JP2009231653A - Substrate storing container - Google Patents

Substrate storing container Download PDF

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JP2009231653A
JP2009231653A JP2008077005A JP2008077005A JP2009231653A JP 2009231653 A JP2009231653 A JP 2009231653A JP 2008077005 A JP2008077005 A JP 2008077005A JP 2008077005 A JP2008077005 A JP 2008077005A JP 2009231653 A JP2009231653 A JP 2009231653A
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piece
support
container body
side wall
container
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Kazumasa Onuki
和正 大貫
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Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
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Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
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Priority to JP2008077005A priority Critical patent/JP2009231653A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate storing container which raises strength of a shelf board strip reduces moisture survival at the time of cleaning of the shelf board strip, can obtain time reduction of a drying work, moreover, prevents thickness variation of the shelf board strip, and which can obtain highly precise support of a substrate and smooth taking out and putting in of a substrate. <P>SOLUTION: The substrate storing container includes: a container body 1 for storing a semiconductor wafer; and a pair of holding bodies 30 which is built in the container body 1 and supports a semiconductor wafer, wherein each holding body 30 includes: an intermediate strip 31 which counters the sidewall inside of the container body 1; a head strip 32 which is formed in the intermediate strip 31 and located in the side of a frontal portion 2 of the container body 1; an end strip 39 formed in the intermediate strip 31; teeth 45 formed from the intermediate strip 31 to the end strip 39 and supporting a semiconductor wafer, and the teeth 45 are formed in a continuous waveform. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、半導体ウェーハ、化合物半導体ウェーハ、ガラスウェーハ等に代表される基板を収納する基板収納容器に関するものである。   The present invention relates to a substrate storage container that stores substrates represented by semiconductor wafers, compound semiconductor wafers, glass wafers, and the like.

従来の基板収納容器は、図示しないが、所定枚数の半導体ウェーハを収納するフロントオープンボックスタイプの容器本体と、この容器本体の開口した正面部を開閉する着脱自在の蓋体とを備え、半導体製造工程の工程間の搬送、保管、工場間の輸送等に使用されており、使用の前後に洗浄液で適宜洗浄されることにより、繰り返し使用されている(特許文献1参照)。   Although not shown, a conventional substrate storage container includes a front open box type container main body that stores a predetermined number of semiconductor wafers, and a detachable lid that opens and closes an open front portion of the container main body. It is used for conveyance between processes, storage, transportation between factories, and the like, and it is used repeatedly by washing it appropriately with a cleaning liquid before and after use (see Patent Document 1).

容器本体は、所定の成形材料により、25枚の半導体ウェーハを収納可能な大きさに成形されたり、半導体生産のスループットを向上させる観点から、2枚の半導体ウェーハを収納可能な大きさに成形される。この容器本体の内部両側には、半導体ウェーハを水平に支持する一対のティースが対設され、この一対のティースが容器本体の上下方向に所定の間隔をおき複数配列されている。   The container body is molded to a size that can accommodate 25 semiconductor wafers by a predetermined molding material, or from the viewpoint of improving the throughput of semiconductor production, and is molded to a size that can accommodate 2 semiconductor wafers. The A pair of teeth for horizontally supporting the semiconductor wafer is provided on both sides inside the container body, and a plurality of pairs of teeth are arranged at predetermined intervals in the vertical direction of the container body.

複数のティースは、容器本体の内部両側にインサート成形法や二色成形法により一体成形されたり、容器本体とは別に成形された後、成形された容器本体の内部に後から装着される。各ティースは、容器本体の前後方向に伸びる細長い平板形に成形され、半導体ウェーハを水平に支持する表面の正面部側には、容器本体に収納された半導体ウェーハに接触してその正面部方向への飛び出しを規制する肉厚部が一体的に積層形成される。
特開2006‐245206号公報
The plurality of teeth are integrally formed on both sides of the container main body by an insert molding method or a two-color molding method, or formed separately from the container main body, and then attached to the interior of the molded container main body. Each tooth is formed into an elongated flat plate shape extending in the front-rear direction of the container body. The front surface side of the surface that horizontally supports the semiconductor wafer is in contact with the semiconductor wafer housed in the container body and toward the front section. A thick portion for restricting the pop-out is integrally laminated.
JP 2006-245206 A

従来における基板収納容器は、以上のように構成され、ティースが細長い平板形に形成されるに止まるので、強度が小さい他、洗浄液の水分が残存しやすく、しかも、残存した水分の付着部分の特定が困難なので、乾燥作業に長時間を要するおそれがある。また、ティースの表面の正面部側に肉厚部等が単に形成される関係上、成形時のヒケや反り等により、ティースの厚さにバラツキが生じ、半導体ウェーハの高精度な支持や半導体ウェーハの円滑な出し入れが困難になるおそれがある。   The conventional substrate storage container is configured as described above, and since the teeth only need to be formed in an elongated flat plate shape, the strength of the cleaning liquid is low, and the water of the cleaning liquid is likely to remain. May be difficult, and the drying operation may take a long time. In addition, due to the fact that a thick portion or the like is simply formed on the front side of the surface of the teeth, the thickness of the teeth varies due to sink marks or warpage during molding, and the semiconductor wafer is supported with high precision and the semiconductor wafer. There is a risk that it will be difficult to smoothly put in and out.

また、従来における基板収納容器は、容器本体の内部に複数のティースが一体成形される場合、成形材料の相溶性や種類により、容器本体とティースとを一体化することが困難なことがあり、しかも、容器本体が2枚の半導体ウェーハを収納するタイプのときには、金型の構造が複雑化してコストアップを招くという問題がある。   Further, in the conventional substrate storage container, when a plurality of teeth are integrally formed inside the container body, it may be difficult to integrate the container body and the teeth depending on the compatibility and type of the molding material. In addition, when the container body is of a type that accommodates two semiconductor wafers, there is a problem that the structure of the mold is complicated and the cost is increased.

係る問題を解消するには、ティースを容器本体とは別に成形して容器本体に後付けすれば良いが、そうすると、洗浄時の洗浄液の水分が残存して半導体ウェーハの汚染源になるという問題が新たに生じることとなる。この問題は、半導体回路の加工線の最小幅が90nm以下に微細化し、半導体ウェーハの汚染を極力排除しなければならないという最近の情勢に鑑みるに、きわめて重要である。さらに、容器本体に複数のティースを後付けする際、装着作業の作業性が悪化したり、位置精度の低下を招きやすく、結果として半導体ウェーハの出し入れに支障を来たすおそれもある。   To solve this problem, it is sufficient to form the teeth separately from the container body and attach it to the container body. Will occur. This problem is extremely important in view of the recent situation that the minimum width of the processing line of the semiconductor circuit is reduced to 90 nm or less and contamination of the semiconductor wafer must be eliminated as much as possible. Furthermore, when a plurality of teeth are retrofitted to the container body, the workability of the mounting work is likely to deteriorate, and the positional accuracy is liable to be lowered. As a result, the semiconductor wafer may be taken in and out.

本発明は上記に鑑みなされたもので、棚板片の強度を向上させ、棚板片の洗浄時の水分残存を低減するとともに、乾燥作業の作業時間の短縮を図ることができ、しかも、棚板片の厚さバラツキを防ぎ、基板の高精度な支持や基板の円滑な出し入れを実現することのできる基板収納容器を提供することを目的としている。   The present invention has been made in view of the above, and it is possible to improve the strength of the shelf piece, to reduce the residual moisture during the washing of the shelf piece, and to shorten the working time of the drying operation. An object of the present invention is to provide a substrate storage container that can prevent variations in thickness of the plate pieces and can realize high-precision support of the substrate and smooth insertion and removal of the substrate.

本発明においては上記課題を解決するため、基板を開口部から収納する容器本体に、基板を支持する支持体を設けたものであって、
支持体は、少なくとも容器本体の側壁内面に対向して基板を支持する棚板片を含み、この棚板片を容器本体の開口部から閉塞部側にかけて略波形に形成したことを特徴としている。
In the present invention, in order to solve the above-described problem, a container body that accommodates a substrate from an opening is provided with a support that supports the substrate,
The support includes at least a shelf piece that supports the substrate so as to face the inner wall of the side wall of the container body, and the shelf board piece is formed in a substantially corrugated shape from the opening of the container body to the closing portion side.

なお、支持体は、容器本体の側壁内面に対向する別体の中間片と、この中間片に形成されて容器本体の側壁内面の開口部側に位置する先端片と、中間片に形成されて容器本体の側壁内面の閉塞部側に位置する末端片と、少なくとも中間片に突出形成されて基板を支持する棚板片とを含み、先端片から末端片方向にかけて棚板片を連続した略波形に形成することができる。   The support is formed on a separate intermediate piece facing the inner wall of the container body, a tip piece formed on the intermediate piece and located on the opening side of the inner wall of the container body, and the intermediate piece. A substantially corrugated shape including a terminal piece located on the closed side of the inner surface of the side wall of the container main body and a shelf piece protruding from at least the intermediate piece and supporting the substrate, and the shelf pieces being continuous from the tip piece to the terminal piece direction. Can be formed.

また、容器本体の側壁内面の開口部側と先端片の先端部のいずれか一方に凹部を形成するとともに、他方には凸部を形成し、これら凹部と凸部との嵌め合わせにより、容器本体の側壁内面に先端片を固定するようにし、支持体の中間片、先端片、末端片、及び棚板片の少なくともいずれかに水切り孔を穿孔することができる。   Moreover, while forming a recessed part in any one of the opening part side of the side wall inner surface of a container main body, and the front-end | tip part of a front-end | tip piece, a convex part is formed in the other, and a container main body is carried out by fitting with these recessed parts and convex parts The tip piece is fixed to the inner surface of the side wall, and a draining hole can be drilled in at least one of the intermediate piece, the tip piece, the end piece, and the shelf board piece of the support.

また、容器本体を、3枚以下の基板を収納可能な背の低いフロントオープンボックスタイプとしてその正面部を開口部とし、容器本体の側壁の開口部側に透視窓を設けることができる。
また、容器本体の側壁内面に、支持体の中間片と末端片のいずれかを挟んで位置決めする複数の位置決めリブを形成することができる。
Further, the container main body can be a short front open box type capable of storing three or less substrates, and the front portion thereof can be an opening, and a transparent window can be provided on the opening side of the side wall of the container main body.
In addition, a plurality of positioning ribs can be formed on the inner surface of the side wall of the container main body with the intermediate piece or the end piece of the support interposed therebetween.

また、容器本体の側壁内面の開口部側に係止溝を形成して凹部とし、先端片の先端部を屈曲させて係止溝に嵌まる凸部とし、この先端片の先端部を略櫛形に形成してその櫛歯には傾斜突部を形成することができる。
また、容器本体の側壁内面に、支持体を挟む複数のガイドリブを形成してこのガイドリブの端部には位置決め溝を形成し、支持体の先端片には、位置決め溝に嵌まる位置決め突部を形成し、支持体の先端片には、容器本体のガイドリブに接触して位置合わせする位置合わせ突部を形成することができる。
In addition, a locking groove is formed on the opening side of the inner wall of the container body to form a recess, and the tip of the tip piece is bent to fit into the locking groove, and the tip of the tip piece is substantially comb-shaped. Inclined protrusions can be formed on the comb teeth.
Also, a plurality of guide ribs sandwiching the support are formed on the inner wall of the side wall of the container body, a positioning groove is formed at the end of the guide rib, and a positioning protrusion that fits into the positioning groove is formed at the end piece of the support. An alignment protrusion can be formed on the tip piece of the support so as to contact and align with the guide rib of the container body.

また、容器本体の側壁内面の閉塞部側に係合溝を形成し、末端片の末端部には、係合溝に嵌まる係合突部を形成し、容器本体の側壁内面の閉塞部側には、支持体の末端片を支持する複数の保持リブを形成することが可能である。
また、容器本体の側壁内面の閉塞部側と支持体の末端片とのいずれかに、末端片の撓みを規制する撓み規制ストッパを形成し、支持体の末端片に、容器本体に収納される基板の収納位置を規制する位置規制部を形成することが可能である。
In addition, an engagement groove is formed on the side of the inner side wall of the container body, and an engagement protrusion is formed at the end of the end piece to fit into the engagement groove. It is possible to form a plurality of retaining ribs that support the end piece of the support.
In addition, a deflection regulating stopper that regulates the deflection of the end piece is formed on either the closed side of the inner wall of the container body or the end piece of the support, and the end piece of the support is housed in the container body. It is possible to form a position restricting portion that restricts the storage position of the substrate.

また、容器本体の側壁内面の開口部側に位置する棚板片の湾曲頂部を他の複数の湾曲頂部よりも高くし、この容器本体の側壁内面の開口部側に位置する湾曲頂部により、容器本体に収納された基板の飛び出しを規制することも可能である。
また、棚板片における他の複数の湾曲頂部のうち、少なくとも一対の湾曲頂部により基板を支持し、この一対の湾曲頂部以外の他の湾曲頂部を基板に非接触とすることも可能である。
Moreover, the curved top of the shelf piece located on the opening side of the inner side wall of the container body is made higher than the other curved tops, and the curved top located on the opening side of the inner side wall of the container body allows the container to It is also possible to regulate the jumping out of the substrate stored in the main body.
Moreover, it is also possible to support the substrate by at least a pair of curved tops among a plurality of other curved tops of the shelf board piece, and make the other curved tops other than the pair of curved tops non-contact with the substrate.

また、棚板片の湾曲頂部と湾曲谷部のうち、少なくとも湾曲谷部を容器本体の側壁内面から内方向に向かうにしたがい徐々に細くなるよう先細りに形成すると良い。
さらに、支持体の棚板片を分割し、この分割した複数の棚板片を支持体の長手方向に間隔をおいて配列すると良い。
Moreover, it is good to form at least a curved valley part so that it may become thin gradually as it goes inward from the side wall inner surface of a container main body among the curved top part and curved valley part of a shelf piece.
Furthermore, it is preferable that the shelf plate pieces of the support are divided and the plurality of divided shelf plate pieces are arranged at intervals in the longitudinal direction of the support body.

ここで、特許請求の範囲における基板には、少なくとも単数複数の半導体ウェーハ(例えば、200mm、300mm、450mmタイプ等)、化合物半導体ウェーハ、ガラスウェーハ、フォトマスクガラス、ハードディスク等が含まれる。容器本体は、25、26枚の基板を収納可能な大きさでも良いし、2、3枚の基板を収納可能な大きさでも良い。この容器本体は、フロントオープンボックスタイプあるいはトップオープンボックスタイプとすることができる。また、支持体は、容器本体とは別体でも良いが、一体構成でも良い。   Here, the substrate in the claims includes at least one semiconductor wafer (for example, 200 mm, 300 mm, 450 mm type, etc.), compound semiconductor wafer, glass wafer, photomask glass, hard disk and the like. The container body may be large enough to accommodate 25 or 26 substrates, or may be large enough to accommodate two or three substrates. The container body can be a front open box type or a top open box type. In addition, the support body may be a separate body from the container main body, but may be integrated.

本発明によれば、支持体の棚板片を容器本体の開口部から閉塞部側にかけて略波形に形成するので、棚板片の強度を向上させ、棚板片の洗浄時の水分残存を低減するとともに、乾燥作業の作業時間の短縮を図ることができ、しかも、棚板片の厚さバラツキを防ぎ、基板の高精度な支持や基板の円滑な出し入れを実現することができるという効果がある。   According to the present invention, since the shelf piece of the support is formed in a substantially corrugated shape from the opening of the container body to the closing portion side, the strength of the shelf piece is improved and the residual moisture during the washing of the shelf piece is reduced. In addition, the working time of the drying operation can be shortened, and the thickness variation of the shelf board pieces can be prevented, and the substrate can be supported with high accuracy and the substrate can be smoothly taken in and out. .

また、支持体を、容器本体の側壁内面に対向する別体の中間片と、この中間片に形成されて容器本体の側壁内面の開口部側に位置する先端片と、中間片に形成されて容器本体の側壁内面の閉塞部側に位置する末端片と、少なくとも中間片に突出形成されて基板を支持する棚板片とから形成し、先端片から末端片方向にかけて棚板片を連続した略波形に形成すれば、成形材料の相溶性や種類にかかわらず、容器本体と棚板片とを一体化することができる。また、例え容器本体が2枚の半導体ウェーハを収納するタイプの場合でも、金型の構造が複雑化して成形の困難化やコストアップを招くことが少なく、安価な製造が期待できる。   Further, the support is formed on the intermediate piece as a separate intermediate piece facing the side wall inner surface of the container body, a tip piece formed on the intermediate piece and positioned on the opening side of the side wall inner surface of the container main body, and the intermediate piece. It is formed from a terminal piece located on the closed side of the inner surface of the side wall of the container main body, and a shelf board piece that protrudes from at least the intermediate piece and supports the substrate, and the shelf board piece is continuous from the tip piece to the terminal piece direction. If it forms in a waveform, a container main body and a shelf piece can be integrated irrespective of the compatibility and kind of molding material. Further, even when the container body is of a type that accommodates two semiconductor wafers, the structure of the mold is not complicated, causing less difficulty in molding and an increase in cost, and inexpensive manufacturing can be expected.

また、容器本体の側壁内面の開口部側と先端片の先端部のいずれか一方に凹部を形成するとともに、他方には凸部を形成し、これら凹部と凸部との嵌め合わせにより、容器本体の側壁内面に先端片を固定すれば、容器本体に別体の支持体を取り付ける際の作業性や位置精度を向上させ、基板を円滑に出し入れすることができる。
また、容器本体の側壁内面に、支持体の中間片と末端片のいずれかを挟んで位置決めする複数の位置決めリブを形成すれば、簡易な構成で支持体の平行度を調整することができる。
Moreover, while forming a recessed part in any one of the opening part side of the side wall inner surface of a container main body, and the front-end | tip part of a front-end | tip piece, a convex part is formed in the other, and a container main body is carried out by fitting with these recessed parts and a convex part. If the tip piece is fixed to the inner surface of the side wall, the workability and positional accuracy when attaching a separate support to the container body can be improved, and the substrate can be taken in and out smoothly.
In addition, if a plurality of positioning ribs are formed on the inner surface of the side wall of the container body with the intermediate piece or the end piece of the support interposed therebetween, the parallelism of the support can be adjusted with a simple configuration.

また、容器本体の側壁内面の開口部側に係止溝を形成して凹部とし、先端片の先端部を屈曲させて係止溝に嵌まる凸部とし、この先端片の先端部を略櫛形に形成してその櫛歯に傾斜突部を形成すれば、先端部の可撓性を向上させたり、傾斜突部により係止溝と櫛歯との摩擦を低減することができる。   In addition, a locking groove is formed on the opening side of the inner wall of the container body to form a recess, and the tip of the tip piece is bent to fit into the locking groove, and the tip of the tip piece is substantially comb-shaped. If the inclined protrusion is formed on the comb teeth, the flexibility of the tip can be improved, and the friction between the locking groove and the comb teeth can be reduced by the inclined protrusion.

また、容器本体の側壁内面に、支持体を挟む複数のガイドリブを形成してこのガイドリブの端部には位置決め溝を形成し、支持体の先端片には、位置決め溝に嵌まる位置決め突部を形成すれば、支持体の少なくとも中間片を適切な位置にセットすることが可能となる。また、位置決め突部により、支持体を挿入方向に適切に位置決めすることが可能となる。また、支持体の先端片に、容器本体のガイドリブに接触して位置合わせする位置合わせ突部を形成すれば、収納された基板の並ぶ方向に支持体や棚板片を位置決めすることが可能になる。   Also, a plurality of guide ribs sandwiching the support are formed on the inner wall of the side wall of the container body, a positioning groove is formed at the end of the guide rib, and a positioning protrusion that fits into the positioning groove is formed at the end piece of the support. If formed, at least the intermediate piece of the support can be set at an appropriate position. Moreover, it becomes possible to position a support body appropriately in an insertion direction by a positioning protrusion. In addition, if the alignment protrusion is formed on the tip of the support to contact and align with the guide ribs of the container body, the support and shelf pieces can be positioned in the direction in which the stored substrates are arranged. Become.

また、容器本体の側壁内面の閉塞部側に係合溝を形成し、末端片の末端部には、係合溝に嵌まる係合突部を形成すれば、この係合突部の嵌め合わせ作用により、支持体の容器本体内への脱落が規制される。また、容器本体の側壁内面の閉塞部側に、支持体の末端片を支持する複数の保持リブを形成すれば、支持体の容器本体内への脱落が規制される。
また、容器本体の側壁内面の閉塞部側と支持体の末端片とのいずれかに、末端片の撓みを規制する撓み規制ストッパを形成すれば、撓み規制ストッパが容器本体の側壁内面に対向して末端片の撓みを規制する。
Further, if an engagement groove is formed on the closed side of the inner surface of the side wall of the container body, and an engagement protrusion that fits into the engagement groove is formed at the end of the end piece, the engagement protrusion is fitted. Due to the action, dropping of the support into the container body is restricted. Moreover, if the several holding rib which supports the terminal piece of a support body is formed in the obstruction | occlusion part side of the side wall inner surface of a container main body, drop | omission into the container main body of a support body will be controlled.
In addition, if a deflection regulating stopper that regulates the bending of the end piece is formed on either the closed side of the inner side wall of the container body or the end piece of the support, the deflection regulating stopper faces the inner side wall of the container body. To regulate the bending of the end piece.

また、容器本体の側壁内面の開口部側に位置する棚板片の湾曲頂部を他の複数の湾曲頂部よりも高くすれば、この容器本体の側壁内面の開口部側に位置する湾曲頂部により、容器本体に収納された基板の開口部方向への飛び出し規制が期待できる。
また、棚板片の湾曲頂部と湾曲谷部のうち、少なくとも湾曲谷部を容器本体の側壁内面から内方向に向かうにしたがい徐々に細くなるよう先細りに形成すれば、水分が湾曲頂部から湾曲谷部に流れて湾曲谷部の先端から排水される。したがって、水分の付着部分の特定が容易になり、乾燥作業に要する時間を短縮することができる。
Also, if the curved top of the shelf piece located on the opening side of the inner side wall of the container body is made higher than the other curved tops, the curved top located on the opening side of the inner side wall of the container body, It can be expected that the substrate stored in the container body will be restricted from projecting toward the opening.
In addition, if at least the curved valley portion of the shelf plate pieces is tapered so as to gradually become narrower inward from the inner surface of the side wall of the container body, moisture can be removed from the curved top portion. It flows into the part and is drained from the tip of the curved valley part. Therefore, it becomes easy to specify the moisture adhering portion, and the time required for the drying operation can be shortened.

さらに、支持体の棚板片を分割し、この分割した複数の棚板片を支持体の長手方向に間隔をおいて配列すれば、棚板片と基板との接触面積を減少させて基板の汚染を抑制したり、製造時の棚板片の変形を防いだり、材料コストの削減が期待できる。   Furthermore, if the shelf pieces of the support are divided and the plurality of divided shelf pieces are arranged at intervals in the longitudinal direction of the support, the contact area between the shelf pieces and the substrate is reduced. It can be expected to suppress contamination, prevent deformation of shelf boards during manufacturing, and reduce material costs.

以下、図面を参照して本発明に係る基板収納容器の好ましい実施形態を説明すると、本実施形態における基板収納容器は、図1ないし図10に示すように、少数枚の半導体ウェーハWを収納可能な平面略多角形の容器本体1と、この容器本体1に別体として内蔵されて半導体ウェーハWを水平に支持する左右一対の支持体30とを備え、各支持体30を、中間片31、先端片32、末端片39、及び一対のティース45とから一体成形するようにしている。   Hereinafter, a preferred embodiment of a substrate storage container according to the present invention will be described with reference to the drawings. The substrate storage container in this embodiment can store a small number of semiconductor wafers W as shown in FIGS. And a pair of left and right supports 30 that are built in the container body 1 and support the semiconductor wafer W horizontally, and each of the supports 30 is an intermediate piece 31. The tip piece 32, the end piece 39, and the pair of teeth 45 are integrally formed.

半導体ウェーハWは、例えば薄く丸いφ300mmのシリコンタイプからなり、周縁部に位置合わせや識別用のノッチが選択的に形成されており、表面には回路パターンが形成される。   The semiconductor wafer W is made of, for example, a thin and round silicon type of φ300 mm, and a notch for alignment and identification is selectively formed on the peripheral edge, and a circuit pattern is formed on the surface.

容器本体1は、図1や図2に示すように、金型に所定の樹脂を含有する成形材料が射出されることにより、2枚の半導体ウェーハWを上下に整列収納する背の低いフロントオープンボックスタイプに成形され、開口した横長の正面部2に同形の蓋体20がエンドレスのガスケットを介し着脱自在に嵌合されるとともに、この蓋体20には、容器本体1の正面部2を嵌合閉塞した蓋体20を施錠する施錠機構が内蔵されており、図示しないロードポート装置にスライド可能に搭載されてその出し入れ口に正面部2を対向接触させる。   As shown in FIGS. 1 and 2, the container body 1 has a short front opening that aligns and stores two semiconductor wafers W by vertically injecting a molding material containing a predetermined resin into a mold. A lid 20 of the same shape is detachably fitted to the horizontally long front portion 2 which is formed into a box type and is opened through an endless gasket, and the front portion 2 of the container body 1 is fitted to the lid 20. A locking mechanism that locks the closed lid 20 is built in, and is slidably mounted on a load port device (not shown) so that the front surface portion 2 is brought into contact with the loading / unloading port.

容器本体1を成形する成形材料の樹脂としては、例えば力学的性質、耐熱性、寸法安定性等に優れるポリブチレンテレフタレート、ポリカーボネート、ポリエーテルイミド、シクロオレフィン樹脂等があげられる。これらの樹脂は、選択的に2種以上組み合わされ、インサート成形や二色成形等に用いられる。また、これらの樹脂には、導電性を向上させる観点からカーボンブラック、カーボンフィラー、カーボンナノチューブ、導電性高分子等が添加されたり、透過波長を制御する観点からヒンダートアミン等の紫外線吸収剤が添加されたり、あるいは剛性を向上させるためガラス繊維が加えられる。   Examples of the resin of the molding material for molding the container body 1 include polybutylene terephthalate, polycarbonate, polyether imide, and cycloolefin resin, which are excellent in mechanical properties, heat resistance, dimensional stability, and the like. Two or more kinds of these resins are selectively combined and used for insert molding, two-color molding, and the like. In addition, carbon black, carbon filler, carbon nanotube, conductive polymer, etc. are added to these resins from the viewpoint of improving conductivity, or UV absorbers such as hindered amines are used from the viewpoint of controlling the transmission wavelength. Glass fibers are added or added to improve rigidity.

容器本体1は、図2に示すように、両側壁の正面部2側がそれぞれ直線的に形成され、両側壁の背面壁側(閉塞部側)がそれぞれ断面略へ字形に屈曲形成されることにより、内部の正面部2側が広く、内部の背面壁側が狭く区画形成される。この容器本体1の各側壁内面の正面部2側、換言すれば、容器本体1の正面部内周には図2や図9に示すように、支持体30の先端片32を固定するための係止溝3が上下方向に切り欠かれる。   As shown in FIG. 2, the container body 1 is formed by linearly forming the front surface 2 side of both side walls and bending the back wall side (closed portion side) of both side walls into a substantially cross-sectional shape. The interior front portion 2 side is wide and the interior back wall side is narrowly formed. As shown in FIG. 2 and FIG. 9, a member for fixing the front end piece 32 of the support 30 to the front portion 2 side of the inner surface of each side wall of the container body 1, in other words, the inner periphery of the front portion of the container body 1. The stop groove 3 is cut out in the vertical direction.

各側壁内面には、図7ないし図9に示すように、支持体30の少なくとも中間片31、具体的には、中間片31や先端片32を僅かな隙間を介して案内挟持する上下一対のガイドリブ4が形成され、各ガイドリブ4が容器本体1の前後方向に細長い板形あるいは棒形に形成されてその正面部2側の先端部には断面略し字形、略C字形、略J字形、略U字形等の位置決め溝5が凹み形成される。一対のガイドリブ4は、中間片31や先端片32の高さに相当する間隔をおいて対向配置され、容器本体1の正面部2から背面壁側にかけて徐々に間隔が狭くなるよう傾斜する。   As shown in FIG. 7 to FIG. 9, a pair of upper and lower portions that guide and sandwich at least the intermediate piece 31 of the support 30, specifically, the intermediate piece 31 and the tip piece 32 through a slight gap, are provided on the inner surface of each side wall. Guide ribs 4 are formed, and each guide rib 4 is formed in a plate shape or a rod shape elongated in the front-rear direction of the container body 1, and the front end portion 2 side has an abbreviated cross-sectional shape, a substantially C shape, a substantially J shape, A U-shaped positioning groove 5 is formed as a recess. The pair of guide ribs 4 are disposed to face each other with an interval corresponding to the height of the intermediate piece 31 and the tip piece 32, and are inclined so that the interval gradually decreases from the front part 2 of the container body 1 to the rear wall side.

容器本体1の各側壁内面の背面壁側には図7ないし図9に示すように、支持体30の末端片39を挟持する上下一対の位置決めリブ6が突出形成される。また、各側壁内面の背面壁側には、位置決めリブ6の後方に位置する断面略L字形、U字形、V字形の係合溝7がリブを介して形成される。また、各側壁内面の背面壁側には、係合溝7の上下近傍に位置する上下一対の保持リブ8が形成され、この一対の保持リブ8が各側壁内面の背面壁側との間に支持体30の末端片39を挟持するよう機能する。各保持リブ8は、容器本体1の前後方向に細長い板形に形成され、位置決めリブ6の後方に位置する。   As shown in FIGS. 7 to 9, a pair of upper and lower positioning ribs 6 sandwiching the end piece 39 of the support 30 are formed on the back wall side of the inner surface of each side wall of the container body 1. In addition, on the back wall side of the inner surface of each side wall, engagement grooves 7 having substantially L-shaped, U-shaped and V-shaped cross sections located behind the positioning rib 6 are formed via the ribs. In addition, a pair of upper and lower holding ribs 8 are formed on the back wall side of the inner surface of each side wall, and the pair of upper and lower holding ribs 8 are located near the upper and lower sides of the engagement groove 7. It functions to sandwich the end piece 39 of the support 30. Each holding rib 8 is formed in a plate shape elongated in the front-rear direction of the container body 1, and is positioned behind the positioning rib 6.

容器本体1の外周面には、機械的強度や剛性を高めるリブフランジ9が形成され、このリブフランジ9が容器本体1の脱型時に突出しピンに対向する。このリブフランジ9は、容器本体1の背面壁と両側壁とに外側から一体形成され、変形した平面略U字形を呈する。背面壁のリブフランジ9の両側部は、容器本体1の正面部2が下方に傾かないよう金属製のバランスウェイト10が後付けで螺着され、容器本体1の金型からの脱型時に複数の突出しピンに外側から対向するよう機能する。   A rib flange 9 is formed on the outer peripheral surface of the container body 1 to increase mechanical strength and rigidity. The rib flange 9 protrudes when the container body 1 is removed and faces the pin. The rib flange 9 is integrally formed on the back wall and both side walls of the container body 1 from the outside, and has a deformed planar substantially U shape. Both sides of the rib flange 9 on the back wall are screwed with a metal balance weight 10 so that the front part 2 of the container body 1 does not tilt downward, and a plurality of parts are removed when the container body 1 is removed from the mold. It functions to face the protruding pin from the outside.

背面壁のリブフランジ9の中央部は、略W字形に屈曲形成されて凹部を形成し、この凹部の開口が下方に向いて容器本体1のロードポート装置に対する位置決め部11として機能する。また、各側壁のリブフランジ9の前部は、略逆V字形に屈曲して凹部を形成し、この凹部の開口が下方に向いてロードポート装置に対する位置決め部11として機能する。また、容器本体1の天井中心部には、複数の被取付リブ12が立設され、この複数の被取付リブ12には、図示しない搬送機構に把持される平面略三角形の吊持フランジ13が締結具を介し着脱自在に螺着される。   A central portion of the rib flange 9 on the back wall is bent into a substantially W shape to form a concave portion, and the opening of the concave portion faces downward and functions as a positioning portion 11 for the load port device of the container body 1. Further, the front portion of the rib flange 9 on each side wall is bent into a substantially inverted V shape to form a concave portion, and the opening of the concave portion functions downward as a positioning portion 11 for the load port device. In addition, a plurality of attached ribs 12 are erected at the center of the ceiling of the container body 1, and a planar substantially triangular suspension flange 13 held by a transport mechanism (not shown) is provided on the plurality of attached ribs 12. It is detachably screwed through a fastener.

容器本体1の正面部2は外方向に広がるよう膨出形成されてリムフランジ14を形成し、このリムフランジ14の内部両側には、蓋体20施錠用の施錠溝15が上下方向に切り欠かれる。リムフランジ14の左右に張り出した両側部には図1、図5、図6に示すように、複数の取付孔16が上下方向に並べて穿孔されており、この複数の取付孔16に情報表示パッドであるインフォパッドが選択的に挿入され、かつロードポート装置の検出センサに検出されることにより、半導体ウェーハWの有無や枚数、半導体ウェーハWの収納位置、基板収納容器のタイプ等がロードポート装置に識別される。   The front portion 2 of the container body 1 is formed to bulge outwardly to form a rim flange 14, and locking grooves 15 for locking the lid 20 are notched in the vertical direction on both sides inside the rim flange 14. It is. As shown in FIGS. 1, 5, and 6, a plurality of mounting holes 16 are perforated in the vertical direction on both sides of the rim flange 14 projecting to the left and right, and information display pads are formed in the plurality of mounting holes 16. The information pad is selectively inserted and detected by the detection sensor of the load port device, so that the presence / absence and number of semiconductor wafers W, the storage position of the semiconductor wafer W, the type of the substrate storage container, etc. Identified.

蓋体20は、図1に示すように、容器本体1の正面部2に着脱自在に嵌合され、施錠機構を内蔵する横長の筐体と、この筐体の開口した正面部(表面部)に螺着されて被覆する表面カバー21とを備えて構成され、容器本体1に対してロードポート装置の蓋体開閉装置により取り付け、取り外しされる。この蓋体20の材料としては、例えば容器本体1と同様の成形材料が使用される。   As shown in FIG. 1, the lid 20 is detachably fitted to the front part 2 of the container body 1, and has a horizontally long case containing a locking mechanism, and an open front part (surface part) of the case. And a front cover 21 that is screwed onto the container body 1 and attached to and removed from the container body 1 by a lid opening / closing device of the load port device. As a material of the lid 20, for example, a molding material similar to that of the container body 1 is used.

筐体の裏面中央部には、横長の取付穴が凹み形成され、この取付穴には、半導体ウェーハWの周縁部前方を弾性片により弾発的に保持するフロントリテーナが装着される。また、筐体の裏面周縁部には、横長で枠形の取付溝が切り欠かれ、この取付溝には、容器本体1との間に介在する弾性のガスケットが嵌合される。   A horizontally long mounting hole is formed in the center of the rear surface of the housing. A front retainer that elastically holds the front of the peripheral edge of the semiconductor wafer W with an elastic piece is mounted in the mounting hole. In addition, a horizontally long frame-shaped mounting groove is cut out at the peripheral edge of the rear surface of the housing, and an elastic gasket interposed between the container main body 1 is fitted into the mounting groove.

表面カバー21は、横長の略矩形に形成され、両側部には、施錠機構用の操作口22がそれぞれ略凸字形に穿孔されており、中央部と最両側部とには、ロードポート装置の蓋体開閉装置に真空吸着される正面円形の吸着領域がそれぞれ形成される。   The front cover 21 is formed in a horizontally long and substantially rectangular shape, and operation ports 22 for a locking mechanism are formed in both sides so as to have a substantially convex shape, respectively. A front circular suction region that is vacuum-sucked by the lid opening / closing device is formed.

各支持体30は、図2ないし図6、図9、図10に示すように、容器本体1の側壁内面に対向する中間片31と、この中間片31に一体形成されて容器本体1の側壁内面の正面部2側に位置する細長い矩形の先端片32と、中間片31に形成されて容器本体1の側壁内面の背面壁側に位置する細長い矩形の末端片39と、中間片31と末端片39とに形成されて半導体ウェーハWの周縁部を水平に支持する上下一対のティース45とを備えて形成される。   As shown in FIGS. 2 to 6, 9, and 10, each support 30 is provided with an intermediate piece 31 that opposes the inner surface of the side wall of the container body 1, and the side wall of the container body 1 that is integrally formed with the intermediate piece 31. An elongated rectangular tip piece 32 positioned on the front surface 2 side of the inner surface, an elongated rectangular end piece 39 formed on the intermediate piece 31 and positioned on the back wall side of the inner wall of the container body 1, and the intermediate piece 31 and the distal end A pair of upper and lower teeth 45 that are formed on the piece 39 and horizontally support the peripheral edge of the semiconductor wafer W are formed.

支持体30を成形する成形材料の樹脂としては、例えば滑性、耐熱性、寸法安定性等に優れるポリエーテルエーテルケトン、ポリブチレンテレフタレート、ポリカーボネート、ポリエーテルイミド、シクロオレフィン樹脂等があげられる。これらの樹脂は、選択的に2種以上組み合わされ、インサート成形や二色成形等に用いられる。また、これらの樹脂には、導電性を向上させる観点からカーボンブラック、カーボンフィラー、カーボンナノチューブ、導電性高分子等が添加されたり、透過波長を制御する観点からヒンダートアミン等の紫外線吸収剤が添加されたり、あるいは剛性を向上させるためガラス繊維が加えられる。   Examples of the resin of the molding material that molds the support 30 include polyether ether ketone, polybutylene terephthalate, polycarbonate, polyether imide, and cycloolefin resin that are excellent in lubricity, heat resistance, dimensional stability, and the like. Two or more kinds of these resins are selectively combined and used for insert molding, two-color molding, and the like. In addition, carbon black, carbon filler, carbon nanotube, conductive polymer, etc. are added to these resins from the viewpoint of improving conductivity, or UV absorbers such as hindered amines are used from the viewpoint of controlling the transmission wavelength. Glass fibers are added or added to improve rigidity.

支持体30の中間片31は、図3や図4に示すように、一対のガイドリブ4の間に介在して容器本体1の前後方向に伸びる細長い矩形に形成され、先端部に先端片32が直線的に伸長形成されており、末端部に末端片39が容器本体1の内部内方向、換言すれば、半導体ウェーハWの中心部方向に向け屈曲して形成される。   As shown in FIGS. 3 and 4, the intermediate piece 31 of the support 30 is formed in an elongated rectangular shape that is interposed between a pair of guide ribs 4 and extends in the front-rear direction of the container body 1. The end piece 39 is formed so as to be bent linearly toward the inside of the container body 1, in other words, toward the center of the semiconductor wafer W.

先端片32は、図3や図4に示すように、洗浄液の水切りを容易にする複数の水切り孔33が格子形に並べて穿孔され、各水切り孔33が前後方向に細長い矩形に形成されており、容器本体1の一対のガイドリブ4間に介在して挟持される。この先端片32の先端部34は、容器本体1の内部外方向に向け略L字形に屈曲形成され、容器本体1の係止溝3に着脱自在に嵌入係止されて支持体30の脱落を防止する。   As shown in FIG. 3 and FIG. 4, the tip piece 32 has a plurality of drain holes 33 arranged in a lattice shape for facilitating draining of the cleaning liquid, and each drain hole 33 is formed in an elongated rectangular shape in the front-rear direction. And interposed between the pair of guide ribs 4 of the container body 1. The distal end portion 34 of the distal end piece 32 is bent and formed in an approximately L shape toward the inside and outside of the container main body 1, and is detachably fitted and locked in the locking groove 3 of the container main body 1 to remove the support 30. To prevent.

先端片32の先端部34は、図3、図4、図8、図9に示すように、可撓性や柔軟性を確保する観点から櫛形に形成され、各櫛歯35の表裏面の少なくともいずれか一方には、係止溝3との摩擦を低減する複数の傾斜突部36が間隔をおいて選択的に並設されており、この複数の配列された傾斜突部36が係止溝3に対する嵌入を容易にしたり、水切り性を向上させる。また、先端片32の上下面には、ガイドリブ4の位置決め溝5に嵌入する位置決め突部37がそれぞれ突出形成され、この一対の位置決め突部37が支持体30をその挿入方向に位置決めする。   As shown in FIGS. 3, 4, 8, and 9, the distal end portion 34 of the distal end piece 32 is formed in a comb shape from the viewpoint of ensuring flexibility and flexibility, and at least the front and rear surfaces of each comb tooth 35. One of the plurality of inclined protrusions 36 that reduce friction with the locking groove 3 is selectively arranged in parallel with a distance from each other, and the plurality of arranged inclined protrusions 36 are arranged in the locking groove. 3 can be easily inserted, and drainage can be improved. In addition, positioning protrusions 37 that are fitted into the positioning grooves 5 of the guide rib 4 are respectively formed on the upper and lower surfaces of the tip piece 32 to project the pair of positioning protrusions 37 in the insertion direction.

各位置決め突部37は、ピン形に突出形成され、先端片32の先端部34よりも後方に位置する。また、先端片32の上下面には図3、図4、図9に示すように、容器本体1のガイドリブ4の対向面に接触する位置合わせ突部38がそれぞれ突出形成され、この一対の位置合わせ突部38が支持体30やティース45を上下方向に位置決めするよう機能する。各位置合わせ突部38は、位置決め突部37よりも低く、摩擦低減の観点から半球形に突出形成されており、位置決め突部37の後方に隣接する。   Each positioning projection 37 is formed to protrude in a pin shape, and is positioned rearward of the distal end portion 34 of the distal end piece 32. Further, as shown in FIGS. 3, 4, and 9, alignment protrusions 38 that contact the opposing surfaces of the guide rib 4 of the container main body 1 are respectively formed on the upper and lower surfaces of the tip piece 32 so as to protrude. The mating protrusion 38 functions to position the support 30 and the teeth 45 in the vertical direction. Each alignment protrusion 38 is lower than the positioning protrusion 37, is formed in a hemispherical shape from the viewpoint of reducing friction, and is adjacent to the rear of the positioning protrusion 37.

末端片39は、図3、図4、図6、図9に示すように、その末端部に取付片40が一体形成され、この取付片40には、容器本体1に収納された半導体ウェーハWに接触して収納位置を規制する位置規制部41が突出形成されており、取付片40の上下面が容器本体1の一対の位置決めリブ6に挟持して位置決めされることにより、平行度が調整される。取付片40の末端部には、中間片31と平行に伸びる端壁部42が一体形成され、この端壁部42の上下が容器本体1の側壁内面の背面壁側と一対の保持リブ8との間に挟持される。   As shown in FIGS. 3, 4, 6, and 9, the end piece 39 is integrally formed with a mounting piece 40 at its end, and the mounting piece 40 has a semiconductor wafer W accommodated in the container body 1. A position restricting portion 41 that protrudes in contact with the container and protrudes is formed so that the upper and lower surfaces of the attachment piece 40 are positioned by being sandwiched between the pair of positioning ribs 6 of the container body 1 so that the parallelism is adjusted. Is done. An end wall portion 42 extending in parallel with the intermediate piece 31 is integrally formed at the end portion of the attachment piece 40, and the upper and lower sides of the end wall portion 42 are on the back wall side of the inner surface of the side wall of the container body 1 and the pair of holding ribs 8 Is sandwiched between.

端壁部42の末端部には、容器本体1の係合溝7に嵌合するピン形の係合突部43が一体形成され、この係合突部43の嵌合と保持リブ8の挟持作用とにより、支持体30の容器本体1内への脱落や落下が有効に防止される。また、位置規制部41は、収納された半導体ウェーハWと共に形成する角度が90°以上の鈍角となるよう傾斜形成されたり、あるいは断面略半円形や略半楕円形に形成され、位置決めリブ6の近傍やティース45の後部近傍に位置する。   A pin-shaped engagement protrusion 43 that fits into the engagement groove 7 of the container body 1 is integrally formed at the end portion of the end wall portion 42, and the engagement of the engagement protrusion 43 and the holding rib 8 are sandwiched. The action effectively prevents the support 30 from dropping or dropping into the container body 1. Further, the position restricting portion 41 is formed so as to form an obtuse angle of 90 ° or more with the semiconductor wafer W accommodated therein, or is formed in a substantially semicircular or substantially semielliptical cross section. It is located in the vicinity and the vicinity of the rear part of the tooth 45.

取付片40の裏面には、位置規制部41の裏側に位置する板形の撓み規制ストッパ44が架設され、この撓み規制ストッパ44が容器本体1の側壁内面の背面壁側に接触して末端片39やティース45の撓みを規制するよう機能する。この撓み規制ストッパ44は、容器本体1の正面部2から蓋体20を取り外した際の半導体ウェーハWの位置ずれを抑制防止するよう機能する。   On the back surface of the mounting piece 40, a plate-shaped bending restriction stopper 44 located on the back side of the position restriction portion 41 is installed, and this bending restriction stopper 44 comes into contact with the rear wall side of the inner wall of the container main body 1 to contact the end piece. It functions to regulate the bending of 39 and teeth 45. The deflection regulating stopper 44 functions to suppress and prevent the positional deviation of the semiconductor wafer W when the lid 20 is removed from the front part 2 of the container body 1.

各ティース45は、図3ないし図6に示すように、平面視で容器本体1の前後方向に細長い板形に形成され、支持体30の中間片31から末端片39に亘る領域に突出形成される。このティース45は、容器本体1の前後方向、換言すれば、先端片32から末端片39方向にかけて凹凸が交互に連続した滑らかな波形に湾曲形成され、高位の複数の湾曲頂部46A・46B・46C・46D・46E・46Fと低位の複数の湾曲谷部47とが交互に位置する。   As shown in FIGS. 3 to 6, each of the teeth 45 is formed in an elongated plate shape in the front-rear direction of the container body 1 in a plan view, and is formed so as to protrude from the intermediate piece 31 to the end piece 39 of the support 30. The The teeth 45 are curved and formed into a smooth waveform having irregularities alternately arranged in the front-rear direction of the container body 1, in other words, from the distal end piece 32 to the distal end piece 39, and a plurality of high-order curved top portions 46 </ b> A, 46 </ b> B, 46 </ b> C. 46D, 46E, 46F and a plurality of lower curved valleys 47 are alternately positioned.

ティース45の複数の湾曲頂部46A・46B・46C・46D・46E・46Fのうち、容器本体1の側壁内面の最も正面部2側に位置する湾曲頂部46Aは、図5に示すように、他の複数の湾曲頂部46B・46C・46D・46E・46Fよりも半導体ウェーハWの厚さ分だけ高く突出形成され、この高い湾曲頂部46Aに半導体ウェーハWの周縁部前方が接触することにより、容器本体1に収納された半導体ウェーハWの正面部2側への飛び出しが有効に規制される。   Of the plurality of curved top portions 46A, 46B, 46C, 46D, 46E, and 46F of the tooth 45, the curved top portion 46A that is located on the most front side 2 side of the inner surface of the side wall of the container body 1 is, as shown in FIG. The plurality of curved top portions 46B, 46C, 46D, 46E, and 46F are formed so as to protrude higher than the thickness of the semiconductor wafer W, and the front of the peripheral portion of the semiconductor wafer W comes into contact with the high curved top portions 46A. The semiconductor wafer W housed in the semiconductor wafer W is effectively restricted from jumping to the front surface 2 side.

他の複数の湾曲頂部46B・46C・46D・46E・46Fは、図5に示すように、少なくとも選択された前後一対の湾曲頂部46B・46Fが半導体ウェーハWの周縁部を下方から支持し、この一対の湾曲頂部46B・46F以外の他の湾曲頂部46C・46D・46Eが低く形成されて半導体ウェーハWに非接触とされる。   As shown in FIG. 5, the plurality of other curved top portions 46B, 46C, 46D, 46E, and 46F support at least the pair of front and rear curved top portions 46B and 46F that support the peripheral portion of the semiconductor wafer W from below. The other curved top portions 46C, 46D, and 46E other than the pair of curved top portions 46B and 46F are formed low and are not in contact with the semiconductor wafer W.

一対の湾曲頂部46B・46Fは、例えば湾曲頂部46Aの直後に位置する湾曲頂部46Bと、容器本体1の側壁内面の最も背面壁側に位置する湾曲頂部46Fとを備えて形成される。この一対の湾曲頂部46B・46F以外の他の湾曲頂部46C・46D・46Eは、半導体ウェーハWの周縁部に接触しないことにより、パーティクルの発生や付着を防いだり、大きな衝撃が作用した場合に半導体ウェーハWのバタツキを防止して保護する。   The pair of curved top portions 46B and 46F are formed, for example, including a curved top portion 46B located immediately after the curved top portion 46A and a curved top portion 46F located on the innermost side surface of the side wall of the container body 1 on the back wall side. The curved top portions 46C, 46D, and 46E other than the pair of curved top portions 46B and 46F are not in contact with the peripheral portion of the semiconductor wafer W, thereby preventing the generation and adhesion of particles or the semiconductor when a large impact is applied. Prevents and protects the wafer W from fluttering.

ティース45の各湾曲谷部47は、図6に示すように、容器本体1の側壁内面(図6の右側)から内部内方向(図6の左側)に向かうにしたがい徐々に低く細くなるようなだらかな断面先細りに傾斜形成される。この湾曲谷部47の傾斜形成により、ティース45に付着した水分の流動や排水が容易になる。   As shown in FIG. 6, each of the curved valley portions 47 of the teeth 45 is gently slender and gradually narrows from the inner surface of the side wall of the container body 1 (right side of FIG. 6) toward the inner inward direction (left side of FIG. 6). The cross section is tapered and formed with a slope. Due to the inclined formation of the curved valley portion 47, the flow and drainage of moisture attached to the tooth 45 are facilitated.

上記において、容器本体1の内部に支持体30を装着する場合には、先ず、容器本体1の内部に支持体30を一対のガイドリブ4を介して挿入し、容器本体1の係合溝7に支持体30の係合突部43を嵌入するとともに、容器本体1の側壁内面の背面壁側と保持リブ8とに支持体30の端壁部42を挟持させ、一対の位置決めリブ6に支持体30の末端片39を挟持させる。この際、一対のガイドリブ4が徐々に狭まるよう傾斜して位置決め作用やガタツキ防止作用を営むので、支持体30の中間片31や末端片39を適切に挿入してスライドさせることができる。   In the above, when the support body 30 is mounted inside the container body 1, first, the support body 30 is inserted into the container body 1 via the pair of guide ribs 4 and is inserted into the engagement groove 7 of the container body 1. The engaging protrusion 43 of the support body 30 is fitted, the end wall portion 42 of the support body 30 is sandwiched between the rear wall side of the inner wall of the container body 1 and the holding rib 8, and the pair of positioning ribs 6 support the support body. Thirty end pieces 39 are clamped. At this time, the pair of guide ribs 4 are inclined so as to be gradually narrowed to perform positioning action and rattling prevention action, so that the intermediate piece 31 and the end piece 39 of the support 30 can be appropriately inserted and slid.

こうして容器本体1の内部に支持体30の中間片31や末端片39を適切に挿入して脱落しないようにしたら、容器本体1の係止溝3に先端片32の先端部34を嵌入係止し、各ガイドリブ4の位置決め溝5に位置決め突部37を嵌入して支持体30を挿入方向に位置決めし、かつガイドリブ4の対向面に位置合わせ突部38を圧接してティース45を上下方向に位置決めすれば、容器本体1の内部に支持体30を装着して一体化することができる。   Thus, when the intermediate piece 31 and the end piece 39 of the support 30 are properly inserted into the container body 1 so as not to fall off, the distal end portion 34 of the distal end piece 32 is fitted and locked in the locking groove 3 of the container body 1. Then, the positioning protrusions 37 are fitted into the positioning grooves 5 of the guide ribs 4 to position the support 30 in the insertion direction, and the alignment protrusions 38 are pressed against the opposing surfaces of the guide ribs 4 so that the teeth 45 are moved vertically. If it positions, the support body 30 can be mounted | worn with the inside of the container main body 1, and can be integrated.

上記構成によれば、例えティース45に洗浄液の水分が付着しても、水分が湾曲頂部46A・46B・46C・46D・46E・46Fから凹んだ湾曲谷部47に流下して溜まり、湾曲谷部47の傾斜した表面を流れて先端48から効率良く排水されるので、水分の付着部分の特定がきわめて容易となり、しかも、乾燥作業時間の大幅な短縮が期待できる。   According to the above configuration, even if moisture of the cleaning liquid adheres to the tooth 45, for example, the moisture flows down from the curved top portions 46A, 46B, 46C, 46D, 46E, and 46F to the concave curved valley portion 47 and accumulates. Since it flows through the inclined surface 47 and is efficiently drained from the tip 48, it is very easy to identify the portion where the moisture adheres, and the drying operation time can be expected to be greatly shortened.

また、ティース45が単なる平板形ではなく、強度向上にも資する波形なので、成形時の冷却効率を向上させ、ティース45を略均一な肉厚に成形することができ、実に変形しにくい構成とすることができる。すなわち、収縮等によるティース45の変形が少ないので、半導体ウェーハWの高精度な支持や半導体ウェーハWの円滑な出し入れが大いに期待できる。   In addition, since the tooth 45 is not a simple flat plate, but has a waveform that contributes to an improvement in strength, the cooling efficiency at the time of molding can be improved, and the tooth 45 can be molded to a substantially uniform thickness, and the structure is hardly deformed. be able to. That is, since there is little deformation of the tooth 45 due to shrinkage or the like, high-precision support of the semiconductor wafer W and smooth removal / insertion of the semiconductor wafer W can be greatly expected.

また、容器本体1の内部に複数のティース45を一体成形しないので、成形材料の相溶性や種類にかかわらず、容器本体1とティース45とを一体化することができる。また、例え容器本体1が2枚の半導体ウェーハWを収納するタイプの場合でも、金型の構造が複雑化して成形の困難化やコストアップを招くことがなく、安価な製造が期待できる。また、支持体30の先端片32に複数の水切り孔33を穿孔するので、洗浄時の洗浄液の水分が残存して半導体ウェーハWの汚染源になるのを防止することができる。   Moreover, since the several teeth 45 are not integrally molded inside the container main body 1, the container main body 1 and the teeth 45 can be integrated irrespective of the compatibility and kind of molding material. Further, even when the container body 1 is of a type that accommodates two semiconductor wafers W, the structure of the mold is not complicated, so that molding is not difficult and the cost is not increased, and inexpensive manufacturing can be expected. Further, since the plurality of drain holes 33 are perforated in the tip piece 32 of the support 30, it is possible to prevent the moisture of the cleaning liquid during cleaning from remaining as a contamination source of the semiconductor wafer W.

また、ガイドリブ4、係合溝7、係合突部43、保持リブ8、位置決めリブ6、係止溝3、先端片32の先端部34、位置決め溝5、位置決め突部37、位置合わせ突部38の活用により、容器本体1に一対の支持体30を後付けする際の作業性や位置精度を著しく向上させることができ、これにより、半導体ウェーハWを専用のロボットにより円滑に出し入れすることが可能になる。また、先端部34の傾斜突部36の厚さを調整すれば、先端部34全体を切削しなくても、先端部34自体の厚さを容易に調整することが可能になる。   Further, the guide rib 4, the engagement groove 7, the engagement protrusion 43, the holding rib 8, the positioning rib 6, the locking groove 3, the tip end 34 of the tip piece 32, the positioning groove 5, the positioning protrusion 37, and the alignment protrusion 38 can significantly improve the workability and position accuracy when attaching the pair of support bodies 30 to the container body 1, thereby enabling the semiconductor wafer W to be smoothly taken in and out by a dedicated robot. become. Further, by adjusting the thickness of the inclined protrusion 36 of the distal end portion 34, the thickness of the distal end portion 34 itself can be easily adjusted without cutting the entire distal end portion 34.

次に、図11は本発明の第2の実施形態を示すもので、この場合には、支持体30の各ティース45を前後一対に分割し、この分割した前後一対のティース45を支持体30の長手方向、換言すれば、容器本体1の前後方向に間隔をおいて配列するようにしている。その他の部分については、上記実施形態と略同様であるので説明を省略する。   Next, FIG. 11 shows a second embodiment of the present invention. In this case, each of the teeth 45 of the support 30 is divided into a pair of front and back, and the pair of front and rear teeth 45 thus divided is supported by the support 30. In other words, the container body 1 is arranged at intervals in the longitudinal direction. The other parts are substantially the same as those in the above embodiment, and thus description thereof is omitted.

本実施形態においても上記実施形態と同様の作用効果が期待でき、しかも、各ティース45を前後一対に分割するので、ティース45と半導体ウェーハWとの接触面積を減少させて半導体ウェーハWの汚染を抑制防止したり、ティース45の成形性や寸法安定性を向上させることができるのは明らかである。また、成形時のティース45の変形を防いだり、材料コストの大幅な削減を図ることもできる。   In this embodiment, the same effect as that of the above embodiment can be expected, and each tooth 45 is divided into a pair of front and rear, so that the contact area between the tooth 45 and the semiconductor wafer W is reduced and contamination of the semiconductor wafer W is prevented. Obviously, it is possible to prevent the suppression and improve the formability and dimensional stability of the teeth 45. Further, deformation of the teeth 45 at the time of molding can be prevented, and the material cost can be greatly reduced.

次に、図11は本発明の第3の実施形態を示すもので、この場合には、支持体30のティース45を上下一対ではなく、3段以上の上下多段(本実施形態では8枚)に配列し、容器本体1の側壁内面に上下多段の支持体30を直接形成したり、あるいは上下多段の支持体30を別体として形成し、この別体の支持体30をインサート成形法や二色成形法により一体化するようにしている。
この場合、支持体30を、中間片31、先端片32、末端片39とから形成することができる。また、先端片32の水切り孔33、櫛歯35、傾斜突部36、位置決め突部37、位置合わせ突部38は、必要に応じて省略することができる。その他の部分については、上記実施形態と略同様であるので説明を省略する。
Next, FIG. 11 shows a third embodiment of the present invention. In this case, the teeth 45 of the support 30 are not a pair of upper and lower sides but three or more stages (up and down in this embodiment). The upper and lower multi-stage supports 30 are formed directly on the inner wall of the container body 1, or the upper and lower multi-stage supports 30 are formed as separate bodies. They are integrated by a color molding method.
In this case, the support 30 can be formed from the intermediate piece 31, the tip piece 32, and the end piece 39. Further, the draining hole 33, the comb teeth 35, the inclined protrusion 36, the positioning protrusion 37, and the alignment protrusion 38 of the tip piece 32 can be omitted as necessary. The other parts are substantially the same as those in the above embodiment, and thus description thereof is omitted.

本実施形態においても上記実施形態と同様の作用効果が期待でき、しかも、容器本体1が2枚の半導体ウェーハWではなく、例えば25枚等の半導体ウェーハWを上下に整列収納する大型のフロントオープンボックスタイプの場合にも、支持体30を使用することができるのは明らかである。   In this embodiment, the same effect as the above-described embodiment can be expected, and the container body 1 is not a semiconductor wafer W of two sheets, but a large front open for storing, for example, 25 semiconductor wafers W up and down. Obviously, the support 30 can also be used in the case of the box type.

次に、図12は本発明の第4の実施形態を示すもので、この場合には、容器本体1の両側壁の正面部2側に光センサ用の透視窓50をそれぞれ形成し、各透視窓50の内面には係止溝3を凹み形成し、この係止溝3に短縮した先端片32の先端部34を着脱自在に嵌入係止するようにしている。
透視窓50は、例えばPC等の成形材料を使用してインサート成形法や二色成形法等により成形される。その他の部分については、上記実施形態と略同様であるので説明を省略する。
Next, FIG. 12 shows a fourth embodiment of the present invention. In this case, see-through windows 50 for optical sensors are respectively formed on the front surface 2 side of both side walls of the container main body 1, and each see-through is shown. A locking groove 3 is formed in the inner surface of the window 50, and the tip portion 34 of the tip piece 32 shortened in the locking groove 3 is detachably fitted and locked.
The see-through window 50 is molded by an insert molding method or a two-color molding method using a molding material such as PC. The other parts are substantially the same as those in the above embodiment, and thus description thereof is omitted.

本実施形態においても上記実施形態と同様の作用効果が期待でき、しかも、透視窓50により、重量センサではなく、透過型の光センサを用いて半導体ウェーハWを直接検出するので、半導体ウェーハWの有無や枚数、収納位置等を正確に検出することができるのは明白である。また、容器本体1の構成の多様化を図ることもできる。   In the present embodiment, the same effect as that of the above embodiment can be expected, and the semiconductor wafer W is directly detected by the transparent window 50 using a transmissive optical sensor instead of a weight sensor. Obviously, the presence / absence, number of sheets, storage position, etc. can be accurately detected. Also, the configuration of the container body 1 can be diversified.

なお、上記実施形態では容器本体1に同タイプの支持体30を一対内蔵したが、半導体ウェーハWの支持に支障を来たさなければ、一の支持体30を異なるタイプとしても良い。また、上記実施形態の中間片31、先端片32、末端片39の長さは、必要に応じて延長したり、短縮しても良い。また、容器本体1の側壁内面の正面部2側に、上下一対の凸部を間隔をおいて形成し、先端片32の先端部34上下に、凸部に嵌合する凹部をそれぞれ形成したり、凸部に嵌合する略クランク形の嵌合片をそれぞれ伸長形成したり、あるいは凹部付きの突片をそれぞれ形成しても良い。   In the above-described embodiment, a pair of the same type of support 30 is built in the container body 1. However, if the support of the semiconductor wafer W is not hindered, the one support 30 may be of a different type. In addition, the lengths of the intermediate piece 31, the tip piece 32, and the end piece 39 in the above embodiment may be extended or shortened as necessary. In addition, a pair of upper and lower convex portions are formed at intervals on the front surface 2 side of the inner surface of the side wall of the container body 1, and concave portions that fit into the convex portions are formed above and below the distal end portion 34 of the distal end piece 32. The substantially crank-shaped fitting pieces that fit into the convex portions may be formed to extend, or the protruding pieces with concave portions may be formed.

また、容器本体1の正面部2内周に凸部を形成するとともに、先端片32の先端部34に凹部を形成し、これら凸部と凹部との嵌合により、容器本体1の側壁に支持体30を固定しても良い。また、上記実施形態では先端片32に複数の水切り孔33を穿孔したが、中間片31、末端片39、及び又はティース45に単数複数の水切り孔33を穿孔しても良い。また、水切り孔33は、矩形の他、円形、楕円形、多角形等に形成することができる。   Moreover, while forming a convex part in the inner periphery of the front part 2 of the container main body 1, a recessed part is formed in the front-end | tip part 34 of the front-end | tip piece 32, and it supports on the side wall of the container main body 1 by fitting with these convex part and a recessed part. The body 30 may be fixed. In the above embodiment, the plurality of drain holes 33 are drilled in the tip piece 32, but a plurality of drain holes 33 may be drilled in the intermediate piece 31, the end piece 39, and / or the teeth 45. Further, the draining hole 33 can be formed in a circle, an ellipse, a polygon, or the like in addition to a rectangle.

また、容器本体1の側壁内面に、支持体30の末端片39を挟んで位置決めする複数の位置決めリブ6を形成したが、支持体30の中間片31を挟んで位置決めする複数の位置決めリブ6を形成することもできる。また、支持体30の末端片39に撓みを規制する撓み規制ストッパ44を形成したが、容器本体1の側壁内面の背面壁側に撓み規制ストッパ44を形成することも可能である。この撓み規制ストッパ44は複数に増加しても良い。また、ティース45に位置決め突部37、及び又は位置合わせ突部38を形成して位置決めすることも可能である。   In addition, a plurality of positioning ribs 6 are formed on the inner surface of the side wall of the container body 1 with the end piece 39 of the support 30 interposed therebetween, but the plurality of positioning ribs 6 positioned with the intermediate piece 31 of the support 30 interposed therebetween. It can also be formed. Further, although the bending restriction stopper 44 for restricting the bending is formed on the end piece 39 of the support 30, the bending restriction stopper 44 can be formed on the back wall side of the inner wall of the container body 1. The deflection regulating stopper 44 may be increased to a plurality. Further, the positioning protrusion 37 and / or the alignment protrusion 38 can be formed on the tooth 45 for positioning.

また、各ティース45を前後一対に分割したが、各ティース45を前方、中央、後方の3枚等に分割して前方と後方のティース45により半導体ウェーハWを支持し、前方と後方のティース45よりも中央のティース45を低位に配置して半導体ウェーハWに接触しないようにすることも可能である。   Further, each tooth 45 is divided into a pair of front and rear, but each tooth 45 is divided into three pieces such as front, center, and rear, and the semiconductor wafer W is supported by the front and rear teeth 45, and the front and rear teeth 45 are supported. It is also possible to dispose the central tooth 45 at a lower position so as not to contact the semiconductor wafer W.

さらに、湾曲頂部46A・46B・46C・46D・46E・46Fの少なくともいずれかを、容器本体1の側壁内面から内部内方向に向かうにしたがい徐々に低く細くなるようなだらかな断面先細りに傾斜形成することも可能である。さらにまた、他の複数の湾曲頂部46B・46C・46D・46E・46Fのいずれか一対に、半導体ウェーハWの周縁部を下方から支持させることもできる。   Further, at least one of the curved top portions 46A, 46B, 46C, 46D, 46E, and 46F is formed so as to be inclined so as to taper gradually so as to become gradually lower from the inner surface of the side wall of the container body 1 toward the inside. Is also possible. Furthermore, the peripheral edge of the semiconductor wafer W can be supported from below by any one of the other plurality of curved top portions 46B, 46C, 46D, 46E, and 46F.

本発明に係る基板収納容器の実施形態を模式的に示す斜視説明図である。It is a perspective explanatory view showing typically an embodiment of a substrate storage container concerning the present invention. 本発明に係る基板収納容器の実施形態を模式的に示す断面平面図である。It is a section top view showing typically an embodiment of a substrate storage container concerning the present invention. 本発明に係る基板収納容器の実施形態における支持体を模式的に示す斜視説明図である。It is a perspective explanatory view showing typically the support in the embodiment of the substrate storage container concerning the present invention. 図3の背面図である。FIG. 4 is a rear view of FIG. 3. 本発明に係る基板収納容器の実施形態における支持体と半導体ウェーハとを模式的に示す説明図である。It is explanatory drawing which shows typically the support body and semiconductor wafer in embodiment of the substrate storage container which concerns on this invention. 本発明に係る基板収納容器の実施形態におけるティースの湾曲谷部を模式的に示す断面説明図である。It is sectional explanatory drawing which shows typically the curved trough part of the teeth in embodiment of the substrate storage container which concerns on this invention. 本発明に係る基板収納容器の実施形態における容器本体を模式的に示す正面説明図である。It is front explanatory drawing which shows typically the container main body in embodiment of the substrate storage container which concerns on this invention. 本発明に係る基板収納容器の実施形態における容器本体と支持体とを模式的に示す正面説明図である。It is front explanatory drawing which shows typically the container main body and support body in embodiment of the substrate storage container which concerns on this invention. 本発明に係る基板収納容器の実施形態における容器本体の側壁の正面部側を模式的に示す一部断面説明図である。It is a partial cross-section explanatory drawing which shows typically the front part side of the side wall of the container main body in embodiment of the substrate storage container which concerns on this invention. 本発明に係る基板収納容器の実施形態における容器本体の側壁の背面壁側を模式的に示す断面説明図である。It is a section explanatory view showing typically the back wall side of the side wall of the container main part in the embodiment of the substrate storage container concerning the present invention. 本発明に係る基板収納容器の第2の実施形態を模式的に示す斜視説明図である。It is a perspective explanatory view showing typically a 2nd embodiment of a substrate storage container concerning the present invention. 本発明に係る基板収納容器の第3の実施形態を模式的に示す斜視説明図である。It is a perspective explanatory view showing typically a 3rd embodiment of a substrate storage container concerning the present invention. 本発明に係る基板収納容器の第4の実施形態を模式的に示す断面説明図である。It is a section explanatory view showing typically a 4th embodiment of a substrate storage container concerning the present invention.

符号の説明Explanation of symbols

1 容器本体
2 正面部(開口部)
3 係止溝(凹部)
4 ガイドリブ
5 位置決め溝
6 位置決めリブ
7 係合溝
8 保持リブ
20 蓋体
30 支持体
31 中間片
32 先端片
33 水切り孔
34 先端部(凸部)
35 櫛歯
36 傾斜突部
37 位置決め突部
38 位置合わせ突部
39 末端片
40 取付片(末端片の一部)
41 位置規制部
42 端壁部(末端片の一部)
43 係合突部
44 撓み規制ストッパ
45 ティース(棚板片)
46A 湾曲頂部
46B 湾曲頂部
46C 湾曲頂部
46D 湾曲頂部
46E 湾曲頂部
46F 湾曲頂部
47 湾曲谷部
48 先端
50 透視窓
W 半導体ウェーハ(基板)
1 Container body 2 Front (opening)
3 Locking groove (concave)
4 Guide rib 5 Positioning groove 6 Positioning rib 7 Engaging groove 8 Holding rib 20 Lid body 30 Support body 31 Intermediate piece 32 End piece 33 Drain hole 34 End part (convex part)
35 Comb tooth 36 Inclined protrusion 37 Positioning protrusion 38 Positioning protrusion 39 End piece 40 Mounting piece (a part of the end piece)
41 Position restriction part 42 End wall part (part of terminal piece)
43 Engaging protrusion 44 Deflection regulating stopper 45 Teeth (shelf plate piece)
46A curved top 46B curved top 46C curved top 46D curved top 46E curved top 46F curved top 47 curved trough 48 tip 50 fluoroscopic window W semiconductor wafer (substrate)

Claims (12)

基板を開口部から収納する容器本体に、基板を支持する支持体を設けた基板収納容器であって、
支持体は、少なくとも容器本体の側壁内面に対向して基板を支持する棚板片を含み、この棚板片を容器本体の開口部から閉塞部側にかけて略波形に形成したことを特徴とする基板収納容器。
A substrate storage container in which a support body for supporting a substrate is provided on a container body that stores a substrate from an opening,
The support includes at least a shelf piece that supports the substrate so as to face the inner surface of the side wall of the container body, and the shelf plate piece is formed in a substantially corrugated shape from the opening of the container body to the closing portion side. Storage container.
支持体は、容器本体の側壁内面に対向する別体の中間片と、この中間片に形成されて容器本体の側壁内面の開口部側に位置する先端片と、中間片に形成されて容器本体の側壁内面の閉塞部側に位置する末端片と、少なくとも中間片に突出形成されて基板を支持する棚板片とを含み、先端片から末端片方向にかけて棚板片を連続した略波形に形成した請求項1記載の基板収納容器。   The support body is a separate intermediate piece facing the inner side wall of the container body, a tip piece formed on the intermediate piece and positioned on the opening side of the inner side wall of the container body, and the intermediate body. Including a terminal piece located on the closed side of the inner wall of the side wall and a shelf piece protruding from at least the intermediate piece to support the substrate, and the shelf piece is formed in a continuous waveform from the tip piece to the terminal piece direction. The substrate storage container according to claim 1. 容器本体の側壁内面の開口部側と先端片の先端部のいずれか一方に凹部を形成するとともに、他方には凸部を形成し、これら凹部と凸部との嵌め合わせにより、容器本体の側壁内面に先端片を固定するようにし、支持体の中間片、先端片、末端片、及び棚板片の少なくともいずれかに水切り孔を穿孔した請求項1又は2記載の基板収納容器。   A concave portion is formed on one of the opening side of the inner surface of the side wall of the container main body and the front end portion of the tip piece, and a convex portion is formed on the other side, and the side wall of the container main body is formed by fitting the concave portion and the convex portion. The substrate storage container according to claim 1 or 2, wherein a tip piece is fixed to the inner surface, and a drain hole is drilled in at least one of the intermediate piece, the tip piece, the end piece, and the shelf board piece of the support. 容器本体を、3枚以下の基板を収納可能な背の低いフロントオープンボックスタイプとしてその正面部を開口部とし、容器本体の側壁の開口部側に透視窓を設けた請求項1、2、又は3記載の基板収納容器。   The container main body is a short front open box type capable of storing three or less substrates, and the front portion is an opening, and a transparent window is provided on the opening side of the side wall of the container main body. 3. The substrate storage container according to 3. 容器本体の側壁内面に、支持体の中間片と末端片のいずれかを挟んで位置決めする複数の位置決めリブを形成した請求項1ないし4いずれかに記載の基板収納容器。   The substrate storage container according to any one of claims 1 to 4, wherein a plurality of positioning ribs are formed on the inner surface of the side wall of the container main body so as to be positioned with either the intermediate piece or the end piece of the support interposed therebetween. 容器本体の側壁内面の開口部側に係止溝を形成して凹部とし、先端片の先端部を屈曲させて係止溝に嵌まる凸部とし、この先端片の先端部を略櫛形に形成してその櫛歯には傾斜突部を形成した請求項3、4、又は5記載の基板収納容器。   A locking groove is formed on the opening side of the inner surface of the side wall of the container body to form a recess, and the tip of the tip piece is bent to fit into the locking groove, and the tip of the tip piece is formed in a substantially comb shape. 6. The substrate storage container according to claim 3, wherein the comb teeth are formed with inclined protrusions. 容器本体の側壁内面に、支持体を挟む複数のガイドリブを形成してこのガイドリブの端部には位置決め溝を形成し、支持体の先端片には、位置決め溝に嵌まる位置決め突部を形成し、支持体の先端片には、容器本体のガイドリブに接触して位置合わせする位置合わせ突部を形成した請求項1ないし6いずれかに記載の基板収納容器。   A plurality of guide ribs sandwiching the support are formed on the inner surface of the side wall of the container body, a positioning groove is formed at the end of the guide rib, and a positioning protrusion that fits into the positioning groove is formed at the end piece of the support. The substrate storage container according to any one of claims 1 to 6, wherein an alignment protrusion is formed on the front end piece of the support so as to contact and align with the guide rib of the container body. 容器本体の側壁内面の閉塞部側に係合溝を形成し、末端片の末端部には、係合溝に嵌まる係合突部を形成し、容器本体の側壁内面の閉塞部側には、支持体の末端片を支持する複数の保持リブを形成した請求項1ないし7いずれかに記載の基板収納容器。   An engagement groove is formed on the closed side of the inner surface of the side wall of the container body, an engagement protrusion that fits into the engagement groove is formed at the end of the end piece, and on the closed side of the inner surface of the side wall of the container body. The substrate storage container according to claim 1, wherein a plurality of holding ribs for supporting the end piece of the support are formed. 容器本体の側壁内面の閉塞部側と支持体の末端片とのいずれかに、末端片の撓みを規制する撓み規制ストッパを形成し、支持体の末端片に、容器本体に収納される基板の収納位置を規制する位置規制部を形成した請求項1ないし8いずれかに記載の基板収納容器。   A deflection regulating stopper that regulates the deflection of the end piece is formed on either the closed side of the inner surface of the side wall of the container body or the end piece of the support, and the end piece of the substrate accommodated in the container body is formed on the end piece of the support. The substrate storage container according to claim 1, wherein a position restricting portion for restricting a storage position is formed. 容器本体の側壁内面の開口部側に位置する棚板片の湾曲頂部を他の複数の湾曲頂部よりも高くし、この容器本体の側壁内面の開口部側に位置する湾曲頂部により、容器本体に収納された基板の飛び出しを規制するようにした請求項1ないし9いずれかに記載の基板収納容器。   The curved top of the shelf piece located on the opening side of the inner side wall of the container main body is made higher than the other curved tops, and the curved top located on the opening side of the inner side wall of the container main body makes the container main body The substrate storage container according to claim 1, wherein jumping out of the stored substrate is restricted. 棚板片の湾曲頂部と湾曲谷部のうち、少なくとも湾曲谷部を容器本体の側壁内面から内方向に向かうにしたがい徐々に細くなるよう先細りに形成した請求項1ないし10いずれかに記載の基板収納容器。   The substrate according to any one of claims 1 to 10, wherein at least the curved valley portion of the shelf plate pieces is tapered so as to gradually become narrower inward from the inner surface of the side wall of the container body. Storage container. 支持体の棚板片を分割し、この分割した複数の棚板片を支持体の長手方向に間隔をおいて配列した請求項1ないし11いずれかに記載の基板収納容器。   The substrate storage container according to any one of claims 1 to 11, wherein a shelf piece of the support is divided, and the plurality of divided shelf pieces are arranged at intervals in the longitudinal direction of the support.
JP2008077005A 2008-03-25 2008-03-25 Substrate storing container Pending JP2009231653A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011086806A (en) * 2009-10-16 2011-04-28 Gold Kogyo Kk Precise substrate housing container
JP2011103391A (en) * 2009-11-11 2011-05-26 Shin Etsu Polymer Co Ltd Substrate housing container and support member
JP2015198113A (en) * 2014-03-31 2015-11-09 株式会社荏原製作所 Substrate holding mechanism, substrate transfer device, and semiconductor manufacturing device
JP2016225341A (en) * 2015-05-27 2016-12-28 信越ポリマー株式会社 Substrate housing container

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011086806A (en) * 2009-10-16 2011-04-28 Gold Kogyo Kk Precise substrate housing container
JP2011103391A (en) * 2009-11-11 2011-05-26 Shin Etsu Polymer Co Ltd Substrate housing container and support member
JP2015198113A (en) * 2014-03-31 2015-11-09 株式会社荏原製作所 Substrate holding mechanism, substrate transfer device, and semiconductor manufacturing device
JP2016225341A (en) * 2015-05-27 2016-12-28 信越ポリマー株式会社 Substrate housing container

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