TW200632128A - Heat dissipation metal of surface plating film structure and manufacturing method thereof - Google Patents

Heat dissipation metal of surface plating film structure and manufacturing method thereof

Info

Publication number
TW200632128A
TW200632128A TW094106361A TW94106361A TW200632128A TW 200632128 A TW200632128 A TW 200632128A TW 094106361 A TW094106361 A TW 094106361A TW 94106361 A TW94106361 A TW 94106361A TW 200632128 A TW200632128 A TW 200632128A
Authority
TW
Taiwan
Prior art keywords
heat dissipation
dissipation metal
surface plating
plating film
manufacturing
Prior art date
Application number
TW094106361A
Other languages
English (en)
Chinese (zh)
Inventor
Ming-Hang Hwang
Yu-Chiang Cheng
Chao-Yi Chen
Hsin-Lung Kuo
Bin-Wei Lee
Wei Chung Hsiao
Original Assignee
Mitac Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitac Technology Corp filed Critical Mitac Technology Corp
Priority to TW094106361A priority Critical patent/TW200632128A/zh
Priority to JP2006027578A priority patent/JP2006245561A/ja
Priority to DE200610007527 priority patent/DE102006007527A1/de
Publication of TW200632128A publication Critical patent/TW200632128A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3732—Diamonds
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
TW094106361A 2005-03-02 2005-03-02 Heat dissipation metal of surface plating film structure and manufacturing method thereof TW200632128A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW094106361A TW200632128A (en) 2005-03-02 2005-03-02 Heat dissipation metal of surface plating film structure and manufacturing method thereof
JP2006027578A JP2006245561A (ja) 2005-03-02 2006-02-03 放熱金属表面の薄膜構造およびその製造方法
DE200610007527 DE102006007527A1 (de) 2005-03-02 2006-02-16 Kühlmetall mit einer Beschichtung und Verfahren zu dessen Herstellung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094106361A TW200632128A (en) 2005-03-02 2005-03-02 Heat dissipation metal of surface plating film structure and manufacturing method thereof

Publications (1)

Publication Number Publication Date
TW200632128A true TW200632128A (en) 2006-09-16

Family

ID=36848306

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094106361A TW200632128A (en) 2005-03-02 2005-03-02 Heat dissipation metal of surface plating film structure and manufacturing method thereof

Country Status (3)

Country Link
JP (1) JP2006245561A (de)
DE (1) DE102006007527A1 (de)
TW (1) TW200632128A (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105386003A (zh) * 2015-12-02 2016-03-09 哈尔滨工业大学 一种三维结构石墨烯增强铜基复合材料的制备方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160021788A1 (en) * 2014-07-16 2016-01-21 General Electric Company Electronic device assembly

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105386003A (zh) * 2015-12-02 2016-03-09 哈尔滨工业大学 一种三维结构石墨烯增强铜基复合材料的制备方法
CN105386003B (zh) * 2015-12-02 2018-01-30 哈尔滨工业大学 一种三维结构石墨烯增强铜基复合材料的制备方法

Also Published As

Publication number Publication date
DE102006007527A1 (de) 2006-09-07
JP2006245561A (ja) 2006-09-14

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