JP2006222386A - プリント配線板、プリント回路基板、電子機器 - Google Patents

プリント配線板、プリント回路基板、電子機器 Download PDF

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Publication number
JP2006222386A
JP2006222386A JP2005036577A JP2005036577A JP2006222386A JP 2006222386 A JP2006222386 A JP 2006222386A JP 2005036577 A JP2005036577 A JP 2005036577A JP 2005036577 A JP2005036577 A JP 2005036577A JP 2006222386 A JP2006222386 A JP 2006222386A
Authority
JP
Japan
Prior art keywords
printed wiring
wiring board
reinforcing
pad
conductor layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005036577A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006222386A5 (enExample
Inventor
Makoto Tanaka
田中　　誠
Shigenori Miyagawa
重徳 宮川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP2005036577A priority Critical patent/JP2006222386A/ja
Priority to US11/352,293 priority patent/US7301103B2/en
Publication of JP2006222386A publication Critical patent/JP2006222386A/ja
Publication of JP2006222386A5 publication Critical patent/JP2006222386A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/114—Pad being close to via, but not surrounding the via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/099—Coating over pads, e.g. solder resist partly over pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP2005036577A 2005-02-14 2005-02-14 プリント配線板、プリント回路基板、電子機器 Pending JP2006222386A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2005036577A JP2006222386A (ja) 2005-02-14 2005-02-14 プリント配線板、プリント回路基板、電子機器
US11/352,293 US7301103B2 (en) 2005-02-14 2006-02-13 Printed-wiring board, printed-circuit board and electronic apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005036577A JP2006222386A (ja) 2005-02-14 2005-02-14 プリント配線板、プリント回路基板、電子機器

Publications (2)

Publication Number Publication Date
JP2006222386A true JP2006222386A (ja) 2006-08-24
JP2006222386A5 JP2006222386A5 (enExample) 2008-06-19

Family

ID=36814504

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005036577A Pending JP2006222386A (ja) 2005-02-14 2005-02-14 プリント配線板、プリント回路基板、電子機器

Country Status (2)

Country Link
US (1) US7301103B2 (enExample)
JP (1) JP2006222386A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013149511A (ja) * 2012-01-20 2013-08-01 Minebea Co Ltd 面状照明装置
JP2017199726A (ja) * 2016-04-25 2017-11-02 富士通株式会社 ケーブル接続基板

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7679004B2 (en) * 2004-03-03 2010-03-16 Shinko Electric Industries Co., Ltd. Circuit board manufacturing method and circuit board
JP4786976B2 (ja) * 2005-09-13 2011-10-05 パナソニック株式会社 配線基板及びその製造方法、並びに半導体装置
JP4911983B2 (ja) * 2006-02-08 2012-04-04 株式会社 日立ディスプレイズ 表示装置
US7746661B2 (en) * 2006-06-08 2010-06-29 Sandisk Corporation Printed circuit board with coextensive electrical connectors and contact pad areas
US7462038B2 (en) * 2007-02-20 2008-12-09 Qimonda Ag Interconnection structure and method of manufacturing the same
JP5001731B2 (ja) * 2007-07-02 2012-08-15 日東電工株式会社 配線回路基板と電子部品との接続構造
CN103874320B (zh) 2012-12-17 2017-02-01 纬创资通股份有限公司 电路板及电路板的制造方法
JP6522317B2 (ja) * 2014-11-10 2019-05-29 日東電工株式会社 配線回路基板およびその製造方法、ならびに、配線回路基板アセンブリおよびその製造方法
KR102888554B1 (ko) * 2022-01-03 2025-11-21 삼성전자주식회사 반도체 모듈용 모듈 기판, 반도체 모듈 및 이를 테스트하기 위한 테스트 소켓
US20240074067A1 (en) * 2022-08-31 2024-02-29 Kollmorgen Corporation Extended pad area to prevent printed circuit board damage

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60124992A (ja) * 1983-12-12 1985-07-04 イビデン株式会社 プリント配線板およびその製造方法
JPS6379064U (enExample) * 1986-11-11 1988-05-25
JPH031476U (enExample) * 1989-05-24 1991-01-09
JPH0446573U (enExample) * 1990-08-22 1992-04-21
JP2002299807A (ja) * 2001-03-30 2002-10-11 Seiko Epson Corp 回路基板及びその製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2874329B2 (ja) * 1990-11-05 1999-03-24 日本電気株式会社 多層印刷配線板の製造方法
JP2673098B2 (ja) * 1994-08-03 1997-11-05 インターナショナル・ビジネス・マシーンズ・コーポレイション プリント配線基板及び実装構造体
JP2970491B2 (ja) * 1995-09-20 1999-11-02 ソニー株式会社 半導体パッケージ及びその製造方法
US5891606A (en) * 1996-10-07 1999-04-06 Motorola, Inc. Method for forming a high-density circuit structure with interlayer electrical connections method for forming
EP1043921A4 (en) * 1997-11-19 2007-02-21 Ibiden Co Ltd MULTILAYER PRINTED PCB AND METHOD FOR THE PRODUCTION THEREOF
US6239980B1 (en) * 1998-08-31 2001-05-29 General Electric Company Multimodule interconnect structure and process
US6687268B2 (en) * 2001-03-26 2004-02-03 Seiko Epson Corporation Surface emitting laser and photodiode, manufacturing method therefor, and optoelectric integrated circuit using the surface emitting laser and the photodiode
KR20020083249A (ko) * 2001-04-26 2002-11-02 삼성전자 주식회사 배선의 접촉 구조 및 그의 제조 방법과 이를 포함하는박막 트랜지스터 기판 및 그 제조 방법
US6828513B2 (en) * 2002-04-30 2004-12-07 Texas Instruments Incorporated Electrical connector pad assembly for printed circuit board
JP2004006538A (ja) 2002-05-31 2004-01-08 Toshiba Corp コネクタの固定構造、印刷配線板およびコネクタ固定方法
TWI234258B (en) * 2003-08-01 2005-06-11 Advanced Semiconductor Eng Substrate with reinforced structure of contact pad
CN1735321A (zh) * 2004-08-11 2006-02-15 鸿富锦精密工业（深圳）有限公司 具有改良焊盘的电路板
JP4625674B2 (ja) * 2004-10-15 2011-02-02 株式会社東芝 プリント配線基板及びこの基板を搭載する情報処理装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60124992A (ja) * 1983-12-12 1985-07-04 イビデン株式会社 プリント配線板およびその製造方法
JPS6379064U (enExample) * 1986-11-11 1988-05-25
JPH031476U (enExample) * 1989-05-24 1991-01-09
JPH0446573U (enExample) * 1990-08-22 1992-04-21
JP2002299807A (ja) * 2001-03-30 2002-10-11 Seiko Epson Corp 回路基板及びその製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013149511A (ja) * 2012-01-20 2013-08-01 Minebea Co Ltd 面状照明装置
US9383086B2 (en) 2012-01-20 2016-07-05 Minebea Co., Ltd. Planar lighting device and mounting substrate including conduction pattern with extension parts
JP2017199726A (ja) * 2016-04-25 2017-11-02 富士通株式会社 ケーブル接続基板

Also Published As

Publication number Publication date
US20060180340A1 (en) 2006-08-17
US7301103B2 (en) 2007-11-27

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