JP2009259951A - Substrate storing container - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate storing container that is improved in moldability and suppresses generation of dust by reducing contact areas between a substrate and holding bodies. <P>SOLUTION: The substrate storing container includes a container body 1 which is injection molded into a front-open box type, such that a semiconductor wafers is arrayed and stored, using a molding material containing a resin, and a pair of supporting bodies 4 which are provided on both inner sides of the container body 1 and opposed to each other, and supports flanks of peripheral edge parts of the semiconductor wafer by the pair of supporting bodies 4. Each of the supporting bodies 4 is divided in the front-rear direction of the container body 1 to form a plurality of teeth 5, and a gap 6 which does not come into contact with the semiconductor wafer is formed between the teeth 5 and the teeth 5. Each of the supporting bodies 4 is composed of the plurality of teeth 5, so the moldability of the supporting body 4 is improved. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a substrate storage container for storing a substrate made of a semiconductor wafer or the like.

Although not shown, a conventional substrate storage container includes a front open box type container main body for storing semiconductor wafers, and a detachable lid that opens and closes the front portion of the container main body that is opened.
The container body is injection-molded with a molding material containing a resin, and a pair of left and right supports that are opposed to each other and support the side of the peripheral edge of the semiconductor wafer are provided on both sides of the container body. Are arranged at intervals in the vertical direction of the container body, and each support is formed on a plate that extends in the longitudinal direction of the container body (see Patent Documents 1 and 2).
JP 2006-351707 A Japanese Patent Laid-Open No. 2006-120791

  The conventional substrate storage container is configured as described above, and the support body is simply formed on a plate extending long in the front-rear direction of the container body, so that the formability of the support body by the molding material (filling capacity of the molding material) is improved. There is a problem that improvement cannot be achieved. Also, in the semiconductor manufacturing field, prevention of particle generation is increasingly important, but in the conventional support, the contact area between the semiconductor wafer and the support is further reduced to effectively prevent the generation of particles. You may not be able to.

  The present invention has been made in view of the above, and provides a substrate storage container that can improve moldability and can reduce the contact area between the substrate and the support to suppress the generation of dust. The purpose is that.

In the present invention, in order to solve the above-mentioned problem, a container main body formed in a front open box that accommodates a substrate by a molding material containing a resin, and a pair of support bodies provided on opposite sides of the container main body and opposed to each other And supporting the substrate on this pair of supports,
Each support is divided in the front-rear direction of the container body to form a plurality of support pieces, and a gap is formed between the support pieces.

In addition, the front part can be made into a horizontally long opening part as a short front open box which accommodates a 3 or less board | substrate with a container main body.
Of the plurality of support pieces, the support piece located on the front side of the container body includes a plate projecting inward from the inner side of the container body, and a rib that is formed on the plate to support the substrate. It is good to include.

Also, a rim flange formed on the peripheral edge of the open front portion of the container body and projecting outward and facing the loading / unloading port of the load port device, a mounting hole drilled in a side portion of the rim flange, and the mounting hole And a removable information display pad that is selectively inserted into
A mounting hole is formed from a large diameter portion located on the front side of the rim flange and a reduced diameter portion formed integrally with the large diameter portion and located on the back side of the rim flange, and the front portion of the information display pad is The front surface of the rim flange can be substantially flush or can be buried in the enlarged diameter portion of the mounting hole.

  In addition, the information display pad can be formed of a column portion that fits into the enlarged diameter portion of the attachment hole, and an elastic locking piece that extends from the pillar portion and catches on the reduced diameter portion of the attachment hole.

Also, provided with a lid that opens and closes the open front portion of the container body, provided with a locking mechanism that locks the lid that closed the front portion of the container body,
The locking mechanism is supported by the lid body and is slidable in the left and right inside and outside directions, and is rotatably supported at the tip of the slide body, and protrudes from the through hole in the side wall of the lid body to protrude from the front portion of the container body. A locking claw capable of interfering with the inner locking groove, a spring that slides the slide body to the left and right outwards of the lid body and projects the locking claw from the through hole of the lid body, and provided on the end side of the slide body And an operation hole into which the operation pin is inserted from the outside of the lid body, the operation hole of the slide body is formed in a substantially circular shape, and a part of the lid body located on the left and right inward side is a straight vertical flat portion When removing the lid from the front part of the container body, insert an operation pin into the slide body operation hole, slide the slide body in the left-right inward direction of the lid body, and insert the protruding locking claws into the lid body. You may make it retreat in a hole.

  Further, the lid is fitted to the open front portion of the container body and houses a locking mechanism, a surface cover covering the open front portion of the housing, and a locking mechanism provided on the front cover. An operation port facing the operation hole of the slide body, and the operation port is formed in a horizontally long shape extending in the left / right / inside / outside direction of the lid, and the left / right outer direction side serves as a widened portion and is positioned on the left / right inner direction side. The remaining part may be a narrow part.

  Here, the substrates in the claims include at least various glass substrates, cover glasses, semiconductor wafers (φ200 mm, 300 mm, 450 mm, etc.), photomasks, and the like. The container body is not particularly required to be transparent, opaque or translucent. Further, the support piece can be formed into a substantially flat plate shape, pin shape, columnar shape, elliptical cross section, prism shape, cone shape, pyramid shape, cross cone shape, or the like.

  According to the present invention, when the substrate is stored in the container body, the plurality of support pieces of the support come into contact with and support the substrate. At this time, the substrate comes into contact with the gap between the support pieces, or the substrate slides. It is rare to be.

According to the present invention, it is possible to improve the moldability and to reduce the contact area between the substrate and the support and to suppress the generation of dust.
Also, among the plurality of support pieces, a support piece located on the front side of the container body is provided with a plate that protrudes inward from the inner side of the container body, and a rib that is formed on the plate to support the substrate. In this way, problems such as oblique insertion of the substrate can be regulated.

  Hereinafter, a preferred embodiment of a substrate storage container according to the present invention will be described with reference to the drawings. The substrate storage container in the present embodiment stores a small number of semiconductor wafers W as shown in FIGS. A container body 1 formed into a front open box, a plurality of pairs of supports 4 that support the semiconductor wafer W in opposition to each other, and a lid body 20 that opens and closes the opened front portion of the container body 1. The body 4 is divided in the front-rear direction of the container body 1 to form a plurality of teeth 5.

  As shown in FIG. 3, the semiconductor wafer W is made of, for example, a thin and round silicon type having a diameter of 300 mm, and an orientation flat for alignment or identification or a substantially semicircular notch in a plane is selectively formed on the peripheral edge.

  As shown in FIGS. 1 to 6, the container body 1 has a short front opening for aligning and storing two semiconductor wafers W by injecting a molding material containing a predetermined resin into a molding die. A box-type injection molded, identically shaped lid 20 is detachably fitted to an open horizontally long front part via an endless gasket 28, and is mounted on a load port device 2 for connection to a semiconductor processing apparatus. The front part and the rim flange 12 are made to face the entrance / exit 3.

  Examples of the predetermined resin of the molding material for molding the container body 1 include polycarbonate, polyetherimide, polyetheretherketone, polybutylene terephthalate and the like which are excellent in mechanical properties, heat resistance, dimensional stability and the like. Necessary carbon, carbon fiber, metal fiber, carbon nanotube, antistatic agent, flame retardant and the like are selectively added to these resins.

  A pair of left and right supports 4 that support the side of the peripheral edge of the semiconductor wafer W are provided on the inside of the container body 1, specifically, on the opposite sides of the interior of the container body 1. A plurality are arranged at intervals in the vertical direction (see FIGS. 3 and 4). Each support body 4 is divided in the front-rear direction of the container body 1 to form a plurality of short teeth 5 that horizontally support the peripheral side of the semiconductor wafer W, and the teeth 5 and teeth lined up in the front-rear direction of the container body 1. A non-contact gap 6 is defined in the semiconductor wafer W.

  As shown in FIGS. 2 and 5, a planar substantially U-shaped rib flange 7 that enhances the mechanical strength and rigidity of the container body 1 is integrated with the outer peripheral surface of the container body 1. The rib flange 7 is integrally formed on the back and both sides of the container body 1 from the outside, and metal balance weights 8 are screwed to both sides of the back, respectively. Inclination of the front portion of the container body 1 is restricted.

  The center of the back surface of the rib flange 7 is bent into a substantially W shape to form a recess, and the opening of the recess faces downward and functions as a positioning portion 9 for the load port device 2 of the container body 1. Further, the front side of the rib flange 7 is also bent into a substantially inverted V shape to form a concave portion, and the opening of the concave portion faces downward and functions as a positioning portion 9 for the load port device 2.

  As shown in FIGS. 1 to 4 and 6, a mounting rib 10 is erected at the center of the ceiling of the container body 1, and a plane gripped by a transport mechanism (not shown) is provided on the mounting rib 10. A substantially triangular or polygonal suspension flange 11 is detachably screwed later through a fastener such as a screw.

  As shown in FIGS. 2 to 4 and 6, the front portion of the container body 1 is bent so as to spread outward to form a rim flange 12, and lid bodies 20 are formed on both sides of the rim flange 12. The locking grooves 13 for locking are cut out in the vertical direction.

  On both sides of the rim flange 12 projecting to the left and right, a plurality of mounting holes 14 are vertically perforated and rounded, and an information pad 17 that is an information display pad is selectively inserted into the plurality of mounting holes 14. In addition, the presence / absence and number of semiconductor wafers W, the type of the substrate storage container, and the like are identified by the load port device 2 by being detected by a detection sensor (for example, a photoelectric sensor, a photo sensor, a touch sensor, etc.) of the load port device 2. The

  As shown in FIG. 7, each mounting hole 14 has a round enlarged diameter portion 15 located on the front side of the rim flange 12, and a round contraction located integrally on the enlarged diameter portion 15 and located on the back side of the rim flange 12. It is formed from the diameter portion 16. Moreover, the info pad 17 is comprised from the cylindrical part 18 fitted to the enlarged diameter part 15 of the attachment hole 14, and a pair of locking piece 19 extended from the back side of this cylindrical part 18, as shown in the figure. The The pair of locking pieces 19 have elasticity and spring properties and bend inward and outward in the radius of the cylindrical portion 18, and are locked to the peripheral edge on the back surface side of the reduced diameter portion 16 so that the infopad 17 is detached from the mounting hole 14. To prevent.

  As shown in FIGS. 2, 6, 8, and 9, the lid 20 is detachably fitted to the front portion of the container body 1, and has a horizontally long case 21 containing a locking mechanism 40. A transparent surface cover 32 that is screwed onto and covers the front portion (surface portion) of the body 21 that is opened and is attached to and detached from the container body 1 by a lid opening / closing device (not shown).

  As shown in FIG. 8, the housing 21 has a plurality of holding ribs 22 for the locking mechanism 40 integrally formed on both sides of the housing 21, and is formed in the locking groove 13 of the container body 1 on both sides of the peripheral wall. Opposing slots 23 for the locking mechanism 40 are cut out, and support ribs 24 for the locking mechanism 40 are integrally formed in the vicinity of the inner peripheral edge of each slot 23.

  A horizontally long mounting hole 25 is formed in the center of the rear surface of the housing 21, and a front retainer 26 is provided in the mounting hole 25 to elastically hold the front sides of the peripheral portions of the plurality of semiconductor wafers W with elastic pieces. Installed. Further, a horizontally long and frame-shaped mounting groove 27 is cut out on the peripheral edge of the back surface of the housing 21, and an elastic gasket 28 interposed between the container body 1 and the mounting groove 27 is fitted into the mounting groove 27. .

  As shown in FIG. 10, the gasket 28 is made of, for example, a silicone rubber, fluororubber, various thermoplastic elastomers (for example, olefin-based) having excellent heat resistance, flame retardancy, cold resistance, and compression characteristics as an elastic material. It is formed into a deformable horizontally long frame. The gasket 28 includes an endless frame-shaped attachment portion 29 that fits into the attachment groove 27 of the lid 20, and a contact portion 30 that is integrally formed with the attachment portion 29 and is pressed into the front portion of the container body 1 to be deformed. And formed with.

  The gasket 28 has a substantially U-shaped cross section, and the thickness and length of both free ends thereof are different, and the outer free end portion extends longer than the inner free end portions of both free ends. Both free ends of the gasket 28 are obliquely cut so that the thin inner free end is easily deformed and tightly fitted in the mounting groove 27 of the lid 20, and the end surface of the thick outer free end is The contact portion 30 is sharpened to have a substantially triangular cross section, and the remaining portion other than the contact portion 30 is the attachment portion 29.

  The front cover 32 is formed in a horizontally long and substantially rectangular shape, and operation ports 33 for the locking mechanism 40 are respectively perforated in a substantially convex shape on both sides. A front circular suction region 36 that is vacuum-sucked by the apparatus is formed. Each operation port 33 is formed in a horizontally long shape extending in the left-right inward / outward direction of the lid 20, the left-right outer direction side is a widened portion 34 with a curved side, and the remaining portion located on the left-right inner direction side is a rectangular narrow-width portion A pair of guide pieces 37 for the locking mechanism 40 are integrally formed in the inner direction of the housing 21 at the rear surface side peripheral edge portion.

  As shown in FIG. 8, the locking mechanism 40 is supported on both inner sides of the casing 21 and is slidably supported in a pair of link plates 41 slidable in the left and right inner and outer directions, and in each slot 23 of the casing 21. And a pair of swingable locking claws 45 which are connected and supported at the distal end of the link plate 41 and interfere with each other by engaging with the locking groove 13 of the container main body 1 and the container main body inserted into each link plate 41. A pair of coil springs 47 that cause the locking claw 45 to interfere with one locking groove 13 and an operation hole 48 that is perforated on the most distal end 43 side of each link plate 41 and into which an operation pin is inserted from the outside of the lid body. Configured.

  Each link plate 41 is formed, for example, in a substantially Y-shaped plate having a bifurcated tip, and a collar 42 that is a cylindrical body for the coil spring 47 is slidably fitted in the center of the rod. And the most distal end portion 43 are slidably sandwiched between a pair of guide pieces 37 of the surface cover 32, and the most distal end portion 43 has a front semi-elliptical operation facing the operation port 33 of the surface cover 32. Hole 48 is drilled.

  A link arm 44, which is a substantially U-shaped arm that restricts the sliding and dropping off of the collar 42, is fitted and supported at the end of the link plate 41 so as to be swingable in the left / right / inside / outward direction via a pin. It is pivotally supported by the holding rib 22 of the housing 21 so as to be swingable in the left and right inner and outer directions via pins.

  Each latching claw 45 is bent and formed into a deformed substantially V shape, and the bent portion is pivotally supported by the support rib 24 of the housing 21 via a pin so as to be swingable. One end of the locking claw 45 is pivotally supported via a pin between the bifurcated tip portions of the link plate 41, and the container main body 1 is latched between the other bifurcated other ends. A plurality of rollers 46 in sliding contact with the groove 13 are rotatably supported via pins. Each roller 46 is formed into a cylindrical shape using, for example, the same material as that of the container body 1.

  Each of the coil springs 47 is inserted into the center portion of the link plate 41 and interposed between the wide tip end side of the link plate 41 and the collar 42, presses the collar 42 against the link arm 44, and The other end portion of the locking claw 45, that is, the plurality of rollers 46 is protruded from the slot 23 to the outside.

  Each operation hole 48 is basically formed in a substantially elliptical shape on the front, and a peripheral edge portion located on the left and right inward side of the lid body 20 is notched into a vertical flat portion 49 that is linear in the vertical direction. The operation pin comes into contact with the vertical flat portion 49 when the lid 20 is removed.

  Although not shown, the operation pin includes an elongated cylindrical pin portion and a bulging portion that is integrally formed with the pin portion and bulges outward in the radial direction, and is operated automatically or manually. The operation pin is inserted into the operation hole 48 of the link plate 41 through the operation port 33, and the bulging portion appropriately contacts and interferes with the operation port 33 of the surface cover 32 to support the lid 20. To function.

  In the above configuration, when the semiconductor wafer W is stored in the container main body 1, the plurality of short teeth 5 of each support 4 supports the peripheral side of the semiconductor wafer W horizontally by surface contact. The side edge of the semiconductor wafer W does not come into contact with the gap 6 between the teeth 5.

When the info pad 17 is selectively inserted into the plurality of mounting holes 14 of the container body 1, the pair of locking pieces 19 of the info pad 17 may be inserted and pressed into the selected mounting hole 14.
Then, a pair of locking pieces 19 are locked to the peripheral edge of the back surface side of the reduced diameter portion 16 of the mounting hole 14 while being bent, and the cylindrical portion 18 of the info pad 17 is fitted to the enlarged diameter portion 15 of the mounting hole 14. The front portion of the info pad 17 is flush with and aligned with the front surface of the flange 12.

  On the contrary, when the info pad 17 is removed from the mounting hole 14 of the container body 1, the pair of locking pieces 19 of the info pad 17 is bent inward so as to be connected to the rear surface side peripheral edge of the reduced diameter portion 16. It is only necessary to release the locking and press the infopad 17 from the back side to the front side of the rim flange 12.

  Further, when the opened front portion of the container body 1 containing the semiconductor wafer W is closed by the lid body 20, the lid body 20 is pressed and fitted into the rim flange 12 of the container body 1 by the lid body opening / closing device. The groove hole 23 of the lid 20 may be made to face each locking groove 13 of the container body 1.

  Then, the link plate 41 is slid horizontally in the left and right outer directions of the lid body 20 while being guided by the holding rib 22, the guide piece 37, and the link arm 44 by the restoring action of each compressed coil spring 47, and the locking claw 45 is moved. A plurality of rollers 46 that are swung in the front and back direction of the lid 20 and projecting while the other end of the locking claw 45 arcs outwardly from the slot 23 of the lid 20 are arranged on the container body 1. By inserting the plurality of rollers 46 into the stop groove 13, the front portion of the container body 1 is firmly closed by the lid body 20, and airtightness and airtightness are ensured.

  When no load is applied to the locking mechanism 40 as described above, the rollers 46 of the locking claws 45 that swing and protrude into the respective locking grooves 13 of the container body 1 are fitted so as to be able to roll and come into contact with each other. The part is covered with the lid 20.

  On the other hand, when removing the locked lid 20 from the front portion of the container main body 1 containing the semiconductor wafer W, the operation pins are inserted into the operation holes 48 of the pair of link plates 41 and the operation ports 33 of the lid 20 are connected. Each link plate 41 may be slid in the left-right inward direction of the lid body 20 by inserting the pin from the outside through moving the operation pin in the direction from the widened portion 34 to the narrow-width portion 35 of the operation port 33.

  Then, each link plate 41 slides horizontally in the left-right inward direction of the cover body 20 while compressing the coil spring 47, and the locking claw 45 swings while drawing an arc to expose the other end, that is, a plurality of rollers. 46 is retracted into the slot 23 of the lid 20, and the other end of the locking claw 45 is retracted, so that the plurality of rollers 46 are removed from the locking groove 13 of the container body 1 and the lid is closed from the container body 1. The body 20 can be removed.

  According to the said structure, since each support body 4 consists of several short teeth 5 instead of only a long board, the remarkable improvement of the moldability of the support body 4 can be aimed at. In addition, since the side of the periphery of the semiconductor wafer W does not come into contact with the gap 6 between the teeth 5 and 5, the contact area between the semiconductor wafer W and the support 4 is reduced, and the generation of particles is reduced. It can be prevented very effectively. In addition, facilitation of fine adjustment of a mold for molding the container body 1 including the support 4 can be greatly expected.

  Further, since the counterbore is formed in the mounting hole 14, the front portion of the info pad 17 can be flush with the front surface of the rim flange 12 or can be buried in the mounting hole 14 and inserted into the mounting hole 14. The front surface of the info pad 17 does not protrude forward from the front surface of the rim flange 12. Accordingly, since the protruding portion of the front surface of the info pad 17 does not become an obstacle, the front portion of the container body 1 and the rim flange 12 are appropriately in contact with the loading / unloading port 3 of the load port device 2 to facilitate the semiconductor manufacturing work. , Speeding up, and facilitating.

  Further, when the locking mechanism 40 that does not remove the lid 20 from the container body 1 is not operated, the locking claw 45 is continuously fitted into the locking groove 13 of the container body 1 by the coil spring 47 so that the front portion of the container body 1 and the rim flange are fitted. 12 is firmly closed by the lid 20, the lid 20 is never detached from the container body 1, and there is no risk of hindering the locking or opening / closing of the lid 20. Further, the locking claw 45 is not directly inserted into the locking groove 13 of the container body 1, but a plurality of rotatable rollers 46 of the locking claw 45 are inserted and slidably contacted, so that the container body 1 and the locking claw There is no possibility that particles are generated by rubbing with 45 and the semiconductor wafer W is contaminated.

  Next, FIGS. 11 and 12 show a second embodiment of the present invention. In this case, the container main body 1A is a large front open box type housing 25 or 26 semiconductor wafers W. FIG. The support body 4 of the container main body 1A is divided into the front and rear directions of the container main body 1A to form a plurality of teeth 5 that horizontally support the side of the peripheral edge of the semiconductor wafer W. Between the teeth 5 and the teeth 5, a non-contact gap 6 is defined in the semiconductor wafer W. The other parts are substantially the same as those in the above embodiment, and thus description thereof is omitted.

  In this embodiment, the same effect as that of the above embodiment can be expected, and the support 4 can be used not only for the small container body 1 but also for the large container body 1A. It is clear that it can enhance sex.

  Next, FIG. 13 shows a third embodiment of the present invention. In this case, among the plurality of teeth 5, the teeth 5 located on the most front side of the container main body 1, in other words, containers The teeth 5 located on the foremost side of the main body 1 are formed so as to protrude inward from the inner side of the container main body 1 and are projected on the plate 5a to support the semiconductor wafer W by point contact. The rib 5b having a substantially circular or semi-elliptical cross section is integrally formed. The other parts are substantially the same as those in the above embodiment, and thus description thereof is omitted.

  In this embodiment, the same effect as that of the above embodiment can be expected, and the rib 5b is integrally formed on the plate 5a, so that it is clear that the cross slot of the semiconductor wafer W can be effectively prevented. .

  In addition, although the several teeth 5 in the said embodiment may all be formed in the same shape, you may form a part in a different shape. The first-stage teeth 5 and the second-stage teeth 5 may or may not be located at the same position in the vertical direction. For example, the first and second teeth 5 may be arranged in a staggered pattern. Further, the lid 20 does not ask for transparency, opaqueness, translucency, or the like.

It is side surface explanatory drawing which shows typically the container main body and load port apparatus in embodiment of the substrate storage container which concerns on this invention. It is a perspective explanatory view showing typically an embodiment of a substrate storage container concerning the present invention. It is front explanatory drawing which shows typically the container main body in embodiment of the substrate storage container which concerns on this invention. It is a section side view showing typically a container main part in an embodiment of a substrate storage container concerning the present invention. It is bottom explanatory drawing which shows typically the container main body in embodiment of the substrate storage container which concerns on this invention. It is front explanatory drawing which shows typically the container main body and its cover body in embodiment of the substrate storage container which concerns on this invention. It is a partial section explanatory view showing typically a rim flange, a mounting hole, and an info pad in an embodiment of a substrate storage container concerning the present invention. It is a disassembled perspective explanatory drawing which shows typically the cover body in embodiment of the substrate storage container which concerns on this invention. It is a perspective explanatory view showing typically the back of the lid in the embodiment of the substrate storage container concerning the present invention. It is a partial section explanatory view showing typically the gasket in the embodiment of the substrate storage container concerning the present invention. It is a perspective explanatory view showing typically a 2nd embodiment of a substrate storage container concerning the present invention. It is a cross-sectional top view which shows typically the accommodation state of the semiconductor wafer in 2nd Embodiment of the substrate storage container which concerns on this invention. It is explanatory drawing which shows typically 3rd Embodiment of the substrate storage container which concerns on this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Container main body A Container main body 2 Load port apparatus 4 Support body 5 Teeth (support piece)
5a plate 5b rib 6 gap 12 rim flange 14 mounting hole 17 infopad 20 lid 40 locking mechanism W semiconductor wafer (substrate)

Claims (3)

A container body formed in a front open box that accommodates a substrate with a molding material containing a resin, and a pair of opposing supports provided on both sides of the container body, and the substrate on the pair of supports A substrate storage container for supporting
A substrate storage container characterized in that each support is divided in the front-rear direction of the container body to form a plurality of support pieces, and a gap is formed between the support pieces.   The substrate storage container according to claim 1, wherein the container body is a short front open box for storing three or less substrates, and the front portion thereof is a horizontally long opening.   Among the plurality of support pieces, the support piece located on the front side of the container body includes a plate projecting inward from the inner side of the container body, and a rib formed on the plate to support the substrate. The substrate storage container according to claim 1 or 2 comprising.

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