CN1797438A - 制造用于射频识别标签的天线的方法 - Google Patents
制造用于射频识别标签的天线的方法 Download PDFInfo
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- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
- H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
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- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
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- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
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- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
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- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
- G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
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- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
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- Y10T29/49—Method of mechanical manufacture
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Abstract
本发明提供了通过使用具有对应于天线的形状的图案的磁体形成天线而容易地和便宜地制造用于RFID标签的天线的方法。方法包括(a)把基片放置在包含导电物质流体的表面上;(b)把按天线图案形状形成的电极放置在基片表面上,给电极加电流,以通过电磁力把导电物质按天线图案的形状粘结到基片底面;(c)固定被粘结到基片的底面导电物质。替换地,方法包括(a)把薄膜放置在按期望的图案成形的磁体上面;(b)在薄膜表面上喷溅具有期望的磁特性的导电粒子,形成具有与磁体的图案相同的图案的导电粒子;(c)把涂有粘结剂的基片与在薄膜上的导电粒子的图案相接触,使导电粒子的图案粘结到基片并被保持;(d)固定被粘结到粘结剂的导电粒子。
Description
相关专利申请的相互参考
本申请主张2004年12月28日提交到韩国知识产权局的韩国专利申请No.10-2004-0113696的优先权,该专利申请的内容整体地在此引用以供参考。
技术领域
本发明涉及一种制造用于射频识别(RFID)标签的天线的方法。
背景技术
RFID标签典型地包括单个天线或由单个闭合环形成的天线,以及电连接到天线的至少一个集成电路芯片。信息通过天线被存储在集成电路芯片中,以及被存储在集成电路芯片中的信息由RFID读取器/编程器通过天线被更新或发送。
这样的RFID标签可被应用到物流管理系统、电子货币、信用卡等的各种领域。通过接触输入系统或非接触输入系统向RFID标签输入以前设置的数据。更具体地,终端的输入端与形成在电子射频识别设备上的接触基片相接触,以便实施感兴趣的操作,或RFID标签由RFID标签的编写者记录了初始信息。在实际的使用中,在初始信息被记录在RFID标签中后,数据就在RFID标签与终端之间无线地通信。
传统的电子射频识别设备的例子显示在图1到4,其中图1和3是传统的RFID标签的平面图。图2是沿图1的II-II线取的截面图,以及图4是沿图3的IV-IV线取的截面图。
参照图1到4,RFID标签10和20包括RFID集成电路芯片12和天线11。
RFID集成电路芯片12被电连接到天线11,以使得芯片通过由于被按照法拉第定律感应的电磁场产生的能量驱动,以便存储、取回和更新信息。RFID集成电路芯片12通过各向异性导电膜(ACF)13被连接到天线11的一个端子。
天线11沿着RFID标签10、20的边界以线圈的形状形成为闭合环。天线11被配置成具有某个谐振频率,这样,天线11通过与读取器(未示出)的无线电通信接收新的信息,以便把该信息存储在集成电路芯片12或把信息从芯片12发送到读取器。
如图1和2所示,天线11的两端11a和11b可以通过卷曲(crimping)连接14而与金属箔(例如铝箔)互相连接,以便形成闭环形状的天线11。
如图3和4所示,天线11的两端11a和11b可以通过由阻焊材料27绝缘的部分而被连接到例如,由银制成的端子25。
如上所述地配置的、用于RFID标签10,20的天线11通常通过蚀刻进行制作。更具体地,把绝缘薄膜涂上光刻胶,然后经受使用光掩模的曝光处理。不期望的部分被曝光,然后通过蚀刻(例如,化学蚀刻)把不期望的部分从绝缘薄膜上去除,这样,由被沉积的或以其它方式被放置在绝缘薄膜上的金属层形成天线11。
可替换地,通过使用丝网掩模(screen mask)将墨水按相应于天线形状的期望的图案印刷在绝缘薄膜上。由墨水形成的图案被固化,而其余部分通过蚀刻被去除,由此形成天线。
以上方法具有缺点,要去除的材料的总量大于被使用于天线的材料。另外,上述的方法牵涉到费时的和复杂的处理过程。而且,由于光掩模和屏掩模的形成很昂贵,掩模和蚀刻的、用于RFID标签的天线的制造成本增加。这样,非常需要一种制造用于RFID标签的天线的新的方法,以克服上述的缺点。
发明内容
本发明提供一种改进的制造用于RFID标签的天线的方法。具体地,本发明一方面提供一种制造用于RFID标签的天线的方法,它减少制造时间,排除在传统的制造过程中所利用的设备并且减小要使用的材料总量。
按照本发明的一个方面,提供一种制造用于RFID标签的天线的方法,包括(a)把基片放置在包含导电物质的流体的表面上;(b)把按天线图案的形状形成的电极放置在基片的表面上,以及给电极加上电流,以便通过电磁力把导电物质按天线图案的形状粘结到基片的底面;以及(c)固定被粘结到基片的底面的导电物质。
处理过程(c)可以在由电极生成的电场和磁场的作用下被实施。
按照本发明的另一个方面,提供一种制造用于RFID标签的天线的方法,包括(a)把薄膜放置在按期望的图案成形的磁体上面;(b)在薄膜表面上喷溅一定量的具有期望的磁特性的导电粒子,形成具有与磁体的图案相同的图案的导电粒子;(c)把其上涂上粘结剂的基片与被形成在薄膜上的导电粒子的图案相接触,使得导电粒子的图案粘结到基片,导电粒子的图案被保持;以及(d)固定被粘结到粘结剂的导电粒子。
方法还可包括在处理过程(d)中固定的导电粒子上喷溅粒子固定液体,或把图案保护片附着到在处理过程(d)中固定的导电粒子。
按照本发明的再一个方面,提供一种制造用于RFID标签的天线的方法,包括(a)把基片放置在按期望的图案成形的磁体上面;(b)在基片表面上喷溅一定量的导电粒子,形成具有与磁体的图案相同的图案的导电粒子;以及(c)把导电粒子固定到基片。
方法还可包括在处理过程(c)中形成图案的导电粒子上喷溅粒子固定液体,或把图案保护片附着到在处理过程(c)中形成图案的导电粒子。
附图说明
通过参照附图详细描述本发明的示例性实施例,将更明白本发明的、以上的和其它的特性和优点,其中:
图1是传统的RFID标签的一个例子的平面图;
图2是沿图1的II-II线取的截面图;
图3是传统的RFID标签的另一个例子的平面图;
图4是沿图3的IV-IV线取的截面图;
图5是示意地显示按照本发明的实施例的制造用于RFID标签的天线的处理过程的图;以及
图6A到6E是顺序地显示按照本发明的另一个实施例的制造用于RFID标签的天线的处理过程的图。
具体实施方式
现在参照附图详细描述按照本发明的实施例的制造用于RFID标签的天线的处理过程,其中与在背景技术一节中描述的相同的单元用相同的标号表示。
图5是示意地显示按照本发明的实施例的制造用于RFID标签的天线的处理过程的图。
参考图5,根据按照本发明的制造用于RFID标签的天线的处理过程,电极200被放置在具有包含导电物质的流体300的容器之上,以及通过由电极200生成的电场在基片16的底面上形成导电物质的期望的图案。
更具体地,基片16被放置在包含导电物质的流体300表面之上。然后,每个被配置成具有天线的图案的电极200被放置在基片16的上表面之上。当强电流加到电极200时,由电极200生成电场,以及导电粒子被电场和相关联的磁场移动,这样,导电粒子按天线图案101的形状被附着到基片16的底面。被附着到基片16的导电粒子然后被固定或被固化,形成天线图案101。可以利用一种蒸发包含导电粒子的流体300的处理过程来提供被固定到基片16的、空气支撑的或自由移动的导电粒子。本领域已知的其它类似的处理过程,诸如在化学气相沉淀(CVD)中使用的那些处理过程,可被利用来提供导电粒子。
然后,在天线图案101被固定或被固化后,基片16被切割,以便把各个天线图案分隔开,然后用于RFID的集成电路芯片被连接到每个切割的基片16。在天线图案101的两端互相被电连接后,用保护片覆盖天线图案101,完成RFID标签(未示出)。
由于导电物质被用作为天线的主要成分,所以导电物质必须包含导电性和磁性。换句话说,导电物质可以是包含诸如Fe,Co,Ni,Al,Ag,Au等等的、具有正电荷的金属离子或细小的磁粒子的流体。
在某些实施例中,基片16是诸如柔性印刷电路板的薄基片,但也可以利用任何适当的基片,只要通过围绕电极200产生的电场可以把电磁力加到基片的反面。可以意识到,基片16可以由非磁性材料制成。例如,基片可以由纸或由聚对苯二甲酸乙二醇酯(PET)膜制成。PET膜被利用来制作用于音频或视频的磁带,或封装膜,比起由其它材料制成并具有相同的厚度的薄膜,具有良好的透明性、热稳定性和抗拉强度,它可被制成具有薄的和均匀的厚度,以及优越的后处理,诸如层压、印刷和涂敷。
为了防止导电物质从基片16上被剥离,通过由电极200生成的电磁力实施把由导电物质制成的天线图案固定到基片16的处理过程。另外,如果基片16由能够吸收流体,例如导电墨水的材料制成,则可以不移动电极200以实施固定处理过程。
图6A到6E是顺序地显示按照本发明的另一个实施例的制造用于RFID标签的天线的处理过程的图。
如图6A所示,首先,把薄膜220放置在磁体210上,每个磁体用来产生期望的天线图案111(例如,所显示的螺旋型图案)。接着,把导电粒子喷溅在薄膜220的上表面。导电粒子通过由磁体210产生的磁力被形成为天线图案111。现在,如图6B所示,把包括被放置在其上的粘结剂230的基片16朝向其上已形成天线图案111的薄膜220的表面。把基片16降低以使得粘结剂230接触天线图案111。此后,把基片提升,以使得粘结剂230从薄膜220上提起天线图案111,以及把天线图案111保持在基片16上,如图6C所示。在天线图案111被粘结到粘结剂230后,基片16可以翻转,或以其它取向,使得天线图案111被放置在上表面,如图6D所示。然后进行固化粘结剂230与形成天线图案111的导电粒子,以便把天线11固定在基片16上。然后,还可以喷溅粒子固定液体或以其它方式把该流体施加到基片16的表面,以及还可以实施后处理,把RFID集成电路芯片连接到每个天线图案111,以形成每个天线的闭环,由此完成RFID标签。如图6E所示,可以把用于保护天线图案111和RFID集成电路芯片的图案保护片240附着到天线图案111。
在另一个实施例中,通过选择基片16为其上最后必须形成天线图案11的薄膜220,上述的制造天线的处理过程可被简化。这样,通过粘结剂230把天线图案111与薄膜220分离开的步骤可被省略。
在这个实施例中,基片16被放置在磁体210上,每个磁体被形成为期望的天线图案111的形状,以及把一定量的导电粒子喷溅在基片16上。因此,喷溅的粒子在基片16上形成相应于磁体210的形状和来自该磁体的相应的电磁场的天线图案111。最后,通过固化按天线图案111被形成在基片16上的导电粒子以及然后喷溅粒子固定液体或如上所述地附着图案保护片240,完成天线11。
在某些实施例中,磁体210是包括铁磁芯和绕铁磁芯缠绕的线圈的电磁体。在其它实施例中,可以采用铁磁体。在采用电磁体的情形下,有可能容易生成和去除磁力,这可方便地设计处理过程。
此前描述的制造用于RFID标签的天线的处理过程可被应用到形成电子电路图案,以及在基片上形成用于无线通信的天线。
通过上述说明,由于本发明比起传统的蚀刻处理过程不需要用于形成掩模或图案的分开的处理过程,形成步骤数目被减小,由此高速度地制作天线和电路图案,因此减少制造成本。
另外,在传统的用于制造天线图案的蚀刻方法中,通常70%到80%的材料被蚀刻损耗。然而,本发明可以明显地减少材料的损耗。
虽然本发明具体地是对于附图上描绘的示例性实施例显示和描述的,但本领域技术人员将会看到,可以在不背离本发明的精神和范围的条件下在形式和细节上作出各种改变和修正。所以,用于保护本发明的真实的精神和范围由以下的权利要求规定。
Claims (20)
1.一种用于制造用于射频识别标签的天线的方法,所述方法包括:
把用来产生具有期望的形状的磁场的磁体取向为在盛有包含导电物质的流体的容器之上并基本上靠近该容器,以吸引该容器中的导电物质;
把非导电基片放置在所述磁体与所述容器之间;
在所述非导电基片的底面上形成对应于所述磁场的导电图案;以及
把所述导电图案固定在所述非导电基片的所述底面上。
2.权利要求1的方法,其中所述取向步骤包括把多个磁体排列成阵列以使得在所述非导电基片的所述底面上同时形成多个导电图案。
3.权利要求2的方法,还包括在所述固定步骤以后,把所述多个导电图案互相分开的步骤。
4.权利要求1的方法,其中所述形成步骤包括给磁体供应能量,以产生所述磁场。
5.权利要求4的方法,其中所述供应能量步骤在所述固定步骤期间持续。
6.权利要求1的方法,其中所述固定步骤包括把固定液体施加在所述导电图案上。
7.权利要求1的方法,其中所述固定步骤包括把保护片附着在所述导电图案上。
8.一种用于制造用于射频识别标签的天线的方法,所述方法包括:
把多个磁体取向为靠近薄膜的第一大体平表面,其中所述多个磁体的每个磁体被配置成产生具有期望的形状的磁场;
把导电粒子喷溅在与所述第一大体平表面相对的所述薄膜的第二大体平表面上,所述导电粒子形成相对于所述多个磁体的多个导电图案;
配置其上具有粘结层的基片,以使得所述粘结层被取向为靠近所述第二大体平表面;
使所述粘结层接触所述第二大体平表面;
把所述多个导电图案与所述薄膜分离开;以及
把所述多个导电图案固定到所述粘结层。
9.权利要求8的方法,其中所述固定步骤包括在所述多个导电图案上喷溅固定液体。
10.权利要求8的方法,其中所述固定步骤包括把保护片附着到所述多个导电图案。
11.权利要求8的方法,其中所述固定步骤包括固化所述导电图案和所述粘结层的至少一个。
12.权利要求8的方法,其中所述多个磁体的每个磁体包括电磁体,该电磁体包括铁磁芯和围绕该铁磁芯缠绕的线圈,以使得每个线圈至少独立地或同时地被供应能量。
13.权利要求12的方法,还包括在所述喷溅步骤以前,给多个电磁体供应能量的步骤。
14.权利要求8的方法,还包括把所述多个导电图案互相分开的步骤。
15.一种用于制造用于射频识别标签的天线的方法,所述方法包括:
把磁体配置成具有期望的图案的磁场;
把非导电基片放置在所述磁体上面;
在所述基片的上表面上喷溅导电粒子,所述导电粒子在该上表面上形成相对于所述磁场的导电图案;以及
把所述导电图案固定到所述基片。
16.权利要求15的方法,其中所述固定步骤包括在所述导电图案上喷溅固定液体。
17.权利要求15的方法,其中所述固定步骤包括把保护片附着到所述导电图案。
18.权利要求15的方法,其中所述磁体是电磁体,该电磁体包括铁磁芯和围绕该铁磁芯缠绕的线圈。
19.权利要求15的方法,还包括在所述喷溅步骤以前,给所述磁体供应能量以产生所述磁场。
20.权利要求19的方法,其中所述供应能量步骤在所述固定步骤期间持续。
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CN104103905A (zh) * | 2013-04-03 | 2014-10-15 | 艾斯艾斯株式会社 | 贴附到移动终端的天线贴片的制造方法及利用该方法的贴附到移动终端的天线的制造方法 |
CN108631051A (zh) * | 2017-03-21 | 2018-10-09 | 中兴通讯股份有限公司 | 天线结构、智能终端设备以及天线结构的制作方法 |
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DE102007043409A1 (de) * | 2006-09-15 | 2008-03-27 | Samsung Electro-Mechanics Co., Ltd., Suwon | Verfahren zur Herstellung einer Gehäusestruktur mit Antenne |
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DE102007050102A1 (de) * | 2007-10-16 | 2009-04-23 | Smartrac Ip B.V. | Verfahren zur Herstellung eines Übertragungsmoduls sowie Übertragungsmodul |
TWI456830B (zh) * | 2010-07-26 | 2014-10-11 | Wistron Neweb Corp | 天線結構的製造方法 |
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CN111384587B (zh) * | 2020-02-17 | 2021-04-20 | 珠海格力电器股份有限公司 | 天线的制造方法、天线及终端设备 |
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