JP2006191529A - Rfidタグ用アンテナの製造方法 - Google Patents
Rfidタグ用アンテナの製造方法 Download PDFInfo
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- JP2006191529A JP2006191529A JP2005270301A JP2005270301A JP2006191529A JP 2006191529 A JP2006191529 A JP 2006191529A JP 2005270301 A JP2005270301 A JP 2005270301A JP 2005270301 A JP2005270301 A JP 2005270301A JP 2006191529 A JP2006191529 A JP 2006191529A
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
- H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
- G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/052—Magnetographic patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49016—Antenna or wave energy "plumbing" making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49016—Antenna or wave energy "plumbing" making
- Y10T29/49018—Antenna or wave energy "plumbing" making with other electrical component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
Abstract
【解決手段】 本発明に係るRFIDタグ用アンテナの製造方法は、伝導性物質を含んでいる流体300の表面の上方に基板16を配置する工程(S1)と、基板16の上方にアンテナパターン101状に形成された電極200を配置した後、電極200の電場によって基板16の下面に伝導性物質をアンテナパターン101状に付着させる工程(S2)と、基板16の下面に付着した伝導性物質を定着させる工程(S3)とを含んでいる。なお、定着工程(S3)は、電極により生じた電場の電磁力が維持された状態で行われることが好ましい。
【選択図】 図5
Description
101、111 アンテナパターン
200 電極
210 磁石
220 薄いフィルム
230 接着剤
240 パターン保護用シート
300 伝導性物質液
Claims (8)
- RFIDタグ用アンテナの製造方法であって、
伝導性物質を含んでいる流体表面の上方に基板を配置する工程(S1)と、
前記基板の上方にアンテナパターン状に形成された電極を配置した後、前記電極により生じた電場の電磁力によって前記基板の下面に前記伝導性物質を前記アンテナパターン状に付着させる工程(S2)と、
前記基板の下面に付着した伝導性物質を定着させる工程(S3)とを含むことを特徴とするRFIDタグ用アンテナの製造方法。 - 前記定着工程(S3)は、前記電極により生じた電場の電磁力が維持された状態で行われることを特徴とする請求項1に記載のRFIDタグ用アンテナの製造方法。
- RFIDタグ用アンテナの製造方法であって、
形成しようとするパターン状に形成された磁石の上方に薄板を配置する工程(S11)と、
前記薄板の上面に磁性を有する伝導性粒子を所定量分散させた後、前記磁石の磁力によって前記薄板の上面に前記伝導性粒子によるパターンを形成させる工程(S12)と、
その下面に接着剤が塗布された基板を前記薄板の上面に形成された前記伝導性粒子のパターンに面接触させて、前記伝導性粒子のパターンを維持しつつ前記基板を前記薄板に接着させる工程(S13)と、
前記接着剤に付着した前記伝導性粒子を定着させる工程(S14)とを含むことを特徴とするRFIDタグ用アンテナの製造方法。 - 前記定着工程(S14)で定着させた前記伝導性粒子のパターン上に、粉末定着用の液体を吹き掛ける又はパターン保護用シートを取り付ける工程(S15)を更に含むことを特徴とする請求項3に記載のRFIDタグ用アンテナの製造方法。
- 前記磁石は、強磁性コアと、該強磁性コアに巻回されたコイルとを備える電磁石であることを特徴とする請求項3に記載のRFIDタグ用アンテナの製造方法。
- RFIDタグ用アンテナの製造方法であって、
形成しようとするパターン状に形成された磁石の上方に基板を配置する工程(S21)と、
前記基板の上面に所定量の伝導性粒子を分散させた後、前記磁石の磁力によって前記基板の上面に前記伝導性粒子によるパターンを形成させる工程(S22)と、
前記基板上に付着した伝導性粒子を定着させる工程(S23)とを含むことを特徴とするRFIDタグ用アンテナの製造方法。 - 前記工程(S23)で定着させた前記伝導性粒子のパターン上に、粉末定着用の液体を吹き掛ける又はパターン保護用シートを取り付ける工程(S24)を更に含むことを特徴とする請求項6に記載のRFIDタグ用アンテナの製造方法。
- 前記磁石は、強磁性コアと、該強磁性コアに巻回されたコイルとを備える電磁石であることを特徴とする請求項6に記載のRFIDタグ用アンテナの製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040113696A KR101038494B1 (ko) | 2004-12-28 | 2004-12-28 | Rfid 태그용 안테나 제조 방법 |
KR2004-113696 | 2004-12-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006191529A true JP2006191529A (ja) | 2006-07-20 |
JP4936697B2 JP4936697B2 (ja) | 2012-05-23 |
Family
ID=36638718
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005270301A Expired - Fee Related JP4936697B2 (ja) | 2004-12-28 | 2005-09-16 | Rfidタグ用アンテナの製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7421775B2 (ja) |
JP (1) | JP4936697B2 (ja) |
KR (1) | KR101038494B1 (ja) |
CN (1) | CN100543767C (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008072721A (ja) * | 2006-09-15 | 2008-03-27 | Samsung Electro-Mechanics Co Ltd | アンテナ付きケース構造物の製造方法 |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101038494B1 (ko) * | 2004-12-28 | 2011-06-01 | 삼성테크윈 주식회사 | Rfid 태그용 안테나 제조 방법 |
US7651932B2 (en) | 2005-05-31 | 2010-01-26 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing antenna and method for manufacturing semiconductor device |
JP2008161837A (ja) | 2006-12-28 | 2008-07-17 | Ricoh Co Ltd | 搬送システム |
DE102007050102A1 (de) * | 2007-10-16 | 2009-04-23 | Smartrac Ip B.V. | Verfahren zur Herstellung eines Übertragungsmoduls sowie Übertragungsmodul |
TWI456830B (zh) * | 2010-07-26 | 2014-10-11 | Wistron Neweb Corp | 天線結構的製造方法 |
TWI514668B (zh) * | 2010-08-20 | 2015-12-21 | Wistron Neweb Corp | 天線之製造方法 |
US8784952B2 (en) * | 2011-08-19 | 2014-07-22 | Earthone Circuit Technologies Corporation | Method of forming a conductive image on a non-conductive surface |
CN102385685B (zh) * | 2011-10-18 | 2013-03-27 | 深圳市科信通信技术股份有限公司 | 一种射频标签系统的使用方法 |
EP2624322B1 (de) * | 2012-01-31 | 2014-07-23 | FESTO AG & Co. KG | Verfahren und Vorrichtung zur Herstellung von Piezowandlern |
KR101928438B1 (ko) | 2012-08-08 | 2019-02-26 | 삼성전자주식회사 | 대전 입자의 진동을 이용한 전자기파 발생기 및 비트 생성기 |
TWI478070B (zh) | 2012-08-29 | 2015-03-21 | E Ink Holdings Inc | 射頻識別與顯示功能並存的控制方法 |
KR101316891B1 (ko) * | 2013-04-03 | 2013-10-11 | 에스에스 주식회사 | 휴대 단말기 부착용 안테나 패치의 제조방법 그리고 이를 이용한 휴대 단말기 부착용 안테나의 제조방법 |
TWI639519B (zh) * | 2013-07-26 | 2018-11-01 | 凌通科技股份有限公司 | 低成本電子印章 |
TWI581942B (zh) | 2015-04-08 | 2017-05-11 | 韋僑科技股份有限公司 | 跨橋裝置與系統及其軟性電路元件跨橋方法 |
CN108631051B (zh) * | 2017-03-21 | 2022-09-02 | 中兴通讯股份有限公司 | 天线结构、智能终端设备以及天线结构的制作方法 |
FR3083892B1 (fr) * | 2018-07-16 | 2020-07-03 | Smart Packaging Solutions | Carte a puce a double interface de communication et son procede de fabrication |
CN111384587B (zh) * | 2020-02-17 | 2021-04-20 | 珠海格力电器股份有限公司 | 天线的制造方法、天线及终端设备 |
CN113394557A (zh) * | 2021-06-09 | 2021-09-14 | 陆凤生 | 一种射频识别标签天线的加法生产工艺 |
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JP2001217639A (ja) * | 2000-01-31 | 2001-08-10 | Toppan Forms Co Ltd | 非接触型データ送受信体用アンテナ |
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JP2003100950A (ja) * | 2001-06-06 | 2003-04-04 | Japan Science & Technology Corp | 粉体集合体からなるパターンの製造方法 |
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-
2004
- 2004-12-28 KR KR1020040113696A patent/KR101038494B1/ko not_active IP Right Cessation
-
2005
- 2005-07-01 US US11/173,618 patent/US7421775B2/en not_active Expired - Fee Related
- 2005-08-16 CN CNB2005100926082A patent/CN100543767C/zh not_active Expired - Fee Related
- 2005-09-16 JP JP2005270301A patent/JP4936697B2/ja not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2001217639A (ja) * | 2000-01-31 | 2001-08-10 | Toppan Forms Co Ltd | 非接触型データ送受信体用アンテナ |
JP2002143728A (ja) * | 2000-08-29 | 2002-05-21 | Maresuke Kobayashi | 転写を利用した静電粉体塗装方法及び転写を利用した静電粉体塗装装置 |
JP2003100950A (ja) * | 2001-06-06 | 2003-04-04 | Japan Science & Technology Corp | 粉体集合体からなるパターンの製造方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008072721A (ja) * | 2006-09-15 | 2008-03-27 | Samsung Electro-Mechanics Co Ltd | アンテナ付きケース構造物の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN1797438A (zh) | 2006-07-05 |
CN100543767C (zh) | 2009-09-23 |
KR20060075129A (ko) | 2006-07-04 |
KR101038494B1 (ko) | 2011-06-01 |
US20060143898A1 (en) | 2006-07-06 |
JP4936697B2 (ja) | 2012-05-23 |
US7421775B2 (en) | 2008-09-09 |
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