JP2006217185A - Antenna circuit and frequency adjustment method for contactless ic inlet - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an antenna circuit which has a finely adjustable resonance frequency, a contactless IC inlet using the antenna circuit and a frequency adjustment method therefor, and a contactless IC tag having the inlet and a contactless type IC card. <P>SOLUTION: On a surface of an insulating base material 2, the antenna circuit is prepared which has a wound plane antenna 6, a common connection pad 8 connected one end of the plane antenna, a plurality of individual connection pads 14a to 14d spaced from the common connection pad at prescribed intervals and arranged around the common connection pad 8, and wiring lines 20b to 20d for inductance adjustment to which intermediate terminal portions 18b to 18d of the plane antenna and the plurality of individual connection pads 14b to 14d are connected, respectively, and an IC chip is mounted on the common connection pad 8 of the antenna circuit and one of the individual connection pads 14a to 14d. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an antenna circuit for a non-contact IC inlet that can be used for a non-contact IC tag, a non-contact IC card, etc. used for personal authentication, merchandise management, logistics management, etc. The present invention relates to a contact type IC inlet, a frequency adjusting method thereof, and a non-contact type IC tag and a non-contact type IC card incorporating the non-contact type IC inlet.

  In recent years, non-contact type IC tags that are attached to a person to be managed or a product (an adherend) and manage the distribution of these objects to be managed have become widespread. This non-contact type IC tag can store data in a built-in IC chip, and can exchange data to be managed with an interrogator by communicating with the interrogator in a non-contact manner via radio waves.

  Fields of use of the non-contact type IC tag are various, such as commuter pass for various transportation facilities, management of people in / out of a company, etc., inventory management of goods, and logistics management. There are various types of non-contact type IC tags and non-contact type IC cards according to these fields of use.

  These non-contact type IC tags and non-contact type IC cards accommodate non-contact type IC inlets therein.

  FIG. 8 shows a typical example of a non-contact type IC inlet. In FIG. 8, 500 is a non-contact type IC inlet. Reference numeral 502 denotes an insulating substrate formed of a resin film or the like, and a planar antenna 504 formed by spirally winding a conductive material is formed on the surface thereof. The outer end of the wound flat antenna 504 is connected to the outer electrode 506. Further, the other inner end of the planar antenna 504 is connected to one connection pad 508.

  Reference numeral 510 denotes the other connection pad, which is opposed to the one connection pad 508 and spaced apart by a predetermined distance.

  An insulating layer 512 is formed between the other connection pad 510 and the outer electrode 506 so as to cover the upper surface of the planar antenna 504, and the jumper 514 formed on the upper surface of the insulating layer 512 allows the outer electrode. 506 and the other connection pad 510 are connected.

  The IC chip 516 is mounted on one connection pad 508 and the other connection pad 510 of the antenna circuit configured as described above via an IC chip connection terminal (not shown). Since the IC chip 516 has two connection terminals, the antenna circuit requires two connection pads 508 and 510 as shown in FIG.

  FIG. 9 shows connection pads having different arrangements. FIG. 9A shows that the connection terminals 608 and 610 formed on the diagonal line of the IC chip 606 are connected to the two connection pads 602 and 604 and mounted. Is shown. (B) shows a state in which connection terminals 626 and 628 formed on one edge of the IC chip 624 are connected to and mounted on connection pads 620 and 622 arranged in parallel to each other.

  In the non-contact type IC inlet 500 having the above-described configuration shown in FIG. 8, a resonance circuit is configured by the planar antenna 504 and a capacitor (not shown) built in the IC chip 516, and radio waves having the resonance frequency are transmitted. Through this, it is possible to communicate with an external interrogator (not shown) in a non-contact manner.

The resonance frequency (f) of the resonance circuit composed of the antenna circuit and the IC chip is determined by the following equation (1) if the capacitance (C) of the IC chip and the inductance (L) of the antenna circuit are determined. The

f = 2π / (LC) ^1/2 (1)

The capacitance of the IC chip has a unique value for each IC chip, and when the IC chip changes, the capacitance also changes.

  When manufacturing a non-contact type IC inlet with an IC chip mounted on an antenna circuit, the antenna circuit is prototyped after designing the number of turns of the planar antenna so that the desired resonance frequency is achieved at the design stage of the antenna circuit. The An IC chip is mounted on the prototyped antenna circuit to obtain a non-contact type IC inlet. However, when the resonance frequency of this non-contact type IC inlet is measured, it is rare if it coincides with the designed resonance frequency, and it is usually slightly different. For this reason, normally, in order to adjust the deviation from the designed resonance frequency, the trial production is performed after redesigning the number of turns of the antenna circuit. However, retrials require a long time and are complicated.

  In order to solve this problem, a method has been proposed in which an adjustment capacitor is formed in advance in an antenna circuit, an IC chip is mounted, and then the adjustment frequency is finely adjusted by cutting the adjustment capacitor (patent) Reference 1).

  Further, a method has been proposed in which a circuit length adjustment wiring pattern is formed in advance in an antenna circuit, and the resonance frequency is finely adjusted by cutting the adjustment wiring pattern according to the frequency deviation (Patent Document 2). ).

However, these adjustment methods require an additional step of cutting the antenna circuit, and there is a problem that the manufacturing process becomes complicated.
JP2001-10264 (Claim 1, paragraph number (0014)) JP 2001-251115 (Claim 1, Abstract)

  While various studies have been made by the present inventors to solve the above problems, an antenna circuit in which a plurality of IC chip mounting connection pads connecting both ends of a planar antenna and an intermediate portion of the planar antenna are formed on the surface of an insulating substrate I came up with it. The antenna circuit having the above configuration can easily change the inductance of the planar antenna by selecting any one of the plurality of connection pads when mounting the IC chip, and flip chip mounting is often used for mounting. At present, it is easy to change the connection pad to be selected. In this case, since the existing device can be used as it is, there is no need to add a process such as cutting the antenna circuit for fine adjustment of the conventional resonance frequency. I knew. The present invention has been completed based on the above findings.

  Accordingly, an object of the present invention is to solve the above-mentioned problems and to make sure that the resonance frequency can be finely adjusted without adding a new process, and a non-contact type in which an IC chip is mounted on the antenna circuit. An IC inlet, a frequency adjusting method thereof, a non-contact IC tag having the same non-contact IC inlet, and a non-contact IC card are provided.

  The present invention for achieving the above object is described below.

[1] An antenna circuit formed on the surface of an insulating substrate,
(A) a wound planar antenna;
(B) a common connection pad connected to one end of the planar antenna;
(C) A plurality of individual connection pads disposed around the common connection pad at a predetermined distance from the common connection pad, and any one of the individual connection pads is the planar antenna. A plurality of individual connection pads connected to the other end of the
(D) Inductance adjustment wiring to which the intermediate terminal portion of the planar antenna and the individual connection pads other than the individual connection pads connected to the other end of the planar antenna among the plurality of individual connection pads are respectively connected;
An antenna circuit.

  [2] The antenna circuit according to [1], the common connection pad of the antenna circuit, and any one individual connection pad of the plurality of individual connection pads are connected and connected to the connection terminal of the IC chip. Non-contact IC inlet consisting of an IC chip.

  [3] Non-contact type IC tags having the non-contact type IC inlet according to [2].

  [4] When connecting the IC chip connection terminal to the common connection pad and the individual connection pad of the antenna circuit according to [1] and mounting the IC chip on the antenna circuit, the individual connection pad to be connected is selected. The non-contact type IC inlet frequency adjusting method for adjusting the resonance frequency of the non-contact type IC inlet.

  The antenna circuit of the present invention has a common connection pad connected to one end of a planar antenna, two or more individual connection pads connected to the other end of the planar antenna, and an intermediate terminal portion of the planar antenna, and mounting an IC chip At this time, since the inductance of the planar antenna can be changed by selecting a connection pad, a non-contact type IC inlet or non-contact type IC having a desired resonance frequency can be easily obtained without adding an additional processing step. Cards, non-contact IC tags, etc. can be manufactured.

  When mounting an IC chip, fine adjustment of the resonance frequency can be easily performed by selecting an arbitrary connection pad using a flip chip mounting apparatus and mounting the IC chip. Even when the mounted IC chip is changed to an IC chip having a different capacitance, it can be easily adjusted to the same resonance frequency by changing the connection pad on which the IC chip is mounted.

  Therefore, a non-contact type IC card, a non-contact type IC tag, and the like manufactured using an antenna circuit having the above advantages are useful for achieving the same effects as described above.

  Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings.

(Antenna circuit and non-contact IC inlet)
FIG. 1 is a plan view showing an example of an antenna circuit of the present invention. In FIG. 1, reference numeral 100 denotes an antenna circuit formed on the surface of the insulating base 2. The insulating base 2 functions as a support for holding a planar antenna, an IC chip and the like which will be described later. As the insulating substrate 2, paper such as high-quality paper and coated paper, a synthetic resin film, and the like are preferable. The resin material constituting the synthetic resin film is not particularly limited. Polyethylene, polypropylene, polyvinyl chloride, polystyrene, polyester, polyvinyl acetate, polybutene, polyacrylic ester, polymethacrylic ester, polyacrylonitrile, polyimide, polycarbonate And polyamide, ethylene-vinyl acetate copolymer, polyvinyl acetal, polyethylene terephthalate, acrylonitrile-butadiene-styrene copolymer, and the like. 10-200 micrometers is preferable and, as for the thickness of the base material 2, 25-125 micrometers is especially preferable.

  An outer electrode 4 is formed on one corner side of the substrate 2.

  A planar antenna 6 formed by winding a conductive material in a rectangular spiral shape is formed on the surface of the insulating base 2, and an outer end thereof is connected to the outer electrode 4.

  A rectangular common connection pad 8 is formed in the vicinity of the outer electrode 4 and inside the planar antenna 6.

  An insulating layer 10 is formed between the outer electrode 4 and the common connection pad 8 so as to cover the upper surface of the planar antenna 6. The common connection pad 8 inside the planar antenna 6 and the outer electrode 4 are electrically connected by a jumper 12 formed on the upper surface of the insulating layer 10. However, the jumper 12 is insulated from the planar antenna 6 by the insulating layer 10.

  Around the common connection pad 8, a plurality of individual connection pads 14 (four individual connection pads 14 a, 14 b, 14 c, 14 d in this figure) are formed at a predetermined distance from the common connection pad 8. .

  The other end inside the planar antenna 6 is connected to any one of the individual connection pads 14 (14a in this example).

  A plurality of intermediate terminal portions 18 (three intermediate terminal portions 18b, 18c, and 18d in this example) of the intermediate portion 16 (in this example, the innermost winding) of the flat antenna 6 that is wound; The individual connection pads 14 (in this example, 14b, 14c, and 14d) excluding any one of the individual connection pads 14 (in this example, 14a) are the inductance adjusting wiring 20 (in this example). Are connected by 20b, 20c, 20d).

  The interval between the plurality of intermediate terminal portions 18 is designed according to the magnitude of the inductance of the planar antenna to be adjusted.

  Although the manufacturing method of the said antenna circuit 100 is not specifically limited, The well-known method of forming a circuit pattern on an insulating base material is employ | adopted without a restriction | limiting at all. Specific examples include a method of screen printing a circuit pattern using a known conductive paste, a method of forming a circuit pattern by etching a conductive metal film such as copper laminated on an insulating substrate or an insulating film, and the like.

  In addition, a known method can be adopted as a method for manufacturing the insulating layer and the jumper without any limitation. Specifically, after printing an insulating layer pattern by screen printing or the like using an insulating ink, a jumper pattern is printed on the printed insulating layer pattern using a conductive paste by screen printing or the like. Etc. Examples of the insulating ink include photocurable ink such as ultraviolet curable ink. 5-50 micrometers is preferable and, as for the thickness of an insulating layer, 10-40 micrometers is especially preferable.

  Examples of the conductive paste include those in which metal particles such as gold, silver, nickel and copper are dispersed in a binder. 1-15 micrometers is preferable and, as for the average particle diameter of a metal particle, 2-10 micrometers is especially preferable. Examples of the binder include polyester resin, polyurethane resin, epoxy resin, and phenol resin. The thickness of the jumper is preferably 5 to 50 μm, and more preferably 10 to 40 μm.

  FIG. 2 is an enlarged view showing a state where the IC chip 26 is mounted on the antenna circuit 100. By mounting the IC chip 26 on the antenna circuit 100, the non-contact type IC inlet 200 is obtained. One connection terminal 28a of the IC chip 26 is connected to the common connection pad 8, and the other connection terminal 28b is connected to the individual connection pad 14b.

  By changing the mounting position of the IC chip 26 and selecting any one of the individual connection pads 14a to 14d connected to the other connection terminal 28b, the winding length of the planar coil is changed. As a result, the planar coil is changed. 6 inductance is changed.

  The mounting method of the IC chip 26 includes flip chip mounting (face down method) in which the IC chip is mounted on the connection pad, and wire bonding method in which the IC chip is mounted face up and connected to the terminal using a conductive wire. A known method can be adopted. In particular, when a flip chip mounting apparatus is used, it is preferable because the IC chip mounting position can be easily changed.

  FIG. 3 shows another example of the antenna circuit of the present invention, where (a) is a front view and (b) is a back view. In this example, intermediate terminal portions 18b, 18c, and 18d are provided at intermediate portions of the planar antenna with different numbers of turns. As described above, by providing the intermediate terminal portions 18b, 18c, and 18d at the intermediate portion of the different number of turns of the planar antenna, a large inductance amount can be adjusted.

  Further, according to this example, the connection between the intermediate terminal portion 18b and the inductance adjusting wire 20b is connected to the end terminal 32b formed at the end portion of the inductance adjusting wire 20b and the intermediate terminal 34b formed at the intermediate terminal portion 18b. They are connected by jumpers 36b on the back surface (FIG. 3 (b)) through through holes (not shown) formed.

  Similarly, the connection between the intermediate terminal portion 18c and the inductance adjustment wiring 20c is made through the end terminal 32c formed at the end of the inductance adjustment wiring 20c and the intermediate terminal 34c formed at the intermediate terminal portion 18c. -It is connected by a jumper 36c on the back surface (FIG. 3B) through a hole (not shown).

  Further, the common connection pad 8 and the outer electrode 4 are also connected by a jumper 12 formed on the back surface through through holes (not shown) formed in these.

  FIG. 4 shows another example of the arrangement of the common connection pad 8 and the individual connection pads 14a to 14i of the antenna circuit of the present invention. In the case of this example, nine individual connection pads 14a to 14i are arranged around the common connection pad 8 at a predetermined interval.

  Note that the number of the individual connection pads 14a... 14x formed around the common connection pad 8 is arbitrary. By increasing the number of the individual connection pads, it is possible to adjust the inductance in a wider range or finer. .

  Furthermore, the shape of the common connection pad 8 is not limited to a rectangle, and an arbitrary shape such as a circle, a triangle, a band-like closed shape, or other polygons may be employed. The shape of the individual connection pad is also arbitrary.

  Furthermore, the common connection pads 8 and the individual connection pads 14 may be formed at any locations. For example, the common connection pads 8 and the individual connection pads 14 may be formed outside the planar antenna 6, and may be variously modified without departing from the scope of the present invention. Absent.

(Non-contact IC tags)
In the present invention, the non-contact type IC tags include the following non-contact type IC tags and a non-contact type IC card described later.

  Next, a non-contact type IC tag including the non-contact type IC inlet will be described with reference to FIG.

  FIG. 5 is a side view showing an example of the non-contact type IC tag of the present invention, and 300 is a non-contact type IC tag. In this example, an adhesive layer 52 is formed on the upper surface of an antenna circuit (not shown) on which an IC chip (not shown) of the non-contact type IC inlet 50 is mounted, covering the antenna circuit and the IC chip. A release material 54 is detachably attached to the upper surface.

  In the present invention, the adhesive is a concept including a normal adhesive and a pressure-sensitive adhesive.

  As an adhesive used for the adhesive layer 52, a known adhesive can be used without limitation. Specific examples include acrylic adhesives, urethane adhesives, natural rubber and synthetic rubber adhesives, silicone resin adhesives, polyolefin adhesives, polyester adhesives, ethylene-vinyl acetate adhesives, etc. it can.

The adhesive layer 52 can be formed by, for example, applying an adhesive on the release treatment surface of the release material 54 and then bonding the adhesive layer 52 to the antenna circuit formation surface of the non-contact type IC inlet 50. The coating amount of the adhesive is preferably ^{5~300g / m 2, 10~50g / m} 2 is particularly preferred.

  Any material may be used as the release material 54. For example, films made of various resins such as polyethylene terephthalate, polybutylene terephthalate, polyethylene, polypropylene, polyethylene laminated paper, polypropylene laminated paper, clay coated paper, resin Various paper materials such as coated paper and glassine paper can be used as the base material, and the surface of the base material bonded to the adhesive layer can be peeled off if necessary. In this case, a representative example of the form subjected to the release treatment includes formation of a release agent layer made of a release agent such as a silicone resin, a long-chain alkyl resin, or a fluorine resin. The thickness of the release material is not particularly limited and may be appropriately selected.

  Next, a method of using the non-contact type IC tag 300 will be described.

  First, the release material 54 is peeled off from the adhesive layer 52, and a non-contact type IC tag is attached to an adherend (not shown) that is a data management object. As a result, the non-contact type IC tag can be used, and by exchanging data with the interrogator, various types of management of the adherend can be performed.

  FIG. 6 is a cross-sectional view showing a different example of a non-contact type IC tag, and 320 is a non-contact type IC tag.

  In FIG. 6, 82 is a non-contact type IC inlet, and an IC chip 88 is mounted on an antenna circuit 86 formed on the lower surface of the insulating base 84.

  A surface base material 90 is adhered to the upper surface of the insulating base material 84 (the non-mounting surface of the IC chip 88). The surface of the surface base material 90 is preferably capable of printing visible information such as a trade name, and is not particularly limited as long as it is suitable for printing on the surface. For example, a synthetic resin film, synthetic paper, non-woven fabric, paper, or a surface on which various recording layers for thermal recording, pressure-sensitive recording, thermal transfer recording, laser light recording, and inkjet recording are formed may be used.

  A double-sided adhesive material 92 is laminated on the lower surface of the non-contact type IC inlet 82. The double-sided pressure-sensitive adhesive material 92 has a pressure-sensitive adhesive layer 96 formed on one surface (upper surface in the figure) of the support 94 and an adhesive layer 98 formed on the other surface (lower surface in the figure).

  As the support 94, paper such as high-quality paper, nonwoven fabric, and coated paper, and synthetic resin films such as polyethylene terephthalate, polypropylene, polyvinyl chloride, polyurethane, and polyimide are preferable. As thickness of the support body 94, 10-100 micrometers is preferable and 12-80 micrometers is more preferable.

  The pressure-sensitive adhesive layer 96 has a function of covering the IC chip and the antenna circuit, and following these irregularities to embed them in the pressure-sensitive adhesive layer 96 and seal them. As the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer 96, any pressure-sensitive adhesive having sufficient adhesiveness and an embedding function can be adopted. Specifically, rubber-based, acrylic-based, silicone-based, polyurethane-based and the like are preferable, and acrylic pressure-sensitive adhesives are particularly preferable.

  As thickness of the adhesive layer 96, 5-300 micrometers is preferable and 10-50 micrometers is more preferable.

  It is important that the adhesive layer 98 can be adhered without being peeled off from the adherend when the non-contact type IC tag is adhered to an adherend such as a product. As the adhesive constituting the adhesive layer 98, known heat-sensitive adhesives such as rubber, acrylic, silicone, and polyurethane, pressure-sensitive adhesives, thermosetting adhesives, and the like can be used without limitation. As thickness of the adhesive bond layer 98, 5-300 micrometers is preferable and 10-50 micrometers is more preferable.

  A release material 99 is attached to the lower surface of the adhesive layer 98. The release material 99 is intended to protect the adhesive layer 98 before use of the non-contact type IC tag. By providing the release material 99, for example, the adhesive layer 98 is protected when printing on the surface substrate 90.

  As the release material 99, the same material as the release material 54 can be used.

(Non-contact IC card)
The non-contact type IC inlet of the present invention can be further configured in the form of a non-contact type IC card described below.

  FIG. 7 is a side sectional view showing an example of the non-contact type IC card of the present invention, and 310 is a non-contact type IC card. In this example, the non-contact type IC inlet 50 is formed in the form of a card enclosed in two surface base materials 64 and 66 to which the peripheral edge 62 is bonded. In FIG. 7, 68 is an insulating substrate, 70 is an antenna circuit formed on the insulating substrate 68, and 72 is an IC chip.

  Examples of the bonding method of the peripheral edge 62 of the surface base materials 64 and 66 include heat bonding and bonding methods using various adhesives.

  Although there is no restriction | limiting in particular as a surface base material, Paper, such as high-quality paper and a coated paper, a synthetic resin film, etc. are preferable. Resin materials constituting the synthetic resin film include polyethylene, polypropylene, polyvinyl chloride, polystyrene, polyester, polyvinyl acetate, polybutene, polyacrylate ester, polymethacrylate ester, polyacrylonitrile, polyimide, polycarbonate, polyamide, ethylene- Examples include vinyl acetate copolymer, polyvinyl acetal, polyethylene terephthalate, acrylonitrile-butadiene-styrene copolymer, and the like. 10-500 micrometers is preferable and, as for the thickness of a surface base material, 50-400 micrometers is especially preferable.

  Examples of applications of the non-contact type IC card include a cash card, a credit card, a membership card, an employee card, an entrance / exit management card, and a commuter pass.

  Hereinafter, the present invention will be described more specifically with reference to examples.

Example 1
(Manufacture of non-contact type IC inlet)
According to the antenna circuit 100 shown in FIG. 1, the antenna circuit was manufactured by the method described below. The manufactured antenna circuit is slightly different from the antenna circuit of FIG.

  First, a laminate film (trade name: Nikaflex (manufactured by Nikkan Kogyo Co., Ltd., Cu / PET = 35 μm / 50 μm)) is applied to the copper foil surface of the laminated film (copper foil and polyethylene terephthalate (PET) film) using the screen printing method. 4. A resist pattern for forming the planar antenna 6, the common connection pad 8, the individual connection pads 14a to 14d, and the inductance adjusting wirings 20b to 20d was printed, and then unnecessary copper foil portions were removed by etching to be integrated. A wiring pattern was formed.

  Thereafter, in order to connect the outer electrode 4 and the common connection pad 8, an insulating layer 10 covering the planar antenna 6 is formed using an insulating resist ink (manufactured by Nippon Atson Co., Ltd., ML25089), and further an Ag paste material (Toyobo Co., Ltd.). The jumper 12 was formed using DW250L-1) manufactured by the company. A screen printing method was used to form the insulating layer and the jumper. The thickness of the insulating layer was 25 μm, and the thickness of the jumper was 25 μm.

  The manufactured planar antenna 6 had a line width of 0.2 mm and a substantially rectangular shape of 16 mm length and 47 mm width wound 12 times. The intermediate terminal portions 18b, 18c, and 18d are formed at three locations on the innermost periphery of the planar antenna 6, and these are connected to the individual connection pads 14b, 14c, and 14d, respectively. As shown in FIG. 1, the intermediate terminal portions 18b, 18c, and 18d are the corners of the antenna circuit that is wound from the other end inside the planar antenna 6 (the antenna end connected to the individual connection pad 14a). Were sequentially formed at the positions.

  An IC chip (manufactured by Philips, I Code 1) was mounted on the manufactured antenna circuit 100. An IC chip was mounted by selecting the common connection pad 8 and any one of the individual connection pads 14a to 14d, and five non-contact type IC inlets having four different resonance frequencies were manufactured. A flip chip mounting machine (manufactured by Kyushu Matsushita, FB30T-M) was used for mounting the IC chip. An anisotropic conductive paste (manufactured by Kyocera Chemical Co., TAP0402E) was used as a bonding material between the IC chip connection terminals and the connection pads, and thermocompression bonded under conditions of 200 ° C., 300 gf, and 10 seconds.

Operation Confirmation Method The operation of the manufactured non-contact type IC inlet was confirmed by performing a Read / Write test on RFID using an I Code evaluation kit SLEV400 manufactured by Philips. Further, a resonance waveform / resonance frequency test was performed using an Agilent network analyzer 8712ET.

  After measuring the resonance frequency of each non-contact type IC inlet using a network analyzer 8712ET, the operation as an RFID circuit was confirmed using SLEV400. For all non-contact type IC inlets, it was confirmed that normal read / write operations could be performed. Table 1 shows the results regarding the resonance frequency. The resonance frequency described in Table 1 is an average value of resonance frequencies of five non-contact type IC inlets at the same mounting position.

  As shown in Table 1, by changing the mounting position of the IC chip, a change in the resonance frequency of 0.1 MHz to 0.6 MHz is observed based on the resonance frequency having the lowest resonance frequency (mounted on the individual connection pad 14a). It was. Therefore, by selecting the individual connection pad when mounting the IC chip, the resonance frequency in this range can be finely adjusted. By mounting the IC chip on the individual connection pad 14d, a desired resonance frequency of 13. I was able to get 8MHz.

Example 2
Five non-contact type IC inlets each having an IC chip (I Code SLI manufactured by Philips) mounted on each individual connection pad are manufactured on the antenna circuit manufactured in Example 1, and the same test as in Example 1 is performed. went. For all non-contact type IC inlets, it was confirmed that normal read / write operation was possible. The results regarding the resonance frequency are shown in Table 1. As shown in Table 1, the resonance frequency can be adjusted in the range of 0.1 MHz to 0.7 MHz. By mounting an IC chip on the individual connection pad 14b, a device having a desired resonance frequency can be obtained. It was.

  The IC chip (I Code 1) and the IC chip (I Code SLI) have the same capacitance according to the standard. However, the resonance frequency of the non-contact type IC inlet of Example 1 in which these IC chips are mounted on the antenna circuit manufactured in Example 1 is different from the non-contact type IC inlet of Example 2 by about 0.5 MHz. It was.

  Even when the resonance frequency is changed by exchanging the IC chip as described above, the same resonance frequency can be adjusted by changing the mounting position (individual connection pad position) of the IC chip.

  That is, the non-contact type IC inlet mounted on the individual connection pad 14d of the first embodiment and the non-contact type IC inlet mounted on the individual connection pad 14b of the second embodiment have the same resonance wave number, so that the individual connection to be selected is selected. By changing the pad, a non-contact type IC inlet having the same resonance frequency with the same antenna circuit can be realized with different IC chips.

Example 3
An antenna circuit having the same shape used in Example 1 but having a smaller number of turns was manufactured in the same manner as in Example 1. An IC chip (I Code 1 manufactured by Philips Co.) was mounted on this antenna circuit in the same manner as in Example 1 with the position of each individual connection pad being changed to produce a non-contact type IC inlet. Five non-contact type IC inlets were manufactured for each individual connection pad selected at the time of mounting.

  Using these non-contact type IC inlets, the same test as in Example 1 was performed. For all non-contact type IC inlets, it was confirmed that normal read / write operation was possible. By reducing the number of turns, the lowest resonance frequency became 13.9 MHz. By changing the individual connection pads selected when mounting, it was possible to adjust the resonance frequency in the range of 0.1 MHz to 0.6 MHz as in the first embodiment. By mounting an IC chip on the individual connection pad 14a, it was possible to obtain a desired resonance frequency.

Example 4
The antenna circuit shown in FIG. 3 was manufactured in the same manner as in Example 1. This planar antenna has the same shape as the planar antenna of the first embodiment. However, the inductance adjusting wiring was connected to the intermediate terminal portions of the two locations 18b and 18d of the second winding number and the first portion 18c of the fourth winding from the inside of the flat antenna being wound.

  At the time of mounting, the position of each individual connection pad was changed, and an IC chip (I Code 1 manufactured by Philips) was mounted. Five non-contact type IC inlets with different individual connection pads to be selected were manufactured. Using these non-contact type IC inlets, the same test as in Example 1 was performed. For all non-contact type IC inlets, it was confirmed that normal read / write operations could be performed. By changing the setting of the mounting position of the flip chip mounting machine, the individual connection pads selected for mounting can be easily changed. As a result, it was possible to adjust the resonance frequency in the range of 0.7 MHz to 2.5 MHz. By mounting an IC chip on the individual connection pad 14b, a desired resonance frequency of 13.9 MHz could be obtained.

  Since this non-contact type IC inlet has a jumper formed on the back surface, there is an advantage that the inductance adjustment wiring can be connected to an arbitrary position of the planar antenna. For the electrical connection between the front and back of the insulating base, a method of pouring Ag paste (DW250L-1 manufactured by Toyobo Co., Ltd.) into the through hole was adopted.

Comparative Example 1
As shown in FIG. 8, the same antenna circuit as in Example 1 was manufactured except that there was one individual connection pad. An IC chip (I Code 1 manufactured by Philips) was mounted on this antenna circuit to produce five non-contact type IC inlets. These IC inlets were tested in the same manner as in Example 1. For all non-contact type IC inlets, it was confirmed that normal read / write operations could be performed. The results regarding the resonance frequency are shown in Table 1. The resonance frequency was the same value as that of the non-contact type IC inlet in which the individual connection pad 14a of Example 1 was selected. However, since the frequency cannot be adjusted, the circuit design needs to be changed to adjust to the target resonance frequency.

Comparative Example 2
Five non-contact type IC inlets in which an IC chip (ICode SLI manufactured by Philips) was mounted on the antenna circuit used in Comparative Example 1 were manufactured, and the same test as in Comparative Example 1 was performed. For all non-contact type IC inlets, it was confirmed that normal read / write operations could be performed. The results regarding the resonance frequency are shown in Table 1.

  An IC chip having the same electrostatic capacity as that used in Comparative Example 1 was used in Comparative Example 2, but a difference of 0.5 MHz occurred in the resonance frequency. Accordingly, when different types of IC chips having the same antenna circuit and the same capacitance are used, the IC chip cannot be replaced because the resonance frequency is not the same.

実施例５
実施例１で製造した実装位置の異なる４種類の非接触型ＩＣインレットをそれぞれ５個ずつ用いて、以下に示すようにして図６に示す非接触型ＩＣタグ３２０を製造した。図６中、８２は非接触型ＩＣインレットを示す。

Example 5
A non-contact IC tag 320 shown in FIG. 6 was manufactured as follows by using five each of the four types of non-contact IC inlets manufactured in Example 1 and having different mounting positions. In FIG. 6, reference numeral 82 denotes a non-contact type IC inlet.

  One-sided release paper 8EC of a double-sided adhesive material (PET25W PA-T1 8KX 8EC manufactured by Lintec Corporation) was peeled off from the non-contact type IC inlet 82 mounting surface of the IC chip 88 and bonded using a laminator. In this double-sided adhesive material 92, an acrylic adhesive was applied to both surfaces of a 25 μm thick polyethylene terephthalate 94 base material with a thickness of 25 μm, and the release paper 8KX (99 in the figure) was applied to one side of the adhesive 98. Is equivalent).

  Next, while attaching the surface substrate 90 for printing (FR3412-50 manufactured by Lintec Corporation) on which the acrylic adhesive is applied to the back surface of the non-contact type IC inlet 82 (IC chip non-mounting surface) to a thickness of 20 μm, Punched with a punching die, 5 types of non-contact type IC tags each having a size of 20 × 55 mm and different mounting positions were manufactured. The non-contact type IC tag was manufactured continuously by adopting a continuous manufacturing process.

  It was confirmed that the obtained non-contact type IC tag can perform normal Read / Write operations. The measured resonance frequency was the same as the result of Example 1 shown in Table 1.

Example 6
The non-contact type IC card 310 shown in FIG. 7 is manufactured as follows by using five each of the four types of non-contact type IC inlets 82 having different mounting positions shown in FIG. did.

  Using a hot melt agent (hot melt type adhesive), white polyethylene terephthalate films 64 and 66 (thickness 125 μm) are bonded to both surfaces of the non-contact type IC inlet 50 by a hot press machine, so that the mounting positions are different. Four types of non-contact type IC cards were manufactured.

It was confirmed that the read / write normal operation can be performed on the obtained non-contact type IC card. The measured resonance frequency was the same as the result of Example 1 shown in Table 1.

It is explanatory drawing which shows an example of the antenna circuit of this invention. It is the elements on larger scale which show the state which mounts an IC chip in the antenna circuit of FIG. An example of the non-contact type IC inlet of the present invention is shown, (a) is a front view, and (b) is a back view. It is the surface partial enlarged view which shows an example of the arrangement | sequence of the individual connection pad of the antenna circuit of this invention. It is a side view which shows an example of a structure of the non-contact-type IC tag of this invention. It is side surface sectional drawing which shows the other example of a structure of the non-contact-type IC tag of this invention. It is side surface sectional drawing which shows an example of a structure of the non-contact-type IC card of this invention. It is explanatory drawing which shows an example of the conventional non-contact-type IC inlet. It is a partial expanded explanatory view which shows the mounting state of the conventional IC chip, (a) shows the case where the connection terminal is formed on the diagonal of the IC chip, and (b) shows the edge of the IC chip. The case where it is formed is shown.

Explanation of symbols

500, 50, 82 Non-contact type IC inlet 502 Insulating substrate 504 Planar antenna 506 Outer electrode 508, 510, 602, 604, 620, 622 Connection pad 512 Insulating layer 514 Jumper 516, 606, 624, 72 IC chip 608, 610 , 626, 628 Connection terminal 200 Non-contact type IC inlet 100 Antenna circuit 2, 84, 68 Insulating substrate 4 Outer electrode 6, 70, 86 Planar antenna 8 Common connection pad 10 Insulating layer 12, 36b, 36c, 36d Jumper 14a 14b, 14c, 14d, 14e, 14f, 14g, 14h, 14i, 14x Individual connection pad 16 Intermediate part 18b, 18c, 18d Intermediate terminal part 20b, 20c, 20d Inductance adjustment wiring 26, 88 IC chip 28a, 28b connection for Child 32b, 32c, 32d End terminal 34b, 34c, 34d Intermediate terminal 300, 320 Non-contact type IC tag 52 Adhesive layer 54 Release material 310 Non-contact type IC card 62 Peripheral part 64, 66 Surface base material 90 Surface base material 92 Double-sided adhesive material 94 Support 96 Adhesive layer 98 Adhesive layer 99 Release material

Claims (4)

An antenna circuit formed on the surface of an insulating substrate,
(A) a wound planar antenna;
(B) a common connection pad connected to one end of the planar antenna;
(C) A plurality of individual connection pads disposed around the common connection pad at a predetermined distance from the common connection pad, and any one of the individual connection pads is the planar antenna. A plurality of individual connection pads connected to the other end of the
(D) Inductance adjustment wiring respectively connected to the intermediate terminal portion of the planar antenna and the individual connection pads other than the individual connection pads connected to the other end of the planar antenna among the plurality of individual connection pads;
An antenna circuit. 2. An antenna chip according to claim 1, and an IC chip mounted by connecting a connection terminal of the IC chip to a common connection pad of the antenna circuit and any one of the plurality of individual connection pads. Non-contact type IC inlet consisting of A non-contact type IC tag having the non-contact type IC inlet according to claim 2. By connecting the connection terminal of the IC chip to the common connection pad and the individual connection pad of the antenna circuit according to claim 1 and mounting the IC chip on the antenna circuit, by selecting the individual connection pad to be connected, A frequency adjustment method for a non-contact type IC inlet, which adjusts a resonance frequency of the non-contact type IC inlet.

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