CN101609924B - High-frequency tag antenna suitably used for various chips - Google Patents

High-frequency tag antenna suitably used for various chips Download PDF

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Publication number
CN101609924B
CN101609924B CN200810039276.5A CN200810039276A CN101609924B CN 101609924 B CN101609924 B CN 101609924B CN 200810039276 A CN200810039276 A CN 200810039276A CN 101609924 B CN101609924 B CN 101609924B
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China
Prior art keywords
chip
frequency tag
tag antenna
font
pin
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Expired - Fee Related
Application number
CN200810039276.5A
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Chinese (zh)
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CN101609924A (en
Inventor
冀京秋
沈德林
陈克勤
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ZHONGJING FUDIAN (SHANGHAI) ELECTRONIC TECHNOLOGY CO., LTD.
Original Assignee
SHANGHAI ZHONGJING ELECTRONIC LABEL INTEGRATION TECHNOLOGY Co Ltd
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Priority to CN200810039276.5A priority Critical patent/CN101609924B/en
Publication of CN101609924A publication Critical patent/CN101609924A/en
Application granted granted Critical
Publication of CN101609924B publication Critical patent/CN101609924B/en
Expired - Fee Related legal-status Critical Current
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Abstract

The invention relates to a high-frequency tag antenna suitably used for various chips. The high-frequency tag antenna comprises a substrate, an antenna coil arranged on the substrate, a terminal and a bridge for connecting both ends of the antenna coil, and an insulating layer arranged between the antenna coil and a bridge, wherein the antenna coil is provided with pins of the chips with different settings of binding points. When the high-frequency tag antenna suitably used for various chips is connected with tag chips, the high-frequency tag antenna is not limited by the setting mode of the binding points of the tag chips, and can be suitably used for various electric chips.

Description

A kind of high-frequency tag antenna that can realize the use of many moneys chip
Technical field
The present invention relates to a kind of radio frequency identification card (RFID) antenna, particularly relate to a kind of high-frequency tag antenna that can realize the use of many moneys chip.
Background technology
Radio RF recognition technology is a kind of non-contacting automatic identification technology, and its basic principle is to utilize the transmission characteristic of radiofrequency signal and Space Coupling (inductance or electromagnetic coupled) or radar reflection, realizes being identified the automatic identification of object.Electronic tag is the data medium of radio frequency identification system, and electronic tag is comprised of label antenna and label chip.Label chip is equivalent to a memory with transceiving function, and its performance is determining the data storage capacities of label, the performance index such as message transmission rate.In label chip, preserve the electronic data of agreement form, it operates inner memory according to the signal receiving, and then data is fed back to read-write equipment in the mode of regulating load.
Label chip is connected with label antenna by the binding point on it, shown in Fig. 1 a, a kind of label antenna 11 of prior art, two pins 111 of its aerial coil are usually designed to a pin and are " L " font, another pin is " 1 " font, and as shown in Figure 1 b, its binding point 121 is arranged on chip diagonal the label chip 12 that can be connected with label antenna 11, Fig. 1 c be as shown in Figure 1a label antenna when label chip is connected as shown in Figure 1 b, the partial enlarged drawing of join domain.The shortcoming of this label antenna is that the label chip that can only be arranged on chip diagonal with binding point is connected.
Shown in Fig. 2 a, the another kind of label antenna 21 of prior art, two pins 211 of its aerial coil are all designed to be " L " font conventionally, the label chip 22 that can be connected with label antenna 21 as shown in Figure 2 b, its binding point 221 is arranged on chip with on one side, Fig. 2 c be as shown in Figure 2 a label antenna when label chip is connected as shown in Figure 2 b, the partial enlarged drawing of join domain.The shortcoming of this label antenna is can only be arranged on chip with binding point to be connected with the label chip on one side.
Also there is following defect in the label antenna of above-mentioned two kinds of prior aries:
1. the pin due to the label antenna of prior art can only be used in conjunction with the chip that specific binding point arranges, even if therefore the inductance of label antenna can mate the different money chips of many producers, it also can only be connected with a part of chip wherein in actual applications, and the range of application of label antenna is restricted.
2. if the pin of the label antenna of better performances does not mate with existing label chip binding point in our hand, our label antenna of just having to revise, can make like this production cost greatly increase, and product is also slow service cycle, the serious product that even can affect us is paid.
Summary of the invention
The object of this invention is to provide a kind of high-frequency tag antenna that can realize the use of many moneys chip, this label antenna can connect from the different binding point set-up modes of label chip, has solved antenna Single-issue in traditional high-frequency tag antenna design.
In order to achieve the above object, technical scheme of the present invention is: a kind of high-frequency tag antenna that can realize the use of many moneys chip, comprise substrate, be arranged on aerial coil on substrate, connect aerial coil head and the tail line end and bridging and be arranged on aerial coil with bridging between insulating barrier, be characterized in, from described aerial coil, draw and can connect and bind the pin that different chips is a little set.
The described high-frequency tag antenna that can realize the use of many moneys chip, wherein, described pin is two, draws respectively from both sides, is oppositely arranged on substrate, and one is " L " font, and another is " h " font.
The described high-frequency tag antenna that can realize the use of many moneys chip, wherein, described pin is three, two are " L " font, one is " U " font, be the pin of " U " font and pin that one of them is " L " font and draw from the same side, and another pin that is " L " font is drawn from opposite side, and two pins that are " L " font are set up in parallel on substrate.
The described high-frequency tag antenna that can realize the use of many moneys chip, wherein, described pin is made by metallic conduction material.
The described high-frequency tag antenna that can realize the use of many moneys chip, wherein, described metallic conduction material is copper.
The described high-frequency tag antenna that can realize the use of many moneys chip, wherein, described metallic conduction material is aluminium.
The described high-frequency tag antenna that can realize the use of many moneys chip, wherein, described metallic conduction material is gold.
The described high-frequency tag antenna that can realize the use of many moneys chip, wherein, described pin is made by electrically conductive ink.
The described high-frequency tag antenna that can realize the use of many moneys chip, wherein, described electrically conductive ink is silver slurry.
The described high-frequency tag antenna that can realize the use of many moneys chip, wherein, described pin adopts salient point face-down bonding technology to be connected with label chip.
The present invention is owing to adopting technique scheme, make it compared with prior art, there is following advantage and good effect: the present invention can realize the pin of the high-frequency tag antenna that many moneys chip uses owing to adopting particular design, therefore label antenna of the present invention can directly connect from the label chip of different binding point set-up modes, flexible and convenient to use, can save label antenna and revise cost, accelerate product service cycle.
Accompanying drawing explanation
Fig. 1 a is a kind of prior art tag antenna structure schematic diagram.
Fig. 1 b is the label chip structural representation that can be connected with label antenna shown in Fig. 1 a in prior art.
Fig. 1 c is label antenna shown in Fig. 1 a while being connected with label chip shown in Fig. 1 b, the local enlarged diagram of join domain.
Fig. 2 a is another kind of prior art tag antenna structure schematic diagram.
Fig. 2 b is the label chip structural representation that can be connected with label antenna shown in Fig. 2 a in prior art.
Fig. 2 c is label antenna shown in Fig. 2 a while being connected with label chip shown in Fig. 2 b, the local enlarged diagram of join domain.
Fig. 3 a is the structural representation that the present invention can realize the high-frequency tag antenna embodiment mono-of many moneys chip use.
Fig. 3 b is the present invention can realize high-frequency tag antenna embodiment mono-that many moneys chip uses and be connected with label chip time, join domain part enlarged diagram.
Fig. 4 a is the structural representation that the present invention can realize the high-frequency tag antenna embodiment bis-of many moneys chip use.
Fig. 4 b is the present invention can realize high-frequency tag antenna embodiment mono-that many moneys chip uses and be connected with label chip time, join domain part enlarged diagram.
Embodiment
Referring to accompanying drawing, illustrate better embodiment of the present invention below:
A kind of high-frequency tag antenna that can realize the use of many moneys chip, comprise substrate 317, be arranged on aerial coil 312 on substrate 317, connect the bridging 316 of aerial coil 312 head and the tail line ends 313 and 314 and be arranged on aerial coil 312 with bridging 316 between insulating barrier 315, be characterized in, from described aerial coil 312, draw and can connect and bind the pin that different chips is a little set.Now concrete row illustrate technical scheme of the present invention for two example two.
One of embodiment of the present invention:
Refer to shown in Fig. 3 a, can realize that the high-frequency tag antenna that many moneys chip uses comprises substrate 317, aerial coil 312, puts up a bridge 316, insulating barrier 315 and two pin 311a drawing from described aerial coil 312.
Described substrate 317 can be macromolecule material film, as polyvinyl chloride film, polyester film, can be also resin material.
Described aerial coil 312 can etch by etch process on substrate 317, also can on substrate 317, print out by typography, can also go out by wire winding coiling on substrate 317; Aerial coil 312 can be single-turn circular coil, can be also multiturn coil, and the shape of coil can be made into rectangular coil coil according to actual needs, semicircle helical coil or other shapes.
When adopting etch process to make aerial coil 312, aerial coil 312 consists of metallic conduction paper tinsel, as Copper Foil, aluminium foil, goldleaf.
When adopting typography to make aerial coil 312, aerial coil 312 consists of electrically conductive ink, as silver slurry.
When adopting wire winding to make aerial coil 312, aerial coil 312 consists of metal conductive wire, as copper cash, aluminum steel, gold thread.
Described bridging 316 connects aerial coil 312 head and the tail line ends 313 and 314, between aerial coil 312 and bridging 316, is coated with insulating barrier 315; Described insulating barrier 315, between the line end 313 and line end 314 of aerial coil 312, is covered on the line end 313 and the metallic conduction material between line end 314 of aerial coil 312, prevent from putting up a bridge 316 and insulating barrier under coil between there is electric connecting relation; Described insulating barrier 315 can adopt printing insulating oil ink film or transparent insulation green oil material to realize, and described bridging 316 is made by electrically conductive ink, and described electrically conductive ink is that silver slurry waits electric conducting material.
Described two pin 311a draw from aerial coil 312, draw materials identical with aerial coil 312; Two pins are drawn from both sides respectively, are oppositely arranged on substrate 317, and one is " L " font, and another is " h " font.
As shown in Figure 3 b, the label antenna of the present embodiment both can connect and bind the label chip being a little arranged on chip diagonal, also can connect and bind and a little be arranged on chip with the label chip on one side, therefore no matter connect which kind of label chip, do not need label antenna of the present invention to modify, be conducive to reduce production costs, accelerate product service cycle.
Two of the embodiment of the present invention:
Refer to shown in Fig. 4 a, embodiment bis-is with the difference of embodiment mono-, from aerial coil 312, draw three pin 311b, two are " L " font, one is " U " font, be the pin of " U " font and pin that one of them is " L " font and draw from the same side, and another pin that is " L " font is drawn from opposite side, and two pins that are " L " font are set up in parallel on substrate 317.
Shown in Fig. 4 b, the label antenna of the present embodiment both can connect and bind the label chip being a little arranged on chip diagonal, also can connect and bind and a little be arranged on chip with the label chip on one side.
The pin design that the present invention can realize the high-frequency tag antenna that many moneys chip uses is not subject to the restriction of above-mentioned two enforcements; as long as the pin of label antenna both can connect and bind label chip a little being arranged on chip diagonal, within also can connecting and binding and a little being arranged on chip the label chip on one side is included in protection scope of the present invention together.
When the high-frequency tag antenna that uses the present invention can realize the use of many moneys chip is connected with label chip, according to actual conditions, label chip can adopt the methods such as salient point face-down bonding, riveted joint, direct pressing to be connected with label antenna of the present invention.
The present invention can realize the high-frequency tag antenna that many moneys chip uses and can adopt multiple label antenna manufacturing process to make, and while being connected with label chip, not being subject to label chip binding to put a set-up mode and limiting, and is applicable to multiple electronic tag application.

Claims (8)

1. can realize the high-frequency tag antenna that many moneys chip is used for one kind, comprise substrate (317), be arranged on aerial coil (312) on substrate (317), connect the bridging (316) of aerial coil (312) head and the tail line ends (313) and (314) and be arranged on aerial coil (312) and bridging (316) between insulating barrier (315), it is characterized in that, from described aerial coil (312), draw and can connect and bind the pin that different chips is a little set, by described pin, directly connect from the label chip of different binding point set-up modes;
Described pin (311a) is two, draws respectively from both sides, is oppositely arranged on substrate (317) upper, and one is " L " font, and another is " h " font;
Or described pin (311b) is three, two are " L " font, one is " U " font, being the pin of " U " font and pin that one of them is " L " font draws from the same side, and another pin that is " L " font is drawn from opposite side, and two pins that are " L " font are set up in parallel on substrate (317).
2. the high-frequency tag antenna that can realize the use of many moneys chip as claimed in claim 1, is characterized in that, described pin is made by metallic conduction material.
3. the high-frequency tag antenna that can realize the use of many moneys chip as claimed in claim 2, is characterized in that, described metallic conduction material is copper.
4. the high-frequency tag antenna that can realize the use of many moneys chip as claimed in claim 2, is characterized in that, described metallic conduction material is aluminium.
5. the high-frequency tag antenna that can realize the use of many moneys chip as claimed in claim 2, is characterized in that, described metallic conduction material is gold.
6. the high-frequency tag antenna that can realize the use of many moneys chip as claimed in claim 1, is characterized in that, described pin is made by electrically conductive ink.
7. the high-frequency tag antenna that can realize the use of many moneys chip as claimed in claim 6, is characterized in that, described electrically conductive ink is silver slurry.
8. the high-frequency tag antenna that can realize the use of many moneys chip as claimed in claim 1, is characterized in that, described pin adopts salient point face-down bonding technology to be connected with label chip.
CN200810039276.5A 2008-06-20 2008-06-20 High-frequency tag antenna suitably used for various chips Expired - Fee Related CN101609924B (en)

Priority Applications (1)

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CN101609924B true CN101609924B (en) 2014-02-12

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Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102035074B (en) * 2010-10-19 2013-03-13 电子科技大学 Method for manufacturing radio frequency identification (RFID) tag antenna
CN102820533A (en) * 2011-06-09 2012-12-12 上海中京电子标签集成技术有限公司 Etching antenna
CN103294976A (en) * 2012-02-23 2013-09-11 王海泉 Card reading device for radio frequency communication close-range card swiping
CN104377439B (en) * 2013-08-15 2019-08-27 德昌电机(深圳)有限公司 Antenna circuit and manufacturing method
CN105740938B (en) * 2016-02-01 2018-09-25 深圳市远望谷信息技术股份有限公司 Suitable for different agreement or the antenna and electronic tag of model electronic label chip
CN108629393A (en) * 2017-03-17 2018-10-09 苏州昭舜物联科技有限公司 RFID high frequency aluminum antenna low temperature solders connect bridging technique

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Publication number Priority date Publication date Assignee Title
JP2006217185A (en) * 2005-02-02 2006-08-17 Lintec Corp Antenna circuit and frequency adjustment method for contactless ic inlet
US7262701B1 (en) * 2005-05-23 2007-08-28 National Semiconductor Corporation Antenna structures for RFID devices
CN101087038A (en) * 2007-01-30 2007-12-12 陈栋栋 RF antenna, electronic label and method for making RF antenna

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Publication number Priority date Publication date Assignee Title
JP2001053529A (en) * 1999-08-12 2001-02-23 Mitsui High Tec Inc Manufacture of antenna substrate

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006217185A (en) * 2005-02-02 2006-08-17 Lintec Corp Antenna circuit and frequency adjustment method for contactless ic inlet
US7262701B1 (en) * 2005-05-23 2007-08-28 National Semiconductor Corporation Antenna structures for RFID devices
CN101087038A (en) * 2007-01-30 2007-12-12 陈栋栋 RF antenna, electronic label and method for making RF antenna

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SE01 Entry into force of request for substantive examination
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ASS Succession or assignment of patent right

Owner name: SHANGHAI ZHONGJING SMART TAG INTEGRATED CO., LTD.

Free format text: FORMER OWNER: SHANGHAI ZHONGJING ELECTRONIC LABEL INTEGRATION TECHNOLOGY CO., LTD.

Effective date: 20140430

C41 Transfer of patent application or patent right or utility model
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Effective date of registration: 20140430

Address after: 200000 Shanghai City, Pudong New Area Chinese (Shanghai) Free Trade Zone No. 1333 Wen Ju Lu B District eight floor room 8060

Patentee after: Beijing complex (Shanghai) electronic tag Integrated Technology Co. Ltd.

Address before: 201203, 11, 1387 East Cheung Road, Shanghai, Pudong New Area

Patentee before: Shanghai Zhongjing Electronic Label Integration Technology Co., Ltd.

C56 Change in the name or address of the patentee
CP01 Change in the name or title of a patent holder

Address after: 200000 Shanghai City, Pudong New Area Chinese (Shanghai) Free Trade Zone No. 1333 Wen Ju Lu B District eight floor room 8060

Patentee after: ZHONGJING FUDIAN (SHANGHAI) ELECTRONIC TECHNOLOGY CO., LTD.

Address before: 200000 Shanghai City, Pudong New Area Chinese (Shanghai) Free Trade Zone No. 1333 Wen Ju Lu B District eight floor room 8060

Patentee before: Beijing complex (Shanghai) electronic tag Integrated Technology Co. Ltd.

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140212

Termination date: 20170620

CF01 Termination of patent right due to non-payment of annual fee