part 30 is thin than the heat-insulating section 20 .
  • the heat-dissipating part 40 is about strip-shaped, and it is connected with the other end of the heat-insulating section 20 . Accordingly, one end of the heat-insulating section 20 is the heat-absorbing part 30 , and the other end is the heat-dissipating part 40 .
  • the heat-dissipating part 40 and the heat-insulating section 20 are integrally formed, and the aforementioned heat-absorbing part 30 and the heat-insulating section 20 are also integrally formed.
  • the heat-dissipating part 40 may be formed by bending the other end of the heat-insulating section 20 .
  • the heat-dissipating part 40 and the heat-insulating section 20 are at two sides of the bent portion, respectively, thus allowing the heat-dissipating part 40 and the heat-insulating section 20 to form an L-shaped object.
  • the heat dissipating apparatus further includes fins 50 disposed at the heat-dissipating part 40 .
  • the fins 50 may also be made of material with high thermal conductivity, and they are arranged at regular intervals.
  • the fins 50 may be formed by extending the heat-dissipating part 40 .
  • the invention is not limited thereto.
  • FIG. 3 is an exploded diagram showing a heat dissipating apparatus according to one embodiment of the invention.
  • FIG. 4 is an overall structure diagram showing a heat dissipating apparatus according to one embodiment of the invention. Please refer to FIG. 3 and FIG. 4 together.
  • a fastening portion 60 is rectangle. Part of one surface of the fastening portion 60 is recessed thus to allow the corresponding part of the opposite surface to be protruded. Accordingly, the fastening portion 60 is U-shaped.
  • the heat-absorbing part 30 may be fastened at the recessed portion of the U-shaped fastening portion 60 . Further, the fastening portion 60 may extend to form brackets 61 .
  • the number of the bracket 61 may be four, and the four brackets 61 are at four end points of the fastening portion 60 , respectively, thus forming a cross. Accordingly, the heat-absorbing part 30 can be fastened on the heat source by the brackets 61 .
  • the invention is not limited thereto. All the apparatus which fasten the heat-absorbing part 30 are within the scope of this invention.
  • the aforementioned heat source may be a chip of a computer or other electronic elements. However, the invention is not limited thereto.
  • FIG. 5 is a flow chart showing a method for improving a heat dissipating apparatus according to one embodiment of the invention. Please refer to FIG. 5 .
  • the method includes the following steps.
  • step 501 a heat pipe is provided.
  • the heat pipe 10 (please refer to FIG. 1 ) is about strip-shaped and is a bit flat. However, the invention is not limited thereto.
  • the heat pipe 10 can also be cylindrical.
  • the heat pipe 10 may be a tubular vacuum-sealed casing, and the inner wall of the casing has capillary structure such as sintered powder, groove structure, or mesh structure.
  • step 502 one end of the heat pipe is punched to form a heat-absorbing part, and the other end of the heat pipe is a heat-dissipating part.
  • a heat-insulating section is formed between the heat-dissipating part and the heat-absorbing part.
  • the heat-absorbing part is thinner than the heat-insulating section.
  • the heat pipe 10 mainly includes the heat-insulating section 20 , the heat-absorbing part 30 , and the heat-dissipating part 40 .
  • One end of the heat pipe 10 forms the heat-absorbing part 30 , while the other end forms the heat-dissipating part 40 , thus allowing the heat-insulating section 20 to be located between the heat-dissipating part 40 and the heat-absorbing part 30 .
  • the heat-absorbing part 30 , the heat-insulating section 20 , and the heat-dissipating part 40 are integrally formed.
  • the heat-absorbing part 30 is punched by an external force to compress the interior space of the tubular casing until no interior space is remained, thus forming a solid sheet. Accordingly, the heat-absorbing part 30 is thinner than the heat-insulating section 20 .
  • the method further includes the step of providing a fin disposed at the heat-dissipating part.
  • the fins 50 are disposed at the heat-dissipating part 40 .
  • the fins 50 can be made of material with high thermal conductivity, and they are arranged at regular intervals.
  • the fins 50 may be formed by extending the heat-dissipating part 40 .
  • the invention is not limited thereto.
  • step 503 the heat-absorbing part contacts a heat source thus to cool the heat source.
  • the heat-absorbing part 30 contacts the heat source which may be a chip of a computer or other electronic elements.
  • the invention is not limited thereto.
  • heat can be transferred to the heat-dissipating part 40 thus to cool the heat source.
  • step 504 a fastening portion is provided to fasten the heat-absorbing part on the heat source.
  • the heat-absorbing part 30 can be fastened at the recessed portion of the U-shaped fastening portion 60 , and then the heat-absorbing part is fastened on the heat source for contacting the heat source.
  • the heat-insulating section can be filled with some liquid such as water, alcohol, acetone and so on.
  • the liquid changes into vapor when the liquid is heated at the heat-absorbing part, and thus heat is lost due to the latent heat of the phase change of the vapor.
  • the vapor can be condensed to the liquid due to the exothermic reaction of the vapor at the heat-dissipating part and the enhancement of the fin, and further the liquid can circulate again by the gravity or the capillary force in the tubular casing.
  • the heat-absorbing part is punched to form a flat solid sheet, and therefore the thickness of the heat-absorbing part can be reduced and the strength can be enhanced. Accordingly, the heat-absorbing part can replace the conventional copper block while the heat dissipation efficiency is not deteriorated. Further, the assembly height of the heat dissipating apparatus can be reduced since the conventional copper block is no longer needed.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat dissipating apparatus and a method for improving the same are provided. The heat dissipating apparatus includes a heat pipe including a heat-insulating section, a heat-absorbing part, and a heat-dissipating part. The heat-absorbing part is connected with one end of the heat-insulating section. The heat-absorbing part for contacting a heat source is thinner than the heat-insulating section. The heat-dissipating part is connected with the other end of the heat-insulating section.

Description

    CROSS-REFERENCE TO RELATED APPLICATIONS
  • This Non-provisional application claims priority under 35 U.S.C. §119(a) on Patent Application No(s). 100105812 filed in Taiwan, Republic of China on Feb. 22, 2011, the entire contents of which are hereby incorporated by reference.
    • BACKGROUND
  • 1. Technology Field
  • This invention relates to a heat dissipating apparatus and, more particularly, to a heat dissipating apparatus and a method for improving the same.
  • 2. Description of the Related Art
  • As technology develops, all the electronic apparatus tend towards the thin-type. For example, the trend of a computer main body or a notebook is to make it lighter and thinner. The thinner electronic apparatus not only save the occupied space but also can facilitate carry and operation for a user.
  • In addition, to improve the heat dissipation effect, most of notebooks or other electronic apparatus have heat dissipating modules. However, heat dissipation is a great problem when the electronic apparatus such as a notebook tends towards the thin-type. Generally, the heat dissipating module includes a copper block for contacting a chip of the electronic apparatus, an elastic sheet, a heat pipe, a fin, and a fan, and therefore the assembly height of the heat dissipating elements including the chip, the copper block, the elastic sheet, and the heat pipe is too high. Containing space of the electronic apparatus has to be increased to contain the assembled heat dissipating elements. Accordingly, the volume of the electronic apparatus is increased, thus deviating from the appeal of thin-type electronic apparatus.
  • To reduce the assembly height of the heat dissipating module, eccentric technology may be used. That is, the copper block for contacting the heat source extends to be connected with the heat pipe, thus allowing the heat pipe not to be stacked over the heat source. Although the height can be reduced, large thermal resistance is generated between two extending end points of the copper block, thus deteriorating the heat transfer efficiency of the heat dissipating module.
    • SUMMARY
  • Accordingly, one embodiment of the invention provides a heat dissipating apparatus for contacting a heat source. The heat dissipating apparatus includes a heat pipe. The heat pipe includes a heat-insulating section, a heat-absorbing part, and a heat-dissipating part. The heat-absorbing part is connected with one end of the heat-insulating section. The heat-absorbing part for contacting the heat source is thinner than the heat-insulating section. The heat-dissipating part is connected with the other end of the heat-insulating section.
  • In one embodiment, the heat-absorbing part may be formed by punching one end of the heat-insulating section thus to form a solid sheet.
  • In one embodiment, the heat dissipating apparatus may further include a fin disposed at the heat-dissipating part. The fin may be formed by extending the heat-dissipating part.
  • In one embodiment, the heat dissipating apparatus may further include a fastening portion fastening the heat-absorbing part on the heat source.
  • The embodiment of the invention further provides a method for improving a heat dissipating apparatus. The method includes the following steps. A heat pipe is provided. One end of the heat pipe is punched to form a heat-absorbing part, and the other end of the heat pipe is a heat-dissipating part. A heat-insulating section is formed between the heat-dissipating part and the heat-absorbing part, and the heat-absorbing part is thinner than the heat-insulating section. The heat-absorbing part is contact with a heat source thus to cool the heat source.
  • In one embodiment, in the step of punching the heat pipe, the heat-absorbing part may form a solid sheet.
  • In one embodiment, after the step of providing the heat pipe, the method may further include a step of providing a fin disposed at the heat-dissipating part. The fin may be formed by extending the heat-dissipating part.
  • In one embodiment, after the step of allowing the heat-absorbing part to contact the heat source, the method may further include a step of providing a fastening portion fastening the heat-absorbing part on the heat source.
  • According to the method for improving a heat dissipating apparatus, one end of the heat-insulating section is punched to form a heat-absorbing part, and the heat-absorbing part forms a solid sheet, thus allowing the heat-absorbing part is thinner than the heat-insulating section. Accordingly, the assembly height of the heat dissipating apparatus can be reduced. Since the heat-absorbing part is punched to form the solid sheet, the strength of the heat-absorbing part can be enhanced, thus replacing the conventional copper block while the heat dissipation efficiency is not deteriorated.
  • These and other features, aspects, and advantages of the present invention will become better understood with regard to the following description, appended claims, and accompanying drawings.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a schematic diagram showing a heat pipe according to one embodiment of the invention;
  • FIG. 2 is a schematic diagram showing a heat-absorbing part and a heat-insulating section according to one embodiment of the invention;
  • FIG. 3 is an exploded diagram showing a heat dissipating apparatus according to one embodiment of the invention;
  • FIG. 4 is an overall structure diagram showing a heat dissipating apparatus according to one embodiment of the invention; and
  • FIG. 5 is a flow chart showing a method for improving a heat dissipating apparatus according to one embodiment of the invention.
    •  DETAILED DESCRIPTION
  • FIG. 1 is a schematic diagram showing a heat pipe according to one embodiment of the invention. A heat dissipating apparatus according to the embodiment of the invention is used for contacting a heat source. The heat dissipating apparatus includes a heat pipe 10 including a heat-insulating section 20, a heat-absorbing part 30, and a heat-dissipating part 40.
  • FIG. 2 is a schematic diagram showing a heat-absorbing part and a heat-insulating section according to one embodiment of the invention. Please refer to FIG. 1 and FIG. 2 together. The heat-insulating section 20 is about strip-shaped. For example, in the embodiment, the heat-insulating section 20 is flat. However, the invention is not limited thereto. In other embodiments, the heat-insulating section 20 can be cylindrical. Further, the heat-insulating section 20 may be a tubular vacuum-sealed casing, and the inner wall of the casing has capillary structure such as sintered powder, groove structure, or mesh structure. Preferably, the heat-insulating section 20 may be made of metal such as copper, aluminum, or other material with high thermal conductivity.
  • The heat-absorbing part 30 is connected with one end of the heat-insulating section 20. Preferably, the heat-absorbing part 30 is formed by punching one end of the heat-insulating section 20, thus allowing the heat-absorbing part 30 to be thinner than the heat-insulating section 20. In this embodiment, the heat-insulating section 20 is flat, and one end of the heat-insulating section 20 is punched by an external force to compress the interior space of the tubular casing until no interior space is remained, thus forming a solid sheet. Accordingly, the heat-absorbing part 30 is thin than the heat-insulating section 20.
  • The heat-dissipating part 40 is about strip-shaped, and it is connected with the other end of the heat-insulating section 20. Accordingly, one end of the heat-insulating section 20 is the heat-absorbing part 30, and the other end is the heat-dissipating part 40. In this embodiment, the heat-dissipating part 40 and the heat-insulating section 20 are integrally formed, and the aforementioned heat-absorbing part 30 and the heat-insulating section 20 are also integrally formed. However, the invention is not limited thereto. Further, the heat-dissipating part 40 may be formed by bending the other end of the heat-insulating section 20. The heat-dissipating part 40 and the heat-insulating section 20 are at two sides of the bent portion, respectively, thus allowing the heat-dissipating part 40 and the heat-insulating section 20 to form an L-shaped object. In the embodiment, the heat dissipating apparatus further includes fins 50 disposed at the heat-dissipating part 40. The fins 50 may also be made of material with high thermal conductivity, and they are arranged at regular intervals. The fins 50 may be formed by extending the heat-dissipating part 40. However, the invention is not limited thereto.
  • FIG. 3 is an exploded diagram showing a heat dissipating apparatus according to one embodiment of the invention. FIG. 4 is an overall structure diagram showing a heat dissipating apparatus according to one embodiment of the invention. Please refer to FIG. 3 and FIG. 4 together. A fastening portion 60 is rectangle. Part of one surface of the fastening portion 60 is recessed thus to allow the corresponding part of the opposite surface to be protruded. Accordingly, the fastening portion 60 is U-shaped. The heat-absorbing part 30 may be fastened at the recessed portion of the U-shaped fastening portion 60. Further, the fastening portion 60 may extend to form brackets 61. In this embodiment, the number of the bracket 61 may be four, and the four brackets 61 are at four end points of the fastening portion 60, respectively, thus forming a cross. Accordingly, the heat-absorbing part 30 can be fastened on the heat source by the brackets 61. However, the invention is not limited thereto. All the apparatus which fasten the heat-absorbing part 30 are within the scope of this invention. Further, the aforementioned heat source may be a chip of a computer or other electronic elements. However, the invention is not limited thereto.
  • FIG. 5 is a flow chart showing a method for improving a heat dissipating apparatus according to one embodiment of the invention. Please refer to FIG. 5. In this embodiment, the method includes the following steps.
  • In step 501, a heat pipe is provided.
  • The heat pipe 10 (please refer to FIG. 1) is about strip-shaped and is a bit flat. However, the invention is not limited thereto. The heat pipe 10 can also be cylindrical. The heat pipe 10 may be a tubular vacuum-sealed casing, and the inner wall of the casing has capillary structure such as sintered powder, groove structure, or mesh structure.
  • In step 502, one end of the heat pipe is punched to form a heat-absorbing part, and the other end of the heat pipe is a heat-dissipating part. A heat-insulating section is formed between the heat-dissipating part and the heat-absorbing part. The heat-absorbing part is thinner than the heat-insulating section.
  • The heat pipe 10 mainly includes the heat-insulating section 20, the heat-absorbing part 30, and the heat-dissipating part 40. One end of the heat pipe 10 forms the heat-absorbing part 30, while the other end forms the heat-dissipating part 40, thus allowing the heat-insulating section 20 to be located between the heat-dissipating part 40 and the heat-absorbing part 30. Further, preferably, the heat-absorbing part 30, the heat-insulating section 20, and the heat-dissipating part 40 are integrally formed. However, the invention is not limited thereto. The heat-absorbing part 30 is punched by an external force to compress the interior space of the tubular casing until no interior space is remained, thus forming a solid sheet. Accordingly, the heat-absorbing part 30 is thinner than the heat-insulating section 20.
  • Further, after the step 501 of providing the heat pipe, the method further includes the step of providing a fin disposed at the heat-dissipating part.
  • In this embodiment, the fins 50 are disposed at the heat-dissipating part 40. The fins 50 can be made of material with high thermal conductivity, and they are arranged at regular intervals. The fins 50 may be formed by extending the heat-dissipating part 40. However, the invention is not limited thereto.
  • In step 503, the heat-absorbing part contacts a heat source thus to cool the heat source.
  • In this embodiment, the heat-absorbing part 30 contacts the heat source which may be a chip of a computer or other electronic elements. However, the invention is not limited thereto. When the heat-absorbing part 30 contacts the heat source, heat can be transferred to the heat-dissipating part 40 thus to cool the heat source.
  • In step 504, a fastening portion is provided to fasten the heat-absorbing part on the heat source.
  • In this embodiment, the heat-absorbing part 30 can be fastened at the recessed portion of the U-shaped fastening portion 60, and then the heat-absorbing part is fastened on the heat source for contacting the heat source.
  • In the embodiments of the invention, the heat-insulating section can be filled with some liquid such as water, alcohol, acetone and so on. The liquid changes into vapor when the liquid is heated at the heat-absorbing part, and thus heat is lost due to the latent heat of the phase change of the vapor. The vapor can be condensed to the liquid due to the exothermic reaction of the vapor at the heat-dissipating part and the enhancement of the fin, and further the liquid can circulate again by the gravity or the capillary force in the tubular casing. The heat-absorbing part is punched to form a flat solid sheet, and therefore the thickness of the heat-absorbing part can be reduced and the strength can be enhanced. Accordingly, the heat-absorbing part can replace the conventional copper block while the heat dissipation efficiency is not deteriorated. Further, the assembly height of the heat dissipating apparatus can be reduced since the conventional copper block is no longer needed.
  • Although the present invention has been described in considerable detail with reference to certain preferred embodiments thereof, the disclosure is not for limiting the scope of the invention. Persons having ordinary skill in the art may make various modifications and changes without departing from the scope and spirit of the invention. Therefore, the scope of the appended claims should not be limited to the description of the preferred embodiments described above.

Claims (13)

1. A heat dissipating apparatus for contacting a heat source, comprising:
a heat pipe including:
a heat-insulating section;
a heat-absorbing part connected with one end of the heat-insulating section, the heat-absorbing part for contacting the heat source being thinner than the heat-insulating section; and
a heat-dissipating part connected with the other end of the heat-insulating section.
2. The heat dissipating apparatus according to claim 1, wherein the heat-absorbing part is a solid sheet.
3. The heat dissipating apparatus according to claim 1, further comprising a fin disposed at the heat-dissipating part.
4. The heat dissipating apparatus according to claim 1, further comprising a fin disposed at the heat-dissipating part.
5. The heat dissipating apparatus according to claim 1, wherein the heat-absorbing part, the heat-insulating section, and the heat-dissipating part are integrally formed.
6. The heat dissipating apparatus according to claim 1, further comprising a fastening portion fastening the heat-absorbing part on the heat source.
7. The heat dissipating apparatus according to claim 1, wherein the heat-absorbing part is formed by punching one end of the heat-insulating section.
8. A method for improving a heat dissipating apparatus, comprising the following steps of:
providing a heat pipe;
punching one end of the heat pipe to form a heat-absorbing part, the other end of the heat pipe being a heat-dissipating part, a heat-insulating section formed between the heat-dissipating part and the heat-absorbing part, wherein the heat-absorbing part is thinner than the heat-insulating section; and
contacting a heat source with the heat-absorbing part to cool the heat source.
9. The method for improving a heat dissipating apparatus according to claim 8, wherein in the step of punching the heat pipe, the heat-absorbing part forms a solid sheet.
10. The method for improving a heat dissipating apparatus according to claim 8, after the step of providing the heat pipe, further comprising a step of providing a fin disposed at the heat-dissipating part.
11. The method for improving a heat dissipating apparatus according to claim 10, wherein the fin is formed by extending the heat-dissipating part.
12. The method for improving a heat dissipating apparatus according to claim 8, after the step of allowing the heat-absorbing part to contact the heat source, further comprising a step of providing a fastening portion fastening the heat-absorbing part on the heat source.
13. The method for improving a heat dissipating apparatus according to claim 8, wherein the heat-absorbing part, the heat-insulating section, and the heat-dissipating part are integrally formed.
US13/398,985 2011-02-22 2012-02-17 Heat Dissipating Apparatus and Method for Improving the Same Abandoned US20120211203A1 (en)

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US20190166721A1 (en) * 2017-10-26 2019-05-30 Chiun Mai Communication Systems, Inc. Heat dissipation structure and electronic device having the same
US20220369512A1 (en) * 2021-05-12 2022-11-17 Lenovo (Singapore) Pte. Ltd. Electronic apparatus, cooling device, and method for manufacturing cooling device

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US20170167799A1 (en) * 2015-12-14 2017-06-15 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Heat pipe and method to embed a heat pipe in a product
US10883769B2 (en) * 2015-12-14 2021-01-05 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Heat pipe and method to embed a heat pipe in a product
US20190166721A1 (en) * 2017-10-26 2019-05-30 Chiun Mai Communication Systems, Inc. Heat dissipation structure and electronic device having the same
US10555438B2 (en) * 2017-10-26 2020-02-04 Chiun Mai Communication Systems, Inc. Heat dissipation structure and electronic device having the same
US20220369512A1 (en) * 2021-05-12 2022-11-17 Lenovo (Singapore) Pte. Ltd. Electronic apparatus, cooling device, and method for manufacturing cooling device
US11963333B2 (en) * 2021-05-12 2024-04-16 Lenovo (Singapore) Pte. Ltd. Electronic apparatus, cooling device, and method for manufacturing cooling device

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