JP4726867B2 - Substrate storage container and manufacturing method thereof - Google Patents

Description

  The present invention relates to a short substrate storage container for storing a substrate composed of a small number of semiconductor wafers and the like, and a method for manufacturing the same.

When processing semiconductor wafers in an LSI manufacturer or the like in a short time, a substrate storage container (also referred to as Small-FOUP) that stores three or less semiconductor wafers is used. A front open box type that accommodates and stores three or less semiconductor wafers (not shown) and includes a short container body, and a lid that removably opens and closes the front part of the container body that opens (patented) References 1 and 2).
The container body is injection-molded in a state where the height (vertical dimension) is limited by injecting a molding material containing resin into a molding die, and a plurality of protruding pins are formed on the inner back side after this injection molding. It is demolded from the closely attached mold by protruding strongly.
JP 2006-245206 A JP 2006-1000071 A

  As described above, the conventional substrate storage container is removed from the mold in which the container body is in close contact with the container body by injection of the container body, and a plurality of protruding pins are strongly protruded on the inner back side of the container body to apply a large load. Since it is molded, there is a problem that the back side of the container body protrudes and is pierced by the pins, causing damage to the container body. As a method of solving this problem, it is possible to change the pulling angle when removing the container main body from the mold, but this causes a change in the dimensions of the container main body, which hinders the taking in and out of the semiconductor wafer. A big problem will arise.

  The present invention has been made in view of the above, and an object of the present invention is to provide a substrate storage container and a method for manufacturing the same, in which the back side of the container body protrudes and is broken through by pins.

To solve the above problems in the present invention, three sheets following the front open box type height 6cm or less of the container body for housing the substrate is molded out morphism using a mold, the injection-molded container body be those container body by collision producing pin for demolding of the mold is projected to the inside back surface side is released from the mold,
A rib flange is formed at least outside the back wall of the back wall and both side walls of the container body, and both sides of the rib flange are positioned in the center of both sides of the back wall so as to face a plurality of protruding pins. The center portion of the rib flange is positioned below the center portion, the center portion of the rib flange is bent to form a recess, and the opening of the recess is directed downward to serve as a positioning portion for the container body .

Also, rib flanges are formed on both side walls of the container body, the front part of the rib flange is positioned below the front part of each side wall, and the remaining part other than the front part of each side wall is at the center other than the front part of the rib flange. The recesses are formed by bending the front portions of the rib flanges on the respective side walls, and the openings of the recesses are directed downward to serve as positioning portions of the container body.

Furthermore, in order to solve the above-mentioned problems, the present invention is characterized in that the substrate storage container according to claim 1 or 2 is manufactured.

  Here, the three or less substrates in the claims include at least three or less various glass substrates, a cover glass, a semiconductor wafer (diameter 300 mm, 450 mm, etc.), a photomask, and the like. The container body is not particularly required to be transparent, opaque, or translucent, but is shorter than a substrate storage container that stores 25 or 26 semiconductor wafers having a diameter of 300 mm. For example, when two substrates made of a semiconductor wafer having a diameter of 300 mm are accommodated, the height is 6 cm or less. Further, the protruding pins are not particularly limited to a plurality. The rib flange on the back wall and the rib flange on the side wall may be integrally formed and may not be continuous.

According to the present invention, when manufacturing a container body, the mold body is clamped to inject and fill the molding material, and the container body with rib flanges is held to compensate for shrinkage associated with the solidification of the molding material. The container body is cooled until it is sufficiently rigid to be molded. When the container body is cooled, the mold is opened and protruded, and the pins are protruded to the inner back side of the container body, and the container body is removed from the mold.
At this time, the rib flange that enhances the strength of the back wall of the container main body is opposed to the protruding pin of the mold to exert a reinforcing effect, so that the back side of the container main body can be prevented from protruding and being pierced by the pin.

According to the present invention, the rib flange is formed on at least the outer side of the back wall and both side walls of the container body, and the both sides of the rib flange are positioned at the center of both sides of the back wall so as to face the plurality of protruding pins. In addition, the central portion of the rib flange is positioned below the central portion of the back wall, the concave portion is formed by bending the central portion of the rib flange of the back wall, and the opening of the concave portion is directed downward to locate the container body. Therefore, there is an effect that the back side of the container body protrudes and is broken by the pin and is not damaged.
Moreover, it can remove from a metal mold | die in the state which stabilized the attitude | position of the container main body , and can suppress that a container main body is pierced by several protrusion pins. In addition, since it is not necessary to change the pulling angle when removing the container body from the mold, it is less likely to hinder the loading and unloading of the substrate. Further, since the positioning portion is integrally formed at the center portion of the rib flange instead of separately forming the rib flange and the positioning portion on the back wall, simplification of the configuration and reduction in the number of parts can be expected.

  Further, if rib flanges are formed on both side walls of the container body, the strength and rigidity of both side walls of the container body can be increased, and deformation of the container body can be effectively prevented. Furthermore, if the front part of the rib flange on each side wall is bent to form a recess, and the opening of this recess is directed downward to form the positioning part of the container body, the rib flange and positioning part are integrated to simplify the configuration. It becomes possible to plan.

  Hereinafter, a preferred embodiment of a substrate storage container according to the present invention will be described with reference to the drawings. The substrate storage container in this embodiment stores a small number of semiconductor wafers W as shown in FIGS. A container main body 1 is injection-molded, and a plurality of protruding pins 2 are projected on the inner back side of the injection-molded container main body 1 so that the container main body 1 is removed from the mold. Rib flanges 20 are formed on the back wall and both side walls of 1, and the rib flange 20 </ b> A on the back wall protrudes when the container body 1 is removed and faces the pin 2.

  As shown in FIGS. 15 and 16, each semiconductor wafer W is made of, for example, a thin and round silicon type having a diameter of 300 mm, and an orientation flat for alignment and identification or a substantially semi-circular notch in a plane is selectively formed on the peripheral edge. The

  As shown in FIGS. 1 to 3 and 6, the container body 1 is formed by injecting a molding material containing a predetermined resin into a molding die so that two or less semiconductor wafers W are aligned and stored. A low open (e.g., 6 cm or less) front open box type, and a lid 10 having the same shape is detachably fitted to an open horizontally long front portion through an elastic gasket. As the mold, an injection molding type (not shown) is used and is mounted on an injection molding machine. In this mold, a plurality of reciprocating protruding pins 2 protruding together with the mold opening are built in a state of being fixed to the protruding plate (see FIG. 16).

  Examples of the predetermined resin of the container body 1 include polycarbonate, polyetherimide, polyetheretherketone, polybutylene terephthalate, and the like that are excellent in mechanical properties, heat resistance, dimensional stability, and the like. Carbon, carbon fiber, metal fiber, carbon nanotube, antistatic agent, flame retardant and the like are appropriately added to these resins.

  As shown in FIG. 16 and the like, a pair of left and right teeth 3 for horizontally supporting the semiconductor wafer W are provided in the interior of the container body 1, specifically, on the inner surfaces of the opposite side walls. Are arranged at intervals in the vertical direction. Each tooth 3 is formed into a long and narrow plate in the front-rear direction of the container body 1, and the end portion of the container body 1 near the back wall is tapered.

  As shown in FIGS. 1, 4 to 6, a plurality of mounted ribs 4 having a substantially Y-shape in a plane are erected at a substantially central portion of the ceiling of the container body 1, and on the plurality of mounted ribs 4. The planar substantially triangular or polygonal holding flange 5 gripped by a transport mechanism (not shown) is detachably screwed later through a fastener such as a screw.

  As shown in FIGS. 3, 14, and 18, the opened front portion of the container body 1 is bent so as to spread outwardly to form a rim flange 6. The locking grooves 7 for body locking are cut out in the vertical direction. As shown in FIG. 3 and FIG. 14, a plurality of identification holes 8 are vertically perforated on both sides of the rim flange 6 protruding left and right, and the identification pins are selectively inserted into the plurality of identification holes 8. In addition, the presence or number of semiconductor wafers W, the type of the substrate storage container, and the like are identified to the processing device by being detected by a detection means (for example, a photoelectric sensor, a photo sensor, a touch sensor, etc.) of the processing device (not shown). The

  As shown in FIGS. 7 to 10, the lid 10 has a surface cover formed in a transparent horizontally long box shape, and a locking mechanism 11 that interferes with the locking groove 7 of the container body 1 is disposed inside. A front retainer that elastically holds front peripheral edges of the plurality of semiconductor wafers W is attached to the center of the back surface.

  As shown in FIG. 9, the locking mechanism 11 is supported on both inner sides of the lid body 10 and is slidably supported by both sides of the lid body 10 so as to be able to slide in and out. A pair of swingable locking claws 13 connected to the distal end of the slide pin 12 and interfering with the locking groove 7 of the container body 1, and a built-in lid 10 and fitted into the slide pin 12. A pair of coil springs 14 that always cause the locking claw 13 to interfere with the locking groove 7 of the container body 1 and function to lock and fix the lid 10 fitted to the container body 1.

  As shown in FIG. 9, a pair of slide pins 12 are slid to compress the coil springs 14 on both sides of the front cover of the lid 10, and the interference of the locking claws 13 with respect to the locking grooves 7 of the container body 1 is released. Each operation hole 15 is drilled.

  As shown in FIGS. 1, 2, 4 to 6, 11 to 13, and 15 to 18, the rib flange 20 is integrally formed on the back wall and both side walls of the container body 1 from the outside. It exhibits a deformed planar substantially U shape. The rib flange 20 </ b> A on the back wall is formed in, for example, a long and thin plate shape, the both side portions 21 are horizontally positioned substantially at the center of the both sides of the back wall of the container body 1, and the center portion 22 is the container body 1. Located below the center of the back wall.

  Both side portions 21 of the rib flange 20A on the back wall are screwed with metal balance weights 23 from below so that the front portion of the container body 1 does not tilt downward, and a plurality of protrusions are projected when the container body 1 is removed. It functions to face the pin 2 from the outside (see FIG. 16).

  As shown in FIGS. 4, 13, and 16, the central portion 22 of the rib flange 20A on the back wall is bent into a substantially W shape to form a recess 24, and the opening of the recess 24 faces downward. It functions as a positioning portion 25 for the processing device of the main body 1.

  As shown in FIGS. 1, 2, 5, 6, 11, 12 and 17, the rib flange 20B on each side wall is formed in, for example, a long and thin plate shape, and the front portion 26 is formed on each side wall. It is located below the front part, and the remaining part 27 other than the front part is horizontally positioned substantially at the center of the remaining part other than the front part of each side wall and is integrated with the rib flange 20A of the back wall. The front portion 26 of the rib flange 20B on each side wall is bent in a substantially inverted V shape to form a concave portion 28, and the opening of the concave portion 28 faces downward and functions as a positioning portion 25 for the processing apparatus of the container body 1.

  In the above, when manufacturing the container main body 1, first, the mold for the container main body 1 is clamped and the molten molding material is injected and filled at high speed and high pressure to compensate for the shrinkage caused by the solidification of the molding material. For this purpose, the container body 1 with the rib flange 20 is formed with high pressure, and the container body 1 is left and cooled with cooling water flowing in the mold until it has sufficient rigidity to be removed. Meanwhile, for the next molding, the screw of the injection molding machine is rotated to plasticize and measure the molding material.

  After the container body 1 is left and cooled in this manner, the mold is opened and a plurality of protruding pins 2 are projected from the front side of the container body 1 to the inner back side, and the container body 1 that is in close contact with the mold is removed. At this time, since both side portions of the thick rib flange 20A for increasing the rigidity of the back wall of the container body 1 are opposed to the plurality of protruding pins 2 of the mold (see FIG. 16), the back side of the container body 1 protrudes to the plurality. It is not pierced by the pin 2. Thereafter, the same operation is repeated.

  According to the above configuration, the both side portions 21 of the rib flange 20A of the container body 1 face the outside from the outer side of the mold projecting pin 2 and become an obstacle, thereby increasing the strength of the back wall and exerting a reinforcing function. Even if the pin 2 is protruded and a large load is applied, the back side of the container body 1 protrudes and is not pierced by the pin 2, thereby preventing damage to the container body 1 during manufacturing extremely effectively. .

  Further, since it is not necessary to greatly change the drawing angle when the container body 1 is removed from the mold, there is no hindrance to taking in and out of the semiconductor wafer W. Further, the rib flange 20A and the positioning portion 25 on the back wall are not separately formed, but the positioning portion 25 is integrally formed at the central portion 22 of the rib flange 20A, so that simplification of the configuration and reduction in the number of parts are expected. it can.

  The substrate storage container and the manufacturing method thereof according to the present invention are not limited to the above embodiment. For example, a viewing window for visually recognizing the semiconductor wafer W may be formed above the center of the back wall of the container body 1 by an insert molding method, a two-color molding method, or the like. Further, an RF tag of the FRID system may be attached to the container main body 1 or its rib flange 20 to contribute to an automatic moving body identification system.

  Further, instead of forming the plurality of positioning portions 25 on the rib flange 20, the positioning portions 25 for the processing apparatus may be formed on both the front side and the rear center of the bottom surface of the container body 1, respectively. Further, the central portion 22 of the rib flange 20A on the back wall can be bent into a substantially V shape instead of a substantially W shape to form a recess 24. Furthermore, the rib flange 20B on each side wall can be omitted if there is no particular problem.

It is a plane explanatory view showing typically an embodiment of a substrate storage container concerning the present invention. It is a bottom view showing typically an embodiment of a substrate storage container concerning the present invention. It is a front view showing typically an embodiment of a substrate storage container concerning the present invention. It is a rear view which shows typically embodiment of the substrate storage container which concerns on this invention. It is a side view showing typically an embodiment of a substrate storage container concerning the present invention. 1 is an overall perspective view schematically showing an embodiment of a substrate storage container according to the present invention. It is a perspective view which shows typically the surface cover of the cover body in embodiment of the board | substrate storage container which concerns on this invention. It is a reverse view of FIG. It is a perspective view which shows typically the cover body and its locking mechanism in embodiment of the substrate storage container which concerns on this invention. It is a back view which shows typically the cover body in embodiment of the substrate storage container which concerns on this invention. It is a top view which shows typically the container main body in embodiment of the substrate storage container which concerns on this invention. It is a bottom view showing typically a container main part in an embodiment of a substrate storage container concerning the present invention. It is a rear view which shows typically the container main body in embodiment of the substrate storage container which concerns on this invention. It is a front view showing typically a container main part in an embodiment of a substrate storage container concerning the present invention. It is a section front view showing typically an embodiment of a substrate storage container and a manufacturing method for the same concerning the present invention. It is back explanatory drawing which shows typically the relationship between the rib flange of a container main body and the protrusion pin in embodiment of the substrate storage container which concerns on this invention. It is side explanatory drawing which shows typically the container main body in embodiment of the substrate storage container which concerns on this invention. It is a section side view showing typically a container main part in an embodiment of a substrate storage container concerning the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Container body 2 Protruding pin 3 Teeth 10 Lid 20A Rib flange 20A Back wall rib flange 20B Side wall rib flange 21 Both sides 22 Central part 24 Recessed part 25 Positioning part 26 Front part 27 Remaining part 28 Recessed part W Semiconductor wafer (substrate)

Claims (3)

Three sheets following the front open box type height 6cm or less of the container body for housing the substrate is molded out morphism using a mold, for demolding of the mold inside the rear side of the injection-molded container body a substrate storage container container body by collision producing pin is protruded is released from the mold,
A rib flange is formed at least outside the back wall of the back wall and both side walls of the container body, and both sides of the rib flange are positioned in the center of both sides of the back wall so as to face a plurality of protruding pins. A substrate characterized in that a central portion of a rib flange is positioned below the central portion, a concave portion is formed by bending the central portion of the rib flange, and an opening of the concave portion is directed downward to serve as a positioning portion of the container body. Storage container. Rib flanges are formed on both side walls of the container body, and the front part of the rib flange is positioned below the front part of each side wall. The remaining part other than the front part of the rib flange is provided at the center of the remaining part other than the front part of each side wall. The substrate storage container according to claim 1 , wherein the front portion of the rib flange on each side wall is bent to form a recess, and the opening of the recess is directed downward to serve as a positioning portion of the container body. A method for manufacturing a substrate storage container, comprising manufacturing the substrate storage container according to claim 1 .

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