EP1656636B1 - Rfid device and method of making - Google Patents
Rfid device and method of making Download PDFInfo
- Publication number
- EP1656636B1 EP1656636B1 EP04816794A EP04816794A EP1656636B1 EP 1656636 B1 EP1656636 B1 EP 1656636B1 EP 04816794 A EP04816794 A EP 04816794A EP 04816794 A EP04816794 A EP 04816794A EP 1656636 B1 EP1656636 B1 EP 1656636B1
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- European Patent Office
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- substrate
- conductive
- strap
- seed layer
- crimping
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- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
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- G—PHYSICS
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- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
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- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
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- G—PHYSICS
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- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
- G06K19/07752—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna using an interposer
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H—ELECTRICITY
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
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- Y10T29/49016—Antenna or wave energy "plumbing" making
- Y10T29/49018—Antenna or wave energy "plumbing" making with other electrical component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Details Of Aerials (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
- The invention relates radio frequency identification (RFID) devices and methods of making such devices.
- Radio frequency identification (RFID) tags and labels (collectively referred to herein as "devices") are widely used to associate an object with an identification code or other information. RFID devices generally have a combination of antennas (a conductive pattern) and analog and/or digital electronics, which may include for example communications electronics, data memory, and control logic. For example, RFID tags are used in conjunction with security locks in cars, for access control to buildings, and for tracking inventory and parcels. Some examples of RFID tags and labels appear in
U.S. Patent Nos. 6,107,920 ,6,206,292 , and6,262,292 , all of which are hereby incorporated by reference in their entireties. - As noted above, RFID devices are generally categorized as labels or tags. RFID labels are RFID devices that are adhesively or otherwise have a surface attached directly to objects. RFID tags, in contrast, are secured to objects by other means, for example by use of a plastic fastener, string or other fastening means.
- One goal in the fabrication of RFID devices is improving methods by which such devices are fabricated.
- A chip having conductive leads (strap) which are connected to an antenna on a substrate by using crimped connections, is disclosed by
WO 03/012734 claim 16 are provided. - According to another aspect of the invention, a method of making an RFID device includes depositing a metal layer on a substrate, covering portions of the metal layer with a patterned mask of dielectric material, and plating to form an antenna on the uncovered portions of the metal layer.
- According to still another aspect of the invention, a method of making a radio frequency identification (RFID) device, includes: forming a conductive seed layer on a substrate; and attaching a strap to the substrate, wherein the attaching includes crimping to form crimped electrical connections between the seed layer and conductive leads of the strap.
- According to a further aspect of the invention, a radio frequency identification (RFID) device includes a substrate; a patterned conductive layer on the substrate; a strap; and at least one crimped electrical connection between the strap and the patterned conductive layer.
- To the accomplishment of the foregoing and related ends, the invention comprises the features hereinafter fully described and particularly pointed out in the claims. The following description and the annexed drawings set forth in detail certain illustrative embodiments of the invention. These embodiments are indicative, however, of but a few of the various ways in which the principles of the invention may be employed. Other objects, advantages and novel features of the invention will become apparent from the following detailed description of the invention when considered in conjunction with the drawings.
- In the annexed drawings, which are not necessarily to scale:
- Fig. 1 is a plan view of an RFID device in accordance with the present invention;
- Fig. 2 is a bottom view of the RFID device of Fig. 1;
- Fig. 3 is a side cross-sectional view of part of the RFI D device of Fig. 1;
- Fig. 3A is a side cross-sectional view of part of a first embodiment of the RFID device of Fig. 1;
- Fig. 3B is a side cross-sectional view of part of a second embodiment of the RFID device of Fig. 1;
- Fig. 3C is a side cross-sectional view of part of a third embodiment of the RFID device of Fig. 1;
- Fig. 3D is a side cross-sectional view of part of a fourth embodiment of the RFID device of Fig. 1;
- Fig. 3E is a side cross-sectional view of part of a fifth embodiment of the RFID device of Fig. 1;
- Fig. 3F is a side cross-sectional view of part of a sixth embodiment of the RFID device of Fig. 1;
- Fig. 3G is a side cross-sectional view of part of a seventh embodiment of the RFID device of Fig. 1;
- Fig. 4 is a high-level flowchart of a method in accordance with the present invention for producing the RFID device of Fig. 1;
- Fig. 5 is a flowchart of one embodiment of the method of Fig. 4;
- Fig. 6 is a plan view of a first step in the method of Fig. 5;
- Fig. 7 is a side cross-sectional view of the first step;
- Fig. 8 is a plan view of a second step in the method of Fig. 5;
- Fig. 9 is a side cross-sectional view of the second step;
- Fig. 10 is a bottom view of a third step of the method of Fig. 5;
- Fig. 11 is a side cross-sectional view of the third step;
- Fig. 12 is a plan view of a fourth step of the method of Fig. 5;
- Fig. 13 is a side cross-sectional view of the fourth step;
- Fig. 14 is a plan view of a fifth step of the method of Fig. 5;
- Fig. 15 is a side cross-sectional view of the fifth step;
- Fig. 16 is a schematic view of a system for carrying out the method of Fig. 5;
- Fig. 17 is a flowchart of a second embodiment of the method of Fig. 4;
- Fig. 18 is a plan view of a first step of the method of Fig. 17;
- Fig. 19 is a side cross-sectional view of the first step;
- Fig. 20 is a bottom view of a second step of the method of Fig. 17; and
- Fig. 21 is a side cross-sectional view of the second step.
- A radio frequency identification (RFID) device includes a conductive pattern, such as an antenna, on one side of a substrate, and a chip, such as part of a strap, electrically coupled to the conductive pattern, and either on an opposite side of the substrate or on the same side of the substrate as the antenna. A method of fabricating the RFID device may include crimping the strap onto the substrate, in contact with a seed layer, which is subsequently used in forming the antenna or other conductive pattern by plating. The seed layer may be a patterned conductive ink layer. Alternatively, the seed layer may be a layer of conductive material deposited on the substrate, such as by vacuum deposition. Parts of the deposited layer may be covered with a patterned mask in order to form the desired configuration of the conductive pattern. Subsequent to the plating, the mask may be removed, and etching may be performed to remove parts of the deposited layer that are not plated because they were covered by the mask.
- Referring initially to Fig. 1, a radio frequency identification (RFID)
device 10 having asubstrate 12 is shown. As shown in Figs. 1 and 3, on a first or front surface or face 14 of thesubstrate 12, theRFID device 10 has a conductive pattern such as anantenna 16. - A
strap 20 is on a back or second surface or face 22 of thesubstrate 12. Thestrap 20 includes achip 26 and conductive leads 28 and 30. The conductive leads 28 and 30 are electrically connected to theantenna 16, through thesubstrate 12, via conductive crimpedconnections connections layer 36, upon which theantenna 16 is formed, such as by plating. As described further below, theseed material 36 may be a conductive ink, or may be a deposited material, such as copper placed on thefront surface 14 of thesubstrate 12 by vapor deposition. - Fig. 3 shows a generalized representation of the crimped
connections connections - Although Figs. 1-3 illustrate an embodiment with the
strap 20 on thesecond face 22 of thesubstrate 12, it will be appreciated that the alternativelystrap 20 may be on thefirst face 14, the same side of thesubstrate 12 as theantenna 16. - Examples of suitable materials for the
substrate 12 include paper and suitable polymers such as polycarbonate, polyvinyl chloride, polystyrene, polymethyl methacrylate, polyurethane polyimide, polyester, cyclic polyolefin polymers, polyether sulfone (PES), polyethylene terephthalate (PET), polyethylene naphthalate, polycarbonate, polybutylene terephthalate, polyphenylene sulfide (PPS), polypropylene, polysulfone, aramid, polyamide-imide (PAl), polyimide, aromatic polyimides, polyetherimide, acrylonitrile butadiene styrene, and polyvinyl chloride. Further details regarding suitable substrates and substrate materials may be found inInternational Publication Nos. WO 00/46854 WO 00/49421 WO 00/49658 WO 00/55915 WO 00/55916 - The leads 28 and 30 of the
strap 20 operatively coupled to chip contacts of thechip 26. Thechip 26 may include any of a variety of suitable electronic components, such as the circuitry described above for modulating the impedance of theRFID device 10. The leads 28 and 30 may be completely made out of an electrically conducting material, such as being made out of a metal foil. Alternatively, theleads strap 20 may include a strap substrate that is attached to theleads - The
strap 20 may be any of a variety of commercially-available straps. The term "strap," as used herein, refers broadly to devices that include a microchip or other electronic circuitry, coupled to conductive leads. The conductive leads may be connected to contacts on the microchip or other circuitry by any of a variety of suitable methods. The conductive leads may include of any of a variety of suitable conductive materials, such as metal strips or deposited conductive ink layers. Examples include an RFID strap available from Alien Technologies, and the strap marketed under the name I-CONNECT, available from Philips Electronics. Alternatively, thestrap 20 may be other than a commercially-available strap. - The crimped
connections seed material 36 or from the conductive leads 28 and 30. In addition, the crimpedconnections antenna 16. For example, the plating may partially or completely fill, with conductive material, holes made during the crimping process. Such additional plated conductive material may make or strengthen the conductive connection between theantenna 16 and the conductive leads 28 and 30. - Figs. 3A-3G show details of various embodiments of the crimped
connections seed material 36. In Fig. 3A the crimpedconnections substrate 12. Theconductive material 38 may be driven through thesubstrate 12 by a pierce or punch that passes through the conductive leads 28 and 30, and thesubstrate 12. Theconductive material 38 may be bent to formcrowns seed layer 36. Subsequent plating may add material and strengthen the connections between theconductive material 38 and theseed layer 36, and/or between theconductive material 38 and the remaining parts of the conductive leads 28 and 30. Plated material may form in the hole left by the punch or pierce, and may fill physical gaps between conductive materials, and/or provide a physically and electrically stronger path between the conductive leads 28 and 30, and theseed layer 36. - Fig. 3B shows the crimped
connections front side 14 of thesubstrate 12. A pierce or punch is used the driveconductive material 38 of the conductive leads 28 and 30 through theseed layer 36 and thesubstrate 12. The driving of theconductive material 38 secures the conductive leads in contact with theseed layer 36. In addition, theconductive material 38 may make electrical connections between the conductive leads 28 and 30, and corresponding parts of theseed layer 36. Subsequent plating may fill gaps between the conductive leads 28 and 30 and theseed material 36 with additional conductive plated material, thereby improving the electrical connection, for example by reducing resistance or improving reliability of the contact. In addition, plating may provide an additional connection between theseed layer 36 and edges of the conductive leads 28 and 30. - The
straps 20 used in the connections shown in Figs. 3A and 3B may have metal conductive leads 28 and 30. An example of such a strap is the I-CONNECT strap referred to above. - Figs. 3C and 3D show alternative configurations, each differing from those shown in Figs. 3A and 3B in that a potion of the
strap 20 resides in ahole 43 in thesubstrate 12. Thehole 43 may be made, for example, by punching, to remove a part of thesubstrate 12 at a suitable location. It will be appreciated that by locating a portion of thestrap 20 in thehole 43, thestrap 20 may have a lower profile on thesubstrate 12. The may make for a less obtrusive device, and/or may facilitate subsequent fabrication operations. - In Fig. 3E the
strap 20 had astrap substrate 44 upon which the conductive leads 28 and 30 are located. The strap substrate may be a suitable polymer material, such as those discussed above with regard to thesubstrate 12. The conductive leads may be formed from a suitable conductive ink material. An example of such a strap is the Alien strap referred to above. - In making the crimped
connections thin metal rods strap substrate 44, thesubstrate 12, and theseed layer 36. The ends of therods strap 20 to thesubstrate 12, and to make contact with the conductive leads 26 and 28, and theseed layer 36. Subsequent plating strengthens the connections between therods seed layer 36 on the other side. - The
metal rods metal rods metal rods - Figs. 3F and 3G shows two other configuration for the crimped
connections substrate 12 and theseed layer 36 have slits orholes 49 cut therethrough. The conductive leads 28 and 30 are themselves inserted through the slits or holes 49, with ends of theleads strap 22 to the rest of thedevice 10. Contact between theleads seed layer 36 forms electrical connections. The electrical connection may be mechanically and/or electrically reinforced by subsequent plating. Thestrap 20 may be attached on the same side of thesubstrate 12 as the seed layer 36 (Fig. 3F), or on an opposite side of thesubstrate 12 as the seed layer 36 (Fig. 3G). - Fig. 4 shows a high-level flow chart of broad outlines of a
method 50 for fabricating theRFID device 10. Instep 52, theseed material 36 is formed on thefront surface 14 of thesubstrate 12. As will be described below in greater detail, theseed material 36 may be a patterned conductive ink, or may be a substantially-uniform layer of conductive material, such as vapor deposited copper, with a patterned mask thereupon. - In
step 54, thestrap 20 is connected to either to the front 14 or to theback 22 of thesubstrate 12 and is electrically coupled to theseed material 36 by a crimping operation. Finally, instep 56, theantenna 16 or other conductive pattern is formed upon theseed layer 36, using a suitable plating process, such as a suitable electroplating process. - The general outline of the
method 50 having just been given, details are now given of a pair of specific embodiments of themethod 50. Fig. 5 shows a high-level flowchart of amethod 50a that involves a vacuum-deposited metal layer. Figs. 6-15 illustrate some of the operations of themethod 50a. - In
step 62 of themethod 50a, alayer 64 of conductive material is deposited on the front surface or face 14 of thesubstrate 12. In a particular embodiment, the depositedlayer 64 may be vacuum-deposited copper having a thickness of about 2000 Angstroms, or more broadly from about 100 Angstroms to about 10,000 Angstroms. As an alternative to copper, the deposited material may include any of a variety of suitable conductive metals, for example aluminum and/or nickel. It will be appreciated that other suitable conductive materials may be employed in the depositedlayer 64. - The deposition of the deposited
layer 64 may utilize any of a variety of methods, including vapor or vacuum deposition, sputtering, physical vapor deposition, chemical vapor deposition, or other suitable processes. - In
step 68, illustrated in Figs. 8 and 9, a patternedmask 70 is printed or otherwise formed on the depositedlayer 64, masking portions of the depositedlayer 64 upon which plating is not desired. The portions of the depositedlayer 64 left exposed after formation of themask 70 correspond to the pattern of theantenna 16 to be formed in a subsequent step. The pattern of themask 70 thus may be a reverse image of the antenna or otherconductive pattern 16 to be formed. - The printing in
step 68 may be any of a variety of suitable printing processes, including inkjet printing, flexo printing, gravure printing, or screen printing. - The ink or other material of the
mask 70 is any suitable non-conductive material. The material for themask 70 may be any of a variety of suitable materials such as suitable oils, or resist materials such as photoresist. Themask 70 may include a material that is alkaline-strippable or is soluble in another suitable solvent for removing themask 70. Examples of suitable alkaline-soluble resists include Enthone PR3011, available from Ethone, Inc., and CGSN 7005, available from Coated Circuit Products of England. Examples of suitable soluble resists include Enthone PR4011, available from Ethone, Inc., and CGSN 7011, available from Coated Circuit Products. - It will be appreciated that, in order to make for a more efficient process, the
mask 70 may be merely printed in a patterned print upon the conductive depositedlayer 64. Alternatively, themask 70 may be formed in a variety of other suitable ways, such as coating with a resist material, followed by selectively removing portions of the resist material to expose parts of the underlying conductive depositedlayer 64. The methods of selectively removing portions of a material may include suitable lithographic methods. - Thereafter, in
step 74, thestrap 20 is crimpedsubstrate 12, as illustrated in Figs. 10 and 11. As illustrated, thestrap 20 is crimped onto theback surface 22 of thesubstrate 12, but it will be appreciated that alternatively the strap may be crimped to thefront surface 14 of thesubstrate 12. The crimping provides electricalcrimped connections strap 20, and the depositedlayer 64. As seen in Fig. 11, the crimped connections correspond to exposed portions 76 and 78 of the depositedlayer 64, that is, portions not covered by themask 70. - The crimping may be performed to make the crimped
connections substrate 12 and theseed layer 36, and by using a cone-shaped device to form thecrowns 40 and 42 (Fig. 3A). - The crimping to make the crimped
connections metal rods 46 and 48 (Fig. 3E) through thedevice 10, and bend the ends of themetal rods seed material 36 and the conductive leads 26 and 28. In fact, standard staples and a standard stapler may be used to make crimped connections similar to those shown in Fig. 3E. - Other of the various connections shown in Figs. 3A-3G may be made by suitable methods.
- As shown in Fig. 11, the
strap 20 may be located relative to thesubstrate 12 such that thechip 26 of thestrap 20 is facing away from the substrate. It will be appreciated that other configurations are possible, for example, with thestrap 20 facing towards theback surface 22 of thesubstrate 12, or with thechip 26 being embedded within thestrap 20. - In
step 80, illustrated in Figs. 12 and 13, a plating process is used to form the antenna or other patternedconductive layer 16. The substantially-uniform depositedconductive layer 64 provides a way of dividing even current flow across the exposed areas (such as the regions 76 and 78) of the depositedlayer 64. Thus, a substantially uniform thickness may be obtained in the antenna or otherconductive pattern 16 formed by the electroplating process. - Copper may be plated to form the antenna or other
conductive pattern 16. Also, the material to be plated may be selected so as to be the same as the material of the conductive depositedlayer 64. - The substantially uniform conductive deposited
layer 64 provides a low electrical resistance when used in the plating process to form the antenna or otherconductive pattern 16. - In
step 84, illustrated in Figs. 14 and 15, themask 70 is removed. Themask 70 may be removed by any of a variety of suitable processes, for example, by washing theRFID device 10 using a suitable solvent. As noted above, themask 70 may include an alkaline-strippable material, which may be removed merely by washing with an alkaline solution. - Finally, in
step 88, etching is performed to remove portions of the depositedlayer 64 not covered by the antenna or otherconductive pattern 16. The etching may be accomplished by any variety of suitable etching processes, for example including exposure to a liquid, such as an acid that removes the copper or other material of the depositedlayer 64. An example of a suitable etchant is a suitable ferrous chloride aqueous solution. As an alternative to wet etching, other suitable methods of etching may be employed, such as dry etching, plasma etching, or reactive ion etching. - The etching may remove some of the material of the antenna or other
conductive pattern 16. However, the duration of the etching and/or concentration of the etchant may be controlled, so as to limit the amount of material removed from the antenna or otherconductive pattern 16, while desirably removing the portions of the conductive depositedlayer 64 that are not covered by the antenna or otherconductive pattern 16. - The resulting structure of the RFID device, following the etching in
step 88, may be substantially similar to that of theRFID device 10 shown in Figs. 1-3 and discussed above. It will be appreciated that, although the antenna or other patternedconductive layer 16 is shown in Figs. 1-3 as being separate from theunderlying seed layer 36, in fact the electroplated material of the antenna or otherconductive pattern 16 may form a unitary conductive pattern with the underlying portions of the depositedconductive layer 64. - Following the
etching step 88, a suitable wash may be utilized to remove traces of the wet etchant material employed. - It will be appreciated that many other suitable processes may be undertaken in transforming the RFID device into a tag or label suitable for use. Other layers may be added, for example, such as adhesive layers, printable coating layers, or seeding layers. Additional devices may be included on the
substrate 12, or may be coupled to theRFID device 10. - Further it will be appreciated that there may be some variation in the order of steps from that illustrated in Fig. 5. For example, as illustrated, the attaching of the
strap 20 occurs after the printing of themask 70. However, it will be appreciated that the printing of themask 70 may occur after attachment of thestrap 20, if desired. It will be appreciated that other suitable modifications may be made to themethod 50a shown in Fig. 5 and discussed above. Such modifications may include, for example, changing the order of steps, adding additional steps, combining multiple of the steps into a single process, or splitting suitable of the steps into multiple sub-operations. - With reference now to Fig. 16, some or all of the processes of the
method 50a may be performed in one or more roll-to-roll operations. Fig. 16 shows asystem 100 for performing themethod 50a in a roll-to-roll process. In thesystem 100,substrate material 101 starts at asupply roll 102. Theconductive layer 64 is then deposited at adeposition station 104, with themask 70 printed at aprinter 106. Thestrap 20 may then be crimped onto a back surface of thesubstrate material 101 using acrimper 110. It will be appreciated that individual of thestraps 20 may be brought to thesubstrate material 101 through any of a variety of suitable methods. For example, a pick-and-place operation may be used to place thestrap 20 in a desired position on thesubstrate 12. Reference marks may be utilized to aid in proper alignment of thestrap 20 relative to the exposed portions of the conductive depositedlayer 64. Alternatively, thestrap 20 may be temporarily separated on a separate web of material that is brought into contact with the web ofsubstrate material 101 at the desired location. - Following the crimping, the antenna or other
conductive pattern 16 is formed in a plating process, for example, by passing thesubstrate material 101 through aplating bath 114. The mask may then be removed in a solvent washing application process shown atreference number 118. Then a wet etching may be performed by passing thesubstrate material 101 through anetch bath 120. Finally, thesubstrate material 101 may be gathered in a take-up roll 122. - Further processing may then be performed on the web of
substrate material 101. As noted above, additional layers or structures may be added. Also, theindividual RFID devices 10 may be physically separated from one another and from theweb substrate material 101, by a suitable cutting process. - Turning now to another embodiment of the
method 50, Fig. 17 shows a method 50b for forming theRFID device 10. Figs. 18-21 illustrate various processes of the method 50b. - In
step 130 of the method 50b, a patternedseed layer 136 is printed or otherwise formed on thefront surface 14 of thesubstrate 12, as illustrated in Figs. 18 and 19. Theseed layer 136 may be printed by any of a variety of suitable printing methods, including screen printing, inkjet printing, or gravure printing. The ink may be any of a variety of suitable conductive inks, for example, an ink containing copper and/or silver particles. Other suitable inks may include inks containing other types of conductive metal particles, or inks containing other conductive materials, such as graphite or suitable conductive polymer materials. - Other methods of forming the patterned seed layer includes patterned vapor deposition of a suitable metal, such as copper. Further details on such a process may be found in
U.S. Published Application No. 2002/0018880 . - The
seed layer 136 corresponds to the desired configuration of the antenna or otherconductive pattern 16. In addition, theseed layer 136 may have additional elements to provide electrical connection between various parts of theseed layer 136, so as to allow a more uniform electroplating process in a subsequent step. For example, if theantenna 16 is an antenna for a 13.56 MHz RFID device, the antenna may have a length large enough such that electrical connection between elements of theantenna 16 is desirable. One method of making such a temporary electrical connection is described inU.S. Patent No. 6,476,775 . On the other had, if theantenna 16 is a dipole antenna, such as the type used for UHF or microwave RFID devices, operating for example at 900 MHz or 2.45 GHz, there may be no need for an additional electrical connection between elements or parts of the antenna. - In
step 140, illustrated in Figs. 20 and 21, thestrap 20 is crimped onto thefront surface 14 or theback surface 22 of thesubstrate 12. The crimping forms crimpedconnections strap 20, and elements of the conductiveink seed layer 136. The crimping may be performed in a similar manner to that as described above with regard to the crimping operation in themethod 50a. - In
step 150, electroplating is performed to produce the antenna or otherconductive pattern 16. By suitable application of current within a suitable, ion-containing bath, material may be plated upon theseed layer 136, forming theantenna 16 of a suitable thickness. - After the electroplating, suitable steps may be taken to remove undesired plated areas. For example, acid may be used to remove additional material between desired elements of the
antenna 16. It will be appreciated that no such removal is necessary when there is no additional conductive material between desired elements of theantenna 16. - It will be appreciated that steps of the method 50b may also be performed in one or more roll-to-roll operations. A system may be used to perform the roll-to-roll operations, with suitable printers, crimpers, and electroplating baths, which may be analogous to those described above with regard to the system 100 (Fig. 16).
- The
method 50, in its various embodiments, allows for inexpensive production of theRFID device 10, with itsantenna 16 andstrap 20 on opposite faces of thesubstrate 12. As described above, the electrical connection between thestrap 20 and theantenna 16 may be a crimped connection through thesubstrate 12. Such a connection provides good mechanical strength, as well as being an efficient way to form a connection. It will be appreciated that the plating operation that occurs subsequent to the crimping may provide plated conductive material at connection points between the crimped connection and the parts of theantenna 16 and thestrap 20 to be coupled together.
Claims (16)
- A method of making a radio frequency identification (RFID) device (10), the method comprising:forming a conductive seed layer (36) on a substrate (12); andattaching a strap (20) to the substrate, wherein the attaching includes crimping to form crimped electrical connections (32, 34) between the seed layer and conductive leads (28, 30) of the strap, characterized in that, the crimping is such thatthe crimped electrical connections pass through the substrate.
- The method of claim 1,
wherein the conductive seed layer is formed on a first face (14) of the substrate; and
wherein the strap is attached on a second face (22) of the substrate that is on an opposite side from the first face. - The method of claim 1 or claim 2, wherein the strap is attached on the same side of the substrate as the conductive seed layer.
- The method of any of claims 1 to 3,
further comprising, after the attaching, plating on the seed layer to form a conductive pattern (16);
wherein the plating includes adding conductive plating material to the crimped electrical connections. - The method of claim 4, wherein the adding material includes thickening at least portions of the crimped connections.
- The method of claim 4 or claim 5, wherein the adding material includes filling gaps between the crimped connections and the conductive leads.
- The method of any of claims 4 to 6, wherein the adding material includes filling gaps between the crimped connections and the seed layer.
- The method of any of claims 1 to 7, wherein the crimping includes piercing the conductive leads, the substrate, and the seed layer, thereby displacing conductive material of the conductive leads and bringing the conductive material into contact with the seed layer.
- The method of claim 8, wherein the crimping further includes forming crowns (40, 42) from the displaced conductive material, wherein the crowns are in contact with portions of the seed layer, thereby securing the strap to the substrate.
- The method of claim 8 or claim 9,
further comprising, prior to the crimping, making a hole in the substrate;
wherein the crimping includes placing a portion of the strap into the hole. - The method of any of claims 1 to 10, wherein the crimping includes driving metal rods (46, 48) through the conductive leads, the substrate, and the seed layer.
- The method of claim 11,
wherein the crimping further includes bending ends of the metal rods; and
wherein the bending includes, for each of the rods, bending the ends against the seed layer and respective of the conductive leads. - The method of any of claims 1 to 10, wherein the crimping includes:making slits (49) in the substrate and the seed layer;passing the conductive leads of the strap through the slits; andbending ends of the conductive leads that have been passed through the slits.
- The method of any of claims 1 to 13, wherein the forming the seed layer includes depositing a conductive layer (64) on a face (14) of the substrate.
- The method of any of claims 1 to 13, wherein the forming the seed layer includes printing a conductive ink on a face (14) of the substrate.
- A radio frequency identification (RFID) device (10) produced by the method of any of claims 1 to 15, the device comprising:a substrate (12);a patterned conductive layer (16) on the substrate;a strap (20); andat least one crimped electrical connection (32, 34) between the strap and the patterned conductive layer, characterised in thatthe at least one crimped connection passes through the substrate.
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PCT/US2004/025087 WO2005041121A2 (en) | 2003-08-05 | 2004-08-04 | Rfid device and method of making |
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EP1656636B1 true EP1656636B1 (en) | 2007-07-25 |
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EP (1) | EP1656636B1 (en) |
KR (1) | KR20060080916A (en) |
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US20050032267A1 (en) | 2005-02-10 |
ATE368266T1 (en) | 2007-08-15 |
DE602004007807D1 (en) | 2007-09-06 |
CA2534730A1 (en) | 2005-05-06 |
US20070008238A1 (en) | 2007-01-11 |
KR20060080916A (en) | 2006-07-11 |
ES2289596T3 (en) | 2008-02-01 |
EP1656636A2 (en) | 2006-05-17 |
DE602004007807T2 (en) | 2008-04-17 |
WO2005041121A2 (en) | 2005-05-06 |
CN100414564C (en) | 2008-08-27 |
WO2005041121A3 (en) | 2005-07-28 |
US7120987B2 (en) | 2006-10-17 |
AU2004284716A1 (en) | 2005-05-06 |
US7333061B2 (en) | 2008-02-19 |
CN1829999A (en) | 2006-09-06 |
WO2005041121B1 (en) | 2005-09-29 |
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