JP2006245206A - Board accommodating case - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a board accommodating case with less size error capable of suitably accommodating and storing a less number of boards, improving efficiency and economy, and easily realizing manufacture or the like using metal dies. <P>SOLUTION: The board accommodating case comprises a case body 1 for accommodating a couple of semiconductor wafers and a cover body for opening and closing the aperture of the case body 1. The front view of the case body 1 is formed like a rectangular front-open box and a ratio of the longer side and the shorter side of the aperture of the front view is set within the range of 1.6 to 25. The ceiling 3, a rear surface wall and both side walls 10 which are greater part of the case body 1 are integrally molded and the remainder is formed as a separated bottom plate 25. After these are molded, these are integrated through the repeated molding process. Since the greater part of the case body 1 and the bottom plate 25 are individually molded and these are molded again after these are assembled, if the aperture of the case body 1 is narrow and depth becomes longer, the case body 1 can be separated from the metal die in the molding process without difficulty. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a substrate storage container called a SMALL FOUP that stores several semiconductor wafers and the like.

In order to efficiently manufacture a large number of IC chips, a semiconductor wafer made of a silicon wafer has recently shifted from a 200 mm type to a 300 mm type. This 300 mm type semiconductor wafer is a substrate that is a part of a mini-environment system. Batch processing is performed with a large number of sheets stored in the storage container.
The mini-environment system is a system that mechanically supplies or collects a semiconductor wafer to a semiconductor processing apparatus in a space where a local clean has been realized without using a human directly.

  As shown in FIG. 16, the substrate storage container of the system is formed into a front open box type having a size of, for example, a total length of 346 mm, a width of 388 mm, and a height of 330 mm. The semiconductor wafers can be aligned and stored horizontally in the vertical direction and connected to a processing apparatus (not shown) (Patent Documents 1 and 2).

  A 300 mm type semiconductor wafer in which a large number of substrates are aligned and stored in such a substrate storage container is sequentially taken out from the substrate storage container after the substrate storage container is connected to the processing apparatus and subjected to various processing processes. . At this time, the substrate storage container is connected to the processing apparatus until the processing of all semiconductor wafers is completed, and movement relative to other processes and processing apparatuses is restricted.

By the way, the processing time of a semiconductor wafer is not uniform, and fluctuates depending on the required performance of an IC chip, the time of commercialization, product specifications, and the like. For example, when processing is performed by a memory device manufacturer or the like, particularly when the processing target is a general-purpose product, mass production is required, and therefore, it takes a long time (for example, 30 to 40 days) through many processes. Processing is performed.
On the other hand, when processing is performed by an LSI manufacturer or the like, it is necessary to respond to requests for a variety of small-quantity production, prototypes, and small-lot products, so in a short time (for example, 14 to 20 days) It needs to be processed.

Therefore, when a semiconductor wafer is processed by a memory device manufacturer or the like, the maximum storage number (for example, 25 sheets) is stored in a substrate storage container, but when processed by an LSI manufacturer or the like, Only a few sheets (for example, 1 to 5 sheets) are stored in the substrate storage container, and the processing time per sheet can be shortened.
Japanese Patent Laid-Open No. 11-91865 JP 2000-58633 A

  The conventional substrate storage container is configured as described above, and when processed by an LSI manufacturer or the like, only a few sheets can be stored even though a large number of sheets can be stored. There is a big problem that the volume, size, etc. become larger than necessary, and the efficiency of space, storage and storage is very poor and uneconomical.

  As a means to solve such problems, development and manufacture of a dedicated substrate storage container that can store several substrates can be considered, but simply developing and manufacturing has hindered manufacture using a mold. As a result, a problem that the dimensional error becomes large is newly generated.

  This problem will be described in detail. In the case of manufacturing a container main body 1A of a substrate storage container that stores several substrates, the opening portion is horizontally long and the length in the front-rear direction is the same as that in the horizontal direction. It becomes. That is, since the opening becomes a narrow and deep container body 1A, the amount of release from the mold during molding becomes large, and even when the taper from the mold is increased, it is easy to deform due to resistance during release, As a result, there is a high possibility that the dimensional error of the container body 1A will increase.

  The present invention has been made in view of the above, is suitable for storing and storing a small number of substrates, can improve efficiency and economy, and can facilitate the production using a mold, etc. An object of the present invention is to provide a substrate storage container with little dimensional error.

In order to solve the above-described problems, the present invention includes a container main body that stores a small number of substrates and a lid that opens and closes the opening of the container main body, and the container main body is a horizontally long front open box in front view. The ratio of the length of the long side to the short side of the opening on the front is in the range of 1.6 to 25,
It is characterized in that a part of the container body is integrally formed and the remaining part is made a separate body, and the part and the remaining part are combined and integrated.
A part of the container body can be integrally formed as a ceiling, a back wall, and both side walls, and the remaining part can be a bottom plate.

Further, a part of the container main body can be integrally formed as a ceiling, a back wall, and a bottom plate, and the remainder can be used as both side walls.
Further, the part of the container body and the remaining part can be integrated by making the combined surface of a part of the container body and the remaining part face each other with a gap and filling the gap with an elastomer to cure.
Furthermore, a part of the container body and the remaining part can be formed of different materials.

  Here, the small number of substrates in the claims refers to 13 or less, preferably 5 or less, more preferably 1 to 2 substrates. This substrate includes semiconductor wafers having a diameter of at least 300 mm or 450 mm (silicon wafers with notches, diffusion wafers, SOI wafers, Hi wafers, etc.), quartz glass, photomask glass, aluminum disks, liquid crystal glass, tablets, etc. It is. An airtight gasket can be interposed between the container body and the lid.

  The container body can be made transparent, translucent, or opaque, and an elastic retainer that holds the periphery of the substrate can be provided on the inner surface of the back wall in a substantially U-shaped or V-shaped cross section. Part of the container body and the rest can be integrated by insert molding or two-color molding, but other methods such as laser welding, thermal welding, and ultrasonic welding are also used. It is possible. In this case, it is possible to integrate a part of the container body and the remaining part through a seal member such as packing. This seal member may or may not be integrated in advance with a part or the remainder of the container body.

  According to the present invention, since the substrate storage container is configured to be substantially horizontally long in accordance with the number of the small number of substrates, the occupied area, volume, size, and the like do not increase more than necessary. Also, part of the container body and the remaining part can be formed separately, and these can be assembled and integrated after the formation, so even if the opening of the container body is narrow and the depth is long, the mold It is possible to suppress the release amount from increasing.

  Further, a part of the container body is a ceiling, a rear wall formed at the rear of the ceiling and extending downward, and a side wall formed at both sides of the ceiling and extended downward to be integrated with the rear wall. If the remaining part of the main body is a bottom plate that covers the lower opening formed by the ceiling, the back wall, and both side walls, it is not necessary to provide a large punching taper on both the upper surface side and the bottom surface side of the container main body. That is, it is only necessary to provide a large draft taper on the inner surface on the upper surface side of the container body.

  Further, a part of the container body is a ceiling, a rear wall formed at the rear of the ceiling and extending downward, and a bottom plate substantially facing the ceiling, and the remaining part of the container body is an opening formed by the ceiling, the back wall, and the bottom plate If both side walls are fitted and covered with each other, it is not necessary to provide a plurality of large taper tapers, and a functional substrate storage container can be obtained.

According to the present invention, it is suitable for storing and storing a small number of substrates, and there is an effect that efficiency and economy can be improved. In addition, manufacturing using a mold can be facilitated, and dimensional errors of the substrate storage container can be suppressed.
Moreover, if a part and remaining part of a container main body are formed using a mutually different material, a some function and performance can be provided to a container main body.

  Hereinafter, a preferred embodiment of the present invention will be described with reference to the drawings. A substrate storage container in the present embodiment is an opaque container main body for storing two semiconductor wafers W as shown in FIGS. 1, a detachable lid 30 that opens and closes the opening 2 of the container body 1, and a lid 30 that closes the container body 1 based on an external operation from a lid opening / closing device in a processing apparatus (not shown). And a plurality of lock mechanisms 50 for unlocking.

  As shown in FIG. 4, each semiconductor wafer W is formed in a thin disk having a diameter of 300 mm (12 inches) so that a large number of IC chips can be efficiently manufactured, and a film such as an oxide film is formed on the surface. It is selectively laminated.

  As shown in FIGS. 1 to 3 and the like, the container body 1 is a front open box type that is horizontally long in front view and has a size of, for example, a total length of 346 mm, a width of 388 mm, and a height of 60 to 70 mm using a predetermined molding material. Thus, the overall height is set lower than that of the conventional container main body 1A, and there is enough space to accommodate two semiconductor wafers W. As shown in FIGS. 8 and 10, the container body 1 includes a ceiling plate 3, a back wall 8, and left and right side walls 10, which are the most (part) of which are integrally formed, and the remainder is a separate bottom plate. 25, and these are fitted and integrated by molding later.

  Examples of the molding material for the ceiling 3, the back wall 8, and the side walls 10 that are separate from the side walls 10 are resins such as polycarbonate, polybutylene terephthalate, cycloolefin polymer, polyetherimide, and polyether terketone. Alternatively, a conductive resin in which carbon, carbon fiber, carbon nanotube, metal fiber, metal oxide, conductive polymer or the like is added to these resin or alloy resin is selected and used.

  The molding material is not particularly limited, but a conductive polycarbonate excellent in mechanical properties, heat resistance and dimensional stability is optimal. The ceiling 3, back wall 8, and both side walls 10 of the container body 1 and the separate bottom plate 25 may be formed using the same material, or may be formed using different materials from each other. May be.

  As shown in FIGS. 1 to 3, 5, and 6, the ceiling 3 of the container main body 1 is formed in a substantially planar polygon having a plurality of steps 4, and the rear portion corresponds to the rear periphery of the semiconductor wafer W. Both sides are formed to be inclined inward. A cylindrical mounting rib 5 is erected at the center of the surface of the ceiling 3, and a plurality of substantially plate-shaped reinforcing ribs 6 are extended from the outer peripheral surface of the mounting rib 5 in the radially outward direction. At the same time, screw holes are drilled in the cylindrical tip portions of the reinforcing ribs 6. A detachable suspension flange 7 is attached to the attached rib 5 and the plurality of reinforcing ribs 6. It is screwed horizontally through a fastener.

  As shown in FIGS. 2 and 3, the suspension flange 7 is formed in a plane substantially triangular plate and is held by a transport mechanism (not shown). Then, by being fitted and held in a fitting hole drilled in a slidable suspension plate of the processing apparatus, the substrate storage container is set in the processing apparatus in a suspended state.

  As shown in FIGS. 3 to 5 and 7, the rear wall 8 of the container body 1 is integrally formed at the rear portion of the ceiling 3 and extends substantially vertically downward. A part of the back wall 8 is formed in a horizontally long rectangle that can be seen through by a two-color molding method or the like, and functions as a window 9 except for the semiconductor wafer W in which the part is accommodated.

  As shown in FIGS. 1 and 4, both side walls 10 of the container body 1 are integrally formed on both sides of the ceiling 3, extend substantially vertically downward, and are integrated with the back wall 8. A pair of left and right teeth 11 for horizontally supporting the semiconductor wafer W are formed on the inner surfaces of the both side walls 10, and the pair of teeth 11 are arranged at predetermined intervals in the vertical direction. The semiconductor wafers W are stored in the teeth 11 aligned in the vertical direction.

  As shown in FIG. 4, each of the teeth 11 is formed on a flat plate 12 having a substantially square shape or a semi-circular arc shape along the peripheral edge of the semiconductor wafer W, and on the curved front inner side of the flat plate 12. The front thick region 13, the front thick region 14 formed on the outer front side of the flat plate 12 and positioned outside the front thick region 13, in other words, close to the side wall 10, and the rear portion of the flat plate 12 It is formed from a rear middle region 15 formed on the top.

  In such a tooth 11, a step for contacting the semiconductor wafer is slightly formed between the front middle region 13 and the front thick region 14, and the front middle region 13 and the rear middle region 15 are formed. While supporting the semiconductor wafer W substantially horizontally, it functions as a stopper that prevents the semiconductor wafer W containing the front thick region 14 from popping out. By employing such a tooth 11, the accuracy of the support mounting position of the semiconductor wafer W can be remarkably improved, and the semiconductor wafer W can be effectively prevented from being inclined obliquely in the vertical direction during support.

  As shown in FIGS. 2 to 4 and 10, the front part of the ceiling 3 of the container body 1 and the front part of the side walls 10 are integrally formed with a horizontally long frame 16 in a front view. It functions as an opening 2 on the front surface of the container body 1. The frame body 16 was set to have a ratio of the length of the long side to the short side (length of the long side / length of the short side) in the range of 1.6 to 25 and protruded outward in the lateral direction. A plurality of identification holes 17 arranged in the vertical direction are respectively perforated in both the left and right side portions, and a detachable identification body 18 is selectively inserted into the plurality of identification holes 17 so that a substrate storage container is provided. The type, the presence / absence of the semiconductor wafer W, the number of the wafers, and the like are identified by the processing apparatus.

  The identification body 18 is formed into a pin shape, a screw shape, a flexible split pin shape having a groove, a flexible cap shape, or the like using a predetermined synthetic resin such as polycarbonate. The presence / absence of such an identification body 18 is detected by a detection unit (a transmission type or reflection type photoelectric sensor, photo sensor, touch sensor, or the like) of a processing apparatus (not shown).

  The lower lower edge of the back wall 8 of the container body 1, the lower lower edge of both side walls 10, and the lower back surface of the frame 16 define a lower opening 19 for fitting the bottom plate, as shown in FIGS. At the same time, a combined surface 20 with a step is provided opposite to the peripheral edge of the bottom plate 25 via a gap, and a plurality of recesses 21 are selectively formed on the combined surface 20 with a step.

  From the lower lower edge of the back wall 8 of the container body 1, the lower lower edge of the side walls 10, and the lower side of the frame 16, as shown in FIGS. 1, 3, 4, 8, 10, and 11. Further, a substantially U-shaped bottom flange 22 is projected in the horizontal direction, and a peripheral edge portion of the bottom flange 22 is bent upward to be reinforced. Grooves 23 for positioning with respect to a processing device (not shown) are formed in the front and rear center of both sides of the bottom flange 22, respectively, and counter weights and balancers of a plurality of lock mechanisms 50 are formed on both sides of the rear portion of the bottom flange 22. Each functioning weight 24 is mounted. The positioning groove 23 is formed into a substantially inverted U-shaped or inverted V-shaped cross section.

  As shown in FIGS. 8 to 11, the bottom plate 25 is formed in a planar substantially polygonal plate shape that fits into the lower opening 19 defined by the back wall 8, both side walls 10, and the frame body 16 of the container body 1. It is molded and melted and integrated into the lower opening 19 via a sealing elastomer 26. As the sealing elastomer 26, various thermoplastic resins, specifically, polyester-based thermoplastic elastomers, alloy resins of polycarbonate and polyester (alloys of polybutylene terephthalate or polyethylene terephthalate), or polycarbonate and ABS are used. Examples thereof include an alloy resin with a resin.

  As shown in FIGS. 8 to 11, the peripheral edge of the bottom plate 25 has a stepped combination surface 27 that faces the combination surface 20 of the container body 1, in other words, the combination surface 20 of the lower opening 19 via a gap. A concave portion 28 filled with a sealing elastomer 26 is selectively formed on the stepped combination surface 27.

  As shown in FIGS. 2 and 4 to 6, the lid 30 includes an opening 2 of the container body 1, in other words, a box 31 having a substantially dish-shaped cross section fitted into the frame body 16, A horizontally long surface plate 37 that covers the opened surface of the box 31 and an elastic gasket 40 that is tightly fitted between the frame 16 of the container body 1 and the box 31.

  The box 31 includes a horizontally long plate 32, and a circular lock mechanism mounting region 33 is arranged on the front surface (inner surface) of the plate 32 in a row in the horizontal direction with a space therebetween. In addition, a cylindrical support shaft 34 oriented horizontally in the front direction is formed. A bent peripheral wall is formed endlessly around the plate body 32, and a plurality of horizontally long slot holes 35 are formed at intervals above and below the peripheral wall. A rectangular and horizontally long mounting hole is formed in the back surface of the box 31, and an elastic front retainer 36 is attached to the mounting hole, and the front peripheral edge of each semiconductor wafer W is elastically projected to the front retainer 36. Fitted and held.

  In the surface plate 37, a plurality of through holes are arranged in a horizontal row in the left and right sides so as to correspond to the plurality of support shafts 34, and a pair of substantially semicircular arcs is formed in the oblique upper and lower regions of each through hole. The operation holes 38 are respectively drilled, and the operation claws of the lid opening / closing device are inserted into the operation holes 38 from the outside. A mounting screw 39 is detachably inserted into each through-hole, and the mounting plate 39 is screwed into the support shaft 34, whereby the surface plate 37 is firmly attached to the opened surface of the box 31.

  The gasket 40 is formed into an endless frame shape using, for example, fluororubber, silicone rubber, various polyester-based or polyolefin-based thermoplastic elastomers having excellent durability, heat resistance, chemical resistance, and the like. And it fits from the board body peripheral part of the box 31 to the level | step-difference part of a surrounding wall, contacts in the frame 16 which is the opening part 2 of the container main body 1, and compresses and deforms.

  As shown in FIGS. 2 and 6, each lock mechanism 50 includes a plurality of locking holes 51 provided in the inner periphery of the frame body 16 of the container body 1 and the outside of the lid opening / closing device supported by the lid body 30. A rotating plate 52 that rotates by an operation, projects outward from the rotating plate 52, and is fitted and locked to the locking hole 51 of the container body 1 through the groove 35 when the lid 30 is locked. A pair of locking claws 55 that come back from the locking hole 51 of the container body 1 when unlocked and return to the inside of the lid 30, and a pair of regulating bodies 56 that are fitted to the rotating plate 52 and restrict unnecessary rotation thereof Consists of

  The plurality of locking holes 51 are arranged at predetermined intervals above and below the inner periphery of the frame body 16, and each locking hole 51 is formed horizontally so as to correspond to the groove hole 35 of the box 31. The rotation plate 52 is formed into a disk using a synthetic resin such as polycarbonate, and a central hole 53 that is penetrated and supported by the support shaft 34 of the lid 30 is formed in the center portion. A pair of mounting holes 54 that are interfered with the operation claws of the lid opening / closing device that penetrates the operation holes 38 of the surface plate 37 are formed at predetermined intervals.

  The pair of locking claws 55 are formed to protrude from the peripheral surface of the rotating plate 52 at a predetermined interval, and each locking claw 55 is formed in a substantially trapezoidal shape. Each regulating body 56 is formed in a substantially U shape by combining a pair of bent elastic pieces, and is detachably fitted into the mounting hole 54 of the rotating plate 52 to function as a spring. And it is interposed between the attachment area | region 33 and the rotation plate 52, and functions so that the rotation plate 52 may be press-contacted to the surface plate 37 at the time of locking of the cover body 30, and the rotation to the application direction of the rotation plate 52 may be controlled.

  In the above configuration, when manufacturing the container main body 1 of the substrate storage container, first, the separate bottom plate 25 is injection-molded with a dedicated mold, and the ceiling 3 and the rear wall which are the majority of the container main body 1 are used. 8 and both side walls 10 are integrally injection-molded by a dedicated mold.

  In this way, when most of the container body 1 and the bottom plate 25 are separately molded, the bottom plate 25 is inserted and fitted into the lower opening 19 of most of the container body 1, and then the mold is mounted. The mold is clamped to inject a molten sealing elastomer 26 into the gap between the lower opening 19 of the container body 1 and the bottom plate 25, in other words, the gap between the combined surfaces 20 and 27. The container body 1 can be manufactured by curing and integrating most of the container body 1 and the bottom plate 25.

  Next, when supplying or recovering the semiconductor wafer W to the processing apparatus in a short time using the mini-environment system, a plurality of substrate storage containers are suspended in the vertical direction on the suspension plate of the processing apparatus, Of the plurality of substrate storage containers, an arbitrary substrate storage container is selected and slidably connected to the processing apparatus, and the lock mechanism 50 of the arbitrary substrate storage container is locked and unlocked by the lid opening / closing device.

  First, when locking the lid body 30, the operation claw of the lid body opening / closing device passes through the operation hole 38 of the lid body 30 and fits into the mounting hole 54 of the rotating plate 52, and the restriction body 56 is bent. The rotating plate 52 can be rotated, the operating claw rotates the rotating plate 52 in the locking direction (for example, clockwise), and the locking claw 55 of the rotating plate 52 is inserted into the container body 1 from the inside of the box 31 through the slot 35. The engagement hole 51 is fitted and locked. By this fitting and locking, the container body 1 containing the semiconductor wafer W is firmly fitted and closed to the lid 30.

  When the operating claw of the lid opening / closing device is removed from the lid 30, the bent regulating body 56 is restored and presses the rotating plate 52 against the surface plate 37, and comes into contact with or meshes with a step or protrusion for preventing rotation. Thus, the rotation of the rotating plate 52 in the application direction is restricted.

  On the other hand, when the lid 30 is unlocked, the operating claw of the lid opening / closing device passes through the operating hole 38 of the lid 30 and fits into the mounting hole 54 of the rotating plate 52, and the regulating body 56 is The rotating plate 52 can be rotated by being bent, and the operation claw rotates the rotating plate 52 in the unlocking direction (for example, counterclockwise), and the locking claw 55 of the rotating plate 52 is the locking hole 51 of the container body 1. To the box 31 through the slot 35.

  By this movement, the lid 30 can be removed from the opening 2 of the container body 1 containing the semiconductor wafer W. When the lid body 30 becomes removable, the lid body opening / closing device removes the lid body 30 and the fork advances into the container body 1 to grip the semiconductor wafer W from below.

  According to the above configuration, since the substrate storage container is configured to be thin and horizontally long according to the number of semiconductor wafers W, which is a small number of two, the occupied volume and size are not increased more than necessary, and efficiency and economy are improved. Can significantly increase the performance. In addition, since most of the container body 1 and the bottom plate 25 are separately molded, and these are combined later and insert-molded, even if the opening 2 of the container body 1 is narrow and the depth is long, a mold is formed during molding. The mold release amount from is not increased. Therefore, it is possible to effectively suppress and prevent the container body 1 from being deformed by the resistance at the time of mold release and increasing the dimensional error.

  In addition, a long bar or shaft that moves forward and backward is not interposed between the locking hole 51 of the locking mechanism 50 and the rotating plate 52, and between the rotating plate 52 and the locking claw 55. Since the short locking claw 55 is directly provided to save space, the lid 30 can be firmly locked with a simple configuration even if the substrate storage container is thin and low. In particular, the central portion of the lid 30 that is easily bent can be firmly locked by the space-saving lock mechanism 50. Further, the number of parts of the lock mechanism 50 can be reduced to simplify the configuration.

  Further, instead of directly forming a plurality of positioning grooves on the bottom surface of the container body 1, a plurality of positioning grooves 23 are formed on the bottom flange 22 projecting from the container body 1 in a substantially horizontal outward direction. The overall height of the main body 1 and the overall height when positioned with the processing apparatus can be reduced.

  Further, more access units can be provided in the access unit of the interface device that can be accessed by the existing 25-sheet storage type substrate storage container, and the storage space can be greatly reduced. Furthermore, most of the container body 1 and the concave portions 21 and 28 of the combination surfaces 20 and 27 in the bottom plate 25 increase the filling amount of the sealing elastomer 26, and the concave portions 21 and 28 and the cured elastomer for sealing. 26 is engaged with the projections and depressions, a strong bonding structure can be expected.

  Next, FIG. 12 and FIG. 13 show a second embodiment of the present invention. In this case, most of the container body 1 and the molding material of the bottom plate 25 are made different, and the bottom plate 25 is moved first. The bottom plate 25 is provided by inserting into a dedicated mold for molding most of the container body 1 by injection molding, and then filling the molding material for molding most of the container body 1 into this dedicated mold. The container body 1 is molded in two colors.

  Examples of the molding material for the bottom plate 25 include molding materials having better sliding properties than the molding material for molding most of the container body 1, such as polyetheretherketone and polybutylene terephthalate. The other parts are the same as those in the above embodiment, and the description thereof is omitted.

  In this embodiment, the same effect as that of the above embodiment can be expected, and the bottom plate 25 is formed of a molding material having excellent slidability, so that the positioning accuracy with the lid opening / closing device can be greatly improved. Obviously you can. In addition, the lower opening 19 and the bottom plate 25 of the container body 1 are not integrated by the sealing elastomer 26 but directly integrated by using heat at the time of molding most of the container body 1. Therefore, it is possible to simplify the work process and reduce costs.

  Next, FIG. 14 and FIG. 15 show a third embodiment of the present invention. In this case, the substrate storage container is a 13-pack type having a total length of 346 mm, a width of 388 mm, and a total height of about 210 mm. 1 is mostly the ceiling 3, the back wall 8 and the bottom plate 25, and the remainder is a separate side wall 10 and the molding material of most of the container body 1 and the side walls 10 is different. Is inserted into a dedicated mold for molding most of the container body 1 by injection molding first, and then the molding material for molding most of the container body 1 is filled in the dedicated mold, thereby forming both side walls. The container body 1 having 10 is manufactured by a two-color molding method.

  The ratio of the long side length to the short side length (long side length / short side length) in the opening 2 of the substrate storage container is set to about 1.8. Further, as the molding material for the both side walls 10, a molding material superior in sliding property, stain resistance, and wear resistance to the molding material for molding most of the container body 1, such as polyether ether ketone and polybutylene terephthalate, etc. Can be given. The other parts are the same as those in the above embodiment, and the description thereof is omitted.

  In this embodiment, the same effect as that of the above embodiment can be expected, and the both side walls 10 with the teeth 11 are molded with a molding material having excellent slidability and wear, unlike most of the container body 1. Therefore, it is clear that the contamination of the semiconductor wafer W can be expected. Furthermore, it is possible to easily avoid deterioration in workability when the separate side walls 10 are attached to the majority of the container body 1 later.

It is a perspective front explanatory view in an embodiment of a substrate storage container concerning the present invention. It is a perspective expansion explanatory view showing an embodiment of a substrate storage container concerning the present invention. It is a perspective back explanatory view showing an embodiment of a substrate storage container concerning the present invention. It is a section explanatory view showing an embodiment of a substrate storage container concerning the present invention. It is a perspective back explanatory view showing typically the relation between a container main part and a lid in an embodiment of a substrate storage container concerning the present invention. It is a disassembled perspective explanatory drawing which shows embodiment of the board | substrate storage container which concerns on this invention. It is a front view which shows the container main body opened in embodiment of the substrate storage container which concerns on this invention. It is a disassembled perspective back view which shows typically the container main body and bottom plate in embodiment of the substrate storage container which concerns on this invention. It is a perspective sectional view showing typically the important section of a container main part and a bottom plate in an embodiment of a substrate storage container concerning the present invention. It is a section schematic explanatory view showing an embodiment of a substrate storage container concerning the present invention. It is principal part sectional explanatory drawing which shows embodiment of the substrate storage container which concerns on this invention. It is back surface perspective explanatory drawing which shows 2nd Embodiment of the substrate storage container which concerns on this invention. It is a cross-sectional schematic explanatory drawing which shows 2nd Embodiment of the substrate storage container which concerns on this invention. It is a cross-sectional schematic explanatory drawing which shows 3rd Embodiment of the substrate storage container which concerns on this invention. It is principal part cross-sectional explanatory drawing which shows 3rd Embodiment of the substrate storage container which concerns on this invention. It is a perspective view showing a substrate storage container for aligning and storing a large number of semiconductor wafers.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Container main body 2 Opening part 3 Ceiling 8 Back wall 10 Side wall 11 Teeth 16 Frame 19 Lower opening 20 Combining surface 21 Recess 25 Bottom plate (bottom plate)
26 Sealing elastomer 27 Combination surface 28 Recess 30 Lid 40 Gasket 50 Lock mechanism W Semiconductor wafer (substrate)

Claims (5)

A container main body for storing a small number of substrates and a lid for opening and closing the opening of the container main body, and the container main body as a horizontally long front open box when viewed from the front. A substrate storage container having a length ratio in the range of 1.6 to 25,
A substrate storage container characterized in that a part of a container body is integrally formed and a remaining part is formed as a separate body, and the part and the remaining part are combined and integrated.   The substrate storage container according to claim 1, wherein a part of the container body is integrally formed as a ceiling, a back wall, and both side walls, and the remaining part is a bottom plate.   The substrate storage container according to claim 1, wherein a part of the container body is integrally formed as a ceiling, a back wall, and a bottom plate, and the remainder is formed on both side walls.   The combination surface of a part of the container main body and the remaining part is opposed to each other with a gap, and the gap is filled with an elastomer and cured to integrate the part of the container main body and the remaining part. 2. The substrate storage container according to 2 or 3.   The substrate storage container according to claim 1, wherein a part of the container body and the remaining part are formed of different materials.

Images