JP2006213937A - スパッタ装置 - Google Patents
スパッタ装置 Download PDFInfo
- Publication number
- JP2006213937A JP2006213937A JP2005025076A JP2005025076A JP2006213937A JP 2006213937 A JP2006213937 A JP 2006213937A JP 2005025076 A JP2005025076 A JP 2005025076A JP 2005025076 A JP2005025076 A JP 2005025076A JP 2006213937 A JP2006213937 A JP 2006213937A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- sputter
- sputtering
- opening
- target
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004544 sputter deposition Methods 0.000 title claims description 35
- 239000000758 substrate Substances 0.000 claims abstract description 59
- 239000002245 particle Substances 0.000 claims abstract description 9
- 239000010409 thin film Substances 0.000 claims abstract description 7
- 239000010408 film Substances 0.000 abstract description 9
- 239000007789 gas Substances 0.000 description 10
- 230000007246 mechanism Effects 0.000 description 8
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 6
- 229910052786 argon Inorganic materials 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000012212 insulator Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
- H01J37/3408—Planar magnetron sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3464—Sputtering using more than one target
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3447—Collimators, shutters, apertures
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
【解決手段】 この発明は、基板を保持して自転する基板ホルダと、前記基板に薄膜を形成するためのターゲットが搭載されるスパッタカソード部と、該スパッタカソード部を前記基板に対して円弧状に移動させる駆動アームとを具備し、前記スパッタカソード部が、前記ターゲットに囲設され、前記基板側に開口部を有するノズル部を具備するスパッタ装置において、前記ノズル部の開口部に、前記スパッタカソード部の移動方向の両端から前記開口部の中央方向に延出して、前記スパッタカソード部の移動方向前後におけるスパッタ粒子を制限する延出部を形成することにある。
【選択図】 図2
Description
2 真空チャンバ
3 スパッタカソード部
4 基板ホルダ
5 プリスパッタ装置
6 アーム
7 制御ユニット
8,10 電動モータ
9,11 回転軸
12,13 シール機構
14 真空ポンプ
15 ガス供給機構
20 基板
30 スパッタカソード
31 シールド部
32 絶縁体
33 ターゲット
34 マグネット
35 延出部
36 開口部
37 ノズル部
Claims (2)
- 基板を保持して自転する基板ホルダと、前記基板に薄膜を形成するためのターゲットが搭載されるスパッタカソード部と、該スパッタカソード部を前記基板に対して円弧状に移動させる駆動アームとを具備し、前記スパッタカソード部が、前記ターゲットに囲設され、前記基板側に開口部を有するノズル部を具備するスパッタ装置において、
前記ノズル部の開口部に、前記スパッタカソード部の移動方向の両端から前記開口部の中央方向に延出して、前記スパッタカソード部の移動方向前後におけるスパッタ粒子を制限する延出部を形成することを特徴とするスパッタ装置。 - 前記延出部は、開口部中心側に突出する円弧形状であることを特徴とする請求項1記載のスパッタ装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005025076A JP4733990B2 (ja) | 2005-02-01 | 2005-02-01 | スパッタ装置 |
US11/220,521 US20060169583A1 (en) | 2005-02-01 | 2005-09-08 | Sputtering device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005025076A JP4733990B2 (ja) | 2005-02-01 | 2005-02-01 | スパッタ装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006213937A true JP2006213937A (ja) | 2006-08-17 |
JP4733990B2 JP4733990B2 (ja) | 2011-07-27 |
Family
ID=36755341
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005025076A Active JP4733990B2 (ja) | 2005-02-01 | 2005-02-01 | スパッタ装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20060169583A1 (ja) |
JP (1) | JP4733990B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011111679A (ja) * | 2009-11-24 | 2011-06-09 | Samsung Mobile Display Co Ltd | スパッタリング装置 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN208791746U (zh) * | 2014-12-16 | 2019-04-26 | 应用材料公司 | 用于涂布基板的设备 |
WO2016095976A1 (en) * | 2014-12-16 | 2016-06-23 | Applied Materials, Inc. | Apparatus and method for coating a substrate with a movable sputter assembly and control over power parameters |
CN110106475B (zh) * | 2019-05-22 | 2021-06-01 | Tcl华星光电技术有限公司 | 蒸镀装置及其驱动组件的控制方法 |
WO2020244781A1 (en) * | 2019-06-07 | 2020-12-10 | Applied Materials, Inc. | Deposition source, deposition apparatus and method of depositing material on a substrate |
CN111424253B (zh) * | 2020-04-16 | 2020-12-08 | 深圳市提姆光电科技有限公司 | 一种5g天线防腐镀膜系统 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0372072A (ja) * | 1989-08-10 | 1991-03-27 | Tdk Corp | スパッタリング装置のアースシールド構造 |
JPH1129859A (ja) * | 1997-05-14 | 1999-02-02 | Ulvac Japan Ltd | 複合スパッタリングカソードを有するスパッタリング装置 |
JP2004156122A (ja) * | 2002-11-08 | 2004-06-03 | Nobuyuki Takahashi | 成膜方法及びスパッタ装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4169031A (en) * | 1978-01-13 | 1979-09-25 | Polyohm, Inc. | Magnetron sputter cathode assembly |
US5135581A (en) * | 1991-04-08 | 1992-08-04 | Minnesota Mining And Manufacturing Company | Light transmissive electrically conductive oxide electrode formed in the presence of a stabilizing gas |
US6398929B1 (en) * | 1999-10-08 | 2002-06-04 | Applied Materials, Inc. | Plasma reactor and shields generating self-ionized plasma for sputtering |
SG90171A1 (en) * | 2000-09-26 | 2002-07-23 | Inst Data Storage | Sputtering device |
-
2005
- 2005-02-01 JP JP2005025076A patent/JP4733990B2/ja active Active
- 2005-09-08 US US11/220,521 patent/US20060169583A1/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0372072A (ja) * | 1989-08-10 | 1991-03-27 | Tdk Corp | スパッタリング装置のアースシールド構造 |
JPH1129859A (ja) * | 1997-05-14 | 1999-02-02 | Ulvac Japan Ltd | 複合スパッタリングカソードを有するスパッタリング装置 |
JP2004156122A (ja) * | 2002-11-08 | 2004-06-03 | Nobuyuki Takahashi | 成膜方法及びスパッタ装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011111679A (ja) * | 2009-11-24 | 2011-06-09 | Samsung Mobile Display Co Ltd | スパッタリング装置 |
US9034156B2 (en) | 2009-11-24 | 2015-05-19 | Samsung Display Co., Ltd. | Sputtering apparatus |
Also Published As
Publication number | Publication date |
---|---|
JP4733990B2 (ja) | 2011-07-27 |
US20060169583A1 (en) | 2006-08-03 |
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