201235823 六、發明說明： 【發明所屬之技術領域】 一種散熱器結構，特別是一種沖壓形成之散熱器結構及其改良方法。 【先前技術】 隨著科技的進步，所有電子裝置的發展趨勢皆為朝向薄型化的方向發 展，例如電腦主機或是筆記型電腦亦朝向輕巧及薄型化的體積發展。於此 同時，藉由這些薄型化的電子裝置，對於使用者來說，不僅可節省電子裝 置所占據之空間，亦方便使用者的攜帶與操作。 籲 ‘然目前市面上之電子裝置，如筆記型電腦雖為朝向薄型化的趨勢，但 其筆記型電腦之散熱問題為朝向薄型化發展之一大阻礙。其原因在於為改 良並增加筆記型電腦之散熱功效，因此大部份筆記型電腦或其他電子裝置 皆會加裝散熱雜組，用以增進電子裝置之散熱功效…般筆記型電腦的 散熱模組包含了與電子袭置中晶片接觸之銅塊、彈片、熱管、散熱籍片及 風扇等。因此’在組裝雜巾晶片、峨、彈片、絲等之散件其 組裝之堆疊會過高’而使電子裝置必須加大其容易空間才能包覆組裝過後 的散熱元件。基此，電子裝置整體反而形成體積增大之㈣，而與達到薄 形化產品之訴求相違背。 為了解決散熱模組堆疊過高之問題，亦有利用偏心形裝置之技術降低 其堆疊高度，亦即將與細_之銅塊延伸出另1來連接歸，而使熱 管不與熱源相互堆疊。《雖能直接齡堆疊之高度，但是其在銅塊延伸 之兩端點之生相當大之熱阻，因此，㉞形之妓雖織降低其堆疊 高度，但同時也犧牲了散熱模組的熱傳性能。 201235823 因此，如何改良散熱模組之堆疊高度，使其可增進在薄型化發展上的 便利丨生射b同時保有良好之散熱功效，係為本案之發明人以及從事此相 關行業之技術領域者盈欲改善的課題。 【發明内容】 有鑑於此’本發明提出一種散熱器結構，用以接觸熱源，散熱器結構 包3熱管’其巾熱管包含絕熱段、受熱端及賴端。受熱端由絕熱段之一 端經由沖Μ而形成，受熱端之厚度小於絕熱段之厚度，用以接觸熱源；散 熱端連接於絕熱段。其中，受熱端經由絕熱段之—端沖壓而形成，並且形 成實心片體。 此外，本發明實施例更包含鰭片，位於散熱端。其中鰭片由散熱端延 伸而成。以及扣合部，扣合受熱端於熱源。 本發明亦提出-赚熱器結構改良方法，包含：提供熱管；沖壓熱管 之-端形成受熱端，熱管之另-端為散熱端，散熱端與受熱端之間為絕熱 段’其中，受熱端之厚度小於絕熱段之厚度；及以受熱端接觸熱源而對熱 源進行散熱。其中，㈣壓熱管之步射，受熱端沖壓成實心片體。 於本發明實施例中’於提供熱管之步驟後，更包含：提供縛片，設置 於散熱端。其中則由散熱端延伸而成。於以受熱端接難源之步驟後， 更包含：提供扣合部’扣合受熱端於熱源。 本發明之散熱腿構改良方法藉她熱段之—端沖壓而形成受妖端， 並且受熱端沖壓而形成實心片體’使受熱端之厚度小於絕熱段之厚度。因 而能降低散熱器結構在組裝上的高度。並且藉由沖壓受熱端形成實心片 201235823 而保有 體’不僅能增加受熱端之強度，亦能取代習知技術中銅塊之功能 良好之散熱效果。 ’其内容足以 且根據本說明 以下在實施方式中詳細敘述本發明之詳細特徵以及優點 使任何熟悉相關技藝者瞭解本發明之技術内容並據以實施， 書所揭露之内容、申請專利範圍及圖式，任何熟習相關技藝者可輕易地理 解本發明相關之目的及優點。 【實施方式】 請參閱第！圖所示，第i圖為本發明熱管之示意圖。其係本發明所揭 露之一種散熱器結構，用以接觸一熱源，包含熱管10，其中熱管1〇包含有 絕熱段20、受熱端30及散熱端40。 請參閱第1及第2圖所示，第i圖為本發明熱管之示意圖，第2圖為 本發明受熱端與絕熱段之示意圖。絕熱段2〇為概呈長條狀之結構，以本發 明而言，絕熱段20為略呈爲平狀’但本發明並非以此為限，絕熱段2〇之 形狀更可為圓柱狀。此外，絕熱段2〇主要係為真空密封之管形殼體其殼 籲體内壁上設置有毛細結構’例如粉體燒結物、溝槽結構及絲網結構等。惟 則所述之絕熱段2〇較佳地可為金屬所製成，例如銅、紹或是其它熱導良性 佳之材質。 党熱端30連接於絕熱段20的—端，其較佳地係由絕熱段2〇之一端經 由沖壓而形成，使得受熱端3〇之厚度小於絕熱段2()之厚度^本發明而 言，絕熱端20係為扁平狀，基此，再將祕端2()之—端以外力沖塵方式 壓扁’使其麵殼翻舰無郎而呈實㈣體，基此，受熱端3〇呈 現出之厚度將小於絕熱段20。 201235823 散熱端40為概呈長條狀之結構，連接於絕熱段2〇的另一端，使得絕 20端為乂熱端3〇，另—端為散熱端4〇。以本發明而言，散熱端 ’前述之钱端3G亦為與絕触2() 一體成 里仁本發明並非以此為限。基此，本發明之散熱端係由絕熱段如之 另端f折而形成’由彎折處區分成散熱端*與絕熱段2〇兩段，使得散 熱端40與絕熱段2〇為概呈L之形狀。再者，本發明更具有縛片％，位於 散熱端40上’鰭片5〇同樣可由熱導良性佳之材質所製成，並呈相間隔排 列之結構。其巾’鰭y 5G亦可由散熱端延伸喊，但本發明並非以此 為限》 . 睛參閱第3及第4圖所示’第3圖為本發明實施例之分解圖，第4圖 為本發明之整體結細。扣合部6G，為概呈細之結構。其巾扣合部6〇之 面部份為内凹處，而使另—面呈凸出狀。基此，扣合部⑹為概呈门字型 、’。構藉由门子型内凹處而將受熱端3〇扣合於此内凹處。此外，扣合部仞 之外側可延伸出扣合支件61 ’其扣合支件61之數量較佳地為四個，而分設 於扣合部60之四個端點而概呈十字之結構，基此，藉由扣合支件61扣合 受熱端3〇於熱源，但本發明並非以此為限，凡可用以扣合受熱端30皆屬 本發明之範《#。惟前所述之熱源可為電腦之晶片或是其他電子元件，但本 發明並非以此為限。 請參閱第5圖所示，第5圖係本發明散熱器結構改良方法之流程圖， 包含下列步驟： 步驟501 ·提供一熱管。 熱官1〇(參照第1圖)為概呈長條狀之結構，並且略呈扁平狀，但本發明 201235823 並非以此為限，熱管U)之形狀更可為圓枉狀。熱管1〇主要係為真空密封 之管形殼體、其殼體内壁上設置有毛細結構，例如粉體燒結物、溝槽結構 及絲網結構等。 步驟502 :沖壓熱管之-端形成受熱端，熱管之另一端為_散熱端，散 熱端與受熱端之間為絕熱段，其中，受熱端之厚度小於絕熱段之厚度。 熱管U)主要係由絕熱段20、綠端3〇及散熱端4〇所組成。其中熱 管10之-端形成受熱端30 ’而另-端則為散熱端4〇而使得絕熱端2〇位於 •散熱端4〇與受熱端3〇之間，此外，受熱端3〇、絕熱段20及散熱端40較 佳地係-體成型，但本發明並非以此為限。再者，受熱端3〇係以外力沖壓 方式壓扁，使其管形殼體内部壓縮至無空間而呈實心片體，基此，受熱端 3〇呈現出之厚度將小於絕熱段2〇。 其中於提供熱管之步驟測後，更包含：提供韓片，設置於散熱端。 本發明更具有則5G ’位於散熱端4〇上，鰭片％可由熱導良性佳之 材質所製成’並呈相間隔排列之結構，亦可由散熱端4〇延伸而成但本發 • 明並非以此為限。 步驟503 :以受熱端接觸熱源而對熱源進行散熱。 藉由受熱端30接觸熱源，熱源可為電腦之晶片或是其他電子元件，但 本發明並非以此雜’於_鱗_時_難至健端4()_以散熱。 步驟504 :提供扣合部’扣合受熱端於熱源。 藉由扣合部60门字型内凹處，而將受熱端3〇扣合於此内凹處再將 受熱端扣合於熱源上，用以接觸熱源。 本發明於絕熱段内部裝人適量之液體，例如水、乙醇、_等。流體 201235823 在受熱端受熱汽化，蒸汽流體因相變產生潛熱而能帶走A4熱能，蒸汽流 體在散熱端因玫熱作用’以及縛片加強放熱效果而冷凝成液體，並藉由重 力或管殼内之毛細力作訂而再錢續循環完成散熱效果，並且受熱 端經由沖壓而形成扁平實心，於縮減厚度同時亦增加強度，而使得受熱端 能取代習知技術中銅塊之功能，而保有良好之散熱效果，並且組裝時因為 減少了銅塊，更能降低散熱器結構在組裝上的高度。 雖然本發明的技術内容已經以較佳實施例揭露如上，然其並非用以限 定本發明’任何熟習此技藝者’在秘離本發明之精神所作些許之更動與 潤飾，皆應涵蓋於本發明的範疇内，因此本發明之保護範圍當視後附之申 請專利範圍所界定者為準。 201235823 【圖式簡單說明】 第1圖為本發明熱管之示意圖。 *· 第2圖為本發明受熱端與絕熱段之示意圖。 第3圖為本發明實施例之分解圖。 第4圖為本發明之整體結構圖。 第5圖為本發明散熱器結構改良方法之流程圖。 【主要元件符號說明】 10............熱管 20............絕熱段 30............受熱端 40............散熱端 50............鰭片 60............扣合部 61 扣合支件201235823 VI. Description of the invention: [Technical field to which the invention pertains] A heat sink structure, in particular, a heat sink structure formed by stamping and an improved method thereof. [Prior Art] With the advancement of technology, the development trend of all electronic devices is toward a thinner direction. For example, a computer mainframe or a notebook computer is also moving toward a light and thin volume. At the same time, with these thin electronic devices, the user can not only save space occupied by the electronic device, but also facilitate the carrying and operation of the user. Appealing that “the current electronic devices on the market, such as notebook computers, are trending towards thinner, but the heat dissipation problem of their notebook computers is one of the major obstacles to the development of thinning. The reason is that in order to improve and increase the heat dissipation effect of the notebook computer, most notebook computers or other electronic devices will be equipped with a heat dissipation group to enhance the heat dissipation effect of the electronic device. It includes copper blocks, shrapnel, heat pipes, heat sinks and fans that come into contact with the wafers in the electronically placed. Therefore, the assembly of the assembly of the wafer, the cymbal, the shrapnel, the wire, and the like may be too high, and the electronic device must increase its easy space to cover the assembled heat dissipating member. Based on this, the overall size of the electronic device is increased (4), which is contrary to the demand for thinning products. In order to solve the problem of excessive stacking of the heat dissipating module, the eccentric device is also used to reduce the stacking height, and the copper block is extended to be connected to the other, so that the heat pipes are not stacked with the heat source. "Although the height of the stack can be directly aged, but it has a considerable thermal resistance at the ends of the copper block extension, the 34-shaped raft reduces the stack height, but at the same time sacrifices the heat of the heat sink module. Pass performance. 201235823 Therefore, how to improve the stacking height of the heat-dissipating module, which can enhance the convenience of thinning development, and maintain good heat-dissipating effect, which is the inventor of the case and the technical field of the related industry. The subject to be improved. SUMMARY OF THE INVENTION In view of the above, the present invention provides a heat sink structure for contacting a heat source, and the heat sink structure 3 heat pipe 'the towel heat pipe includes a heat insulating portion, a heat receiving end, and a heat receiving end. The heated end is formed by punching one end of the heat insulating section, the thickness of the heated end is smaller than the thickness of the heat insulating section for contacting the heat source; and the heat radiating end is connected to the heat insulating section. Wherein, the heated end is formed by stamping the end of the adiabatic section and forming a solid sheet. In addition, the embodiment of the invention further includes a fin located at the heat dissipation end. The fins are formed by the heat dissipation end. And a fastening portion that fastens the heat receiving end to the heat source. The invention also proposes a method for improving the structure of the heat earner, comprising: providing a heat pipe; forming a heat receiving end at the end of the heat pipe, a heat radiating end at the other end of the heat pipe, and a heat insulating portion between the heat radiating end and the heat receiving end, wherein the heat receiving end The thickness is less than the thickness of the adiabatic section; and the heat source is cooled by contacting the heat source with the heat receiving end. Among them, (4) the step of the pressure heat pipe, the heated end is stamped into a solid piece. In the embodiment of the present invention, after the step of providing the heat pipe, the method further comprises: providing a binding piece disposed on the heat dissipation end. Among them, it is extended by the heat dissipation end. After the step of connecting the hard source to the heat, the method further comprises: providing the fastening portion to fasten the heat receiving end to the heat source. The heat-dissipating leg structure improving method of the present invention forms a demon end by the end-pressing of the hot section, and is pressed by the hot end to form a solid sheet body. The thickness of the heat receiving end is smaller than the thickness of the heat insulating section. Therefore, the height of the heat sink structure in assembly can be reduced. And by forming a solid piece 201235823 by stamping the heated end, the retaining body can not only increase the strength of the heated end, but also replace the function of the copper block in the prior art. DETAILED DESCRIPTION OF THE INVENTION The detailed description and advantages of the present invention are set forth in the Detailed Description of the Detailed Description of the <RTIgt; The related objects and advantages of the present invention will be readily understood by those skilled in the art. [Embodiment] Please refer to the first! In the figure, the figure i is a schematic view of the heat pipe of the present invention. It is a heat sink structure disclosed in the present invention for contacting a heat source, comprising a heat pipe 10, wherein the heat pipe 1〇 comprises a heat insulating section 20, a heat receiving end 30 and a heat radiating end 40. Referring to Figures 1 and 2, Figure ith is a schematic view of the heat pipe of the present invention, and Figure 2 is a schematic view of the heat receiving end and the heat insulating section of the present invention. The adiabatic section 2 is a substantially elongated structure. In the present invention, the adiabatic section 20 is slightly flat. However, the present invention is not limited thereto, and the shape of the adiabatic section 2 can be more cylindrical. Further, the heat insulating section 2 is mainly a vacuum-sealed tubular casing, and the shell is provided with a capillary structure such as a powder sintered body, a groove structure, and a wire mesh structure. However, the adiabatic section 2 can preferably be made of metal, such as copper, sinter or other thermally conductive material. The hot end 30 of the party is connected to the end of the insulating section 20, which is preferably formed by stamping one end of the insulating section 2〇 such that the thickness of the heated end 3〇 is less than the thickness of the insulating section 2(). The adiabatic end 20 is flat, and then the end of the secret end 2 () is squashed by a force-crushing method, so that the shell is turned over and the sturdy (four) body is formed, and the heated end 3 The thickness of the crucible will be less than the adiabatic section 20. 201235823 The heat-dissipating end 40 is a generally elongated structure connected to the other end of the heat-insulating section 2〇, so that the 20th end is the hot end 3〇, and the other end is the heat-dissipating end 4〇. In the present invention, the heat-dissipating end 'the aforementioned money end 3G is also integrated with the touch-sensitive 2(). The invention is not limited thereto. Therefore, the heat dissipating end of the present invention is formed by folding the other end of the heat insulating section, which is formed by the bending portion into a heat dissipating end* and a heat insulating section 2, so that the heat dissipating end 40 and the heat dissipating section 2 are approximate. The shape of L. Furthermore, the present invention has a % of the tabs, and is located on the heat dissipating end 40. The fins 5 can also be made of a material having good thermal conductivity and arranged in a spaced arrangement. The towel 'fin y 5G can also be shouted by the heat sink end, but the invention is not limited thereto. See Fig. 3 and Fig. 4 'Fig. 3 is an exploded view of the embodiment of the present invention, and Fig. 4 is The overall thickness of the invention is fine. The fastening portion 6G has a structure that is thin. The surface of the towel fastening portion 6 is a concave portion, and the other surface is convex. Accordingly, the engaging portion (6) is a generalized door type, '. The heated end 3〇 is fastened to the recess by the recess of the door type. In addition, the outer side of the fastening portion can extend out of the fastening support member 61'. The number of the fastening support members 61 is preferably four, and is disposed at the four end points of the fastening portion 60 to form a cross. The structure of the present invention is not limited thereto, and the present invention is not limited thereto, and any of the heat-receiving ends 30 can be used to buckle the heat-receiving end 30. However, the heat source described above may be a computer chip or other electronic component, but the invention is not limited thereto. Referring to FIG. 5, FIG. 5 is a flow chart of a method for improving the structure of the heat sink of the present invention, comprising the following steps: Step 501: Providing a heat pipe. The heat official 1〇 (refer to Fig. 1) has a substantially elongated structure and is slightly flat, but the present invention 201235823 is not limited thereto, and the shape of the heat pipe U) is more rounded. The heat pipe 1〇 is mainly a vacuum-sealed tubular casing, and the inner wall of the casing is provided with a capillary structure such as a powder sintered body, a groove structure and a wire mesh structure. Step 502: The end of the stamped heat pipe forms a heat receiving end, and the other end of the heat pipe is a heat radiating end, and the heat radiating end and the heat receiving end are an adiabatic section, wherein the thickness of the heat receiving end is smaller than the thickness of the heat insulating section. The heat pipe U) is mainly composed of a heat insulating section 20, a green end 3〇, and a heat radiating end 4〇. Wherein the end of the heat pipe 10 forms a heat receiving end 30' and the other end is a heat radiating end 4〇 such that the heat insulating end 2〇 is located between the heat radiating end 4〇 and the heat receiving end 3〇, and further, the heated end 3〇, the heat insulating section 20 and the heat dissipating end 40 are preferably system-formed, but the invention is not limited thereto. Further, the heated end 3 is crushed by a force punching method, and the inside of the tubular casing is compressed to have no space and is a solid sheet body. Therefore, the thickness of the heated end 3〇 will be smaller than that of the adiabatic section 2〇. After the step of providing the heat pipe, the method further comprises: providing a Korean film and setting it on the heat dissipation end. The invention further has a structure in which the 5G 'is located on the heat-dissipating end 4〇, and the fin % can be made of a material with good thermal conductivity and is arranged at intervals, and can also be extended by the heat-dissipating end 4但 but the present invention is not This is limited to this. Step 503: Dissipating heat to the heat source by contacting the heat source with the heat receiving end. The heat source can be a computer chip or other electronic component by the heat receiving end 30 contacting the heat source. However, the present invention does not use the heat source to dissipate heat. Step 504: Providing a fastening portion to engage the heat receiving end with the heat source. The heat receiving end is fastened to the heat source by engaging the heat receiving end 3 with the heat receiving end by engaging the heat receiving end with the heat receiving end. The invention is filled with a suitable amount of liquid inside the adiabatic section, such as water, ethanol, _, and the like. Fluid 201235823 is heated and vaporized at the heated end, the vapor fluid can take away A4 thermal energy due to the latent heat generated by the phase change, and the vapor fluid condenses into liquid at the heat radiating end due to the heat effect and the reinforcing effect of the tab, and by gravity or shell The capillary force inside is ordered and then renewed to complete the heat dissipation effect, and the heated end is formed into a flat solid by stamping, which reduces the thickness and increases the strength, so that the heated end can replace the function of the copper block in the prior art, and maintains good The heat dissipation effect and the reduction of the copper block during assembly can further reduce the height of the heat sink structure in assembly. Although the technical content of the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the invention. Any modifications and refinements made by the skilled person in the spirit of the present invention should be encompassed by the present invention. The scope of protection of the present invention is therefore defined by the scope of the appended claims. 201235823 [Simple description of the drawings] Fig. 1 is a schematic view of the heat pipe of the present invention. *· Figure 2 is a schematic view of the heated end and the adiabatic section of the present invention. Figure 3 is an exploded view of an embodiment of the present invention. Figure 4 is an overall structural view of the present invention. Fig. 5 is a flow chart showing a method for improving the structure of the heat sink of the present invention. [Main component symbol description] 10............heat pipe 20............adiabatic section 30............heated end 40............heating end 50............fin 60............fastening part 61 fastening branch Piece