JP2006200034A - 低磁気ヒステリシス損失の二軸配向性金属テープ及びその製造方法 - Google Patents
低磁気ヒステリシス損失の二軸配向性金属テープ及びその製造方法 Download PDFInfo
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- JP2006200034A JP2006200034A JP2005049758A JP2005049758A JP2006200034A JP 2006200034 A JP2006200034 A JP 2006200034A JP 2005049758 A JP2005049758 A JP 2005049758A JP 2005049758 A JP2005049758 A JP 2005049758A JP 2006200034 A JP2006200034 A JP 2006200034A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
- H01F41/24—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates from liquids
- H01F41/26—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates from liquids using electric currents, e.g. electroplating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
- C25D5/38—Pretreatment of metallic surfaces to be electroplated of refractory metals or nickel
- C25D5/40—Nickel; Chromium
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/615—Microstructure of the layers, e.g. mixed structure
- C25D5/617—Crystalline layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/08—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers
- H01F10/10—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition
- H01F10/12—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition being metals or alloys
- H01F10/14—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition being metals or alloys containing iron or nickel
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/26—Thin magnetic films, e.g. of one-domain structure characterised by the substrate or intermediate layers
- H01F10/265—Magnetic multilayers non exchange-coupled
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12944—Ni-base component
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- Crystallography & Structural Chemistry (AREA)
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- Electroplating Methods And Accessories (AREA)
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Abstract
【解決手段】 本発明の製造方法は、単結晶又はそれに近い配向性を有する負極と、高純度ニッケル板より構成された正極とよりなる電気メッキ浴槽で負極を回転させて、表面に二軸集合組織を有するニッケル金属層を形成させる段階と、前記負極の表面に形成されたニッケル金属層を水洗槽で洗浄する段階と、前記洗浄されたニッケル金属層を非磁性金属メッキ浴よりなるメッキ槽で負極を回転させて、その表面に非磁性金属層を形成させ、ニッケル/非磁性金属層を製造する段階と、前記ニッケル/非磁性金属層よりなる金属テープを剥離して巻き取る段階とで構成される。
【選択図】 図4
Description
次のような条件でNi/Cu構造の多層メッキをした。
正極:高純度のニッケル板及び高純度の銅板
負極:二軸配向性ニッケル基板({100}<100>配向)
ニッケルメッキ溶液の組成:スルファミン酸ニッケル250g/リットル、塩化ニッケル15g/リットル、硼酸15g/リットル
銅メッキ溶液の組成:硫酸100g/リットル、硫酸銅300g/リットル
メッキ温度:50℃
メッキ時間:ニッケル−5分〜20分、銅−20分
メッキ方式:PR
平均電流密度:5A/dm2
2 メッキ液
3 電流供給装置
4 正極
10 1層メッキ溶液
20 正極
30、60 円筒形負極
30a、60a 金属ベルト
40 水洗槽
50 多層メッキ溶液
Claims (9)
- ニッケル層上に非磁性金属層が積層されたことを特徴とする低磁気ヒステリシス損失の二軸配向性金属テープ。
- 前記ニッケル層上に積層される非磁性金属層は、銅(Cu)、亜鉛(Zn)、錫(Sn)、銀(Ag)、金(Au)、マンガン(Mn)、クロム(Cr)、バナジウム(V)、アルミニウム(Al)、タンタル(Ta)、タングステン(W)などの金属層、又はこれらの合金層よりなることを特徴とする請求項1記載の低磁気ヒステリシス損失の二軸配向性金属テープ。
- 前記非磁性金属層は、前記ニッケル層上に、単層又は2層以上の多層で積層されていることを特徴とする請求項1又は2記載の低磁気ヒステリシス損失の二軸配向性金属テープ。
- 前記ニッケル層と前記非磁性金属層は、電気メッキ法によりメッキされて積層されたものであることを特徴とする請求項1又は2記載の低磁気ヒステリシス損失の二軸配向性金属テープ。
- 単結晶又はそれに近い配向性を有する負極と、高純度ニッケル板よりなる正極とから構成される電気メッキ浴槽において負極を回転させて、表面に二軸集合組織を有するニッケル金属層を形成させる段階と、
前記負極の表面に形成されたニッケル金属層を水洗槽で洗浄する段階と、
前記洗浄されたニッケル金属層を非磁性金属メッキ浴よりなるメッキ槽において負極を回転させて、その表面に非磁性金属層を形成させ、ニッケル/非磁性金属層を製造する段階と、
前記ニッケル/非磁性金属層よりなる金属テープを剥離して巻き取る段階とで構成されることを特徴とする低磁気ヒステリシス損失の二軸配向性金属テープの製造方法。 - 前記負極は、円筒形又はベルト形状であり、前記正極は、曲面又は平面形状であることを特徴とする請求項5記載の低磁気ヒステリシス損失の二軸配向性金属テープの製造方法。
- 前記非磁性金属は、銅(Cu)、亜鉛(Zn)、錫(Sn)、銀(Ag)、金(Au)、マンガン(Mn)、クロム(Cr)、バナジウム(V)、アルミニウム(Al)、タンタル(Ta)、タングステン(W)などの金属又はこれらの合金を使用することを特徴とする請求項5記載の低磁気ヒステリシス損失の二軸配向性金属テープの製造方法。
- 前記負極の表面にニッケルをメッキしてニッケル層を得る段階は、
前記ニッケル金属層を形成させるメッキ工程を行う前に、負極板を予め電解研磨して、表面を平滑にした後、塩酸0〜10M、硝酸0〜10M、硫酸0〜10M、酢酸0〜10M、クロム酸0〜10M、重クロム酸カリウム0〜10M、フッ酸0〜10M、水酸化リチウム0〜10M、水酸化ナトリウム0〜10M、水酸化カリウム0〜10M、アンモニア水0〜10M、過酸化水素0〜10Mよりなる群から選ばれた1つ又は2つ以上の水溶液において前記負極板を数秒から数十分まで浸漬した後、水洗し、乾燥させる工程で構成されることを特徴とする請求項5又は6記載の低磁気ヒステリシス損失の二軸配向性金属テープの製造方法。 - 前記ニッケルをメッキする段階において、ニッケルメッキのために用いられるメッキ液は、硫酸ニッケル0〜600g/リットル、スルファミン酸ニッケル0〜600g/リットル、塩化ニッケル10〜70g/リットル、硼酸20〜80g/リットル、NaWO3 0〜10g/リットル、塩化コバルト0〜10g/リットルの一部又は全部よりなる水溶液よりなり、前記メッキ液のpHが1.5〜6であることを特徴とする請求項5又は6記載の低磁気ヒステリシス損失の二軸配向性金属テープの製造方法。
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KR1020050005428A KR100624665B1 (ko) | 2005-01-20 | 2005-01-20 | 자기이력 손실이 적은 이축 배향성 금속 테이프 및 그제조방법 |
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Cited By (6)
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KR100917278B1 (ko) | 2006-12-27 | 2009-09-16 | (주)이모트 | 연속전주법을 이용한 이차전지 음극집전판의 전주 도금 방법 |
CN102953101A (zh) * | 2012-11-14 | 2013-03-06 | 施志明 | 一种镀铬锌合金拉链及其电镀方法 |
CN103382564A (zh) * | 2013-07-18 | 2013-11-06 | 华南理工大学 | 金属表面超疏水钴镀层及其制备方法 |
JP2015529746A (ja) * | 2012-07-27 | 2015-10-08 | インスティテュート スペリオール テクニコ | 樹枝状構造を有するニッケル−コバルト被覆の電着プロセス |
CN108855046A (zh) * | 2018-08-02 | 2018-11-23 | 泉州师范学院 | 一种核壳结构的钨酸锌/钨酸亚锡复合光催化剂及其制备和应用 |
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KR100516126B1 (ko) * | 2003-04-03 | 2005-09-23 | 한국기계연구원 | 이축집합조직을 갖는 금속 도금층의 제조방법 |
KR100828239B1 (ko) * | 2006-07-05 | 2008-05-07 | 엘에스전선 주식회사 | 다층 표면을 갖는 금속박막을 제조하기 위한 장치 |
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KR100917610B1 (ko) * | 2008-11-14 | 2009-09-17 | 한국에너지기술연구원 | 고체산화물 연료전지용 금속연결재의 코팅방법 |
JP5474339B2 (ja) * | 2008-11-28 | 2014-04-16 | 住友電気工業株式会社 | 超電導線材の前駆体の製造方法、超電導線材の製造方法 |
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GB0010494D0 (en) * | 2000-04-28 | 2000-06-14 | Isis Innovation | Textured metal article |
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- 2005-02-24 JP JP2005049758A patent/JP4143073B2/ja not_active Expired - Fee Related
- 2005-03-04 DE DE102005010095A patent/DE102005010095B4/de not_active Expired - Fee Related
- 2005-03-07 US US11/074,568 patent/US7402230B2/en not_active Expired - Fee Related
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
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KR100917278B1 (ko) | 2006-12-27 | 2009-09-16 | (주)이모트 | 연속전주법을 이용한 이차전지 음극집전판의 전주 도금 방법 |
JP2015529746A (ja) * | 2012-07-27 | 2015-10-08 | インスティテュート スペリオール テクニコ | 樹枝状構造を有するニッケル−コバルト被覆の電着プロセス |
CN102953101A (zh) * | 2012-11-14 | 2013-03-06 | 施志明 | 一种镀铬锌合金拉链及其电镀方法 |
CN102953101B (zh) * | 2012-11-14 | 2015-06-24 | 施天程 | 一种镀铬锌合金拉链及其电镀方法 |
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CN108855046A (zh) * | 2018-08-02 | 2018-11-23 | 泉州师范学院 | 一种核壳结构的钨酸锌/钨酸亚锡复合光催化剂及其制备和应用 |
CN108855046B (zh) * | 2018-08-02 | 2020-11-27 | 泉州师范学院 | 一种核壳结构的钨酸锌/钨酸亚锡复合光催化剂及其制备和应用 |
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CN109604116B (zh) * | 2018-11-29 | 2021-04-09 | 安徽荣泽科技有限公司 | 一种全自动特种胶带涂布机 |
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Publication number | Publication date |
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DE102005010095A1 (de) | 2006-07-27 |
KR100624665B1 (ko) | 2006-09-19 |
KR20060084653A (ko) | 2006-07-25 |
JP4143073B2 (ja) | 2008-09-03 |
DE102005010095B4 (de) | 2008-07-03 |
US20060159949A1 (en) | 2006-07-20 |
US7402230B2 (en) | 2008-07-22 |
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